What Primemas does

Primemas is a fabless semiconductor company founded in 2023 by Dr. Il Park (formerly VP of DRAM Solutions at SK hynix, with prior experience at Samsung Electronics and IBM Watson Research), headquartered in Santa Clara, California with an R&D center in Seongnam, South Korea (Primemas Korea Inc.). The company develops and sells "Hublet," which it describes as the world's first chiplet-based Hub SoC platform — a pre-built, modular system-on-chip foundation that integrates CPU clusters, DDR controllers, die-to-die interfaces, and CXL 3.0/PCIe connectivity. Customers attach their own custom accelerator chiplets to Hublet to produce full SoC products, with the company claiming this approach reduces development cost to under 10% of traditional ASIC manufacturing and cuts time-to-market from 2–3 years to under one year. The core chip product is Falcon-1, a chiplet-based CXL 3.0 controller SoC, supplemented by the Kameleon FPGA companion chiplet, the Bitlets software-configurable hardware platform, and a memory infrastructure product line (JBOM appliances, Direct Attached Memory modules, Switchless Pooled Memory systems, and Near Memory Computing) targeting AI data centers. Primemas also offers Physical AI acceleration products (Mobile Vision AI, Multimodal AI) running third-party models such as YOLO11 and Qwen3-VL on its NPU-equipped silicon.

The company's business model is direct B2B enterprise sales of chiplet-based SoC platforms, CXL memory expansion modules, and AI acceleration hardware to hyperscalers (Microsoft referenced), memory manufacturers (Samsung, SK hynix, Micron), AI chip designers, and government/research end customers (US Department of Energy national laboratories via Micron). Distribution is exclusively through direct sales engagement by the executive team (CEO, EVP Business Development) and through channel co-development with DRAM manufacturers — Samsung Electronics (CXL joint development MOU since August 2024), Micron (CXL AVL program with mass production commitment from H2 2026), and SK hynix. Revenue is generated from hardware sales (chiplet SoC, AIC memory cards, JBOM appliances), IP/platform licensing, and engineering services, priced via quote-based multi-year enterprise contracts with no public list pricing. As of June 2025, the company had shipped customer samples of its CXL 3.0 SoC and was on track for mass production in H2 2026; total disclosed funding is approximately $79M across a pre-A round (Oct 2023) and a Series B (June 2025).

Name

Primemas

Legal name

Primemas Inc.

Website

https://primemas.com

Company type

Private

Founded year

2023

Operating status

Operating

Headcount range

11–50 employees

Short description

Primemas is a fabless semiconductor startup that develops Hublet, the world's first chiplet-based Hub SoC platform with CXL 3.0 silicon, selling chiplets, JBOM memory appliances, and AI acceleration modules to memory manufacturers (Samsung, Micron, SK hynix), hyperscalers, and AI chip designers.

Ownership category

akta.pro rank

Product category

Semiconductor Chiplet SoC Platform

NAICS

Computer Systems Design and Related Services (54151)

SIC

Computer Storage Devices (3572)

akta.pro primary industry

Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC) (HDAHABAC)

akta.pro secondary industry

AI Interconnects & Fabric (NVLink/CXL/PCIe/Switches) (HDAAAAAD)

Keywords

• Chiplet semiconductor design
• CXL memory expansion
• AI data infrastructure
• Hub SoC platform
• Fabless semiconductor chips

Headquarters

HQ city

Santa Clara

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations

Revenue model

1. Chiplet-based SoC / Hublet Platform Sales: Fabless semiconductor company selling chiplet-based Hub SoC platforms (Falcon-1) and companion chiplets (Kameleon). Revenue is generated from chip sales, IP licensing, and platform access fees. Customers (hyperscalers, AI chip designers, memory companies) purchase Hublet-based components or full solutions. Pricing is likely per-unit for chips and modules, with engineering services potentially bundled for enterprise customers.
2. AI Data Infrastructure Solutions (JBOM, Memory Expansion): Sale of CXL-based memory expansion products including AIC (Add-in Card) memory expansion modules, JBOM (Just a Bunch of Memory) appliances, and Switchless Pooled Memory systems. Revenue is generated from product sales to memory manufacturers (Micron) and data center operators. Products range from 256GB direct-attached modules to multi-petabyte JBOM systems.
3. FPGA / Prototyping Platform Licensing: Sale or licensing of Kameleon FPGA chiplets and Bitlets technology for rapid hardware prototyping and emulation. Customers can use the platform to prototype custom AI accelerators and SoCs without designing from scratch.

