What GlobalFoundries does

GlobalFoundries is a publicly traded specialty semiconductor foundry (NASDAQ: GFS) headquartered in Malta, New York, that manufactures differentiated integrated circuits for high-growth end markets including AI infrastructure, automotive, aerospace/defense, smart mobile devices, and home/industrial IoT. The company was established in 2009 as a spin-off from AMD's manufacturing operations and is majority-owned by Abu Dhabi's Mubadala Investment Company, a sovereign wealth fund. GlobalFoundries operates a global manufacturing footprint spanning the United States (Malta NY, Burlington VT), Europe (Dresden Germany), and Asia (Singapore, Guangzhou China, Penang Malaysia), employing over 10,000 people and generating $6.79 billion in FY2025 revenue. The company differentiates from leading-edge foundries by focusing on essential, specialty process technologies that are not efficiently served by general-purpose fabs.

GlobalFoundries' technology platform spans FDX FD-SOI, FinFET (with over 3 million wafers shipped since 2015), RF-SOI, SiGe (with over 4 billion chips shipped), RF GaN, BCD power, and silicon photonics (with demonstrated 200G/λ and 8λ/16λ DWDM capabilities). Proprietary technologies include the SLATE wafer-to-wafer bonding platform (production-ready as of June 2026, with up to 45% die size reduction), the SCALE co-packaged optics solution (the first OCI MSA-capable CPO platform), GF Fotonix silicon photonics, and Auto Grade 0/1 qualified eMRAM embedded memory. The company launched Quantum Technology Solutions in May 2026 as a dedicated quantum manufacturing business backed by $375 million in CHIPS R&D funding, serving multiple qubit modalities. Recent acquisitions of MIPS Technologies, Advanced Micro Foundry, InfiniLink, and Synopsys' ARC Processor IP Solutions have expanded the portfolio into processor IP for Physical AI and silicon photonics for AI data centers.

The company generates revenue primarily through wafer fabrication services, quote-based pricing tied to technology platform, volume, and complexity, delivered under multi-year enterprise contracts. The customer base is concentrated among global semiconductor companies, hyperscalers (Meta, Amazon, Nvidia), defense contractors (BAE Systems, Northrop Grumman), automotive leaders (Renesas), and quantum pioneers (PsiQuantum, Quantinuum, Diraq). The go-to-market is direct enterprise field sales supplemented by inside sales, the GlobalShuttle multi-project wafer (MPW) program, and a GlobalSolutions design partner ecosystem including Cadence, Synopsys, Keysight, and Applied Materials. Revenue diversification spans five end markets with horizontal segmentation, and the customer mix is anchored by multi-billion dollar long-term supply agreements with Meta, Amazon, and Renesas, providing revenue visibility offset by moderate concentration risk.

Name

GlobalFoundries

Legal name

GlobalFoundries Inc.

Website

https://gf.com/

Company type

Public

Founded year

2009

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

GlobalFoundries is a specialty semiconductor foundry manufacturing differentiated integrated circuits on proprietary platforms including FDX FD-SOI, FinFET, RF-SOI, silicon photonics, and GaN, serving AI infrastructure, automotive, aerospace/defense, mobile, and IoT markets from facilities in the U.S., Europe, and Asia.

Ownership category

akta.pro rank

Product category

Semiconductor Foundry Services

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ)

akta.pro secondary industries

Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser) (HDAHACAG), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), R&D / Prototyping & MPW Shuttle Foundries (HDAHACAI)

Keywords

• Semiconductor foundry services
• Wafer fabrication
• Silicon photonics manufacturing
• Advanced packaging services
• RF and power semiconductors

Headquarters

HQ city

New York

HQ country

United States

HQ region

North America

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Infrastructure, Operations, Technology or R&D, Personnel, Supply Chain, Marketing or Sales

Revenue model

1. Wafer Fabrication: Core semiconductor manufacturing revenue from producing customer-designed chips using GF's technology platforms. Revenue is transaction-based, driven by wafer volume and technology complexity.
2. Technology Services: Growing revenue stream from design services, PDK licensing, prototyping, and multi-project wafer programs. Expanding toward higher-margin technology services as part of margin improvement strategy.
3. Advanced Packaging Services: End-to-end packaging, assembly and test services delivered through advanced packaging centers in U.S. and Singapore, supporting heterogeneous integration for AI and photonics applications.
4. Processor IP (MIPS): Revenue from MIPS processor IP portfolio including virtual platforms, standards-based compute, and ASSP design capabilities following acquisition of MIPS and Synopsys ARC Processor IP Solutions.

