Aehr Test Systems

What Aehr Test Systems does

Aehr Test Systems, founded in 1977 and headquartered in Fremont, California, designs and manufactures semiconductor test and burn-in equipment used across the wafer-level, singulated die, and packaged-part stages of device production. The company's core FOX-P family — FOX-XP (multi-wafer, up to nine 300mm wafers in parallel), FOX-NP, and the lower-cost FOX-CP — performs full-wafer burn-in and reliability screening for silicon carbide power devices, silicon photonics transceivers, 2D/3D sensors, memory, microcontrollers, and processors, supported by proprietary consumables including the FOX WaferPak contactor and FOX DiePak carrier. Through its August 2024 acquisition of Incal Technology, Aehr added the Sonoma ultra-high-power packaged-part burn-in platform, capable of delivering over 3,200 watts per distribution tray with active liquid cooling across up to 88 sites — a product specifically engineered for AI accelerators, GPUs, and HPC processors exceeding 1,000 watts.

Aehr generates revenue primarily through direct enterprise sales of capital equipment systems priced at multi-million-dollar contract values, with multi-year customer relationships and recurring consumables (WaferPak contactors, DiePak carriers, Sonoma burn-in modules) that are device-specific and require periodic replacement. The go-to-market is direct enterprise field sales targeting hyperscale AI chip programs, silicon photonics manufacturers, automotive/SiC power device makers, and storage and logic semiconductor companies; there are no channel partners for core system sales. Revenue is recognized on shipment and acceptance, producing lumpy quarterly results, as evidenced by Q3 fiscal 2026 revenue of $10.3M down 44% year-over-year despite record bookings of $37.2M, a record $50.9M backlog, and a $41M single order from its lead hyperscale AI customer.

The company is publicly traded on NASDAQ (AEHR), has 51-100 employees, has installed more than 2,500 systems worldwide, completed a $60 million at-the-market offering in April 2026, and counts institutional ownership at roughly 69-70%. William Blair estimates Aehr's addressable market for AI-processor burn-in tools at $1.5-2.3 billion by 2030.

Name

Aehr Test Systems

Legal name

Aehr Test Systems

Website

https://aehr.com

Company type

Public

Founded year

1977

Operating status

Operating

Headcount range

51–100 employees

Short description

Aehr Test Systems designs and manufactures semiconductor wafer-level and packaged-part burn-in and test systems, including the FOX-P family and Sonoma ultra-high-power platform, primarily serving hyperscale AI chip makers, silicon photonics manufacturers, and automotive silicon carbide device producers through direct enterprise sales.

Ownership category

akta.pro rank

Product category

Semiconductor Test Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)

SIC

Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Services-Testing Laboratories (8734)

akta.pro primary industry

Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)

Keywords

• Semiconductor burn-in systems
• Wafer-level test equipment
• AI processor reliability testing
• Packaged parts burn-in
• Silicon carbide test solutions

Headquarters

HQ city

Fremont

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. Test and Burn-in Systems: Primary revenue from selling FOX-P family test and burn-in systems including FOX-XP, FOX-NP, and FOX-CP. These are capital equipment purchases with multi-million dollar order values. Revenue recognized upon shipment and acceptance.
2. Consumables (WaferPak and DiePak): Recurring revenue from consumable contactors and carriers used in the test systems. WaferPak contactors and DiePak carriers require periodic replacement based on usage.
3. Sonoma High-Power Package-Level Systems: Revenue from ultra-high-power burn-in systems acquired through Incal Technology for testing AI processors and accelerators. Includes turnkey modules and device-specific sockets.
4. Support and Services: Annual maintenance, support services, and training provided to customers with installed systems.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

Aehr Test Systems manufactures and sells semiconductor test and burn-in equipment covering wafer-level (FOX-XP, FOX-NP, FOX-CP), die-level (FOX DiePak), and packaged-part (Sonoma, Tahoe) form factors, plus proprietary consumables (WaferPak contactors and DiePak carriers). Its FOX systems test up to nine 300mm wafers in parallel, while the Sonoma platform delivers ultra-high-power burn-in (3,200+ watts per tray with active liquid cooling) for AI accelerators, GPUs, and HPC processors exceeding 1,000 watts.

