What Multibeam does

Multibeam Corporation designs, manufactures, and sells Multicolumn Electron Beam Lithography (MEBL) systems for maskless, direct-write semiconductor patterning. Founded in 2010 by Dr. David K. Lam (who previously founded Lam Research in 1980), the Sunnyvale, California-based company addresses the productivity limitations that have historically confined electron-beam lithography to R&D applications. The MEBL platform uses arrays of miniature e-beam columns operating independently and in parallel while the stage is in continuous motion, achieving throughputs more than 100 times greater than conventional e-beam systems, with sub-100nm resolution and the ability to pattern up to 300mm wafers without field-stitching discontinuities. The system integrates Synopsys CATS data preparation software with physics-based and model-based corrections, and the platform is protected by approximately 50 patents covering hardware, software, and process innovations.

The company's MB Platform targets seven primary application segments: advanced packaging (2.5D/3D-IC, fan-out wafer-level packaging, wafer-scale interposers), silicon photonics and gratings, quantum technologies, rapid prototyping and high-mix production, compound semiconductor and power devices, MEMS and sensors, and secure chip ID for defense and anti-counterfeiting use cases. Multibeam operates a horizontal segmentation approach across semiconductor manufacturers, foundries, fabless companies, research institutions, and government/defense customers. Revenue is generated through capital equipment sales of MEBL systems bundled with software licensing and multi-year service contracts. The company goes to market via enterprise field sales led by SVP Andre Linden, direct sales offices in the US (Sunnyvale HQ, manufacturing) and Japan (opened April 2025), plus a channel partnership with Marketech International Corporation in Taiwan (announced October 2025). SkyWater Technology is the flagship customer, deploying the MB200 system at its Minnesota fab, and the U.S. Department of Defense awarded a $38 million contract in September 2020 for full-wafer maskless patterning development. In July 2025, the company closed a $31 million Series B led by Onto Innovation and Lam Capital, with participation from UMC Capital and MediaTek Capital.

Name

Multibeam

Legal name

Multibeam Corporation

Website

https://multibeamcorp.com

Company type

Private

Founded year

2010

Operating status

Operating

Headcount range

51–100 employees

Short description

Multibeam Corporation manufactures Multicolumn Electron Beam Lithography (MEBL) systems for maskless, direct-write semiconductor patterning. The Sunnyvale-based company serves semiconductor manufacturers, foundries, and research institutions with high-productivity e-beam tools targeting advanced packaging, photonics, quantum, and compound semiconductor applications.

Ownership category

akta.pro rank

Product category

Semiconductor Capital Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Lithography Equipment (DUV/EUV) (HDAHAEAA)

akta.pro secondary industries

R&D / Prototyping & MPW Shuttle Foundries (HDAHACAI), RF & Compound Semiconductor Foundries (GaAs/GaN/SiGe) (HDAHACAD), Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ)

Keywords

• Electron beam lithography
• Maskless lithography
• Semiconductor capital equipment
• Direct-write lithography
• Advanced packaging lithography

Headquarters

HQ city

Santa Clara

HQ country

United States

HQ region

North America

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. MEBL System Sales: Multibeam designs, manufactures, and sells multi-column electron-beam lithography (MEBL) systems to semiconductor manufacturers. The company provides hardware, software and services for maskless production of integrated circuits. Revenue is generated through capital equipment sales and associated software/service contracts.
2. Software and Services: Software licensing (integrated Synopsys CATS), process development, and technical support services bundled with system sales and ongoing customer engagements.

Pricing tiers

Go-to-market motion3 records

Distribution channels3 records

Marketing channels6 records

Core offering

Multibeam designs, manufactures, and sells Multicolumn Electron Beam Lithography (MEBL) systems — maskless, direct-write capital equipment that uses arrays of miniature e-beam columns (typically 9 to 25) writing independently and in parallel across full wafers while the stage is in continuous motion. The platform achieves throughputs more than 100x greater than conventional e-beam systems at sub-100nm resolution and is integrated with Synopsys CATS data preparation software. Target applications include 2.5D/3D advanced packaging, silicon photonics, quantum devices, compound semiconductor power devices, MEMS/sensors, secure chip ID, and rapid prototyping/high-mix production for semiconductor manufacturers and foundries.

Product overview

Multibeam offers a single unified product line: the MB Platform, a Multicolumn Electron Beam Lithography (MEBL) system. This flagship product integrates a patented array of miniature e-beam columns with Synopsys CATS data preparation software to enable maskless, high-throughput semiconductor patterning across full wafers. The platform targets advanced packaging, silicon photonics, quantum technologies, compound semiconductors, MEMS/sensors, secure chip ID, and rapid prototyping applications. Multibeam's systems are designed modularly, accommodating multiple writing modules for scalability, and are deployed in semiconductor fabs worldwide following their first production system shipment to SkyWater Technology.