Pricing tiers

Go-to-market motion2 records

Distribution channels4 records

Marketing channels8 records

Core offering

GlobalFoundries is a specialty semiconductor foundry that manufactures customer-designed integrated circuits on differentiated process platforms (FDX FD-SOI, FinFET, RF-SOI, SiGe, RF GaN, BCD Power, Power GaN, Silicon Photonics, eMRAM) across 200mm and 300mm fabs in the U.S., Europe, and Asia. The company also delivers advanced 2.5D/3D packaging, SLATE wafer-to-wafer bonding, SCALE co-packaged optics, multi-project wafer prototyping, design enablement/PDK licensing, Quantum Technology Solutions manufacturing, and MIPS/ARC processor IP as a vertically integrated software-to-silicon offering.

Product overview

GlobalFoundries is a leading semiconductor foundry offering differentiated, essential chip technologies across multiple platforms including FDX FD-SOI, Feature-rich CMOS, FinFET, BCD Power, Power GaN, RF-SOI, SiGe, RF GaN, Silicon Photonics (Gen 1-3), and Advanced Packaging. The company provides a comprehensive software-to-silicon capability through MIPS processor IP (augmented by the Synopsys ARC acquisition), Quantum Technology Solutions division (backed by $375M CHIPS grant), and the SCALE CPO solution for AI data centers. Key services include the GlobalShuttle MPW program, Advanced Packaging and Photonics Center (APPC) in Malta NY, and GF Labs for research partnerships. Manufacturing spans Malta NY, Burlington VT, Dresden Germany, Singapore, and Guangzhou China, enabling AI infrastructure, automotive, aerospace/defense, smart mobile, and industrial IoT applications.

Differentiator

Problem solved

Functional benefit

Brands

• MIPS: A GlobalFoundries company delivering virtual platforms, standards-based compute and ASSP design capabilities for making software into silicon, part of the Physical AI platform
• SLATE
• SCALE
• Quantum Technology Solutions
• GlobalShuttle
• FDX
• GF Fotonix

Products and services

• FDX FD-SOI Technology Fully depleted silicon-on-insulator (FD-SOI) process platform purpose-built for ultra-low-power edge intelligence, offering adaptive body biasing, embedded non-volatile memory, and leading RF/mmWave performance for always-on consumer, industrial, and automotive applications.
• Feature-rich CMOS Portfolio of reliable, feature-rich CMOS solutions spanning 40+ distinct platforms from 22nm to 180nm nodes, optimized for cost-effective, long-lifecycle edge devices across consumer, industrial, and automotive markets.
• FinFET Technology High-performance FinFET process technologies using three-dimensional transistor architecture for area compaction, low leakage, radiation resilience, and up to 20% lower logic core power than 22nm-class technologies, serving high-performance and mission-critical applications.
• BCD Power Technology Bipolar-CMOS-DMOS (BCD) technologies combining analog, digital, and high-voltage power devices for efficient mixed-signal power ICs with scalable 5V to 150V operation, integrated passives, and embedded non-volatile memory.
• Power GaN Technology Wide-bandgap gallium nitride (GaN) power technologies delivering high power density and high-efficiency power conversion with lower losses and faster switching for next-generation AI data center, automotive, and industrial power systems.
• RF-SOI Technology Partially depleted RF-SOI process technology optimized for low RF loss and high linearity in switching and tuning, enabling highly integrated, low-loss RF front-end designs at scale for mobile, wireless infrastructure, and SATCOM applications.
• SiGe Technology Silicon germanium (SiGe) BiCMOS technologies offering industry-leading ft/fmax performance for high-frequency applications spanning mobile, wireless infrastructure, optical communications, automotive radar, and SATCOM, with over 4 billion SiGe chips shipped to date.
• RF GaN Technology RF gallium nitride on silicon (GaN-on-Si) technologies delivering high power density, gain, and efficiency across FR1 and FR3 frequency bands for power amplifiers, SATCOM systems, and wireless infrastructure.
• Silicon Photonics Platform Production-proven 300mm silicon photonics process technology (Gen 1 at 100G/λ, Gen 2 at 200G/λ, Gen 3 on a 400G/λ path) with demonstrated 8λ and 16λ bi-directional DWDM, supporting pluggable optics and the transition to co-packaged optics (CPO) for AI data centers.
• SCALE CPO Solution Industry's first Optical Compute Interconnect (OCI) MSA-capable co-packaged optics platform for AI scale-up architectures, combining integrated photonic devices, CWDM and DWDM, and advanced packaging to exceed interconnect specifications for modern AI data centers.
• Quantum Technology Solutions Dedicated quantum manufacturing business backed by a $375M CHIPS R&D grant to scale U.S. quantum manufacturing, supplying quantum processors across multiple qubit modalities including superconducting, trapped ion, photonic, neutral-atom, and silicon spin qubits.
• Advanced Packaging Services End-to-end 2.5D/3D advanced packaging services including wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, interposer-based architectures, and through-silicon-via (TSV) integration, delivered through the Advanced Packaging and Photonics Center in Malta, NY and Singapore.
• SLATE Wafer-to-Wafer Bonding Technology Wafer-to-wafer bonding technology on the 9SW RF-SOI platform enabling advanced 3D integration for compact, high-performance cellular front-ends in 5G mobile and sub-8GHz/FR3 satellite communications, with up to 45% reduction in die size.
• MIPS Processor IP Processor IP, virtual platforms, standards-based compute, and ASSP design capabilities from MIPS and the acquired Synopsys ARC Processor IP Solutions business, forming a unified software-to-silicon capability purpose-built for Physical AI applications.
• GlobalShuttle Multi-Project Wafer Program Multi-project wafer (MPW) prototyping program providing accessible early design and prototyping across all GlobalFoundries process technologies, including CMOS, RF, silicon photonics, and advanced packaging.
• Advanced Packaging and Photonics Center (APPC) U.S.-based Advanced Packaging and Photonics Center in Malta, New York, focused on silicon photonics co-packaged optics (CPO) development, advanced packaging, and test for security-sensitive applications with secure, onshore manufacturing.
• AutoPro 150 eMRAM Embedded Memory Auto Grade 1 embedded magnetoresistive random access memory (eMRAM) on the enhanced FDX platform, delivering rapid read/write speeds, >500K cycle endurance, and 20-year data retention at 150°C for safety-critical automotive applications.

