Blue Cheetah Analog Design

What Blue Cheetah Analog Design does

Blue Cheetah Analog Design is a Sunnyvale, California-based semiconductor IP company founded in 2018 that develops customizable die-to-die (D2D) interconnect intellectual property for chiplet-based chip designs. The company's core product, the BlueLynx platform, delivers physical layer (PHY) and link layer chiplet interfaces supporting the Universal Chiplet Interconnect Express (UCIe) and Open Compute Project Bunch of Wires (BoW) standards, with reported performance of 40+ Gbps per wire, bandwidth density exceeding 15 Tbps/mm, sub-2ns PHY-to-PHY latency, and power consumption as low as sub-0.300 fJ/bit. A distinguishing feature is the proprietary BlueLynx Generator, an executable generator framework that produces tapeout-ready customized designs from high-level parameters (packaging type, data rate, I/O configuration, process technology), reducing the time and engineering effort required to integrate the IP across diverse chiplet architectures.

The company monetizes its technology through enterprise IP licensing to semiconductor companies, delivering GDS hard IP and RTL soft IP, reference platforms, and silicon bring-up software. BlueLynx is silicon-proven across 7+ process nodes (16nm, 12nm, 7nm, 6nm, 5nm, 4nm, 3nm and below) at multiple foundries including Samsung Foundry, and supports 2D, 2.5D, and 3D advanced packaging. Primary customers are AI accelerator and HPC chip developers, with the company serving approximately 50+ full-time engineers and operating under an enterprise field-sales motion supplemented by a channel partner (Micon Global) covering EMEA. Blue Cheetah was acquired by Tenstorrent in July 2025 to internalize the chiplet interconnect IP for Tenstorrent's AI and RISC-V product roadmap and to support an open chiplet ecosystem.

Name

Blue Cheetah Analog Design

Legal name

Blue Cheetah Analog Design, Inc.

Website

https://bcanalog.com

Company type

Private

Founded year

2018

Operating status

Acquired

Headcount range

11–50 employees

Short description

Blue Cheetah Analog Design developed the BlueLynx customizable die-to-die interconnect IP platform for chiplet-based semiconductors, supporting UCIe and BoW standards across multiple process nodes for AI accelerator, HPC, and consumer electronics chip designers before its 2025 acquisition by Tenstorrent.

Ownership category

akta.pro rank

Product category

Semiconductor IP

NAICS

Semiconductor Machinery Manufacturing (333242)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Die-to-die interconnect IP
• Chiplet interconnect solutions
• Semiconductor IP licensing
• Physical layer design
• UCIe BoW standards

Headquarters

HQ city

Sunnyvale

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Software

Cost components

Personnel, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor IP Licensing: Blue Cheetah generates revenue through licensing of their BlueLynx die-to-die interconnect IP to semiconductor companies. Customers license the IP for use in their chiplet-based designs, paying for access to the customizable PHY and link layer solutions. The company provides IP deliverables including GDS hard IP and RTL soft IP, reference platforms, and software for silicon bring-up.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels4 records

Core offering

Blue Cheetah develops and licenses the BlueLynx die-to-die (D2D) adaptive interconnect subsystem IP, providing customizable, standards-based PHY and link layer chiplet interfaces that support UCIe and Open Compute Project BoW standards. The company's proprietary executable generator technology rapidly produces tapeout-ready, silicon-proven designs tailored to customer specifications for packaging type, data rate, I/O configuration, and process node, with availability across 7+ process nodes at multiple foundries.

Product overview

Blue Cheetah Analog Design offers a unified chiplet interconnect IP platform called BlueLynx, which consists of a die-to-die (D2D) adaptive interconnect subsystem providing PHY and link layer chiplet interfaces, alongside a proprietary executable generator technology that rapidly creates customized tapeout-ready designs from high-level parameters. The BlueLynx subsystem supports UCIe and OCP BoW standards, operates across 16nm through 3nm and below across multiple semiconductor foundries, and integrates with on-die buses and NoCs using AMBA standards. BlueLynx targets AI/ML, HPC, networking, and mobile applications requiring high-bandwidth, low-latency, power-efficient die-to-die connectivity in 2D, 2.5D, and 3D packaging configurations.

Differentiator

Problem solved

Functional benefit

Brands

• BlueLynx: Die-to-die (D2D) adaptive interconnect subsystem IP providing physical (PHY) and link layer chiplet interfaces supporting Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards.

Products and services

• BlueLynx Die-to-Die Interconnect IP Subsystem BlueLynx is a customizable standards-based die-to-die (D2D) adaptive interconnect subsystem IP providing physical (PHY) and link layer chiplet interfaces supporting Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards. Available across 16nm, 12nm, 7nm, 6nm, 5nm, 4nm, 3nm and below at multiple foundries, BlueLynx connects to on-die buses and NoCs via AMBA AXI, ACE, and CHI standards. Key specs include 40+ Gbps/line, >15 Tbps/mm bandwidth density, <0.300 fJ/bit power for advanced packaging, <2ns PHY-to-PHY latency, and support for 2D, 2.5D, and 3D packaging. Customers receive an industry-standard ASIC integration view with a reference platform and bring-up software for first-pass silicon success. The product targets semiconductor companies building AI, HPC, networking, and mobile chiplet-based designs.

