Halo Industries

What Halo Industries does

Halo Industries is a Santa Clara-based semiconductor manufacturing company founded in 2014 as a Stanford spinout. The company has developed proprietary laser-based wafering technology that replaces traditional mechanical (diamond-saw) wafer slicing, with a process purpose-built for hard and brittle materials and currently focused on silicon carbide (SiC). The process delivers 2.2 to 2.3 wafers per millimeter of ingot, reduces kerf loss by 90%, eliminates bow, warp, and subsurface damage, lowers manufacturing cost by more than 60%, and improves wafer throughput by 2 to 3 times relative to conventional methods. Halo operates from a single headquarters at 3270 Scott Blvd in Santa Clara, California, employs 101-250 people, and has raised approximately $132 million in cumulative funding through Series B.

The company monetizes through three integrated offerings: direct sale of production-grade SiC wafers in multiple thicknesses and four quality grades (MOSFET Production, Diode Production, R&D, and Mechanical Grade); laser wafering services delivered as manufacturing-as-a-service covering slicing, grinding, chemical mechanical polishing, and metrology with no upfront equipment investment for the customer; and custom solutions including prototype development, process optimization, and technical training. Pricing is quote-based and not publicly disclosed. The service-based component converts customer capex into variable cost, a structure Halo uses as a primary commercial differentiator against in-house wafering options.

Halo pursues a sales-led, consultative go-to-market motion targeting semiconductor manufacturers and power electronics companies across seven verticals. Electric vehicles, renewable energy, and data centers are identified as primary segments, with telecommunications, aerospace and defense, power infrastructure, and augmented reality as secondary targets. End-applications cited include SiC-based power electronics for EV drivetrains and charging infrastructure, solar and wind inverters, AI processor thermal management, RF components, radar, and HVDC grid systems. No customer names are publicly disclosed. The company is backed by U.S. Innovative Technology Fund (Series B lead), 8VC, SAIC, the California Energy Commission, Prime Movers Lab, Abstract Ventures, Atento Capital, Fontinalis Partners, and Harmonix.

Name

Halo Industries

Legal name

Halo Industries

Website

https://halo-industries.com

Company type

Private

Founded year

2014

Operating status

Operating

Headcount range

101–250 employees

Short description

Halo Industries is a Stanford spinout that produces silicon carbide wafers using proprietary laser-based wafering, replacing traditional mechanical methods. It serves electric vehicle, renewable energy, data center, and power electronics manufacturers through direct wafer sales and manufacturing-as-a-service.

Ownership category

akta.pro rank

Product category

Semiconductor Materials Manufacturing

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor Machinery Manufacturing (333242)

SIC

Electronic Components, Nec (3679)

akta.pro primary industry

Compound Semiconductor Wafers & Substrates (SiC/GaN/GaAs/InP/Sapphire) (HDAHAGAB)

akta.pro secondary industry

Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)

Keywords

• Laser wafering services
• Silicon carbide wafers
• Semiconductor manufacturing
• Power electronics materials
• Laser material processing

Headquarters

HQ city

Santa Clara

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Operations, Personnel, Infrastructure, Marketing or Sales, Supply Chain

Revenue model

1. SiC Wafer Sales: Production and sale of silicon carbide wafers in multiple thicknesses and four quality grades (MOSFET Production, Diode Production, R&D, and Mechanical Grade). Delivers 2.2-2.3 wafers per mm with industry-leading yield per ingot.
2. Laser Wafering Services: Manufacturing excellence as a service model offering laser slicing with precision geometry control, grinding and surface preparation, chemical mechanical polishing (CMP), and metrology and wafer mapping. No upfront equipment costs for customers - turns fixed expenses into flexible economics.
3. Custom Solutions: Tailored wafering solutions including custom material processing, prototype development and testing, process optimization consulting, and technical support and training.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

Halo Industries manufactures silicon carbide (SiC) wafers using proprietary laser-based wafering technology for the semiconductor industry. The company replaces traditional mechanical diamond-saw wafering with laser precision, producing SiC wafers in multiple quality grades (MOSFET Production, Diode Production, R&D, Mechanical Grade). It also delivers laser wafering as a managed manufacturing service and provides custom wafering solutions co-developed with customers for advanced materials and specialized geometries.