Quantifiable outcome

• Silicon photonics revenue expected to reach $1 billion annualized run rate by end of 2028
• +5 more outcomes

Named customers14 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration8 records

AI capability5 records

Feature7 records

Partnerships

34 partnerships are on record, tiered minor, core and major.

• FujitsuminorStrategic or Co-development Partner · 6 July 2026Listed as likely investor in NTT's IOWN-AI fund targeting approximately $500 million to build out IOWN ecosystem for photonic network technology.
• CorningcoreStrategic or Co-development Partner · 24 June 2026Co-development of Glass Bridge glass optical interconnect technology for co-packaged optics and glass-core semiconductor packaging, targeting sub-2dB coupling loss for AI data centers.
• Silicon Saxony ClusterminorStrategic or Co-development Partner · 24 June 2026Part of 'Fab Five' anchor companies (with Infineon, X-FAB, Bosch, ESMC) in Dresden semiconductor cluster expanding production under Europe's Chips Act.
• InfosysmajorImplementation/ SI/ Consulting Partner · 23 June 2026Expanded multi-year AI-led managed services partnership covering GF's enterprise IT landscape including application, infrastructure, data, and service desk operations.
• QualcommmajorStrategic or Co-development Partner · 18 June 2026Strategic partnership for scale production of SENZ smart glasses platform waveguides at GF Singapore facility, as part of Snapdragon START program.
• Applied MaterialscoreStrategic or Co-development Partner · 17 June 2026Strategic partnership for SENZ integrated visual system for smart glasses, with GlobalFoundries producing waveguides at scale in Singapore facility. Joint development with EssilorLuxottica for AR eyewear optical systems.
• OCI MSA ConsortiumcoreStrategic or Co-development Partner · 15 June 2026First chipmaker to have silicon ready for Optical Compute Interconnect MSA, supporting multi-vendor supply chain for AI data center optical scale-up interconnects. Consortium includes AMD, Broadcom, Meta, Microsoft, Nvidia, OpenAI.
• CEA-LeticoreStrategic or Co-development Partner · 12 June 2026Expanded collaboration through FAMES Pilot Line to accelerate FD-SOI semiconductor R&D, focusing on energy efficiency, sustainability and European technological sovereignty.
• UCLAmajorStrategic or Co-development Partner · 12 June 2026$125 million semiconductor research hub focused on AI-powered chip technology, workforce development, and embedding Ph.D. students in industry environments.
• im ECcoreStrategic or Co-development Partner · 12 June 2026Partnership for FD-SOI technology advancement and European technological sovereignty through FAMES Pilot Line collaboration.
• FermioniccoreTechnology or Integration · 11 June 2026Commercial partnership to manufacture Fermionic's RF chips for radar, satellite communications, and telecom infrastructure. First Indian-designed semiconductors produced by GlobalFoundries, supported by India's Design Linked Incentive scheme.
• FermioniccoreTechnology or Integration · 11 June 2026Partnership to produce RF and millimeter-wave chips for beamformers, phased-array transceivers, and integrated front-end ICs for strategic applications.
• SynopsyscoreTechnology or Integration · 11 June 2026Chip design tool collaboration for IIIT-Dharwad students designing indigenous chip Siddharooda-1.
• QualinxcoreStrategic or Co-development Partner · 10 June 2026Completed first fully European end-to-end semiconductor manufacturing flow for security-critical GNSS SoC at GF's Dresden fab, co-funded by European Chips Act.
• Keysight TechnologiescoreTechnology or Integration · 9 June 2026Integration of GF's silicon photonics process technology into Keysight's ADS Photonic Designer software, enabling combined photonic and electronic system simulation for PIC design.
• UCLAmajorStrategic or Co-development Partner · 8 June 2026Five-year initiative combining philanthropy and in-kind support for collaboration across chip design, software, manufacturing, equipment, and advanced materials.
