Developer docs
API playgroundTry for free, no card

Search company profiles

Advanced Micro-Fabrication Equipment

Full company profile

uuid000285d

Namestring
Advanced Micro-Fabrication Equipment
Legal namestring
中微半导体设备(上海)股份有限公司
Company typeenum
Public
Founded yearint
2004
Descriptiontext

Advanced Micro-Fabrication Equipment (AMEC, ticker 688012.SH, 中微公司) is a Shanghai-headquartered semiconductor capital equipment manufacturer founded in 2004 by Dr. Yin Zhixiong and 15 Silicon Valley veterans, and listed on the Shanghai Stock Exchange STAR Market since July 2019. The company designs and produces plasma etching equipment (CCP and ICP architectures), metal-organic chemical vapor deposition (MOCVD) systems for GaN-based LEDs and power devices, thin-film deposition tools (LPCVD, ALD, PVD), and environmental/abatement equipment for semiconductor fabs. Its industry-first dual-reaction-chamber (反应台) platform processes two wafers per reactor, reducing per-wafer capital cost by approximately 30% versus single-chamber alternatives, and its etch tools are qualified at process nodes from 65nm down to 3nm and below at TSMC, SMIC, YMTC, CXMT, and leading Korean memory manufacturers. AMEC holds more than 80% global market share in GaN-based LED MOCVD equipment and has shipped over 7,800 reaction chambers into 170+ production lines globally.

The company operates a direct enterprise sales model with 15 regional offices and 6 overseas subsidiaries covering China, Taiwan, Singapore, South Korea, Germany, Italy, and North America, with all equipment sold and serviced directly by in-house engineering teams rather than through resellers. Revenue is generated primarily through hardware sales of equipment, supplemented by on-site technical support, spare parts, and operational consulting. 2025 revenue reached approximately 12.385 billion yuan (roughly $1.7 billion USD) at 36.62% year-over-year growth, with net profit attributable to parent shareholders of 2.111 billion yuan (up 30.69% YoY) and R&D investment of 37.44 billion yuan representing 30.2% of sales. Manufacturing and R&D are anchored at the Lingang industrialization base (180,000 sqm, operational August 2024) and Nanchang base (140,000 sqm, operational July 2023), with additional capacity under construction in Guangzhou, Chengdu, and a South China headquarters (groundbreaking September 2025).

Short descriptiontext

AMEC (中微公司, 688012.SH) designs and manufactures plasma etching, MOCVD, and thin-film deposition equipment for global semiconductor foundries, memory chip makers, and LED manufacturers, with tools qualified from 65nm down to 3nm and over 80% global share in GaN-based LED MOCVD.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
101–250
akta.pro rankint
HeadquartersShanghai, China
HQ citystring
Shanghai
HQ countrystring
China
HQ regionstring
Asia
Markets served

Serves global market

Offices11 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
plasma etching equipment, MOCVD equipment, semiconductor manufacturing equipment, thin film deposition, micro-fabrication equipment
Industry1 code
1Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware)
CodeIMAGAGAKPrimaryYes
NAICS code1 code
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Electronic & Other Electrical Equipment (No Computer Equip)3600
Product category
Semiconductor Manufacturing Equipment
No data
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model2 records
1Semiconductor equipment sales
TypeHardware Sales
Description

AMEC generates revenue primarily through the sale of plasma etching equipment, MOCVD equipment, thin film deposition equipment, and related services to global integrated circuit and LED chip manufacturers. The company reported 2025 revenue of approximately 123.85 billion yuan, with etching equipment sales of 98.32 billion yuan and LPCVD/ALD equipment sales of 5.06 billion yuan.

amec-inc.com
2Customer support and field services
TypeProfessional Services
Description

On-site technical support, spare parts management, and operational consulting services provided to customers alongside equipment sales, supporting the high-value hardware revenue stream.

amec-inc.com
Marketing channels5 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components5 values
Technology or R&D, Personnel, Supply Chain, Operations, Infrastructure
Pricing details1 tier
1High-end semiconductor fabrication equipment with enterprise-level pricing
ModelOtherBilling cadenceMulti-year contract
Notes

Equipment sales negotiated directly with chip manufacturers. No public pricing disclosed. Per-reaction-chamber and per-system pricing varies significantly based on configuration, process node capability, and customer requirements.

amec-inc.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

AMEC designs, manufactures, and sells high-end semiconductor micro-fabrication equipment, with a platform-based portfolio comprising plasma etching equipment (CCP and ICP systems covering 65nm to 3nm nodes), MOCVD equipment for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device production, thin film deposition equipment (LPCVD, ALD, PVD), and environmental protection equipment. The company sells directly to global integrated circuit manufacturers, LED chip makers, and advanced packaging companies, with more than 7,800 reaction chambers shipped across 170+ production lines globally.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 7 values shown
  • AMEC maintained over 35% average annual revenue growth for 13 consecutive years through 2025
+6 more records
Product overview1 text field

