ACM Research

What ACM Research does

ACM Research, Inc. is a global wafer fabrication equipment (WFE) manufacturer founded in 1998 in California and headquartered in Fremont, USA, with its principal operating subsidiary ACM Research (Shanghai) listed on the Shanghai Stock Exchange's STAR Market. The company develops, manufactures, and sells production equipment for single-wafer and batch wet cleaning, electrochemical plating (ECP), stress-free polishing (SFP), PECVD, thermal deposition (furnace/ALD), and track lithography systems, serving integrated circuit manufacturers, compound semiconductor producers, advanced packaging providers, and wafer manufacturers in North America, Europe, China, South Korea, and Singapore.

ACM's technology stack is anchored on proprietary megasonic cleaning innovations — SAPS (Space Alternated Phase Shift) for uniform energy delivery across flat and patterned wafers, TEBO (Timely Energized Bubble Oscillation) for damage-free cleaning of 3D structures such as FinFET, DRAM, and 3D NAND at aspect ratios up to 60:1, and the hybrid Ultra C Tahoe architecture that combines batch and single-wafer SPM processing to cut sulfuric acid consumption by up to 75%. The portfolio has expanded beyond cleaning into Multi-Anode Partial Plating for dual-damascene and TSV copper deposition, panel-level plating up to 600x600mm for AI packaging, 300mm batch furnace systems, PECVD with a proprietary three-station rotating chamber design, and lithography track systems. The portfolio is now organized under the 'ACM Planetary Family' structure grouping tools into eight themed series; the IP estate exceeds 448 internationally granted patents.

ACM's business model is primarily direct sale of capital equipment to semiconductor manufacturers, with project-specific pricing and multi-year contracts, supplemented by global service and support including spare parts, installation, preventive maintenance, and process optimization delivered through depots in Asia, Europe, and North America. Revenue is recorded at $901.3M in FY2025 (+15.2% YoY), with FY2026 guidance of $1.08–$1.175B (21%–30% growth). Q1 2026 revenue was $231.3M (+34% YoY). Customer concentration is high: 52.2% of 2025 revenue came from customers each contributing at least 10%, with Samsung, SK hynix, and Micron as anchor HBM buyers. ACM also faces material geopolitical exposure: its Shanghai and South Korea units were placed under U.S. export controls in December 2024, and a 2025 Intel evaluation of ACM wet etch tools for the 14A node drew bipartisan U.S. Senate scrutiny, while named customers include U.S.-sanctioned entities YMTC, CXMT, and SMIC.

Name

ACM Research

Legal name

ACM Research, Inc.

Website

https://acmr.com

Company type

Public

Founded year

1998

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

ACM Research is a global wafer fabrication equipment manufacturer founded in 1998, producing single-wafer wet cleaning, electrochemical plating, stress-free polishing, PECVD, furnace, and track lithography systems for IC, compound semiconductor, and advanced packaging customers worldwide.

Ownership category

akta.pro rank

Product category

Semiconductor Wafer Fabrication Equipment (WFE)

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)

Keywords

• Semiconductor wafer cleaning
• Electrochemical plating equipment
• Wafer fabrication equipment
• Advanced packaging tools
• Semiconductor wet processing

Headquarters

HQ city

Fremont

HQ country

United States

HQ region

North America

Offices8 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Equipment Sales: ACM Research develops, manufactures, and sells production equipment for semiconductor manufacturing including wet cleaning systems, electrochemical plating tools, furnace systems, PECVD, track systems, and stress-free polishing equipment. Equipment sales is the primary revenue stream, with customers including leading global semiconductor manufacturers and foundries.
2. Service and Support: The company provides comprehensive customer support including spare parts, installation, preventive maintenance, process optimization, and technical training. Global support is available through depots strategically located near customer facilities in Europe, Asia, and North America.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

ACM Research develops, manufactures, and sells production wafer fabrication equipment (WFE) for the global semiconductor industry, including single-wafer and batch wet cleaning systems, electrochemical plating (ECP) tools, stress-free polishing (SFP) systems, PECVD, thermal deposition (furnace/ALD), and lithography track systems. Its tools serve IC and compound semiconductor manufacturing, advanced wafer-level and panel-level packaging, and wafer manufacturing/reclaim applications for technology nodes from 55nm down to 10nm and beyond. The company complements its equipment portfolio with global installation, qualification, spare parts, and process support services delivered through depots in North America, Asia, and Europe.