Quantifiable outcome

• Industry-leading bandwidth density exceeding 15+ Tbps/mm with 40+ Gbps/line performance
• +3 more outcomes

Named customers2 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration1 record

Feature5 records

Partnerships

Six partnerships are on record, tiered core and minor.

• TenstorrentcoreTechnology or Integration · 2 July 2025Tenstorrent acquired Blue Cheetah Analog Design in 2025 to enhance its chiplet solutions and develop an open chiplet ecosystem. Prior to acquisition, Tenstorrent had selected Blue Cheetah's chiplet interconnect IP for its AI and RISC-V solutions. The acquisition focused on high-speed interconnects and IP capabilities to support Tenstorrent's product strategies.
• Samsung FoundrycoreTechnology or Integration · 21 January 2025Blue Cheetah taped out its next-generation BlueLynx die-to-die PHY on Samsung Foundry's SF4X 4nm advanced manufacturing process. The PHY supports both advanced and standard chiplet packaging with aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area footprint and power consumption.
• Micon GlobalminorChannel Partner/ Reseller/ Distributor · 3 December 2024Micon Global was selected as a strategic sales representative for Blue Cheetah to expand global presence in EMEA regions. Micon Global has represented top-tier semiconductor providers since 2001, with presence in UK, Israel, Italy, France, Germany, Japan, Korea, and Taiwan.
• LG ElectronicscoreTechnology or Integration · 3 September 2024Blue Cheetah and LG collaborated to demonstrate successful silicon bring-up of a complex System-in-Package (SiP) including chiplets with processors, DDR memory interfaces, AI accelerators, and Blue Cheetah's BlueLynx die-to-die interconnect. This collaboration demonstrates Blue Cheetah's IP in consumer electronics applications for LG's future AI-enabled products.
• Baya SystemscoreStrategic or Co-development Partner · 24 June 2024Blue Cheetah and Baya Systems partnered to deliver a combined chiplet-optimized Network-on-Chip (NoC) and Physical Layer (PHY) interconnect solution. The integration combines Baya's WeaveIP NoC with Blue Cheetah's BlueLynx D2D PHY IP, simplifying chiplet interconnect architecture and design for customers building multi-die systems.
• TenstorrentcoreTechnology or Integration · 6 February 2024Tenstorrent licensed Blue Cheetah's die-to-die interconnect IP for its AI and RISC-V chiplet solutions. This partnership enables Tenstorrent to accelerate development of chiplet-based AI solutions by leveraging Blue Cheetah's customizable, standards-based interconnect technology supporting UCIe and BoW standards.

Scale indicators3 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• Synopsys: Largest semiconductor IP and EDA provider with a DesignWare portfolio that includes UCIe-compliant die-to-die interconnect IP. Directly competes with BlueLynx for chiplet interconnect design wins at the same semiconductor customers.
• Eliyan Corporation: Specialist chiplet interconnect IP company developing its own D2D PHY and interconnect fabric solutions. Closest direct competitor focused exclusively on the same chiplet interconnect niche as Blue Cheetah.
• Alphawave Semi: High-speed connectivity IP company focused on PHY IP for data infrastructure, including die-to-die and SerDes solutions. Competes with BlueLynx for high-bandwidth interconnect IP licensing in HPC, AI, and networking segments.

Broad incumbents

• Cadence Design Systems: Major EDA and IP vendor offering a broad portfolio including high-speed SerDes and emerging chiplet interconnect IP. Competes with Blue Cheetah broadly across interconnect IP and is the former employer of several Blue Cheetah VPs.
• Marvell Technology: Large semiconductor company with deep custom-silicon and interconnect IP heritage and founders/investors shared with Blue Cheetah. Relevant as an established incumbent in custom silicon and interconnect IP for data infrastructure.

Emerging players

• Astera Labs: Connectivity-focused semiconductor company providing silicon and IP for cloud and AI infrastructure interconnects. Overlaps with Blue Cheetah's chiplet interconnect mission in AI compute and data center segments.
• Mobiveil: IP company developing controller and PHY IP including interconnect and memory solutions. Competes in adjacent interconnect IP licensing deals for chip designers evaluating chiplet connectivity.

Regional players

• Faraday Technology: Taiwan-based ASIC and IP provider offering design services and IP cores including interconnect solutions. Comparable as a regional IP/semiconductor design services peer serving fabless customers across APAC.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/blue-cheetah-analog-design-inc

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Blue Cheetah Analog Design