• DiraqcoreTechnology or Integration · 8 June 2026Partnership with Nvidia, Dell, and imec to translate CMOS-native quantum processor technology into commercially viable products.
• Keysight TechnologiescoreTechnology or Integration · 3 June 2026PDK integration for full electro-optical-electrical system simulation including eye diagram analysis and TDECQ metrics before tapeout.
• U.S. Department of EnergycoreStrategic or Co-development Partner · 3 June 2026Genesis Mission partnership opening GF's U.S. manufacturing platform and design enablement resources to National Laboratories, universities, and startups for AI-enabled semiconductor design and prototype fabrication.
• IIIT-DharwadminorStrategic or Co-development Partner · 3 June 2026Chip design collaboration producing GPIO expander chip SIDHARUD-1 taped out to GF Germany as part of India's semiconductor capability development.
• U.S. Department of Energy (Genesis Mission)coreStrategic or Co-development Partner · 3 June 2026Genesis Mission AI chip partnership providing researchers access to U.S. manufacturing platforms for AI-enabled semiconductor design and prototype fabrication.
• Sivers SemiconductorscoreStrategic or Co-development Partner · 2 June 2026Strategic collaboration integrating Sivers' laser arrays into GF's silicon photonics platform and SCALE optical engine solutions for AI data center applications, targeting $25 billion pluggable optics market by 2030.
• CorningcoreStrategic or Co-development Partner · 2 June 2026Partnership for GlassBridge detachable fiber connector solutions enabling low-loss, high-bandwidth optical coupling compatible with GF's v-groove-enabled photonics platform.
• SynopsysmajorTechnology or Integration · 2 June 2026Completed acquisition of Synopsys' ARC Processor IP Solutions business, combining with MIPS to create unified software-to-silicon capability for Physical AI applications.
• Northrop GrummancoreStrategic or Co-development Partner · 1 June 2026Ecosystem partnership for developing and delivering space-grade chips leveraging radiation-hardened semiconductor technologies.
• Vorago TechnologiescoreStrategic or Co-development Partner · 1 June 2026Ecosystem partnership for radiation-hardened semiconductor solutions for space applications.
• Malaysia (Government)minorStrategic or Co-development Partner · 28 May 2026Penang hub operating as part of Malaysia's National Semiconductor Strategy, supporting advanced engineering and digital operations.
• PsiQuantumcoreStrategic or Co-development Partner · 21 May 2026Founding customer in GF's Quantum Technology Solutions division for photonic quantum computing chip manufacturing. Part of $375 million CHIPS R&D grant program.
• QuantinuumcoreStrategic or Co-development Partner · 21 May 2026Founding customer in GF's Quantum Technology Solutions division for quantum processor manufacturing across multiple qubit architectures.
• DiraqcoreStrategic or Co-development Partner · 21 May 2026Founding customer for silicon-based quantum computing manufacturing through Quantum Technology Solutions division, leveraging CMOS-native approach.
• Quantum MotioncoreStrategic or Co-development Partner · 21 May 2026Founding customer for quantum computing manufacturing through Quantum Technology Solutions division, using 300mm silicon CMOS wafer technology.
• Renesas ElectronicscoreStrategic or Co-development Partner · 16 February 2026Expanded multi-billion dollar partnership to accelerate U.S. semiconductor manufacturing, including advanced packaging and technology development.
• InfiniLinkmajorTechnology or Integration · 25 November 2025Acquisition of Cairo-based photonics startup integrating silicon photonics technology into GF's portfolio for high-speed data connectivity in AI and data centers.
• Advanced Micro Foundry (AMF)majorTechnology or Integration · 18 November 2025Acquisition of Singapore-based silicon photonics chipmaker specializing in AI data center and quantum computer applications, positioning GF as world's largest silicon photonics manufacturer.