Pricing tiers

Go-to-market motion2 records

Distribution channels3 records

Marketing channels5 records

Core offering

Primemas is a fabless semiconductor company that develops chiplet-based Hub SoC platforms called Hublets (Falcon-1), integrating CPU clusters, DDR controllers, D2D interfaces, and CXL 3.0/PCIe connectivity into a pre-built, modular SoC foundation. Customers combine their custom accelerator or memory chiplets with the Hublet to create full SoC products, while also deploying Primemas' CXL-based memory expansion solutions (JBOM, Direct Attached Memory, Switchless Pooled Memory) for AI data center infrastructure.

Product overview

Primemas offers a platform-plus-modules architecture centered on its Hublet chiplet-based Hub SoC platform. The core product is Falcon-1, the world's first chiplet-based SoC platform, which serves as a pre-built, reusable foundation that customers combine with specialized chiplets. Supporting modules include Kameleon (FPGA companion chiplet for prototyping), Bitlets (software-configurable hardware blocks), and memory solutions (JBOM, Direct Attached Memory, Switchless Pooled Memory, Near Memory Computing) for AI data infrastructure. AI acceleration is provided through Mobile Vision AI and Multimodal AI solutions for Physical AI applications. Reconfigurable hardware offerings include Emulation Hardware and Bespoke Hardware for prototyping and custom acceleration. All products are built on CXL technology for memory expansion and interconnect.

Differentiator

Problem solved

Functional benefit

Brands

• Hublet: World's first chiplet-based Hub SoC platform that provides pre-built SoC hub chiplets to streamline custom chip design and reduce time-to-market. Available in configurations from 1x1 to 4x4 for various memory and accelerator applications.
• Falcon
• Kameleon
• JBOM (Just a Bunch of Memory)

Products and services

• Falcon-1 SoC World's first chiplet-based CXL 3.0 controller SoC that combines high-bandwidth, low-latency die-to-die interface, low-power CPU cluster, scalable NoC bus, abundant memory, and efficient resource scheduler. Supports E3.S and AIC form factors for CXL memory expansion. Serves as the foundation for CXL memory systems, AI/ML accelerators, and server solutions for hyperscalers and memory manufacturers.
• Kameleon FPGA Companion Chiplet FPGA-based companion chiplet for Falcon-1 enabling rapid prototyping and dynamic feature expansion. Provides reconfigurable hardware for industrial robotics, AI/ML acceleration, database processing, and FPGA-based prototyping. Allows customers to program FPGAs via software APIs without HDL knowledge.
• Hublet Platform World's first chiplet-based Hub SoC platform providing I/O, control, and compute functionality in a scalable format, using high-performance D2D interfaces to achieve infrastructure sharing with custom dies. Supports configurations from 1x1 (512GB) to 4x4 (8TB DRAM). Enables customers to build full SoCs by attaching custom chiplets to the Hublet.
• JBOM (Just a Bunch of Memory) Enterprise-grade CXL-based memory appliance solution that pools multiple AIC memory cards into a massive DRAM pool. Scales from 40TB to 120TB (2026) and up to 240TB+ (2027). Enables CPU server DRAM capacity expansion from 2-4TB baseline to hundreds of TB per server, dramatically improving GPU utilization and eliminating memory bottlenecks in AI data centers.
• Direct Attached Memory High-density CXL memory expansion modules (E3.S, AIC form factors) providing 256GB to 4TB of instant DRAM memory expansion for memory-intensive single-server workloads with low-latency performance boost.
• Switchless Pooled Memory Memory disaggregation solution enabling multiple servers (from few to 10s) to share a flexible DRAM pool of 1TB to 20TB capacity using proprietary switchless architecture, reducing datacenter TCO by eliminating external CXL switch costs.
• Near Memory Computing (NMC) Solution integrating Near-Data Processing (NDP) technology that moves memory-intensive computations closer to memory, minimizing data movement, reducing latency, and improving energy efficiency for memory-intensive workloads.
• AI Inference for Physical AI - Mobile Vision AI AI vision solution combining stereo camera interface with NPU processor to efficiently run advanced vision models like YOLO11, optimized for lightweight edge devices including drones, traffic monitors, and real-time security systems.
• AI Inference for Physical AI - Multimodal AI Multimodal vision-language AI solution supporting state-of-the-art models such as Qwen3-VL, combining stereo camera interface with NPU and 256GB-1TB high-capacity memory for physical AI systems requiring sophisticated reasoning and contextual understanding.
• Bitlets Reconfigurable Hardware Platform Reconfigurable hardware technology enabling software applications to dynamically assemble and program new hardware architectures at runtime by combining modular Bitlets from an extensive library, without requiring hardware engineering expertise or HDL knowledge.
• Emulation Hardware Platform Emulation platform combining multiple Hublets with Kameleon FPGA chiplets to prototype and execute pre-silicon system designs at scale, supporting large-scale validation workloads for comprehensive testing before silicon fabrication.
• Bespoke Hardware Platform Custom hardware solution platform using Hublet with multiple Kameleon FPGA chiplets, enabling rapid design and deployment of task-specific hardware through intuitive software APIs without engaging directly with FPGA design flows.