Differentiator

Problem solved

Functional benefit

Products and services

• MB Platform — Multicolumn E-Beam Lithography (MEBL) System High-productivity multi-column electron-beam lithography (MEBL) system for maskless direct-write semiconductor patterning at sub-100nm resolution. Features arrays of 9 to 25 miniature e-beam columns writing independently and in parallel on-the-fly while the wafer stage is in continuous motion, delivering more than 100x throughput improvement over conventional single-column e-beam systems. Modular cluster-tool architecture supports up to three writing modules on a 30.6 m² footprint with internal isolation for vibration, EMI, and temperature. Integrated with Synopsys CATS data preparation software for GDSII/OASIS/MULTIGON handling and physics- and model-based corrections. Targets advanced packaging (2.5D/3D-IC, fan-out WLP, interposers), silicon photonics, quantum devices, compound semiconductor power devices, MEMS/sensors, secure chip ID, and rapid prototyping for semiconductor manufacturers, foundries, defense agencies, and research institutions.

Quantifiable outcome

• 100x faster throughput than conventional e-beam systems
• +8 more outcomes

Named customers2 records

Segments8 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration1 record

Feature7 records

Partnerships

Four partnerships are on record, tiered core, strategic and flagship.

• Marketech International Corporation (MIC)coreChannel Partner/ Reseller/ Distributor · 8 October 2025Multibeam and Marketech International Corporation announced a strategic partnership on October 8, 2025 to accelerate deployment of Multibeam's Multiple-Column E-Beam Lithography (MEBL) systems across Taiwan's semiconductor fabrication facilities. Marketech leverages its local market presence to facilitate adoption among Taiwan's leading foundries. Follows launch of Japan's sales office and fresh Series B funding.
• U.S. Government / DoDstrategicStrategic or Co-development Partner · 1 October 2025Multibeam supports U.S. Government initiatives focused on advancing next-generation semiconductor technologies for strategic aerospace and defense applications. A $38 million DoD contract (September 2020) funded development of full-wafer all-maskless patterning at 45nm and larger nodes on the MEBL production system for defense and domestic infrastructure applications.
• SynopsyscoreTechnology or Integration · 25 April 2024Synopsys and Multibeam collaborate on data preparation software integration. Multibeam's MEBL systems leverage Synopsys CATS software, custom-modified for Multibeam and fully integrated into system software. This enables physics-based and model-based corrections (3D proximity effect, thermal), seamless handling of GDSII, OASIS, and MULTIGON formats, and compatibility with system-level EDA. Joint blog and co-marketing demonstrate the partnership's importance to the customer workflow.
• SkyWater TechnologyflagshipStrategic or Co-development Partner · 18 November 2020SkyWater Technology and Multibeam formed a partnership to deploy Multibeam's MEBL system. SkyWater's Minnesota production facility is home to Multibeam's MB200 platform. SkyWater enhances its Technology as a Service offerings, enabling faster early concept prototyping and rapid production of next-generation ICs. MEBL enables Secure Chip ID for anti-counterfeit applications, full wafer patterning for focal plane readout ICs, large depth of focus for microfluidic and MEMS architectures, curvilinear designs for photonics, and sub-50nm geometries on 200mm wafers.

Scale indicators5 records

Recent moves8 records

Expansion highlights7 records

Direct peers

• Heidelberg Instruments: Direct peer in maskless direct-write lithography, offering both laser-based and electron-beam-based systems for photomask production, advanced packaging, MEMS, and photonics. Targets a similar customer base with a competing maskless lithography approach.
• Raith: Direct competitor in electron-beam lithography and nanofabrication systems, serving R&D, photonics, and quantum device developers with maskless nanopatterning tools. Overlaps with Multibeam in maskless e-beam direct-write for specialty and research applications.
• JEOL: Established manufacturer of electron-beam lithography and nanofabrication systems used in semiconductor R&D, mask making, and advanced device development. Competes with Multibeam in e-beam-based patterning, though traditionally focused on lower-throughput R&D tools.
• Vistec Electron Beam: Provider of electron-beam lithography systems for mask writing, photonics, MEMS, and compound semiconductor applications. Direct competitor to Multibeam in maskless e-beam direct-write for specialty semiconductor and nanofabrication markets.
• IMS Nanofabrication: Electron-beam-based mask writing and multi-beam lithography specialist, now majority-owned by Intel. Closest historical analog to Multibeam in developing multi-beam e-beam architectures for high-throughput mask writing and direct-write applications.

Broad incumbents

• ASML: Dominant incumbent in semiconductor lithography (DUV/EUV). Not a direct e-beam competitor, but the primary alternative platform against which Multibeam must justify its maskless approach for leading-edge and advanced packaging use cases.
• Onto Innovation: Strategic investor and broad semiconductor equipment incumbent offering process control, metrology, and lithography solutions for advanced packaging and heterogeneous integration. Competes in adjacent niches and provides co-selling leverage to Multibeam.
• Applied Materials: Largest semiconductor capital equipment OEM with broad portfolio including deposition, etch, and inspection. Has the R&D budget and customer relationships to compete in advanced packaging lithography, including emerging direct-write approaches.
• KLA Corporation: Leader in process control and yield management with e-beam-based inspection capabilities. Indirect competitor/adjacent player in e-beam-enabled semiconductor manufacturing, with resources to expand into maskless patterning if commercially attractive.

Emerging players

• Canon (FPA Nanoimprint Lithography): Competitor in next-generation lithography via nanoimprint technology, targeting advanced packaging and memory applications. Represents an alternative maskless or mask-reduced approach that could overlap with Multibeam's addressable market.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Funding overview

Funding rounds1 record

Investors5 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Multibeam