GS Microelectronics
GS Microelectronics (GSME) is a B2B semiconductor services company providing end-to-end custom chip design, Multi-Project Wafer manufacturing via its Muse subsidiary, 2.5D/3D advanced packaging, and RF/PMIC IP for AI, HPC, and wireless customers globally.
- Company typePrivate
- Founded2022
- HeadquartersSan Jose, United States
- Headcount251–500
- GTM typeB2B
- OfferingServices
What GS Microelectronics does
GS Microelectronics U.S., Inc. (GSME) is a B2B semiconductor services company founded in 2022 by Farhat Jahangir and headquartered in San Jose, California. The company provides end-to-end custom silicon solutions spanning chip design (architecture, RTL, verification, physical design, tape-out), manufacturing operations, power management ICs (Buck converters, LDOs, multi-rail PMICs), RF/mmWave design, and 2.5D/3D advanced packaging including CoWoS-class architectures. Its customer base is concentrated in three use-case segments: AI and HPC companies (high-end GPUs, specialized CPUs), RF and wireless technology firms (6G, 7G, Wi-Fi 7, FWA), and semiconductor startups and researchers seeking affordable foundry access via its Multi-Project Wafer (MPW) services.
GSME monetizes through professional services and project-based contracts (chip design, advanced packaging, advanced technology incubation/training), supplemented by product revenue from proprietary PMIC designs and mmWave front-end IP. The go-to-market is direct enterprise sales — engineering-led engagements with AI, HPC, and RF customers — distributed through offices in the US (San Jose), Oman (Al Mawaleh, in partnership with the Oman Investment Authority), Taiwan (Zhubei, near Hsinchu Science Park for TSMC ecosystem proximity), and Vietnam (Ho Chi Minh City primary design center, Da Nang secondary). The company is a TSMC ecosystem partner, which underwrites its advanced-node design (12nm and below FinFET) and CoWoS-class packaging capabilities.
The business has been built primarily through acquisition and capital deployment in 2025-2026: Sinble Technology Vietnam (acquired July 2025) added TSMC-based advanced node design, Muse Semiconductor (acquired October 2025) added MPW services, and roughly $66 million in disclosed funding across three rounds ($18M growth in March 2025, $35M Series B led by Maverick Silicon in January 2026, and approximately $13M from OIA/ITHCA Group in March 2026) is funding advanced packaging, AI-driven design services, and continued M&A. Headcount sits in the 251-500 band. Stated AI capabilities include the Intelligent Manufacturing Dashboard Solution (IMDS) and the AI-Digital Brain Platform, both focused on manufacturing yield, predictive modeling, and supply chain visibility.
GS Microelectronics firmographics
Firmographics- Name
- GS Microelectronics
- Legal name
- GS Microelectronics U.S., Inc.
- Website
- https://gsme.com
- Company type
- Private
- Founded year
- 2022
- Operating status
- Operating
- Headcount range
- 251–500 employees
- Short description
- GS Microelectronics (GSME) is a B2B semiconductor services company providing end-to-end custom chip design, Multi-Project Wafer manufacturing via its Muse subsidiary, 2.5D/3D advanced packaging, and RF/PMIC IP for AI, HPC, and wireless customers globally.