Advanced Micro-Fabrication Equipment (AMEC/中微公司) is a China-based, globally-oriented high-end semiconductor micro-fabrication equipment company providing equipment and high-quality services for the integrated circuit and compound semiconductor industries. The company operates a platform-based business model with three main product families: (1) Plasma Etching Equipment — CCP (capacitively coupled plasma) and ICP (inductively coupled plasma) systems spanning dual-reaction-chamber and single-reaction-chamber configurations, covering 9 etching equipment models including Primo D-RIE®, Primo AD-RIE®, Primo SSC AD-RIE®, Primo HD-RIE®, Primo TSV®, Primo nanova®, Primo Twin-Star®, Primo Angnova™, Primo Domingo™, Primo Halona™, and Primo Menova™, covering 95%+ of hundreds of etching applications from 65nm to 3nm and below; (2) MOCVD Equipment — including PRISMO D-BLUE®, PRISMO A7®, PRISMO HiT3®, PRISMO UniMax®, and Preciomo Udx® for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device (SiC, GaN) production; (3) Thin Film Deposition Equipment — Preforma Uniflash® and Preforma Uniflex® series covering LPCVD, ALD, PVD, PECVD, and EPI technologies for conductor and semiconductor films. The company also offers environmental protection equipment (VOC purification, plasma exhaust treatment, combustion water-wash systems). As of 2025, the company had shipped over 7,800 plasma and chemical film reaction chambers to more than 170 production lines globally.

Product and service28 records
1Primo D-RIE
CategoryPlasma etching equipment
Description

Dual-reaction-chamber CCP (capacitively coupled plasma) high-energy plasma etching equipment for dielectric etching, covering processes from 65nm to 5nm and below.

2Primo AD-RIE
CategoryPlasma etching equipment
Description

Dual-reaction-chamber CCP etching equipment with switchable dual low-frequency RF sources for 28nm to 5nm and below advanced processes.

3Primo SSC AD-RIE
CategoryPlasma etching equipment
Description

Single-reaction-chamber CCP etching equipment for high-aspect-ratio contact hole etching, trench etching, and serial etching at 2xnm and 1xnm nodes.

4Primo iDEA
CategoryPlasma etching equipment
Description

Integrated dielectric etching and photoresist ashing system combining dual-reaction-chamber CCP etching with dual-reaction-chamber plasma ash in one system.

5Primo HD-RIE
CategoryPlasma etching equipment
Description

High-density plasma etching equipment for 3D NAND and DRAM high-aspect-ratio trench and deep hole etching.

6Primo TSV
CategoryPlasma etching equipment
Description

Through-silicon via etching equipment for 3D chip packaging and advanced packaging applications, available in 8-inch and 12-inch versions.

7Primo nanova
CategoryPlasma etching equipment
Description

ICP (inductively coupled plasma) etching equipment for 7nm, 5nm and below advanced logic and memory chip production with symmetric reaction chambers.

8Primo Twin-Star
CategoryPlasma etching equipment
Description

Dual-reaction-chamber ICP etching equipment for conductive/dielectric film etching in IC front-end and back-end processes, suitable for power devices and CMOS image sensors.

9Primo UD-RIE
CategoryPlasma etching equipment
Description

Ultra-low energy ICP etching equipment for advanced semiconductor manufacturing.

10Primo Angnova
CategoryPlasma etching equipment
Description

Next-generation ICP etching equipment launched in 2026, featuring advanced plasma technology for silicon and compound semiconductor critical processes.

11Primo Domingo
CategoryPlasma etching equipment
Description

High-selectivity etcher launched in 2026 for advanced semiconductor etching applications.

12Primo Halona
CategoryPlasma etching equipment
Description

First wafer edge etching equipment launched in April 2025, expanding coverage of critical etching processes.

13Primo Menova
CategoryPlasma etching equipment
Description

12-inch metal etching equipment with global first delivery in June 2025, expanding the company's metal etching product portfolio.

14PRISMO D-BLUE
CategoryMOCVD equipment
Description

First domestically developed mass-production MOCVD equipment for GaN-based LED epitaxial wafer production.

15PRISMO A7
CategoryMOCVD equipment
Description

Second-generation MOCVD equipment for GaN-based LED production with improved throughput and performance over first-generation tools.

16PRISMO HiT3
CategoryMOCVD equipment
Description

MOCVD equipment for deep UV LED production, capable of processing 18x2-inch wafers at reaction chamber temperatures up to 1400 degrees Celsius.

17PRISMO UniMax
CategoryMOCVD equipment
Description

MOCVD equipment for high-performance Mini LED mass production, featuring multi-zone temperature control system and large 785mm diameter substrate for up to 164x4-inch or 72x6-inch wafers.

18Preciomo Udx
CategoryMOCVD equipment
Description

Blue/green Micro LED mass production MOCVD equipment launched in 2026, further enriching the MOCVD product family.

19Preforma Uniflash TiAl
CategoryThin film deposition equipment
Description

12-inch high-aspect-ratio metal tungsten deposition equipment using atomic layer deposition technology.

20Preforma Uniflash TaN
CategoryThin film deposition equipment
Description

12-inch tungsten nitride deposition equipment for complex structure metal tungsten fill applications.

