What 3DSEMI does

3DSEMI (Guangdong Yuehai Integration Technology Co., Ltd. / 广东越海集成技术有限公司) is a privately held Chinese advanced semiconductor packaging company founded in January 2022 and headquartered in the Guangzhou Zengcheng Economic and Technological Development Zone. The company is the first wafer-level advanced packaging project in Guangzhou, operating TSV (Through Silicon Via), 2.5D/3D system-level packaging, micro-bump preparation, ultra-thin wafer permanent/temporary bonding and debonding, and 2.5D organic substrate heterogeneous integration. It serves automotive sensor chip manufacturers (EV and ADAS applications), consumer and industrial sensor/filter chip makers, 5G RF chip designers, and high-performance computing and AI chip customers requiring advanced packaging.

3DSEMI generates revenue through B2B enterprise packaging services quoted per wafer, per chip, or per project, plus custom process development engagements. The company also operates a 12-inch intelligent microfluidic (MEMS) chip production line targeting inkjet printhead localization, with initial planned capacity of 1,500 chips per month, and a strategic goal of breaking near-zero domestic localization in smart microfluidic chips. Recent operational milestones include achieving 12-inch product mass production in October 2024, with filter chip packaging yields improved from 95% to 99%+ and CIS chip packaging yields to 99.8-99.9%, as well as first equipment entry for the MEMS line in June 2025.

The company is controlled by Xingcheng Capital and Bay Area Sensor Industry Group, with minority participation from state-backed Yuecai VC, Guangzhou Industrial Investment, and Zengcheng Industrial Investment, under an 'equity investment + industrial synergy' model alongside strategic partners Aorui Technology and Guangdong Industrial Research Institute. Total planned investment is approximately CNY 6.6 billion against CNY 550 million registered capital. Go-to-market is direct enterprise sales; the company participated in SEMICON China 2024 and maintains a WeChat-based industry news and training platform ('Yuehai Lecture Hall'). Customer pricing, customer names, and revenue are not publicly disclosed.

Name

3DSEMI

Legal name

广东越海集成技术有限公司

Website

https://3d-semi.com

Company type

Private

Founded year

2022

Operating status

Operating

Short description

3DSEMI (Guangdong Yuehai Integration) is a Guangzhou-based privately held Chinese OSAT provider founded in 2022, offering TSV and 2.5D/3D advanced semiconductor packaging services plus a 12-inch MEMS microfluidic chip line, serving automotive, consumer, RF, and HPC chip customers.

Ownership category

akta.pro rank

Product category

Semiconductor Advanced Packaging (OSAT)

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ), Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)

Keywords

• Semiconductor packaging services
• Advanced wafer-level packaging
• TSV chip packaging
• OSAT services
• Microfluidic chip production

Headquarters

HQ city

Guangzhou

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Technology or R&D, Infrastructure, Personnel, Operations, Supply Chain, Marketing or Sales

Revenue model

1. Advanced Semiconductor Packaging Services: Provides TSV packaging, 2.5D/3D packaging, and system-level packaging services for sensor chips, filter chips, AI chips, 5G RF chips, HPC chips, and microprocessor chips. Revenue is generated through per-wafer processing fees and chip-level packaging service fees.
2. Custom Process Development and Processing Services: Offers customized process development for specialized semiconductor packaging requirements, including custom process design, prototyping, and mass production processing services

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

3DSEMI operates an Outsourced Semiconductor Assembly and Test (OSAT) business delivering advanced wafer-level packaging services, including TSV (Through-Silicon Via), 2.5D/3D system-level packaging, micro-bump preparation, ultra-thin wafer bonding/debonding, and 2.5D organic substrate heterogeneous integration for sensor, filter, AI, 5G RF, HPC, and microprocessor chips. The company also offers custom process development services and operates a 12-inch intelligent microfluidic (MEMS) chip production line serving inkjet printhead localization and smart manufacturing applications.

Product overview

广东越海集成技术有限公司 (3DSEMI) is a semiconductor advanced packaging company offering integrated packaging solutions. The core product portfolio includes five main packaging solution categories: automotive sensor chip packaging, industrial/medical/consumer sensor packaging, TSV (Through-Silicon Via) packaging, 5G RF chip packaging, and customized process development services. The company leverages 2.5D/3D TSV advanced packaging technology with capabilities such as 10μm aperture TSV (10:1 aspect ratio), micro-bump preparation, ultra-thin wafer bonding/de-bonding, and 2.5D organic substrate heterogeneous integration. Product applications span consumer electronics, automotive electronics, RF, security surveillance, and high-performance computing (HPC), covering sensor chips, filter chips, AI chips, 5G RF chips, HPC chips, and microprocessor chips. The company also operates a 12-inch intelligent microfluidic chip production line for smart manufacturing applications.