Product overview

ACM Research is a global wafer fabrication equipment (WFE) manufacturer offering a comprehensive multi-product portfolio organized under the ACM Planetary Family™ structure into eight themed series (Earth, Jupiter, Venus, Mars, Mercury, Saturn, Uranus, Neptune) aligned with core semiconductor manufacturing process steps. The product portfolio includes: Wet Processing Systems (Ultra C SAPS, TEBO, Tahoe, Single Hot SPM, Bevel Etch, Ultra C b, Ultra C s, Ultra C wb, Ultra C we, Ultra C pr, Ultra C ct, Ultra SiC, Ultra C vac-p); Electrochemical Plating Systems (Ultra ECP map, Ultra ECP 3d, Ultra ECP ap-p, Ultra ECP G-III); Thermal Deposition Processing (Ultra Fn Furnace, Ultra FnA ALD, Ultra FN Atmospheric Pressure); Ultra Pmax™ PECVD; Ultra Lith Track; and Ultra SFP Stress-Free Polishing. These tools support single-wafer and batch wet cleaning, electroplating, stress-free polishing, PECVD, track, and thermal processes for IC, compound semiconductor, wafer-level packaging, and wafer manufacturing applications. The company also provides global service and support solutions.

Differentiator

Problem solved

Functional benefit

Brands

• ACM Planetary Family: Product portfolio structure organizing semiconductor processing tools into eight themed series (Earth, Jupiter, Venus, Mars, Mercury, Saturn, Uranus, Neptune) aligned with core semiconductor manufacturing process steps
• Smart Megasonix
• SAPS
• TEBO
• Ultra C
• Ultra ECP
• Ultra Furnace
• Ultra Pmax
• Ultra Lith

Products and services

• Wet Processing Systems (Ultra C Series) Single-wafer and batch wet cleaning systems for precision wafer cleaning, etch, photoresist strip, coating, and developing in semiconductor manufacturing. Includes SAPS, TEBO, Tahoe, and other cleaning technologies for advanced technology nodes.
• Ultra C SAPS (Space Alternated Phase Shift) Cleaning System Single-wafer megasonic cleaning technology using alternating phases of megasonic waves for uniform energy delivery across flat and patterned wafers, removing defects more effectively than conventional jet-spray processes at advanced nodes.
• Ultra C TEBO (Timely Energized Bubble Oscillation) Cleaning System Damage-free single-wafer megasonic cleaning technology providing stable cavitation control for delicate 3D patterned wafers including FinFET, DRAM, 3D NAND, and high-aspect-ratio structures up to 60:1.
• Ultra C Tahoe SPM Cleaning System Hybrid architecture combining batch wafer processing and single-wafer cleaning chambers for SPM processes, delivering up to 75% reduction in sulfuric acid consumption while meeting advanced node requirements.
• Single Hot SPM Cleaning System High-temperature (up to 200°C) single-wafer SPM cleaning system for photoresist stripping post-etch, post-implant, and post-CMP processing at 28nm and beyond.
• Bevel Etch Cleaning System Single-wafer bevel etching and cleaning system for precise removal of dielectric, metal, and organic materials at wafer edge to optimize chip manufacturing yield.
• Ultra C b Backside Cleaning System Contactless backside wafer cleaning tool using Bernoulli chuck for 200mm or 300mm wafers in IC manufacturing, WLP, and power device applications.
• Ultra C vac-p Flux Cleaning Tool Vacuum-based flux cleaning tool for fan-out panel-level packaging (FOPLP) addressing critical flux residue removal before underfilling, supporting panels up to 600x600mm.
• Electrochemical Plating (ECP) Systems Ultra ECP product line spanning front-end dual-damascene and TSV applications to wafer-level packaging and compound semiconductor plating with multizone anodes and partial pulse plating technology.
• Ultra ECP map Electrochemical Plating System Front-end dual-damascene ECP system with Multi-Anode Partial Plating for copper metal layer deposition compatible for 55nm/40nm/28nm/14nm applications and beyond.
• Ultra ECP 3d TSV Electrochemical Plating System 3D TSV and 2.5D interposer ECP system with Multi-Anode Partial Plating for copper deposition in high aspect ratio via structures (10:1 and beyond).
• Ultra ECP ap-p Panel-Level Electrochemical Plating Tool Horizontal panel electroplating tool for fan-out panel-level packaging supporting up to 16 plating chambers for copper, nickel, tin-silver, gold and handling organic/glass substrates up to 600x600mm.
• Thermal Deposition Processing (Ultra Furnace) Systems 300mm batch processing tools for LPCVD, ALD, oxidation, and annealing processes with proprietary control algorithms for stable temperature, pressure, and gas flow rate management.
• Ultra FnA ALD Furnace System High-throughput batch ALD system depositing silicon nitride and silicon carbide nitride with good step coverage for FinFET, CFET, and nanosheet structures.
• Ultra Pmax PECVD System Plasma-enhanced chemical vapor deposition tool for legacy node (28nm and above) logic and memory devices with proprietary chamber design for better film uniformity and reduced film stress.
• Ultra Lith Track Coater/Developer System 300mm coater/developer track system supporting i-line, KrF, and ArF lithography processes with eight coating chambers, eight developing chambers, and customizable software.
• Ultra SFP Stress-Free Polishing System Pre-CMP copper overburden removal system using electrochemical approach to minimize mechanical stress on wafer surface, reducing defects in TSV and FOWLP processes.
• Customer Support & Service Solutions Global support including spare parts, applications and process support, tool optimization, training, and worldwide service through strategically located depots in Europe, Asia, and North America.

