Advanced Micro-Fabrication Equipment
AMEC (中微公司, 688012.SH) designs and manufactures plasma etching, MOCVD, and thin-film deposition equipment for global semiconductor foundries, memory chip makers, and LED manufacturers, with tools qualified from 65nm down to 3nm and over 80% global share in GaN-based LED MOCVD.
- Company typePublic
- Founded2004
- HeadquartersShanghai, China
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Advanced Micro-Fabrication Equipment does
Advanced Micro-Fabrication Equipment (AMEC, ticker 688012.SH, 中微公司) is a Shanghai-headquartered semiconductor capital equipment manufacturer founded in 2004 by Dr. Yin Zhixiong and 15 Silicon Valley veterans, and listed on the Shanghai Stock Exchange STAR Market since July 2019. The company designs and produces plasma etching equipment (CCP and ICP architectures), metal-organic chemical vapor deposition (MOCVD) systems for GaN-based LEDs and power devices, thin-film deposition tools (LPCVD, ALD, PVD), and environmental/abatement equipment for semiconductor fabs. Its industry-first dual-reaction-chamber (反应台) platform processes two wafers per reactor, reducing per-wafer capital cost by approximately 30% versus single-chamber alternatives, and its etch tools are qualified at process nodes from 65nm down to 3nm and below at TSMC, SMIC, YMTC, CXMT, and leading Korean memory manufacturers. AMEC holds more than 80% global market share in GaN-based LED MOCVD equipment and has shipped over 7,800 reaction chambers into 170+ production lines globally.
The company operates a direct enterprise sales model with 15 regional offices and 6 overseas subsidiaries covering China, Taiwan, Singapore, South Korea, Germany, Italy, and North America, with all equipment sold and serviced directly by in-house engineering teams rather than through resellers. Revenue is generated primarily through hardware sales of equipment, supplemented by on-site technical support, spare parts, and operational consulting. 2025 revenue reached approximately 12.385 billion yuan (roughly $1.7 billion USD) at 36.62% year-over-year growth, with net profit attributable to parent shareholders of 2.111 billion yuan (up 30.69% YoY) and R&D investment of 37.44 billion yuan representing 30.2% of sales. Manufacturing and R&D are anchored at the Lingang industrialization base (180,000 sqm, operational August 2024) and Nanchang base (140,000 sqm, operational July 2023), with additional capacity under construction in Guangzhou, Chengdu, and a South China headquarters (groundbreaking September 2025).
Advanced Micro-Fabrication Equipment firmographics
Firmographics- Name
- Advanced Micro-Fabrication Equipment
- Legal name
- 中微半导体设备(上海)股份有限公司
- Website
- http://www.amec-inc.com/
- Company type
- Public
- Founded year
- 2004
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- AMEC (中微公司, 688012.SH) designs and manufactures plasma etching, MOCVD, and thin-film deposition equipment for global semiconductor foundries, memory chip makers, and LED manufacturers, with tools qualified from 65nm down to 3nm and over 80% global share in GaN-based LED MOCVD.
- Ownership category
- akta.pro rank
Advanced Micro-Fabrication Equipment industry classification
Industry- Product category
- Semiconductor Manufacturing Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Electronic & Other Electrical Equipment (No Computer Equip) (3600)
- akta.pro primary industry
- Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware) (IMAGAGAK)
Keywords
Where Advanced Micro-Fabrication Equipment is headquartered
LocationHeadquarters
- HQ city
- Shanghai
- HQ country
- China
- HQ region
- Asia
Offices11 records
Markets served
Advanced Micro-Fabrication Equipment business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Supply Chain, Operations, Infrastructure
Revenue model
- Semiconductor equipment sales: AMEC generates revenue primarily through the sale of plasma etching equipment, MOCVD equipment, thin film deposition equipment, and related services to global integrated circuit and LED chip manufacturers. The company reported 2025 revenue of approximately 123.85 billion yuan, with etching equipment sales of 98.32 billion yuan and LPCVD/ALD equipment sales of 5.06 billion yuan.
- Customer support and field services: On-site technical support, spare parts management, and operational consulting services provided to customers alongside equipment sales, supporting the high-value hardware revenue stream.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | High-end semiconductor fabrication equipment with enterprise-level pricing |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels5 records
Advanced Micro-Fabrication Equipment product offering
Product offeringCore offering
AMEC designs, manufactures, and sells high-end semiconductor micro-fabrication equipment, with a platform-based portfolio comprising plasma etching equipment (CCP and ICP systems covering 65nm to 3nm nodes), MOCVD equipment for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device production, thin film deposition equipment (LPCVD, ALD, PVD), and environmental protection equipment. The company sells directly to global integrated circuit manufacturers, LED chip makers, and advanced packaging companies, with more than 7,800 reaction chambers shipped across 170+ production lines globally.