Quantifiable outcome

• DB performance improvement of 20-80x with JBOM solutions
• +5 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability5 records

Feature7 records

Partnerships

13 partnerships are on record, tiered core, flagship and minor.

• ETRI (Korea Electronics and Telecommunications Research Institute)coreStrategic or Co-development Partner · 6 April 2026ETRI joined the Samsung Electronics–Primemas CXL partnership in April 2026. ETRI integrates the technologies from both companies into ultra-large-capacity memory chassis — a complete system form factor — implementing system-level innovation. ETRI contributes system integration capabilities to combine chiplet SoC, DRAM, and system integration into a production-ready CXL memory solution.
• Micron TechnologyflagshipStrategic or Co-development Partner · 23 June 2025Micron and Primemas are collaborating through Micron's CXL ASIC Validation Lab (AVL) program. Primemas supplies its Falcon CXL 3.0 controller SoC for integration into Micron's memory module ecosystem. The collaboration combines the world's first CXL 3.0 controller with Micron's high-capacity 128GB RDIMM modules for high-quality memory solutions targeting AI data centers. Micron has confirmed mass production supply from Primemas starting H2 2026, with final products supplied to US Department of Energy national laboratories.
• Samsung ElectronicsflagshipStrategic or Co-development Partner · 1 August 2024Samsung Electronics and Primemas signed an MOU in August 2024 for joint R&D on advanced CXL solutions and CXL memory ecosystem expansion. Samsung provides CXL-based data center memory fabric management technology, latest DDR DIMM and high-capacity DRAM technology, and memory orchestration software. Primemas provides the Falcon chiplet-based CXL controller SoC for AIC-type memory expansion solutions. In April 2026, ETRI joined the partnership to develop ultra-large-capacity CXL memory solutions into a complete system chassis.
• Plug and Play NeoCitycoreGTM or Marketing Partner · 26 June 2024Selected for Plug and Play NeoCity Semiconductor Accelerator Program's inaugural cohort in 2024. The accelerator, with partners Osceola County, BRIDG, and imec, provides workshops, mentorship, and business development resources. Primemas joined to accelerate go-to-market for its chiplet products.
• Global Semiconductor Alliance (GSA)coreGTM or Marketing Partner · 26 June 2024Primemas joined the Global Semiconductor Alliance in 2024 to advance semiconductor technology and bring chiplet benefits to AI applications. GSA membership connects Primemas with a network of innovative technology companies in the semiconductor industry.
• AchronixcoreTechnology or Integration · 19 June 2024Primemas integrates Achronix Speedcore embedded FPGA (eFPGA) IP into the Hublet chiplet platform. The Speedcore IP enables programmable, flexible, and scalable FPGA functionality within the Hublet, allowing customers to prototype and test custom algorithms. When paired with a custom FPGA chiplet die, the Hublet provides a cost-effective and scalable solution for data centers, cloud service providers, and memory manufacturers. Steve Mensor, VP Marketing at Achronix, stated the semiconductor chiplet ecosystem has reached critical mass and Primemas is positioned to capitalize on this emerging market.
• SK hynixcoreTechnology or IntegrationSK hynix is listed as a key partner on Primemas' company website, alongside Samsung Electronics and Micron. The partnership involves CXL memory ecosystem collaboration and platform access, similar to the Micron AVL program model.
• MicrosoftcoreStrategic or Co-development PartnerMicrosoft is listed as a key partner on Primemas' company website. Per press coverage, Primemas is expanding collaboration with global data center operators including Microsoft for CXL-based memory solutions and AI infrastructure deployment.
• ArmcoreTechnology or IntegrationArm is listed as a key partner on Primemas' company website. The partnership involves Arm's CPU IP being integrated into the Hublet platform's high-performance multi-core CPU cluster with advanced processing capabilities.
• SynopsyscoreTechnology or IntegrationSynopsys is listed as a key partner on Primemas' company website. Synopsys provides EDA (Electronic Design Automation) tools and IP used in the design and verification of Primemas' Hublet SoC platform.
• TSMCcoreTechnology or IntegrationTSMC is listed as a key partner on Primemas' company website. TSMC provides wafer fabrication services for Primemas' chiplet-based SoC products (Falcon-1).
• Amkor TechnologycoreTechnology or IntegrationAmkor Technology is listed as a key partner on Primemas' company website. Amkor provides advanced packaging and test services for Primemas' chiplet products, enabling the chiplet integration and packaging technology central to the Hublet platform.
• ASICLANDminorImplementation/ SI/ Consulting PartnerASICLAND is listed as a key partner on Primemas' company website. ASICLAND likely provides design services orEDA tool support for SoC development.