Product overview

Halo Industries is a laser-based manufacturing services company for the semiconductor industry, founded in 2014 as a Stanford spinout. Their portfolio consists of three integrated offerings: SiC wafers (production-grade silicon carbide wafers in multiple quality grades for power electronics), laser wafering services (manufacturing excellence delivered as a service with no upfront equipment investment), and custom solutions (tailored wafering solutions for specific materials and requirements). The company operates from California and serves industries including electric vehicles, renewable energy, data centers, telecommunications, aerospace and defense, and consumer electronics.

Differentiator

Problem solved

Functional benefit

Products and services

• SiC wafers Production-grade silicon carbide wafers in multiple thicknesses and four quality grades engineered for power electronics in electric vehicles, renewable energy, data centers, telecommunications, aerospace & defense, and power infrastructure. Laser-cut wafers eliminate bow, warp, and subsurface damage that plague traditional mechanical wafering.
• Laser wafering services Manufacturing excellence delivered as a service: laser slicing with precision geometry control, grinding and surface preparation, chemical mechanical polishing (CMP), and metrology and wafer mapping. Customers avoid upfront equipment costs and capacity risk while accessing Halo's proprietary laser process.
• Custom Solutions Tailored wafering solutions co-developed with customers to optimize for specific materials, geometries, and quality requirements, including custom material processing, prototype development and testing, process optimization consulting, and technical support and training.

Quantifiable outcome

• 90% reduction in material waste (kerf loss)
• +3 more outcomes

Segments7 records

Ideal customer profiles7 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

One partnership is on record.

• Stanford Universityfounding partnerStrategic or Co-development PartnerHalo Industries was founded in 2014 as a Stanford spinout, combining breakthrough research with real-world execution. The Stanford connection provides ongoing access to research talent and academic rigor.

Scale indicators7 records

Recent moves5 records

Expansion highlights6 records

Emerging players

• Soitec (SmartSiC): French engineered-substrate leader developing SmartSiC, a wafer-bonding approach to low-defect SiC wafers for power electronics. Targets the same SiC wafer end-market as Halo via an alternative process route, making it a relevant emerging competitor for the same EV and industrial customers.

Direct peers

• 3D-Micromac AG: German specialist in laser micromachining systems for semiconductors, including laser dicing, wafer singulation, and SiC processing. A direct technology peer to Halo's laser-based wafer processing capability, supplying equipment to similar fab and power-electronics customers.
• DISCO Corporation: Japanese precision equipment maker and global leader in wafer dicing, grinding, and laser-based wafer processing machinery. Closely comparable to Halo's laser wafering equipment/process capability and supplies many of the same fab customers with singulation and thinning tools.
• Resonac (formerly Showa Denko): Japanese chemical/materials company and one of the largest merchant suppliers of SiC epitaxial wafers for power devices. Directly competes with Halo in supplying production-grade SiC wafers to automotive and industrial power electronics customers.
• SK Siltron CSS: Subsidiary of SK Siltron specializing in SiC wafer manufacturing for EV and power electronics. A direct competitor in the same SiC wafer market with comparable focus on MOSFET- and diode-grade substrates that Halo's laser-cut wafers target.
• Wolfspeed: Vertically integrated SiC wafer and device manufacturer with captive ingot growth and large-scale fab capacity. Directly comparable to Halo as a competing source of production-grade SiC wafers for EV, industrial, and RF power customers.

Broad incumbents

• Coherent (formerly II-VI): Large diversified compound-semiconductor and laser-photonics platform that inherited II-VI's SiC wafer business through the II-VI/Finisar merger. Overlaps with Halo on SiC wafer production and laser process technology but operates across a much broader materials and optics portfolio.
• Siltectra (Infineon Technologies): Infineon's acquired cold-split technology (originally Siltectra) competes directly with Halo's laser approach for thin SiC wafer production. Represents the incumbent alternative path to material-efficient SiC wafering that Halo must displace in customer qualification processes.
• ROHM Semiconductor (SiCrystal): Vertically integrated Japanese power-semi maker that acquired SiCrystal to secure captive SiC wafer supply. Competes with Halo in the SiC wafer market as both a customer (historically) and increasingly as a vertically integrated merchant supplier serving EV and industrial power customers.

Others

• Onto Innovation: Supplier of optical/metrology and inspection equipment used across semiconductor wafer production, including SiC. Adjacent to Halo through the metrology and wafer-mapping services Halo itself offers, and a potential supplier of in-line inspection tools Halo's customers use to qualify its wafers.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/halo-industries

Revenue estimate

Valuation estimate

Number of profiles

Profiles13 records

Funding overview

Funding rounds6 records

Investors8 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Halo Industries