Product overview
Advanced Micro-Fabrication Equipment (AMEC/中微公司) is a China-based, globally-oriented high-end semiconductor micro-fabrication equipment company providing equipment and high-quality services for the integrated circuit and compound semiconductor industries. The company operates a platform-based business model with three main product families: (1) Plasma Etching Equipment — CCP (capacitively coupled plasma) and ICP (inductively coupled plasma) systems spanning dual-reaction-chamber and single-reaction-chamber configurations, covering 9 etching equipment models including Primo D-RIE®, Primo AD-RIE®, Primo SSC AD-RIE®, Primo HD-RIE®, Primo TSV®, Primo nanova®, Primo Twin-Star®, Primo Angnova™, Primo Domingo™, Primo Halona™, and Primo Menova™, covering 95%+ of hundreds of etching applications from 65nm to 3nm and below; (2) MOCVD Equipment — including PRISMO D-BLUE®, PRISMO A7®, PRISMO HiT3®, PRISMO UniMax®, and Preciomo Udx® for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device (SiC, GaN) production; (3) Thin Film Deposition Equipment — Preforma Uniflash® and Preforma Uniflex® series covering LPCVD, ALD, PVD, PECVD, and EPI technologies for conductor and semiconductor films. The company also offers environmental protection equipment (VOC purification, plasma exhaust treatment, combustion water-wash systems). As of 2025, the company had shipped over 7,800 plasma and chemical film reaction chambers to more than 170 production lines globally.
Differentiator
Problem solved
Functional benefit
Products and services
- Primo D-RIE Dual-reaction-chamber CCP (capacitively coupled plasma) high-energy plasma etching equipment for dielectric etching, covering processes from 65nm to 5nm and below.
- Primo AD-RIE Dual-reaction-chamber CCP etching equipment with switchable dual low-frequency RF sources for 28nm to 5nm and below advanced processes.
- Primo SSC AD-RIE Single-reaction-chamber CCP etching equipment for high-aspect-ratio contact hole etching, trench etching, and serial etching at 2xnm and 1xnm nodes.
- Primo iDEA Integrated dielectric etching and photoresist ashing system combining dual-reaction-chamber CCP etching with dual-reaction-chamber plasma ash in one system.
- Primo HD-RIE High-density plasma etching equipment for 3D NAND and DRAM high-aspect-ratio trench and deep hole etching.
- Primo TSV Through-silicon via etching equipment for 3D chip packaging and advanced packaging applications, available in 8-inch and 12-inch versions.
- Primo nanova ICP (inductively coupled plasma) etching equipment for 7nm, 5nm and below advanced logic and memory chip production with symmetric reaction chambers.
- Primo Twin-Star Dual-reaction-chamber ICP etching equipment for conductive/dielectric film etching in IC front-end and back-end processes, suitable for power devices and CMOS image sensors.
- Primo UD-RIE Ultra-low energy ICP etching equipment for advanced semiconductor manufacturing.
- Primo Angnova Next-generation ICP etching equipment launched in 2026, featuring advanced plasma technology for silicon and compound semiconductor critical processes.
- Primo Domingo High-selectivity etcher launched in 2026 for advanced semiconductor etching applications.
- Primo Halona First wafer edge etching equipment launched in April 2025, expanding coverage of critical etching processes.
- Primo Menova 12-inch metal etching equipment with global first delivery in June 2025, expanding the company's metal etching product portfolio.
- PRISMO D-BLUE First domestically developed mass-production MOCVD equipment for GaN-based LED epitaxial wafer production.
- PRISMO A7 Second-generation MOCVD equipment for GaN-based LED production with improved throughput and performance over first-generation tools.
- PRISMO HiT3 MOCVD equipment for deep UV LED production, capable of processing 18x2-inch wafers at reaction chamber temperatures up to 1400 degrees Celsius.
- PRISMO UniMax MOCVD equipment for high-performance Mini LED mass production, featuring multi-zone temperature control system and large 785mm diameter substrate for up to 164x4-inch or 72x6-inch wafers.
- Preciomo Udx Blue/green Micro LED mass production MOCVD equipment launched in 2026, further enriching the MOCVD product family.
- Preforma Uniflash TiAl 12-inch high-aspect-ratio metal tungsten deposition equipment using atomic layer deposition technology.