- Ownership category
- akta.pro rank
GS Microelectronics industry classification
Industry- Product category
- Semiconductor Design and Manufacturing Services
- NAICS
- Semiconductor and Related Device Manufacturing (334413)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ)
- akta.pro secondary industries
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Mobile & Wireless Connectivity SoCs (Modem/Wi‑Fi/Bluetooth/GNSS) (HDAHABAA), Power Management & Power Conversion ICs (PMIC/DC‑DC/AC‑DC/Gate Drivers) (HDAHABAE)
Keywords
Where GS Microelectronics is headquartered
LocationHeadquarters
- HQ city
- San Jose
- HQ country
- United States
- HQ region
- North America
Offices5 records
Markets served
GS Microelectronics business model
Business model- GTM type
- B2B
- Offering type
- Services
- Cost components
- Personnel, Technology or R&D
Revenue model
- Chip Design Services: End-to-end chip design implementation services including architecture specification, RTL coding, integration, verification, DFT, synthesis, place & route, physical verification, and tape-out sign-off
- Chip Manufacturing Services: Comprehensive semiconductor manufacturing services covering product planning, wafer fabrication, IC packaging, prototype build, and product sustaining
- MPW Services: Multi-Project Wafer services offered through Muse Semiconductor, enabling cost-sharing among multiple projects on single wafer for affordable access to advanced fabrication
- Advanced Technology Incubation: Training and incubation services for chip design, verification, manufacturing, and quality/reliability, using industry EDA tools and TSMC process nodes
- Advanced Packaging Services: 2.5D/3D packaging services including CoWoS-class architectures for AI, HPC, and RF applications
Go-to-market motion1 record
Distribution channels1 record
Marketing channels7 records
GS Microelectronics product offering
Product offeringCore offering
GS Microelectronics provides end-to-end semiconductor services spanning custom chip design (architecture, RTL coding, verification, DFT, synthesis, place & route, physical verification, tape-out), contract chip manufacturing (product planning, wafer fabrication, packaging, prototype build), Multi-Project Wafer (MPW) services via Muse Semiconductor, 2.5D/3D advanced packaging, and Power Management IC and RF front-end IP products. The company serves IC design and system companies building high-end GPUs, specialized CPUs, low-power IoT devices, and 5G/6G wireless products.
Differentiator
Problem solved
Functional benefit
Brands
- Muse Semiconductor: MPW (Multi-Project Wafer) services brand offering cost-effective semiconductor manufacturing through shared wafer fabrication, enabling access to advanced fabrication processes for small to medium-scale projects.
Products and services
- Chip Design Services
Companies that use GS Microelectronics
Customer profileSegments3 records
Ideal customer profiles3 records
GS Microelectronics technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
AI capability2 records
Feature5 records
GS Microelectronics partnerships and signals
Strategic signalPartnerships
Seven partnerships are on record, tiered core and minor.
- Tarana WirelesscoreStrategic partnership for RF transceiver products supporting next-generation wireless connectivity including 6G, 7G, Wi-Fi 7, and fixed wireless access. GSME provides dedicated RF-Analog engineering support, product optimization, validation, and new releases across Tarana's current and future RF product portfolio. The partnership leverages GSME's expanded RF-Analog team to accelerate innovations for global telecom customers.
- TSMCcoreTSMC ecosystem partner providing advanced node design services (12nm and below FinFET). GSME participates in TSMC technology symposia and provides MPW services using TSMC process nodes. Services include design enablement and CoWoS-class advanced packaging for AI applications.
- LumotiveminorCo-participant in Oman semiconductor ecosystem development alongside GSME. Both companies received investment from Oman Investment Authority through ITHCA Group as part of Oman's regional hub strategy.
- MovandiminorCo-participant in Oman semiconductor ecosystem development. Received $20 million investment from ITHCA Group in October 2025. Sponsored Oman Semiconductor Ecosystem Enablement & Investment Forum co-hosted by GSME.
- Semiconductor Industry AssociationminorIndustry association membership providing networking, standards participation, and industry advocacy.
- Global Semiconductor AllianceminorIndustry alliance membership for semiconductor industry collaboration and networking.
- Oman American Business CouncilminorBilateral business council membership supporting US-Oman commercial relations and market access.
Scale indicators5 records
Recent moves6 records
Expansion highlights7 records
GS Microelectronics competitors and assessment
Company assessmentDirect peers
- Alchip Technologies: Leading ASIC design services and manufacturing partner specializing in advanced-node SoC design for AI, HPC, and networking customers. Directly comparable to GSME in providing custom silicon design services with TSMC foundry access.
- Faraday Technology: Taiwan-based ASIC design services and IP provider offering turnkey SoC design, IP licensing, and manufacturing services. Comparable to GSME's chip design services, MPW offerings, and TSMC ecosystem positioning.