Scale indicators10 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Astera Labs: Astera Labs designs CXL/PCIe connectivity and memory controller silicon for AI and cloud data centers, with a comparable fabless semiconductor business model and overlapping customer base of hyperscalers and OEMs. Directly comparable as a fabless CXL/connectivity silicon vendor.
• Eliyan: Eliyan (formerly Blue Cheetah) develops chiplet interconnect PHY technology, including UCIe-based die-to-die IP that competes with Primemas' Hublet D2D interfaces. Directly comparable in the chiplet interconnect layer of the same fabless ecosystem.
• XConn Technologies: XConn builds CXL switch and pooling silicon, competing in the same CXL memory expansion and pooling market that Primemas' JBOM and Switchless Pooled Memory products target. Directly comparable CXL-focused fabless startup.
• Achronix Semiconductor: Achronix provides high-performance FPGAs and embedded FPGA (eFPGA) IP, and is an explicit Primemas partner (Speedcore eFPGA integrated into Hublet). Comparable as a fabless FPGA/eFPGA vendor in the same chiplet ecosystem.

Broad incumbents

• Marvell Technology: Marvell is an established fabless semiconductor company offering custom silicon, data center interconnect, and storage controllers — overlapping with Primemas' custom compute platform and data infrastructure silicon ambitions as a broad incumbent.
• AMD: AMD pioneered commercial chiplet-based CPU designs (EPYC, Ryzen) and offers the Infinity Fabric interconnect that competes conceptually with Primemas' Hublet D2D architecture. Comparable as the established chiplet architecture reference point.
• Intel Corporation: Intel is a broad semiconductor incumbent with active chiplet (Foveros) and CXL initiatives, including a foundry business that could compete with or enable Primemas' chiplet SoC platform. Comparable as the largest incumbent in both compute and CXL memory.

Others

• Rambus: Rambus provides memory interface and CXL IP and is also listed as a Primemas partner. Comparable as an enabling IP vendor in the same CXL and DDR memory ecosystem, rather than a direct SoC competitor.

Emerging players

• SiFive: SiFive offers customizable RISC-V compute IP and chiplet-ready subsystems, overlapping with Primemas' Hublet model of pre-built SoC building blocks that customers extend with their own IP. Comparable as an emerging player in custom compute platforms.
• Tenstorrent: Tenstorrent develops AI accelerator chiplets and RISC-based compute, and like Primemas targets the same AI accelerator and chiplet-based custom silicon market. Comparable as a fabless AI accelerator startup intersecting Primemas' customer base.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/@PRIMEMAS_Chiplet
• LinkedInlinkedin.com/company/primemas

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries1 record

Funding overview

Funding rounds2 records

Investors7 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Primemas