21Preforma Uniflash TiN
CategoryThin film deposition equipment
Description

12-inch titanium nitride deposition equipment with excellent step coverage and low resistivity characteristics.

22Preforma Uniflex AW
CategoryThin film deposition equipment
Description

12-inch atomic layer metal tungsten deposition equipment with proprietary high-speed gas switching control system for atomic-level growth precision.

23Preforma Uniflex HW
CategoryThin film deposition equipment
Description

12-inch high-aspect-ratio metal tungsten deposition equipment with up to five dual-reaction-chamber configuration for high productivity.

24Preforma Uniflex CW
CategoryThin film deposition equipment
Description

12-inch LPCVD equipment for contact hole and metal tungsten line fill applications in advanced logic, DRAM, and 3D NAND devices.

25VOC Purification Equipment
CategoryEnvironmental protection equipment
Description

Volatile organic compound purification equipment for environmental protection in semiconductor manufacturing facilities.

26Plasma Exhaust Gas Treatment Equipment
CategoryEnvironmental protection equipment
Description

Plasma-based exhaust gas treatment equipment for semiconductor fab environmental compliance.

27Combustion Water-Wash Exhaust Gas Treatment Equipment
CategoryEnvironmental protection equipment
Description

Combustion water-wash exhaust gas treatment equipment for hazardous gas abatement.

28Smart RF Match
CategoryIntelligent component for semiconductor equipment
Description

Intelligent RF matcher launched in 2026 as a core intelligent component for semiconductor equipment.

Scale indicator11 records

Each record includes

Type, Value, Description, Source

Partnership6 partners
Strategic tierCoreTypeTechnology or IntegrationAnnounced on2024-04-14
Description

YMTC is intensifying use of AMEC equipment as a domestic supplier following its addition to the US Entity List in December 2022. YMTC's Phase 3 Wuhan fab sources over 50% of equipment from Chinese domestic suppliers including AMEC. YMTC is building two additional fabs with total planned capacity of 300,000 wafers/month, with AMEC as a key equipment partner.

Strategic tierMinorTypeStrategic or Co-development PartnerAnnounced on2021-03-26
Description

AMEC subsidiary Zhongwei Huichuang signed strategic cooperation agreement with German DAS Environmental Expert GmbH for exhaust gas treatment equipment in semiconductor manufacturing. DAS provides product sales and after-sales service while Zhongwei Huichuang provides localized manufacturing for DAS equipment in China.

Strategic tierCoreTypeTechnology or Integration
Description

Leading Chinese LED manufacturer and key customer for AMEC's Prismo D-BLUE and Prismo A7 MOCVD equipment. San'an Optoelectronics values AMEC's advanced technical capabilities, superior performance, high throughput, and competitive capital costs.

Strategic tierCoreTypeTechnology or Integration
Description

Major Chinese LED chip manufacturer using AMEC MOCVD equipment for GaN-based LED production.

Strategic tierCoreTypeTechnology or Integration
Description

Zhaochi Semiconductor placed a 52-chamber Prismo UniMax MOCVD order with AMEC for Mini LED production. This followed AMEC's Prismo UniMax reaching over 180 total orders, making it a major customer for AMEC's Mini LED MOCVD platform.

Strategic tierMinorTypeOthers
Description

AMEC and Veeco, along with SGL, reached a comprehensive settlement of all IP disputes in February 2018. The settlement resolved all legal actions in courts, patent offices, and otherwise globally between the parties, allowing all business operations including sales, service, and imports to continue.

Recent move11 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight7 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

Global #1 semiconductor equipment maker with overlapping capabilities in plasma etching (Producer Selectra), CVD/ALD (Producer XP), and inspection. AMEC directly competes with Applied Materials in dielectric etching at advanced nodes, and Applied Materials' global scale and process library represent the benchmark AMEC is challenging domestically.

TypeDirect peer
Description

The dominant global supplier of plasma etching equipment and a long-standing direct competitor to AMEC's Primo series. Lam Research has been involved in extensive patent litigation with AMEC (won by AMEC multiple times), and the two compete head-to-head for the same IC manufacturer customers in memory and logic.

TypeBroad incumbent
Description

Major Japanese semiconductor equipment maker with strong presence in plasma etching, CVD, and coating/developing track systems. TEL competes with AMEC in dielectric etching and thin film deposition, and supplies many of the same Korean and Taiwanese customers that AMEC targets.

TypeDirect peer
Description

China's largest domestic semiconductor equipment manufacturer, with competing product lines in etching, CVD/PVD, cleaning, and thermal processing. Naura is the most direct Chinese rival to AMEC in etching and thin film, sharing the same customer base of SMIC, YMTC, and CXMT.

TypeDirect peer
Description

China-based (with US-listed parent) semiconductor cleaning equipment leader that is also expanding into furnace, CVD, and electroplating. ACM competes with AMEC's thin film deposition line and serves the same Chinese foundry/memory customers, representing a parallel Chinese semiconductor equipment success story.

TypeDirect peer
Description

US-headquartered MOCVD equipment supplier historically competing with AMEC's Prismo series in GaN LED and now Mini/Micro LED. AMEC and Veeco settled global IP disputes in 2018, and Veeco remains the principal Western alternative to AMEC's dominant share in GaN LED MOCVD.

