Absolics
Absolics Inc. is a U.S.-based semiconductor materials company, subsidiary of South Korea's SKC Ltd., that manufactures glass-core substrates under the inProut™ brand for advanced chip packaging targeting AI accelerator GPUs, hyperscale data center custom silicon, MPUs, and enterprise multi-die integration customers globally.
- Company typePrivate
- Founded2018
- HeadquartersCovington, United States
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Absolics does
Absolics Inc. is a U.S.-based semiconductor materials company developing and manufacturing glass substrate technology for advanced chip packaging. Founded in 2018 in Covington, Georgia as a subsidiary of South Korea's SKC Ltd. (part of SK Group), the company sells a proprietary glass-core platform branded inProut™ that is engineered to replace or supplement traditional silicon and organic substrates in next-generation chip packages. The technology targets large-die AI accelerator GPUs/NPUs, hyperscale data center custom silicon (TPUs, DPUs, custom ASICs), microprocessors (MPUs), and enterprise-scale multi-die integration, with claimed benefits of greater than 40% power efficiency improvement and more than 25% chip thickness reduction versus incumbent substrate approaches. Technical differentiators include panel-handling automation, device embedding with active and passive component integration, ultra-fine micro-via interconnections, and AI-driven manufacturing intelligence for process optimization, predictive maintenance, and defect detection. The SVM (Silicon Valley Materials) manufacturing facility in Covington was completed and commissioned in 2024, targeting mass production by end of 2025 and positioning Absolics as the operator of the world's first glass substrate mass production plant.
The business model is a B2B direct enterprise sales motion selling glass substrate panels to semiconductor manufacturers, AI chip designers, and hyperscale data center operators across more than 40 countries, with international commercial offices in London and Singapore supplementing the Georgia headquarters. Pricing is negotiated bilaterally with chipmaker customers under confidential enterprise agreements; no public pricing exists. Revenue is currently negligible to non-existent as the company transitions from commissioning to commercial qualification and mass production. Capital structure is dominated by parent SKC Ltd., which holds a controlling stake (SK Inc. 40.64%) and has committed substantial capital — including a reported ~600 billion KRW allocation from a ~1 trillion KRW SKC capital increase — alongside $175 million in cumulative U.S. CHIPS Act grants ($75M manufacturing in May 2024 and up to $100M R&D in December 2024). The company is also a co-recipient with Applied Materials and Arizona State University of $300M in CHIPS for America National Advanced Packaging Manufacturing Program funding.
Leadership blends former Intel and SK hynix semiconductor packaging executives (CEOs Kang Ji-ho and Kim Jong-woo), and the company operates 101–250 employees. The principal forward execution risks are chipmaker qualification timelines for novel substrate materials, the operational yield ramp of a first-of-its-kind glass substrate line, and the dual-track strategy that splits engineering attention between high-performance AI data center glass substrates and faster-commercialization variants.
Absolics firmographics
Firmographics- Name
- Absolics
- Legal name
- Absolics Inc.
- Website
- https://absolicsinc.com
- Company type
- Private
- Founded year
- 2018
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- Absolics Inc. is a U.S.-based semiconductor materials company, subsidiary of South Korea's SKC Ltd., that manufactures glass-core substrates under the inProut™ brand for advanced chip packaging targeting AI accelerator GPUs, hyperscale data center custom silicon, MPUs, and enterprise multi-die integration customers globally.
- Ownership category
- akta.pro rank
Absolics industry classification
Industry- Product category
- Semiconductor Advanced Packaging (Glass Substrates)
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (3344), Flat Glass Manufacturing (327211)
- SIC
- Flat Glass (3211)
- akta.pro primary industry
- Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE)
- akta.pro secondary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
Keywords
Where Absolics is headquartered
LocationHeadquarters
- HQ city
- Covington
- HQ country
- United States
- HQ region
- North America
Offices4 records
Markets served
Absolics business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Supply Chain, Infrastructure, Technology or R&D, Personnel, Operations, Marketing or Sales
Revenue model
- Glass Substrate Hardware Sales: B2B sale of glass substrates for semiconductor chip packaging. Absolics manufactures and sells glass substrate panels to semiconductor companies for use in AI chips, GPUs, data center processors, and custom ASICs.
Go-to-market motion1 record
Distribution channels1 record
Marketing channels3 records
Absolics product offering
Product offeringCore offering
Absolics manufactures and sells glass substrate panels for advanced semiconductor packaging under its proprietary inProut™ glass-core platform. The substrates are designed for AI accelerator GPUs, hyperscale data-center processors (TPUs, DPUs, custom ASICs), and high-performance computing chips, replacing traditional silicon and organic substrates to improve power efficiency (over 40%) and reduce chip thickness (over 25%). Production occurs at the SVM facility in Covington, Georgia, with sales conducted through direct B2B enterprise engagement.
Product overview
Absolics offers a single unified product platform centered on its inProut™ Glass Substrate technology. This glass-core platform serves as the foundational material for advanced semiconductor packaging, targeting AI accelerator GPUs, hyperscale data centers, and custom ASICs. The platform comprises manufacturing capabilities including panel handling automation, device embedding, tailored reliability features, ultra-fine interconnections, and AI-driven manufacturing intelligence to enable next-generation computing and scalable AI infrastructure.
Differentiator
Problem solved
Functional benefit
Brands
- inProut™: Innovative glass-core platform engineered to eliminate traditional silicon bottlenecks, accelerating data velocity and energy efficiency for next-generation AI chips.