- Preforma Uniflash TaN 12-inch tungsten nitride deposition equipment for complex structure metal tungsten fill applications.
- Preforma Uniflash TiN 12-inch titanium nitride deposition equipment with excellent step coverage and low resistivity characteristics.
- Preforma Uniflex AW 12-inch atomic layer metal tungsten deposition equipment with proprietary high-speed gas switching control system for atomic-level growth precision.
- Preforma Uniflex HW 12-inch high-aspect-ratio metal tungsten deposition equipment with up to five dual-reaction-chamber configuration for high productivity.
- Preforma Uniflex CW 12-inch LPCVD equipment for contact hole and metal tungsten line fill applications in advanced logic, DRAM, and 3D NAND devices.
- VOC Purification Equipment Volatile organic compound purification equipment for environmental protection in semiconductor manufacturing facilities.
- Plasma Exhaust Gas Treatment Equipment Plasma-based exhaust gas treatment equipment for semiconductor fab environmental compliance.
- Combustion Water-Wash Exhaust Gas Treatment Equipment Combustion water-wash exhaust gas treatment equipment for hazardous gas abatement.
- Smart RF Match Intelligent RF matcher launched in 2026 as a core intelligent component for semiconductor equipment.
Quantifiable outcome
- AMEC maintained over 35% average annual revenue growth for 13 consecutive years through 2025
- +6 more outcomes
Companies that use Advanced Micro-Fabrication Equipment
Customer profileNamed customers10 records
Segments3 records
Ideal customer profiles3 records
Advanced Micro-Fabrication Equipment technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
Advanced Micro-Fabrication Equipment partnerships and signals
Strategic signalPartnerships
Six partnerships are on record, tiered core and minor.
- Yangtze Memory Technologies (YMTC)coreYMTC is intensifying use of AMEC equipment as a domestic supplier following its addition to the US Entity List in December 2022. YMTC's Phase 3 Wuhan fab sources over 50% of equipment from Chinese domestic suppliers including AMEC. YMTC is building two additional fabs with total planned capacity of 300,000 wafers/month, with AMEC as a key equipment partner.
- DAS Environmental Expert GmbHminorAMEC subsidiary Zhongwei Huichuang signed strategic cooperation agreement with German DAS Environmental Expert GmbH for exhaust gas treatment equipment in semiconductor manufacturing. DAS provides product sales and after-sales service while Zhongwei Huichuang provides localized manufacturing for DAS equipment in China.
- San'an OptoelectronicscoreLeading Chinese LED manufacturer and key customer for AMEC's Prismo D-BLUE and Prismo A7 MOCVD equipment. San'an Optoelectronics values AMEC's advanced technical capabilities, superior performance, high throughput, and competitive capital costs.
- HC SemiTek CorporationcoreMajor Chinese LED chip manufacturer using AMEC MOCVD equipment for GaN-based LED production.
- Zhaochi Semiconductor (江西兆驰半导体)coreZhaochi Semiconductor placed a 52-chamber Prismo UniMax MOCVD order with AMEC for Mini LED production. This followed AMEC's Prismo UniMax reaching over 180 total orders, making it a major customer for AMEC's Mini LED MOCVD platform.
- Veeco InstrumentsminorAMEC and Veeco, along with SGL, reached a comprehensive settlement of all IP disputes in February 2018. The settlement resolved all legal actions in courts, patent offices, and otherwise globally between the parties, allowing all business operations including sales, service, and imports to continue.
Scale indicators11 records
Recent moves11 records
Expansion highlights7 records
Advanced Micro-Fabrication Equipment competitors and assessment
Company assessmentBroad incumbents
- Applied Materials: Global #1 semiconductor equipment maker with overlapping capabilities in plasma etching (Producer Selectra), CVD/ALD (Producer XP), and inspection. AMEC directly competes with Applied Materials in dielectric etching at advanced nodes, and Applied Materials' global scale and process library represent the benchmark AMEC is challenging domestically.
- Tokyo Electron: Major Japanese semiconductor equipment maker with strong presence in plasma etching, CVD, and coating/developing track systems. TEL competes with AMEC in dielectric etching and thin film deposition, and supplies many of the same Korean and Taiwanese customers that AMEC targets.
- ASML Holding: The global monopoly supplier of advanced lithography equipment, which sits alongside AMEC's etching and deposition tools in every leading-edge fab. While not a direct product competitor, ASML defines the process roadmap that AMEC's etching equipment must support (e.g., 3nm node compatibility) and is the ultimate upstream partner/customer dependency for advanced fab buildouts.