Differentiator

Problem solved

Functional benefit

Products and services

• Automotive Sensor Chip Packaging Turnkey Solutions (车载传感芯片封装成套解决方案) A complete advanced packaging solution targeting automotive sensor chip manufacturers serving electric vehicle power systems, battery management, ADAS imaging sensors, and automotive radar applications. Delivered as turnkey packaging services meeting automotive-grade quality and reliability requirements.
• Industrial, Medical, and Consumer Sensor Packaging Products (工业、医疗及消费类传感器封装应用产品) Sensor and filter chip packaging services for industrial, medical, and consumer electronics applications, including smartphone sensors, IoT device sensors, wearable sensors, and consumer filter chips. Reported packaging yields of 95% to 99%+ for filter chips and 99.5% to 99.9% for CIS image sensor chips.
• TSV Packaging Turnkey Solutions (TSV封装成套解决方案) Through-Silicon Via (TSV) advanced packaging services featuring proprietary 10μm aperture diameter TSV technology with a 10:1 aspect ratio deep via formation capability and micro-bump preparation technology, enabling vertical electrical interconnection in 3D chip stacking and high-density 2.5D/3D integration.
• 5G RF Chip Packaging Turnkey Solutions (5G射频芯片封装成套解决方案) Advanced packaging solutions for 5G RF chips including 5G RF front-end modules, RF filters, and RF power amplifiers, addressing the performance and frequency requirements of 5G infrastructure and mobile device applications.
• Custom Process Development and Processing Services (定制工艺开发及加工服务) Customized process development services for specialized semiconductor packaging requirements, including custom process design, prototyping, and mass production processing services tailored to specific customer chip architectures and technology nodes.
• 12-inch Intelligent Microfluidic Chip Production Line (12英寸智能微流控芯片产线) A 12-inch intelligent microfluidic (MEMS) chip production line for inkjet printhead localization, smart manufacturing core components, and microfluidic-based diagnostic chip applications. Includes full lithography and wafer bonding equipment coverage (18 machine types including cleaning, bonding, coating, exposure, and development systems) and wet processing capabilities including wafer cleaning, etching, and surface treatment.

Quantifiable outcome

• Filter chip packaging yield increased from 95% to 99%+ within a short period under quality department leadership
• +4 more outcomes

Named customers3 records

Segments5 records

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Three partnerships are on record, tiered core.

• 兴橙资本 (Xingcheng Capital), 傲睿科技 (Aorui Technology), 广东工研院 (Guangdong Industrial Research Institute)coreStrategic or Co-development Partner · 20 June 2025In January 2025, the four-party strategic cooperation established by Xingcheng Capital, Yuehai Integrated, Aorui Technology,, and Guangdong Industrial Research Institute achieved a milestone — the first equipment entry for the 12-inch smart microfluidic chip production line. This marked the official launch of inkjet printhead localization, fulfilling the strategic commitment to building a comprehensive technology platform.
• 傲睿科技 (Aorui Technology)coreStrategic or Co-development Partner · 1 January 2022Aorui Technology partnered with Yuehai Integrated and Guangdong Industrial Research Institute under Xingcheng Capital's coordination to establish an 'equity investment + industrial synergy' model. The collaboration focuses on the intelligent microfluidic chip (MEMS) supply chain covering design, manufacturing, and application, with Aorui providing key technology for the 12-inch smart microfluidic chip production line.
• 广东工研院 (Guangdong Industrial Research Institute)coreStrategic or Co-development Partner · 1 January 2022Guangdong Industrial Research Institute participates as the fourth partner in the 'equity investment + industrial synergy' strategic cooperation alongside Yuehai, Aorui Technology, and Xingcheng Capital, contributing to the comprehensive technology platform for advanced packaging and microfluidic chip development.

Scale indicators4 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• Amkor Technology: One of the world's largest OSAT providers with a strong advanced packaging portfolio including 2.5D/3D TSV and fan-out wafer-level packaging. Directly comparable as a back-end packaging services competitor targeting AI, HPC, automotive, and mobile customers.
• ASE Technology Holding: Global OSAT leader offering advanced packaging including flip-chip, wafer-level packaging, and 2.5D/3D integration. Directly competes for advanced-packaging service revenue across same end-market verticals as 3DSEMI.
• JCET (Jiangsu Changjiang Electronics Technology): China's largest domestic OSAT, providing advanced packaging services including bumping, WLP, and 2.5D/3D packaging. Direct competitor for Chinese advanced-packaging customers and a key benchmark for domestic packaging capacity expansion.
• Tongfu Microelectronics: China-based OSAT offering advanced packaging including flip-chip, bumping, and fan-out WLP. Comparable as a domestic Chinese packaging competitor pursuing similar automotive, communications, and consumer electronics customers.
• Powertech Technology (PTI): Taiwan-based OSAT with significant advanced packaging capabilities including wafer-level packaging and high-bandwidth memory integration. Targets overlapping customer set in 5G, AI, and HPC chip packaging.
• ChipMOS Technologies: OSAT providing back-end services including advanced packaging for memory, logic, and mixed-signal chips. Overlaps with 3DSEMI's TSV/RF/automotive sensor packaging customer base.
• Shinko Electric Industries: Japan-based advanced packaging provider with strong flip-chip BGA and 2.5D/3D integration capabilities serving AI/HPC customers. Comparable through its high-end packaging technology mix and quality focus.
• UTAC Holdings: Global OSAT specializing in advanced packaging including automotive-grade and analog/mixed-signal packaging. Comparable as a multi-segment OSAT competing for sensor, automotive, and industrial IC packaging work.

Broad incumbents

• TSMC (Taiwan Semiconductor Manufacturing Company): Operates the leading CoWoS/InFO advanced packaging platforms that serve as the global benchmark for 2.5D/3D TSV services. While primarily a foundry, its OSAT-like advanced packaging offerings set the competitive ceiling 3DSEMI must approach.

Emerging players

• Sanan IC: Chinese compound-semiconductor and advanced-packaging-focused player building out advanced packaging capacity. Comparable as a domestic Chinese peer also pursuing semiconductor localization-driven capacity expansion.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Funding overview

Funding rounds1 record

Investors3 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about 3DSEMI