Quantifiable outcome

• Up to 75% reduction in sulfuric acid consumption with Ultra C Tahoe
• +4 more outcomes

Named customers10 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Seven partnerships are on record, tiered core and minor.

• Singapore FoundrycoreChannel Partner/ Reseller/ Distributor · 26 February 2026First deployment of ACM Research's 300mm single-wafer cleaning systems to a Singapore foundry's front-end wafer fabrication facility for wafer backside cleaning and wet etch processes, marking company's first Singapore deployment.
• Singapore OSAT CustomercoreChannel Partner/ Reseller/ Distributor · 26 February 2026Ordered wafer-level advanced packaging systems from ACM Research for delivery in 2026, representing expansion of ACM's advanced packaging platform and global customer base.
• North America Technology CustomercoreChannel Partner/ Reseller/ Distributor · 26 February 2026Ordered wafer-level systems for advanced packaging applications from ACM Research, representing meaningful expansion into North American advanced packaging market.
• IntelminorChannel Partner/ Reseller/ Distributor · 1 December 2025Intel tested ACM Research wet etch tools for potential use in its 14A chipmaking process scheduled for 2027. Testing raised national security concerns from U.S. lawmakers due to ACM's China ties.
• SamsungcoreChannel Partner/ Reseller/ Distributor · 1 January 2025Samsung has placed orders with ACM Research for HBM (High Bandwidth Memory) production equipment. ACM's Ultra ECP 3D system achieved 99.8% yield rate for TSV copper filling in 3D NAND configurations exceeding 500 layers.
• SK hynixcoreChannel Partner/ Reseller/ Distributor · 1 January 2025SK hynix has ordered HBM production equipment from ACM Research as part of next-generation DRAM manufacturing initiatives.
• MicroncoreChannel Partner/ Reseller/ Distributor · 1 January 2025Micron has placed orders with ACM Research for HBM production equipment for advanced memory applications.

Scale indicators9 records

Recent moves9 records

Expansion highlights6 records

Direct peers

• Lam Research: Lam Research is a leading wafer fabrication equipment manufacturer with strong positions in plasma etch, deposition, and cleaning. It is directly comparable to ACM Research as both serve logic, memory, and advanced packaging customers with overlapping single-wafer wet cleaning and electrochemical plating product lines.
• Tokyo Electron (TEL): Tokyo Electron is a major WFE supplier with strong positions in coater/developer tracks, deposition, and etch systems. ACM's Ultra Lith track and PECVD systems compete directly with TEL in the same customer fabs.
• SCREEN Holdings: SCREEN Semiconductor Solutions is the historical leader in single-wafer wet cleaning equipment, and ACM's Ultra C SAPS and TEBO platforms directly compete with SCREEN's cleaning products at advanced nodes.

Broad incumbents

• Applied Materials: Applied Materials is the largest WFE company globally, offering deposition, etch, CMP, inspection, and packaging tools. ACM competes against AMAT in ECP, PECVD, and advanced packaging equipment, though AMAT serves a far broader process-step portfolio.
• KLA Corporation: KLA is the dominant provider of process control and yield management equipment for wafer fabs. While not a direct competitor in cleaning or plating, KLA is a comparable WFE incumbent serving the same memory and logic customer base that ACM depends on.
• ASML: ASML is the monopolistic supplier of advanced lithography systems. While ACM's track lithography competes only at i-line/KrF/ArF (not EUV), ASML is a comparable WFE incumbent and a key enabler of the advanced-node semiconductor manufacturing that drives demand for ACM's cleaning and ECP tools.

Regional players

• NAURA Technology Group: NAURA is a leading Chinese WFE manufacturer offering etch, deposition, cleaning, and thermal processing equipment. It is comparable to ACM Research as a direct competitor for Chinese semiconductor manufacturers, particularly given ACM's significant China operations and customer base.

Emerging players

• Piotech: Piotech is a Chinese PECVD and atomic layer deposition equipment supplier. It is comparable to ACM as a regional emerging player expanding in deposition equipment for Chinese memory and logic fabs, with overlapping customer relationships in mainland China.
• AIXTRON: AIXTRON provides deposition equipment for compound semiconductors (SiC, GaN). ACM's Ultra SiC cleaning tool and Ultra ECP G-III target the same compound semi customer base, making AIXTRON a comparable emerging player in the power semiconductor equipment space.
• Veeco Instruments: Veeco provides MOCVD and other deposition systems used in compound semiconductor and advanced packaging manufacturing. It is comparable to ACM as an equipment peer focused on enabling compound semiconductor and advanced packaging process steps.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries3 records

Funding overview

Funding rounds4 records

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about ACM Research