TypeDirect peer
Description

German MOCVD equipment supplier specializing in compound semiconductor epitaxy for LED, power electronics (GaN/SiC), and optoelectronics. Aixtron competes with AMEC's Prismo UniMax and HiT3 systems for Mini LED and deep UV LED customers globally.

TypeDirect peer
Description

Chinese CVD/ALD equipment maker in which AMEC holds a minority stake (co-invested with the National IC Fund in 2015). Toajing directly competes with AMEC's Preforma Uniflex/Uniflash thin film deposition product line and represents both a strategic partner and a domestic rival in advanced CVD.

TypeBroad incumbent
Description

The global monopoly supplier of advanced lithography equipment, which sits alongside AMEC's etching and deposition tools in every leading-edge fab. While not a direct product competitor, ASML defines the process roadmap that AMEC's etching equipment must support (e.g., 3nm node compatibility) and is the ultimate upstream partner/customer dependency for advanced fab buildouts.

TypeRegional player
Description

US-headquartered process control and inspection equipment leader. KLA does not compete directly in plasma etching or MOCVD, but its metrology tools complement AMEC's equipment in fabs and KLA represents the kind of Western incumbent whose capabilities AMEC is working to localize via its own measurement equipment roadmap.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat6 records

Each record includes

Type, Details

Key risks7 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers10 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment3 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile3 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature6 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles18 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries5 records

Each record includes

Name, Acquired on, Relationship type, Type, Business focus

No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds8 records

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors16 records

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment6 records

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Advanced Micro-Fabrication Equipment

Semiconductor Manufacturing Equipmentamec-inc.com

AMEC (中微公司, 688012.SH) designs and manufactures plasma etching, MOCVD, and thin-film deposition equipment for global semiconductor foundries, memory chip makers, and LED manufacturers, with tools qualified from 65nm down to 3nm and over 80% global share in GaN-based LED MOCVD.

What Advanced Micro-Fabrication Equipment does

Advanced Micro-Fabrication Equipment (AMEC, ticker 688012.SH, 中微公司) is a Shanghai-headquartered semiconductor capital equipment manufacturer founded in 2004 by Dr. Yin Zhixiong and 15 Silicon Valley veterans, and listed on the Shanghai Stock Exchange STAR Market since July 2019. The company designs and produces plasma etching equipment (CCP and ICP architectures), metal-organic chemical vapor deposition (MOCVD) systems for GaN-based LEDs and power devices, thin-film deposition tools (LPCVD, ALD, PVD), and environmental/abatement equipment for semiconductor fabs. Its industry-first dual-reaction-chamber (反应台) platform processes two wafers per reactor, reducing per-wafer capital cost by approximately 30% versus single-chamber alternatives, and its etch tools are qualified at process nodes from 65nm down to 3nm and below at TSMC, SMIC, YMTC, CXMT, and leading Korean memory manufacturers. AMEC holds more than 80% global market share in GaN-based LED MOCVD equipment and has shipped over 7,800 reaction chambers into 170+ production lines globally.

The company operates a direct enterprise sales model with 15 regional offices and 6 overseas subsidiaries covering China, Taiwan, Singapore, South Korea, Germany, Italy, and North America, with all equipment sold and serviced directly by in-house engineering teams rather than through resellers. Revenue is generated primarily through hardware sales of equipment, supplemented by on-site technical support, spare parts, and operational consulting. 2025 revenue reached approximately 12.385 billion yuan (roughly $1.7 billion USD) at 36.62% year-over-year growth, with net profit attributable to parent shareholders of 2.111 billion yuan (up 30.69% YoY) and R&D investment of 37.44 billion yuan representing 30.2% of sales. Manufacturing and R&D are anchored at the Lingang industrialization base (180,000 sqm, operational August 2024) and Nanchang base (140,000 sqm, operational July 2023), with additional capacity under construction in Guangzhou, Chengdu, and a South China headquarters (groundbreaking September 2025).

Advanced Micro-Fabrication Equipment firmographics

Firmographics
Name
Advanced Micro-Fabrication Equipment
Legal name
中微半导体设备(上海)股份有限公司
Website
http://www.amec-inc.com/
Company type
Public
Founded year
2004
Operating status
Operating
Headcount range
101–250 employees
Short description
AMEC (中微公司, 688012.SH) designs and manufactures plasma etching, MOCVD, and thin-film deposition equipment for global semiconductor foundries, memory chip makers, and LED manufacturers, with tools qualified from 65nm down to 3nm and over 80% global share in GaN-based LED MOCVD.
Ownership category
akta.pro rank

Advanced Micro-Fabrication Equipment industry classification

Industry
Product category
Semiconductor Manufacturing Equipment
NAICS
Semiconductor Machinery Manufacturing (333242)
SIC
Electronic & Other Electrical Equipment (No Computer Equip) (3600)
akta.pro primary industry
Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware) (IMAGAGAK)