- GlobalUnichip Corp: Taiwan-based ASIC design services company with deep TSMC partnership, providing custom IC design, IP, and supply chain management. Closely aligned with GSME's advanced-node design services business and TSMC ecosystem positioning.
- VeriSilicon Holdings: China-headquartered semiconductor IP and design services platform offering custom silicon, IP licensing, and chip design services. Comparable to GSME's end-to-end design services and IP-driven business model.
Broad incumbents
- Marvell Technology: Major custom silicon and networking ASIC provider with broad portfolio spanning data center, 5G, and automotive. Operates overlapping custom silicon services at much larger scale than GSME, including advanced packaging programs.
- Amkor Technology: One of the world's largest OSAT providers offering advanced packaging services including 2.5D/3D integration for AI and HPC customers. Directly comparable to GSME's CoWoS-class advanced packaging offering, but at significantly larger scale.
- ASE Technology Holding: World's largest OSAT provider with comprehensive semiconductor packaging and test services including advanced packaging. Comparable to GSME's advanced packaging services across AI/HPC/RF applications.
- Powertech Technology: Major Taiwan-based OSAT provider offering advanced packaging including 2.5D/3D integration and heterogeneous packaging. Competes with GSME in advanced packaging services for AI/HPC customers.
Others
- Synopsys: EDA and semiconductor IP leader providing design tools, IP, and design services that underpin much of the semiconductor industry. Comparable as a design enablement partner and competitor in IP and design services adjacent to GSME's offerings.
- Tarana Wireless: Fixed wireless access technology company developing next-generation RF transceivers for 6G/Wi-Fi 7. GSME's named commercial partner, illustrating the customer segment GSME's RF design services target.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights6 records
Customer concentration
GS Microelectronics social profiles
Digital presenceGS Microelectronics financial estimates
Financial estimateRevenue estimate
Valuation estimate
GS Microelectronics leadership team
Management profileNumber of profiles
Profiles10 records
GS Microelectronics subsidiaries and ownership
Company hierarchySubsidiaries2 records
GS Microelectronics funding detail
Funding detailFunding overview
Funding rounds3 records
Investors2 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
GS Microelectronics M&A and investment
M&A and investmentM&A2 records
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about GS Microelectronics
What does GS Microelectronics do?
GS Microelectronics provides end-to-end semiconductor services spanning custom chip design (architecture, RTL coding, verification, DFT, synthesis, place & route, physical verification, tape-out), contract chip manufacturing (product planning, wafer fabrication, packaging, prototype build), Multi-Project Wafer (MPW) services via Muse Semiconductor, 2.5D/3D advanced packaging, and Power Management IC and RF front-end IP products. The company serves IC design and system companies building high-end GPUs, specialized CPUs, low-power IoT devices, and 5G/6G wireless products.
Is GS Microelectronics a public or private company?
GS Microelectronics is a private company. It is classified as venture growth investor backed and is currently operating.
When was GS Microelectronics founded?
GS Microelectronics was founded in 2022. It employs 251 to 500 people.
Where is GS Microelectronics based?
GS Microelectronics is headquartered in San Jose, United States, in the North America region.
How does GS Microelectronics make money?
Five revenue lines are on record. Chip Design Services are the primary driver. The others are chip Manufacturing Services, MPW Services, advanced Technology Incubation and advanced Packaging Services.
Who are GS Microelectronics's main competitors?
Direct peers on record are Alchip Technologies, Faraday Technology, GlobalUnichip Corp and VeriSilicon Holdings. Broad incumbents are Marvell Technology, Amkor Technology, ASE Technology Holding and Powertech Technology. Others are Synopsys and Tarana Wireless.
Does GS Microelectronics have an API?
No public API is recorded for GS Microelectronics.
What industry is GS Microelectronics in?
GS Microelectronics's product category is Semiconductor Design and Manufacturing Services. Its primary akta.pro industry code is HDAHACAJ, Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 334413 and its SIC code is 3674.