Direct peers
- Lam Research: The dominant global supplier of plasma etching equipment and a long-standing direct competitor to AMEC's Primo series. Lam Research has been involved in extensive patent litigation with AMEC (won by AMEC multiple times), and the two compete head-to-head for the same IC manufacturer customers in memory and logic.
- Naura Technology Group: China's largest domestic semiconductor equipment manufacturer, with competing product lines in etching, CVD/PVD, cleaning, and thermal processing. Naura is the most direct Chinese rival to AMEC in etching and thin film, sharing the same customer base of SMIC, YMTC, and CXMT.
- ACM Research: China-based (with US-listed parent) semiconductor cleaning equipment leader that is also expanding into furnace, CVD, and electroplating. ACM competes with AMEC's thin film deposition line and serves the same Chinese foundry/memory customers, representing a parallel Chinese semiconductor equipment success story.
- Veeco Instruments: US-headquartered MOCVD equipment supplier historically competing with AMEC's Prismo series in GaN LED and now Mini/Micro LED. AMEC and Veeco settled global IP disputes in 2018, and Veeco remains the principal Western alternative to AMEC's dominant share in GaN LED MOCVD.
- Aixtron SE: German MOCVD equipment supplier specializing in compound semiconductor epitaxy for LED, power electronics (GaN/SiC), and optoelectronics. Aixtron competes with AMEC's Prismo UniMax and HiT3 systems for Mini LED and deep UV LED customers globally.
- Shenyang Toajing Technology: Chinese CVD/ALD equipment maker in which AMEC holds a minority stake (co-invested with the National IC Fund in 2015). Toajing directly competes with AMEC's Preforma Uniflex/Uniflash thin film deposition product line and represents both a strategic partner and a domestic rival in advanced CVD.
Regional players
- KLA Corporation: US-headquartered process control and inspection equipment leader. KLA does not compete directly in plasma etching or MOCVD, but its metrology tools complement AMEC's equipment in fabs and KLA represents the kind of Western incumbent whose capabilities AMEC is working to localize via its own measurement equipment roadmap.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks7 records
Key highlights7 records
Customer concentration
Advanced Micro-Fabrication Equipment financial estimates
Financial estimateRevenue estimate
Valuation estimate
Advanced Micro-Fabrication Equipment leadership team
Management profileNumber of profiles
Profiles18 records
Advanced Micro-Fabrication Equipment subsidiaries and ownership
Company hierarchySubsidiaries5 records
Advanced Micro-Fabrication Equipment funding detail
Funding detailFunding overview
Funding rounds8 records
Investors16 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Advanced Micro-Fabrication Equipment M&A and investment
M&A and investmentM&A1 record
Investments6 records
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Advanced Micro-Fabrication Equipment
What does Advanced Micro-Fabrication Equipment do?
AMEC designs, manufactures, and sells high-end semiconductor micro-fabrication equipment, with a platform-based portfolio comprising plasma etching equipment (CCP and ICP systems covering 65nm to 3nm nodes), MOCVD equipment for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device production, thin film deposition equipment (LPCVD, ALD, PVD), and environmental protection equipment. The company sells directly to global integrated circuit manufacturers, LED chip makers, and advanced packaging companies, with more than 7,800 reaction chambers shipped across 170+ production lines globally.
Is Advanced Micro-Fabrication Equipment a public or private company?
Advanced Micro-Fabrication Equipment is a public company. It is classified as public and is currently operating.
When was Advanced Micro-Fabrication Equipment founded?
Advanced Micro-Fabrication Equipment was founded in 2004. It employs 101 to 250 people.
Where is Advanced Micro-Fabrication Equipment based?
Advanced Micro-Fabrication Equipment is headquartered in Shanghai, China, in the Asia region.
How does Advanced Micro-Fabrication Equipment make money?
Two revenue lines are on record. Semiconductor equipment sales are the primary driver. The others are customer support and field services.
Who are Advanced Micro-Fabrication Equipment's main competitors?
Broad incumbents on record are Applied Materials, Tokyo Electron and ASML Holding. Direct peers are Lam Research, Naura Technology Group, ACM Research, Veeco Instruments, Aixtron SE and Shenyang Toajing Technology. KLA Corporation is listed as a regional player.
Does Advanced Micro-Fabrication Equipment have an API?
No public API is recorded for Advanced Micro-Fabrication Equipment.
What industry is Advanced Micro-Fabrication Equipment in?
Advanced Micro-Fabrication Equipment's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is IMAGAGAK, Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware). Its NAICS code is 333242 and its SIC code is 3600.