Keywords

  • Plasma etching equipment
  • MOCVD equipment
  • Semiconductor manufacturing equipment
  • Thin film deposition
  • Micro-fabrication equipment

Where Advanced Micro-Fabrication Equipment is headquartered

Location

Headquarters

HQ city
Shanghai
HQ country
China
HQ region
Asia

Offices11 records

Markets served

Advanced Micro-Fabrication Equipment business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Technology or R&D, Personnel, Supply Chain, Operations, Infrastructure

Revenue model

  1. Semiconductor equipment sales: AMEC generates revenue primarily through the sale of plasma etching equipment, MOCVD equipment, thin film deposition equipment, and related services to global integrated circuit and LED chip manufacturers. The company reported 2025 revenue of approximately 123.85 billion yuan, with etching equipment sales of 98.32 billion yuan and LPCVD/ALD equipment sales of 5.06 billion yuan.
  2. Customer support and field services: On-site technical support, spare parts management, and operational consulting services provided to customers alongside equipment sales, supporting the high-value hardware revenue stream.

Pricing tiers

ModelBillingPrice
OtherMulti-year contractHigh-end semiconductor fabrication equipment with enterprise-level pricing

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Advanced Micro-Fabrication Equipment product offering

Product offering

Core offering

AMEC designs, manufactures, and sells high-end semiconductor micro-fabrication equipment, with a platform-based portfolio comprising plasma etching equipment (CCP and ICP systems covering 65nm to 3nm nodes), MOCVD equipment for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device production, thin film deposition equipment (LPCVD, ALD, PVD), and environmental protection equipment. The company sells directly to global integrated circuit manufacturers, LED chip makers, and advanced packaging companies, with more than 7,800 reaction chambers shipped across 170+ production lines globally.

Product overview

Advanced Micro-Fabrication Equipment (AMEC/中微公司) is a China-based, globally-oriented high-end semiconductor micro-fabrication equipment company providing equipment and high-quality services for the integrated circuit and compound semiconductor industries. The company operates a platform-based business model with three main product families: (1) Plasma Etching Equipment — CCP (capacitively coupled plasma) and ICP (inductively coupled plasma) systems spanning dual-reaction-chamber and single-reaction-chamber configurations, covering 9 etching equipment models including Primo D-RIE®, Primo AD-RIE®, Primo SSC AD-RIE®, Primo HD-RIE®, Primo TSV®, Primo nanova®, Primo Twin-Star®, Primo Angnova™, Primo Domingo™, Primo Halona™, and Primo Menova™, covering 95%+ of hundreds of etching applications from 65nm to 3nm and below; (2) MOCVD Equipment — including PRISMO D-BLUE®, PRISMO A7®, PRISMO HiT3®, PRISMO UniMax®, and Preciomo Udx® for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device (SiC, GaN) production; (3) Thin Film Deposition Equipment — Preforma Uniflash® and Preforma Uniflex® series covering LPCVD, ALD, PVD, PECVD, and EPI technologies for conductor and semiconductor films. The company also offers environmental protection equipment (VOC purification, plasma exhaust treatment, combustion water-wash systems). As of 2025, the company had shipped over 7,800 plasma and chemical film reaction chambers to more than 170 production lines globally.

