Black Sesame Technologies

What Black Sesame Technologies does

Black Sesame Technologies is a Chinese fabless semiconductor company founded in 2016 and publicly listed on the Hong Kong Stock Exchange (ticker 02533.HK) since 2024. It designs automotive-grade computing System-on-Chips (SoCs) for autonomous driving and edge AI applications, with proprietary ISP (Image Signal Processor) and NPU (Neural Processing Unit) IP cores branded as its 'Al3' technology. The product portfolio centers on two chip families: the Huashan series (A1000, A1000L, A1000 Pro, A2000) serving as the 'brain' for perception and decision-making, and the Wudang series (C1236, C1296) serving as the 'cerebellum' for motion control in robotics. In November 2025, the company launched the SesameX multidimensional embodied intelligence computing platform to address the humanoid robotics market under a stated 'intelligent vehicles + robots' dual-engine strategy. Supporting infrastructure includes the Hanhai middleware, Shanhai toolchain, and integrations with BlackBerry QNX (safety OS), LeddarTech (perception), and AEye (lidar).

The company sells primarily through direct B2B enterprise relationships with automotive OEMs and Tier 1 suppliers (Dongfeng Motor, Chery, MINIEYE), complemented by revenue from software/IP licensing and an acquired 60% stake in Eeasy Tech for entry-level edge AI SoCs in smart security and in-vehicle intelligence. The 7nm Huashan A2000 received clearance from the U.S. Department of Commerce and Department of Defense for global sales in 2026, making Black Sesame the first Chinese company to achieve this regulatory milestone and enabling international market expansion. 2025 revenue reached CNY 822 million with 73.4% YoY growth, gross profit of CNY 337 million (up from CNY 195 million), and an operating loss that narrowed 17.5% year-on-year. Recent strategic moves include the Eeasy Tech acquisition (January 2026), a CNY 500 million SummitView Capital-led raise (January 2026), an HKD 631 million Infini Capital placement (March 2026), and partnerships with SIIC Tech Capital, DEEP Robotics, COSCO Shipping, and Wuhan University. The company has 1,001-5,000 employees across offices in Wuhan (headquarters), Shanghai, and San Jose.

Name

Black Sesame Technologies

Legal name

Black Sesame Technologies Co., Ltd

Website

https://bst.ai

Company type

Public

Founded year

2016

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Black Sesame Technologies is a Chinese fabless semiconductor company that designs automotive-grade AI SoCs (Huashan and Wudang chip families) and the SesameX embodied intelligence platform for autonomous driving and humanoid robotics, serving automotive OEMs, robotics firms, and edge AI customers globally.

Ownership category

akta.pro rank

Product category

Automotive Computing Chips

NAICS

Semiconductor and Related Device Manufacturing (334413), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Automotive & Industrial ICs (ADAS/Powertrain/Factory/Robotics) (HDAHABAD)

akta.pro secondary industries

Automotive & Safety-Certified Processors (ADAS/Domain/ASIL MCUs) (HDAHAJAJ), System-on-Chip (SoC) Platforms (Mobile/Consumer/Embedded) (HDAHAJAC), Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC) (HDAHABAC), Audio, Imaging & Multimedia SoCs (ISP/Codec/Display) (HDAHABAH), Edge AI Hardware & NPUs (SoCs, modules, accelerators) (HDAAAJAC), Real-Time Vision at the Edge (on-device CV/video) (HDAAAJAE)

Keywords

• Automotive computing chips
• Autonomous driving semiconductors
• Intelligent driving SoCs
• Automotive AI processors
• Image signal processor IP

Headquarters

HQ city

Wuhan

HQ country

China

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Intelligent Vehicle Chips and Solutions: Sale of Huashan series automotive-grade computing chips (A1000, A1000L, A1000 Pro, A2000) and driving solutions to automotive OEMs and Tier 1 suppliers for ADAS and autonomous driving applications.
2. Embodied Intelligence Solutions: Revenue from robotics platforms including SesameX, Wudang series chips for robotics control, and integrated solutions for humanoid robots, maritime inspection robots, and industrial robotics applications.
3. Software and IP Licensing: Licensing of proprietary algorithms, perception software, and IP cores for autonomous driving and AI applications to partners and customers.
4. Eeasy Tech Acquisition Revenue: Eeasy Tech (60% owned subsidiary) contributes revenue from general-purpose AI SoC solutions for smart security and in-vehicle intelligence, with management committing to cumulative revenue of at least 1.2 billion yuan over three years.