Product overview

Aehr Test Systems offers a comprehensive portfolio of semiconductor test and burn-in solutions spanning from wafer-level to packaged-part testing. The core product lines include the FOX-P family (FOX-XP, FOX-NP, FOX-CP) for wafer-level and die-level test and burn-in operations, the Sonoma and Tahoe systems for packaged-part reliability testing, and a complete range of consumables (WaferPak Contactors, DiePak Carriers) and accessories (automated loaders, aligners). The company also offers the legacy ABTS and MAX systems. Through the 2024 acquisition of Incal Technology, Aehr expanded into ultra-high-power burn-in solutions for AI processors exceeding 1,000 watts with the Sonoma family. The systems are used across multiple markets including artificial intelligence, automotive, mobile, silicon photonics, memory/logic, and silicon carbide applications.

Differentiator

Problem solved

Functional benefit

Products and services

• FOX-XP Full wafer contact and singulated die/module test and burn-in system that tests, burns in, and stabilizes silicon carbide power semiconductors, 2D/3D sensors, memory, processors, microcontrollers, systems-on-a-chip, and photonics devices. Configured to test up to nine 300mm wafers in parallel. For semiconductor manufacturers needing high-volume wafer-level reliability screening.
• FOX-NP Full wafer contact and singulated die/module test and burn-in system designed for characterization and product qualification of photonics-based devices and other semiconductors, supporting multi-wafer testing.
• FOX-CP Low-cost single-wafer compact test solution for logic, memory, and photonic devices. Newest economical addition to the FOX-P product family for entry-level or lower-volume wafer-level testing.
• FOX WaferPak Contactor Unique full wafer contactor capable of testing wafers up to 300mm, enabling IC manufacturers to perform test, burn-in, and stabilization of full wafers on FOX-P systems. A recurring consumable sold separately.
• FOX WaferPak Aligner Automated alignment tool for WaferPak contactors that enables precise positioning for full wafer testing operations on FOX-P systems.
• FOX DiePak Carrier Reusable carrier enabling testing, burning in, and stabilization of singulated bare die and modules up to 1,024 devices in parallel per DiePak on FOX-NP and FOX-XP systems, up to nine DiePaks at a time.
• FOX DiePak Loader Automated loading system for DiePak carriers that enables efficient handling of singulated die and modules for test and burn-in operations.
• Sonoma Ultra-High-Power Production Burn-in System Ultra-high-power packaged part reliability and burn-in test system designed for AI accelerators, GPUs, and high-performance computing processors. Delivers 3,200+ watts per Distribution Tray with active liquid cooling, up to 88 independent controlled liquid-cooled high-power sites, and a 50 x 50 inch footprint. Acquired through Incal Technology.
• Sonoma Auto Loader and Unloader Automated loading and unloading system for Sonoma ultra-high-power burn-in systems, maximizing efficiency in high-volume production environments.
• Sonoma Burn-in Modules Turnkey application-specific burn-in modules with active liquid-based conductive temperature control per device for the Sonoma ultra-high-power system.
• Tahoe Packaged parts test and burn-in system for production and qualification testing of packaged semiconductor devices, complementing the Sonoma ultra-high-power family.
• Tahoe Burn-in Boards Burn-in boards for the Tahoe packaged parts test system, used for reliability screening of packaged semiconductor devices.
• ABTS (Advanced Burn-in Test System) Legacy burn-in and test system for packaged parts covering low-power and high-power logic as well as all common types of memory devices. Aehr's original flagship system for packaged-part reliability testing.
• MAX System Legacy burn-in and functional test system for complex devices such as digital signal processors, microprocessors, microcontrollers, and systems-on-a-chip.