Differentiator

Problem solved

Functional benefit

Products and services

  • Primo D-RIE Dual-reaction-chamber CCP (capacitively coupled plasma) high-energy plasma etching equipment for dielectric etching, covering processes from 65nm to 5nm and below.
  • Primo AD-RIE Dual-reaction-chamber CCP etching equipment with switchable dual low-frequency RF sources for 28nm to 5nm and below advanced processes.
  • Primo SSC AD-RIE Single-reaction-chamber CCP etching equipment for high-aspect-ratio contact hole etching, trench etching, and serial etching at 2xnm and 1xnm nodes.
  • Primo iDEA Integrated dielectric etching and photoresist ashing system combining dual-reaction-chamber CCP etching with dual-reaction-chamber plasma ash in one system.
  • Primo HD-RIE High-density plasma etching equipment for 3D NAND and DRAM high-aspect-ratio trench and deep hole etching.
  • Primo TSV Through-silicon via etching equipment for 3D chip packaging and advanced packaging applications, available in 8-inch and 12-inch versions.
  • Primo nanova ICP (inductively coupled plasma) etching equipment for 7nm, 5nm and below advanced logic and memory chip production with symmetric reaction chambers.
  • Primo Twin-Star Dual-reaction-chamber ICP etching equipment for conductive/dielectric film etching in IC front-end and back-end processes, suitable for power devices and CMOS image sensors.
  • Primo UD-RIE Ultra-low energy ICP etching equipment for advanced semiconductor manufacturing.
  • Primo Angnova Next-generation ICP etching equipment launched in 2026, featuring advanced plasma technology for silicon and compound semiconductor critical processes.
  • Primo Domingo High-selectivity etcher launched in 2026 for advanced semiconductor etching applications.
  • Primo Halona First wafer edge etching equipment launched in April 2025, expanding coverage of critical etching processes.
  • Primo Menova 12-inch metal etching equipment with global first delivery in June 2025, expanding the company's metal etching product portfolio.
  • PRISMO D-BLUE First domestically developed mass-production MOCVD equipment for GaN-based LED epitaxial wafer production.
  • PRISMO A7 Second-generation MOCVD equipment for GaN-based LED production with improved throughput and performance over first-generation tools.
  • PRISMO HiT3 MOCVD equipment for deep UV LED production, capable of processing 18x2-inch wafers at reaction chamber temperatures up to 1400 degrees Celsius.
  • PRISMO UniMax MOCVD equipment for high-performance Mini LED mass production, featuring multi-zone temperature control system and large 785mm diameter substrate for up to 164x4-inch or 72x6-inch wafers.
  • Preciomo Udx Blue/green Micro LED mass production MOCVD equipment launched in 2026, further enriching the MOCVD product family.
  • Preforma Uniflash TiAl 12-inch high-aspect-ratio metal tungsten deposition equipment using atomic layer deposition technology.
  • Preforma Uniflash TaN 12-inch tungsten nitride deposition equipment for complex structure metal tungsten fill applications.
  • Preforma Uniflash TiN 12-inch titanium nitride deposition equipment with excellent step coverage and low resistivity characteristics.
  • Preforma Uniflex AW 12-inch atomic layer metal tungsten deposition equipment with proprietary high-speed gas switching control system for atomic-level growth precision.
  • Preforma Uniflex HW 12-inch high-aspect-ratio metal tungsten deposition equipment with up to five dual-reaction-chamber configuration for high productivity.
  • Preforma Uniflex CW 12-inch LPCVD equipment for contact hole and metal tungsten line fill applications in advanced logic, DRAM, and 3D NAND devices.
  • VOC Purification Equipment Volatile organic compound purification equipment for environmental protection in semiconductor manufacturing facilities.
  • Plasma Exhaust Gas Treatment Equipment Plasma-based exhaust gas treatment equipment for semiconductor fab environmental compliance.
  • Combustion Water-Wash Exhaust Gas Treatment Equipment Combustion water-wash exhaust gas treatment equipment for hazardous gas abatement.
  • Smart RF Match Intelligent RF matcher launched in 2026 as a core intelligent component for semiconductor equipment.

Quantifiable outcome

  • AMEC maintained over 35% average annual revenue growth for 13 consecutive years through 2025
  • +6 more outcomes

Companies that use Advanced Micro-Fabrication Equipment

Customer profile

Named customers10 records

Segments3 records

Ideal customer profiles3 records

Advanced Micro-Fabrication Equipment technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature6 records

Advanced Micro-Fabrication Equipment partnerships and signals

Strategic signal

Partnerships

Six partnerships are on record, tiered core and minor.

  • Yangtze Memory Technologies (YMTC)coreTechnology or Integration · 14 April 2024YMTC is intensifying use of AMEC equipment as a domestic supplier following its addition to the US Entity List in December 2022. YMTC's Phase 3 Wuhan fab sources over 50% of equipment from Chinese domestic suppliers including AMEC. YMTC is building two additional fabs with total planned capacity of 300,000 wafers/month, with AMEC as a key equipment partner.
  • DAS Environmental Expert GmbHminorStrategic or Co-development Partner · 26 March 2021AMEC subsidiary Zhongwei Huichuang signed strategic cooperation agreement with German DAS Environmental Expert GmbH for exhaust gas treatment equipment in semiconductor manufacturing. DAS provides product sales and after-sales service while Zhongwei Huichuang provides localized manufacturing for DAS equipment in China.
  • San'an OptoelectronicscoreTechnology or IntegrationLeading Chinese LED manufacturer and key customer for AMEC's Prismo D-BLUE and Prismo A7 MOCVD equipment. San'an Optoelectronics values AMEC's advanced technical capabilities, superior performance, high throughput, and competitive capital costs.
  • HC SemiTek CorporationcoreTechnology or IntegrationMajor Chinese LED chip manufacturer using AMEC MOCVD equipment for GaN-based LED production.
  • Zhaochi Semiconductor (江西兆驰半导体)coreTechnology or IntegrationZhaochi Semiconductor placed a 52-chamber Prismo UniMax MOCVD order with AMEC for Mini LED production. This followed AMEC's Prismo UniMax reaching over 180 total orders, making it a major customer for AMEC's Mini LED MOCVD platform.
  • Veeco InstrumentsminorOthersAMEC and Veeco, along with SGL, reached a comprehensive settlement of all IP disputes in February 2018. The settlement resolved all legal actions in courts, patent offices, and otherwise globally between the parties, allowing all business operations including sales, service, and imports to continue.

Scale indicators11 records

Recent moves11 records

Expansion highlights7 records

Advanced Micro-Fabrication Equipment competitors and assessment

Company assessment

Broad incumbents

  • Applied Materials: Global #1 semiconductor equipment maker with overlapping capabilities in plasma etching (Producer Selectra), CVD/ALD (Producer XP), and inspection. AMEC directly competes with Applied Materials in dielectric etching at advanced nodes, and Applied Materials' global scale and process library represent the benchmark AMEC is challenging domestically.
  • Tokyo Electron: Major Japanese semiconductor equipment maker with strong presence in plasma etching, CVD, and coating/developing track systems. TEL competes with AMEC in dielectric etching and thin film deposition, and supplies many of the same Korean and Taiwanese customers that AMEC targets.
  • ASML Holding: The global monopoly supplier of advanced lithography equipment, which sits alongside AMEC's etching and deposition tools in every leading-edge fab. While not a direct product competitor, ASML defines the process roadmap that AMEC's etching equipment must support (e.g., 3nm node compatibility) and is the ultimate upstream partner/customer dependency for advanced fab buildouts.