Go-to-market motion3 records

Distribution channels5 records

Marketing channels5 records

Core offering

Black Sesame Technologies designs and manufactures automotive-grade AI computing chips and system-on-chips (SoCs) for intelligent and autonomous driving applications. Its product portfolio spans high-performance autonomous driving chips (Huashan Series such as A1000, A1000L, A1000 Pro, A2000), cross-domain SoCs (Wudang Series C1296, C1236), the SesameX intelligent driving platform, supporting Hanhai middleware, Shanhai toolchain, and proprietary ISP and NPU IP cores, alongside Driving Solutions, V2X Solution, and the Eeasy Tech AI SoC solution line.

Product overview

Black Sesame Technologies is a leading provider of intelligent automotive computing chips and comprehensive solutions for autonomous driving and robotics. The product portfolio centers on two proprietary chip families: the Huashan series (A1000, A1000L, A1000 Pro, and A2000) serving as the 'brain' for perception and decision-making, and the Wudang series (C1236, C1296) serving as the 'cerebellum' for motion control. The SesameX platform integrates both chip families into a unified embodied intelligence computing system for humanoid robotics. Supporting infrastructure includes Hanhai middleware for software integration and the Shanhai toolchain for development. Core IP includes proprietary ISP and NPU processors. The company offers complete driving solutions and V2X communication solutions. Following the January 2026 acquisition of Eeasy Tech, the portfolio expanded to include cost-effective AI SoCs for entry-level edge applications, complementing the mid-to-high-end automotive-grade chips. The company serves both the intelligent vehicles sector and the expanding robotics market through its 'intelligent vehicles + robots' dual-engine strategy.

Differentiator

Problem solved

Functional benefit

Brands

• SesameX: Multidimensional embodied intelligence computing platform for humanoid robotics
• Huashan Series
• Wudang Series
• Hanhai Middleware

Quantifiable outcome

• 73.4% year-over-year revenue growth in 2025 to 822 million yuan
• +3 more outcomes

Named customers8 records

Segments5 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration3 records

AI capability7 records

Feature7 records

Partnerships

Nine partnerships are on record, tiered major, core and strategic.