Quantifiable outcome

• Book-to-bill ratio exceeding 3.5x indicating strong demand outpacing current revenue recognition
• +4 more outcomes

Named customers6 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Two partnerships are on record, tiered core.

• ISE LabscoreStrategic or Co-development Partner · 3 November 2025Aehr Test Systems and ISE Labs announced a partnership on wafer-level test and burn-in for high-performance computing and artificial intelligence processors. ISE Labs provides semiconductor test and burn-in services, and the partnership enables joint customer engagement and service delivery for HPC and AI chip manufacturers.
• Incal Technology, Inc.coreStrategic or Co-development Partner · 1 August 2024Aehr Test Systems completed acquisition of Incal Technology on August 1, 2024. Incal is a Fremont, California-based manufacturer of packaged part reliability/burn-in test solutions used by leading AI semiconductor manufacturers. The acquisition enhances Aehr's high-power capabilities for AI accelerators, GPUs, and HPC processors, with power levels exceeding 1000 watts. Incal CEO Alberto Salamone became Executive Vice President of Aehr's package part burn-in business.

Scale indicators10 records

Recent moves7 records

Expansion highlights6 records

Broad incumbents

• Onto Innovation: Onto Innovation provides a broad portfolio of inspection, metrology, and test equipment for semiconductor manufacturers. While not a direct burn-in competitor, it addresses adjacent reliability and process-control needs for the same logic, memory, and power-semiconductor customers as Aehr.

Emerging players

• PDF Solutions: PDF Solutions provides analytics and test-related software for semiconductor yield and reliability improvement. It is adjacent to Aehr's reliability and burn-in workflow, increasingly relevant as AI and advanced-node devices demand deeper test data analytics.
• Translarity: Translarity develops advanced probe and contactor technologies for wafer-level and packaged-part test, including AI and high-power semiconductor applications. It addresses similar reliability and test challenges to Aehr's FOX wafer-level systems with a complementary contactor approach.

Direct peers

• Chroma ATE: Chroma ATE is a Taiwan-based manufacturer of semiconductor test and burn-in equipment, including SoC/Logic testers and burn-in systems that compete directly with Aehr's FOX and legacy ABTS product lines for logic, memory, and power semiconductor manufacturers.
• FormFactor: FormFactor is a leading supplier of probe cards and test contactors used in wafer-level and packaged-part testing. Its contactors are complementary to Aehr's WaferPak/DiePak consumables, and it serves overlapping semiconductor customers in logic, memory, and AI devices.
• Cohu: Cohu is a semiconductor test handler and tester company whose products interface with burn-in systems and ATE at major fabs. Its testers and contactors serve the same automotive, memory, and logic semiconductor customers that Aehr addresses with FOX and Sonoma systems.
• MJC (Micronics Japan): MJC is a Japanese manufacturer of test handlers and burn-in equipment serving semiconductor manufacturers globally. It directly competes with Aehr in burn-in and packaged-part test, particularly for memory and logic IC manufacturers in Asia.
• Advantest: Advantest is the world's largest semiconductor automated test equipment (ATE) supplier, offering memory and SoC testers as well as burn-in systems that directly overlap with Aehr's FOX and Sonoma product lines. Both serve AI, memory, and logic semiconductor manufacturers with reliability and burn-in test solutions.
• Teradyne: Teradyne is a leading supplier of semiconductor test equipment (UltraFlex, J750, etc.) serving logic, memory, and analog IC manufacturers. It competes with Aehr in packaged-part test and burn-in, and overlaps in serving AI accelerator and hyperscale customers.

Others

• ASE Technology Holding: ASE is the world's largest OSAT provider offering assembly, packaging, and test services including burn-in. It is a customer of burn-in equipment suppliers like Aehr, and its captive test services represent an alternative to customers evaluating capital equipment purchases versus outsourced test.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/aehr-test-systems

Revenue estimate

Valuation estimate

Number of profiles

Profiles11 records

Subsidiaries1 record

Funding overview

Funding rounds6 records

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Aehr Test Systems