Direct peers

  • Lam Research: The dominant global supplier of plasma etching equipment and a long-standing direct competitor to AMEC's Primo series. Lam Research has been involved in extensive patent litigation with AMEC (won by AMEC multiple times), and the two compete head-to-head for the same IC manufacturer customers in memory and logic.
  • Naura Technology Group: China's largest domestic semiconductor equipment manufacturer, with competing product lines in etching, CVD/PVD, cleaning, and thermal processing. Naura is the most direct Chinese rival to AMEC in etching and thin film, sharing the same customer base of SMIC, YMTC, and CXMT.
  • ACM Research: China-based (with US-listed parent) semiconductor cleaning equipment leader that is also expanding into furnace, CVD, and electroplating. ACM competes with AMEC's thin film deposition line and serves the same Chinese foundry/memory customers, representing a parallel Chinese semiconductor equipment success story.
  • Veeco Instruments: US-headquartered MOCVD equipment supplier historically competing with AMEC's Prismo series in GaN LED and now Mini/Micro LED. AMEC and Veeco settled global IP disputes in 2018, and Veeco remains the principal Western alternative to AMEC's dominant share in GaN LED MOCVD.
  • Aixtron SE: German MOCVD equipment supplier specializing in compound semiconductor epitaxy for LED, power electronics (GaN/SiC), and optoelectronics. Aixtron competes with AMEC's Prismo UniMax and HiT3 systems for Mini LED and deep UV LED customers globally.
  • Shenyang Toajing Technology: Chinese CVD/ALD equipment maker in which AMEC holds a minority stake (co-invested with the National IC Fund in 2015). Toajing directly competes with AMEC's Preforma Uniflex/Uniflash thin film deposition product line and represents both a strategic partner and a domestic rival in advanced CVD.

Regional players

  • KLA Corporation: US-headquartered process control and inspection equipment leader. KLA does not compete directly in plasma etching or MOCVD, but its metrology tools complement AMEC's equipment in fabs and KLA represents the kind of Western incumbent whose capabilities AMEC is working to localize via its own measurement equipment roadmap.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks7 records

Key highlights7 records

Customer concentration

Advanced Micro-Fabrication Equipment financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Advanced Micro-Fabrication Equipment leadership team

Management profile

Number of profiles

Profiles18 records

Advanced Micro-Fabrication Equipment subsidiaries and ownership

Company hierarchy

Subsidiaries5 records

Advanced Micro-Fabrication Equipment funding detail

Funding detail

Funding overview

Funding rounds8 records

Investors16 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Advanced Micro-Fabrication Equipment M&A and investment

M&A and investment

M&A1 record

Investments6 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Advanced Micro-Fabrication Equipment

What does Advanced Micro-Fabrication Equipment do?

AMEC designs, manufactures, and sells high-end semiconductor micro-fabrication equipment, with a platform-based portfolio comprising plasma etching equipment (CCP and ICP systems covering 65nm to 3nm nodes), MOCVD equipment for GaN-based LED, Mini LED, Micro LED, deep UV LED, and power device production, thin film deposition equipment (LPCVD, ALD, PVD), and environmental protection equipment. The company sells directly to global integrated circuit manufacturers, LED chip makers, and advanced packaging companies, with more than 7,800 reaction chambers shipped across 170+ production lines globally.

Is Advanced Micro-Fabrication Equipment a public or private company?

Advanced Micro-Fabrication Equipment is a public company. It is classified as public and is currently operating.

When was Advanced Micro-Fabrication Equipment founded?

Advanced Micro-Fabrication Equipment was founded in 2004. It employs 101 to 250 people.

Where is Advanced Micro-Fabrication Equipment based?

Advanced Micro-Fabrication Equipment is headquartered in Shanghai, China, in the Asia region.

How does Advanced Micro-Fabrication Equipment make money?

Two revenue lines are on record. Semiconductor equipment sales are the primary driver. The others are customer support and field services.

Who are Advanced Micro-Fabrication Equipment's main competitors?

Broad incumbents on record are Applied Materials, Tokyo Electron and ASML Holding. Direct peers are Lam Research, Naura Technology Group, ACM Research, Veeco Instruments, Aixtron SE and Shenyang Toajing Technology. KLA Corporation is listed as a regional player.

Does Advanced Micro-Fabrication Equipment have an API?

No public API is recorded for Advanced Micro-Fabrication Equipment.

What industry is Advanced Micro-Fabrication Equipment in?

Advanced Micro-Fabrication Equipment's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is IMAGAGAK, Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware). Its NAICS code is 333242 and its SIC code is 3600.