Products and services
- inProut™ Glass Substrate
Quantifiable outcome
- Over 40% power efficiency improvement
- +2 more outcomes
Companies that use Absolics
Customer profileNamed customers3 records
Segments4 records
Ideal customer profiles3 records
Absolics technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
AI capability4 records
Feature6 records
Absolics partnerships and signals
Strategic signalPartnerships
Two partnerships are on record, tiered major.
- Applied Materials Inc.majorCo-recipient of $300 million National Advanced Packaging Manufacturing Program funding. All three recipients (Absolics, Applied Materials, Arizona State University) sharing $300M in total funding with expected investment exceeding $470 million combined.
- Arizona State UniversitymajorCo-recipient of $300 million National Advanced Packaging Manufacturing Program funding. Partnership aims to develop advanced substrates and packaging technology for AI, next-generation wireless communication, and power electronics.
Scale indicators6 records
Recent moves10 records
Expansion highlights6 records
Absolics competitors and assessment
Company assessmentBroad incumbents
- Intel Corporation: Intel is publicly developing glass substrate technology for its Foveros and advanced packaging roadmaps. It is a broad incumbent pursuing in-house glass substrates — directly relevant as both a potential competitor and a potential customer/partner for Absolics' glass-core platform.
- Amkor Technology: Amkor is one of the world's largest OSAT providers offering advanced packaging services including 2.5D/3D and chiplet integration. It is a broad incumbent serving the same AI and hyperscaler customers that Absolics targets, and a likely downstream partner or competitor depending on integration model.
- TSMC: TSMC operates industry-leading advanced packaging services (CoWoS, InFO, SoIC) and is a primary customer ecosystem for substrate suppliers including Absolics. While not a substrate manufacturer, it is a critical comparand as the leading advanced-packaging foundry and potential offtake partner.
- ASE Technology Holding: ASE is the largest OSAT globally, offering advanced packaging including fan-out wafer-level packaging and 2.5D/3D integration. It competes in the broader advanced packaging ecosystem and is a natural comparand for Absolics' downstream integration ambitions.
Direct peers
- Unimicron Technology Corp. Unimicron is one of the world's largest PCB and IC substrate manufacturers, with significant exposure to advanced packaging substrates for AI, networking, and HPC chips. It is a direct competitor in the high-end substrate market Absolics targets.
- AT&S Austria Technologie & Systemtechnik: AT&S is a European-headquartered advanced substrate manufacturer producing IC substrates and package substrates for high-performance computing and AI applications. Its substrate roadmap directly competes with Absolics' glass-core platform.
- Shinko Electric Industries: Shinko is a top Japanese flip-chip BGA substrate supplier serving high-end computing and AI applications. Its product portfolio of advanced IC substrates directly overlaps with Absolics' inProut™ target market.
- Ibiden Co., Ltd. Ibiden is a leading Japanese IC substrate manufacturer specializing in high-end flip-chip BGA and build-up substrates for advanced packaging. It competes directly in the high-density substrate category Absolics targets for AI accelerators and HPC.
- Samsung Electro-Mechanics: Samsung Electro-Mechanics is a major global substrate manufacturer producing flip-chip BGA and advanced packaging substrates for AI/HPC applications. It is the most direct competitor to Absolics in advanced semiconductor packaging substrates, with deep relationships across Samsung's chip franchise.
Regional players
- LG Innotek: LG Innotek is a Korean substrate manufacturer (under SKC's domestic peer group) producing flip-chip BGA substrates for mobile and computing applications. It is a regional competitor with significant Asia-customer penetration overlapping Absolics' AI accelerator and hyperscaler target markets.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat6 records
Key risks6 records
Key highlights7 records
Customer concentration
Absolics social profiles
Digital presenceAbsolics financial estimates
Financial estimateRevenue estimate
Valuation estimate
Absolics leadership team
Management profileNumber of profiles
Profiles4 records
Absolics funding detail
Funding detailFunding overview
Funding rounds2 records
Investors1 record
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Absolics M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Absolics
What does Absolics do?
Absolics manufactures and sells glass substrate panels for advanced semiconductor packaging under its proprietary inProut™ glass-core platform. The substrates are designed for AI accelerator GPUs, hyperscale data-center processors (TPUs, DPUs, custom ASICs), and high-performance computing chips, replacing traditional silicon and organic substrates to improve power efficiency (over 40%) and reduce chip thickness (over 25%). Production occurs at the SVM facility in Covington, Georgia, with sales conducted through direct B2B enterprise engagement.
Is Absolics a public or private company?
Absolics is a private company. It is classified as corporate owned and is currently operating.
When was Absolics founded?
Absolics was founded in 2018. It employs 101 to 250 people.
Where is Absolics based?
Absolics is headquartered in Covington, United States, in the North America region.
How does Absolics make money?
One revenue line is on record: glass Substrate Hardware Sales.
Who are Absolics's main competitors?
Broad incumbents on record are Intel Corporation, Amkor Technology, TSMC and ASE Technology Holding. Direct peers are Unimicron Technology Corp., AT&S Austria Technologie & Systemtechnik, Shinko Electric Industries, Ibiden Co., Ltd. and Samsung Electro-Mechanics. LG Innotek is listed as a regional player.
Does Absolics have an API?
No public API is recorded for Absolics.
What industry is Absolics in?
Absolics's product category is Semiconductor Advanced Packaging (Glass Substrates). Its primary akta.pro industry code is HDAHADAE, Package Substrates & Interposers (ABF/BT, Silicon/Glass), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 3344 and its SIC code is 3211.