• SIIC Tech CapitalmajorStrategic or Co-development Partner · 8 June 2026Strategic partnership to accelerate commercialization of embodied AI and robotics technologies through initiatives including an embodied AI robotics ecosystem and a World Robot Super Accelerator. Combines Black Sesame's computing capabilities and SesameX platform with SIIC Tech Capital's investment network and industrial resources. Aims to strengthen innovation links between Shanghai and Hong Kong while helping Chinese robotics companies access overseas markets.
• COSCO Shipping (Qingdao) Smart Transportation Equipment Co., Ltd.majorStrategic or Co-development Partner · 15 January 2026Joint development of maritime embodied-intelligence inspection robots for ocean-going vessels. Black Sesame supplies edge-side intelligent computing platforms and hardware/software technologies; COSCO contributes real operational logic and engineering frameworks from maritime settings. Partnership extends robotics business into shipping sector and supports China's maritime automation ambitions.
• Eeasy Technology Co., Ltd. (Eeasy Tech)coreStrategic or Co-development Partner · 2 January 2026Black Sesame completed acquisition of a 60% controlling stake in Eeasy Tech through equity transfer and capital injection. Eeasy Tech specializes in general-purpose AI SoC solutions for smart security and in-vehicle intelligence. Management committed to cumulative revenue of at least CNY 1.2 billion and net profit of at least CNY 90 million over three years. The acquisition complements Black Sesame's mid-to-high-end chips with Eeasy Tech's low-power, cost-effective AI SoC portfolio.
• ArterisstrategicTechnology or Integration · 3 December 2025Black Sesame licensed Arteris' Ncore 3 cache coherent network-on-chip IP and FlexNoC 5 non-coherent NoC IP with physical awareness for use in next-generation automotive SoC designs targeting full-stack autonomous driving capabilities. Collaboration accelerates development and deployment of intelligent vehicle hardware.
• DEEP RoboticsmajorStrategic or Co-development Partner · 28 August 2025Strategic partnership to collaborate on developing control platforms for embodied AI, building industry-specific intelligent solutions, and expanding into global markets. Black Sesame contributes automotive-grade computing chips; DEEP Robotics contributes robotics platform capabilities. Targets applications including vessel inspection, smart construction, and research and education.
• AEye, Inc.strategicTechnology or Integration · 18 August 2025Strategic cooperation to integrate AEye's Apollo long-range lidar sensor with Black Sesame's automotive-grade chipset and perception software for AI-based railway safety applications in China. Aims to deliver a full-stack, plug-and-play obstacle detection and early warning system targeting high-speed transportation networks. System has been selected by a top-tier Chinese OEM.
• Wuhan University (Academician Liu Sheng's Team)majorStrategic or Co-development Partner · 12 March 2025Strategic partnership to advance humanoid robotics technology by integrating Black Sesame's chip and algorithm platforms into Wuhan University's TIANWEN humanoid robot. Collaboration centers on the 'brain-cerebellum' platform featuring Huashan A2000 for cognitive functions and Wudang C1236 for motion control. Both parties developing mass-production-ready chip solutions for humanoid robots.
• LeddarTechstrategicTechnology or Integration · 10 January 2024Collaboration to provide high-performance and cost-effective ADAS solutions to Chinese and global automakers. Combines Black Sesame's intelligent vehicle SoC with LeddarTech's AI-based low-level sensor fusion and perception software.
• BlackBerry QNXstrategicTechnology or Integration · 19 January 2022BlackBerry QNX technology selected to power Black Sesame's latest autonomous driving chipset. Partnership aims to create safe, reliable autonomous driving solutions for Chinese automakers.

Scale indicators13 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• NVIDIA: NVIDIA's DRIVE Orin and DRIVE Thor automotive SoCs compete head-to-head with Black Sesame's Huashan A2000 in the autonomous driving compute segment, targeting the same Tier 1s and OEMs.
• Mobileye: Mobileye's EyeQ family of ADAS SoCs is the dominant incumbent in assisted/autonomous driving compute, competing with Huashan chips for OEM design wins globally.
• Qualcomm: Qualcomm's Snapdragon Ride Platform is a direct competitor offering automotive-grade SoCs and software stacks for ADAS and autonomous driving, often benchmarked against Huashan A2000.
• Horizon Robotics: Horizon Robotics' Journey series AI SoCs are Black Sesame's closest Chinese competitor, both targeting domestic automotive OEMs with similar positioning around cost-effective ADAS compute.
• Ambarella: Ambarella's CV series of AI vision SoCs serve automotive ADAS and autonomous applications, overlapping with Black Sesame's ISP+NPU compute approach for perception workloads.

Broad incumbents

• Renesas Electronics: Renesas supplies automotive MCUs and SoCs (R-Car family) used in ADAS and autonomous driving, competing in the broader automotive compute market though not specializing in AI accelerators like Black Sesame.
• NXP Semiconductors: NXP's S32 platform and BlueBox automotive solutions compete in ADAS/autonomous compute with a broader portfolio approach spanning microcontrollers, processors, and radar.

Emerging players

• Hailo: Hailo's edge AI processors target automotive and robotics inference workloads, overlapping with Black Sesame's NPU-based compute offerings for edge perception.
• Cambricon Technologies: Cambricon is a Chinese AI chip designer focused on training and inference accelerators with similar automotive and edge AI ambitions as Black Sesame.
• Biren Technology: Biren Technology designs domestic Chinese AI accelerator GPUs and SoCs, addressing similar AI compute markets in automotive and edge applications within China.

Market position

Strengths5 records

Weaknesses6 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/black-sesame

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries2 records

Funding overview

Funding rounds10 records

Investors31 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments2 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Black Sesame Technologies