Unlock the full company data

50 free credits on sign-up, no credit card required.

Contact sales
Live signals
YicaiglobalChina's AMEC to Invest USD520 Million to Boost Chip Equipment Capacity at Lingang PlantAdvanced Micro-Fabrication Equipment (AMEC) announced a CNY3.5 billion investment to expand its Lingang plant in Shanghai, aiming to boost production capacity for semiconductor etch and deposition equipment. The company reported that its net profit quadrupled to CNY2.8 billion in the first half of the year, driven by increased shipments of high-end chip gear. Once fully operational, the expansion is projected to generate CNY3 billion in annual revenue and create up to 2,000 jobs.DIGITIMES AsiaAMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M planAdvanced Micro-Fabrication Equipment Inc. (AMEC) has reported a 300% increase in profit and is expanding its capabilities beyond etch with a US$520 million investment plan. This strategic move indicates AMEC's intent to diversify its product offerings and enhance its competitive advantage in the semiconductor equipment market.36krSichuan Brothers Build 50-Billion-Yuan Semiconductor IPO with Stock Price Surge of 655%Chengdu Superpure Applied Materials Co., Ltd. officially listed on the Shenzhen Stock Exchange, raising approximately 1.68 billion yuan in its initial public offering with a stock price surge exceeding 650%. The company, a key supplier of core components for semiconductor equipment, attracted strategic investments from major industry players including BYD and Advanced Micro-Fabrication Equipment Inc. China. This listing highlights the firm's dominant position in the domestic market for special coating components used in semiconductor etching processes.InfoMoneyAções da China atingem maior cotação da semana com alta das ações do setor de chipsChinese stocks reached their highest weekly level on Wednesday, driven by a surge in chip manufacturing stocks after Reuters reported that Samsung Electronics and SK Hynix are evaluating equipment from Chinese firm Advanced Micro-Fabrication Equipment (AMEC) for their China factories amid efforts to guard against tighter US export controls. Meanwhile, Chinese optical module manufacturers fell sharply after reports that Washington was considering banning imports of Chinese data center components, with Zhongji Innolight dropping 7% in Shenzhen and 5% in Hong Kong. Global markets broadly advanced as Middle East tensions eased.Business RecorderChina stocks rise as surge in chipmaking shares offsets tumble in optical module playsChina stocks rose to a one-week high on Wednesday, with chipmaking shares surging after Reuters reported Samsung and SK Hynix evaluating AMEC equipment. The CSI300 gained 1% and the Shanghai Composite 1.3%, while optical module makers like Zhongji Innolight fell on a draft U.S. ban. Energy shares also dropped as oil prices retreated.MarketScreenerAMEC Expects H1 Profit to Soar Up to 311%Advanced Micro-Fabrication Equipment Inc. China (AMEC), a semiconductor equipment manufacturer, expects first-half profit to surge by up to 311% according to preliminary estimates. The company, which produces etching equipment, thin film deposition equipment, and MOCVD equipment, is listed in the Semiconductor Equipment & Testing sector with 2,963 employees. Analyst consensus rates the stock as Buy with a mean target price of 345.10 CNY, representing an 11.38% upside from the last close of 309.85 CNY.South China Morning PostChinese chip-tool maker AMEC says preliminary first-half profit up 282%AMEC, China's top chip-tool maker, reported preliminary first-half profit up 282% to at least 2.7 billion yuan, with revenue rising 35% to 6.7 billion yuan. The growth was partly driven by investment and fair-value gains, including a share sale in Piotech. Adjusted profit excluding gains doubled.DoNews中微公司2026年上半年净利预增超282%- DoNews快讯Zhongwei Company forecast its 2026 H1 net profit to rise over 282%, with revenue at 6.691 billion yuan (up 34.89%). Net profit is expected between 2.7 and 2.9 billion yuan, driven by R&D investment and equity income.South China Morning PostChina’s chip equipment rally faces earnings test as memory boom fuels bets on local tools | South China Morning PostChina's semiconductor equipment stocks have rallied sharply in 2026, with Naura Technology Group shares soaring over 70% and rivals including Advanced Micro-Fabrication Equipment, Piotech and Hwatsing Technology more than doubling, driven by investor bets on China's next chip spending cycle benefiting domestic suppliers. A group of 14 major Chinese chip equipment firms tracked by Soochow Securities reported combined revenues of 90 billion yuan (US$13.1 billion) in 2025, up 35% year on year, with first-quarter 2026 revenue rising 32% to 21.78 billion yuan and combined net profits surging 61%. As first-half earnings season approaches, investors are seeking proof that memory-chip expansion, advanced packaging investments and Beijing's self-reliance push are translating into sustainable orders and margins to justify the sharp re-ratings.PedailyDomestic semiconductor equipment companies welcome a 'golden year'Three domestic semiconductor equipment companies announced expansion plans in June 2026, including acquisitions and a private placement. China's semiconductor equipment expenditure is projected to reach $49.3 billion in 2025, with domestic market share rising from 16% to 21% by 2025. Bernstein estimates domestic equipment localization will reach 43% by 2028.