Scale indicators12 records

Recent moves7 records

Expansion highlights7 records

Direct peers

• Taiwan Semiconductor Manufacturing Company (TSMC): World's largest contract semiconductor foundry offering advanced-node CMOS, RF, advanced packaging and silicon photonics services. Directly competes with GlobalFoundries for foundry wafer volumes across most technology platforms, though TSMC leads at leading-edge nodes while GF differentiates at specialty and 22nm-12nm.
• United Microelectronics Corporation (UMC): Taiwan-based pure-play foundry specializing in mature and specialty nodes (28nm-22nm CMOS, embedded memory, RF, BCD). Closely comparable to GF's feature-rich CMOS and FinFET offerings and competes head-to-head for the same fabless customer base in communications, automotive and consumer.
• Samsung Foundry: Pure-play foundry within Samsung offering advanced-node logic, RF, FinFET and increasingly silicon photonics. Directly comparable as a full-service foundry serving the same hyperscaler and mobile customers, with overlapping capabilities in advanced packaging and RF.
• SMIC (Semiconductor Manufacturing International Corporation): China's largest foundry offering mature and mid-range CMOS nodes, BCD, RF, and eNVM. Closely comparable to GF's specialty foundry offering and serves similar fabless customers, particularly in automotive and consumer IoT, though geopolitical positioning differs.
• Tower Semiconductor: Israel-based specialty foundry focusing on RF, analog, power management, MEMS and silicon photonics. Closely comparable to GF's specialty platform offering and identified as a partner in GF's data. Competes for the same differentiated, long-lifecycle customer base in automotive, industrial and communications.
• Intel Foundry Services: Intel's external foundry offering advanced-node CMOS, Foveros advanced packaging and emerging silicon photonics. Increasingly overlaps with GF's advanced packaging (SLATE, SCALE) and high-performance compute offerings, competing for U.S. government and hyperscaler foundry demand.

Broad incumbents

• Infineon Technologies: German semiconductor manufacturer with its own fabs producing power, automotive and GaN/SiC devices. Directly competes with GF's BCD and GaN offerings in power and automotive segments and is co-located with GF in the Dresden Silicon Saxony cluster.
• STMicroelectronics: European IDM with internal fabs producing automotive, industrial, power and MEMS semiconductors. Competes with GF's automotive-grade CMOS, BCD and SiGe offerings and pursues similar long-lifecycle, AEC-qualified customer relationships.
• ON Semiconductor (onsemi): U.S. semiconductor manufacturer with fabs producing power, analog and SiC devices. Comparable to GF's BCD Power and GaN platforms and competes for automotive electrification and industrial power-conversion design wins.
• Micron Technology: Memory and storage specialist with advanced fabs in the U.S. and Japan. Adjacent comparable as a U.S.-domestic semiconductor manufacturer benefiting from CHIPS Act funding and serving AI infrastructure demand, though not a direct foundry competitor to GF.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat7 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/GLOBALFOUNDRIES
• YouTubeyoutube.com/@globalfoundries
• Facebookfacebook.com/GLOBALFOUNDRIES
• LinkedInlinkedin.com/company/globalfoundries
• Instagraminstagram.com/globalfoundries.corporate

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles13 records

Subsidiaries4 records

Funding overview

Funding rounds10 records

Investors4 records

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M&A6 records

Investments10 records

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Frequently asked questions about GlobalFoundries