What Green Mountain Semiconductor does

Green Mountain Semiconductor Inc. is a privately-held US semiconductor design services firm founded in 2014 and headquartered at 28 Howard St, Burlington, Vermont, with a workforce of 11-50 employees. The firm specializes in custom analog, digital, and mixed-signal ASIC design with deep technical roots in memory design (DRAM, SRAM, and emerging non-volatile memories) and, since 2015, in compute-in-memory architectures for AI applications. Core technology centers on in-memory neural network accelerators that eliminate the Von Neumann memory bottleneck, with silicon-validated implementations including a >100X energy reduction NV-1 AI processor, 3000+-core multi-core ASICs for client Non-Von LLC, radiation-hard neuromorphic processors for NASA, and proprietary radiation hardness simulation tooling. The firm holds seven patents in compute-in-memory and related domains, with founders Wolfgang Hokenmaier, Ryan Jurasek, and Don Labrecque collectively holding 52+ patents and 20+ years of industry experience each.

The company's offerings span five core service lines — AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, and Interface Solutions — complemented by licensable IP products including LPDDR4/4X/5 Secondary PHY IP at TSMC 7nm and SPI/QPI controllers. All design work is performed in-house at the Burlington, VT office (100% US-based), and the firm holds CMMC 2.0 certification and full ITAR compliance, qualifying it for defense, aerospace, and other government work. Target markets are aerospace and defense, high-performance computing, and medical devices, all characterized by demanding size, weight, and power (SWaP) constraints.

Revenue is generated through three streams: (1) custom ASIC design services billed as project-based professional engagements, (2) IP licensing of proprietary PHY and controller IP, and (3) technology development contracts with government agencies including NASA and NSF via SBIR Phase I and Phase II programs. Pricing is quote-based and project-specific with multi-year contract cadence. Customers include NASA (multiple SBIR awards 2023-2024), NSF (Phase I 2016, Phase II 2018), Non-Von LLC (extended multi-core design contract), and IBM (turn-key emerging memory design). The go-to-market motion is consultative enterprise field sales supported by gated white papers, an active technical blog, and conference presence at GOMACTech, IEEE symposiums, DAC, and Memcon. Foundry and ecosystem partners include TSMC, GlobalFoundries, SkyWater Technology, Powerchip, X-FAB, Arm, Aragio Solutions, QP Technologies, and SUNY Albany.

Name

Green Mountain Semiconductor

Legal name

Green Mountain Semiconductor Inc.

Website

https://greenmountainsemi.com

Company type

Private

Founded year

2014

Operating status

Operating

Headcount range

11–50 employees

Short description

Green Mountain Semiconductor is a privately-held, US-based semiconductor design services firm in Burlington, Vermont, specializing in custom analog, digital, and mixed-signal ASIC design with deep expertise in memory design and compute-in-memory AI architectures for aerospace, defense, HPC, and medical device clients.

Ownership category

akta.pro rank

Product category

Semiconductor Design Services

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Hardware/Chip Design IP Cores (Processor, Interface, Analog, Security) (HDAHAFAF)

Keywords

• Custom ASIC design
• Semiconductor design services
• Compute-in-memory architectures
• Emerging memory development
• Mixed signal circuit design

Headquarters

HQ city

Burlington

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Technology or R&D, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Custom ASIC Design Services: Full-service semiconductor design from early technology development to test chips and production. Services include custom analog, digital, and mixed-signal design; memory design (DRAM, SRAM, emerging NVM); and compute-in-memory architectures.
2. IP Licensing: Licensing of proprietary IP including LPDDR4/4X/5 PHY, SPI/QPI controllers, and compute-in-memory architectures. Available as hard IP or soft IP with customization and porting services.
3. Technology Development Contracts: R&D contracts with government agencies (NASA, NSF) and commercial clients for developing specialized semiconductor solutions. Includes Phase I/II SBIR contracts and extended development agreements with clients like Non-Von LLC.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels5 records

Core offering

Green Mountain Semiconductor is a B2B semiconductor design services firm delivering custom analog, digital, and mixed-signal ASIC design grounded in deep memory design expertise (DRAM, SRAM, Emerging NVM) and proprietary compute-in-memory architectures. The firm offers five core service lines — AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, and Interface Solutions — supplemented by licensable IP such as LPDDR4/4X/5 secondary PHY and SPI/QPI controller blocks, with tape-outs at TSMC 7nm and Global Foundries 22FDX Plus.

Product overview

Green Mountain Semiconductor is a design services firm offering semiconductor design and development expertise, not a single product company. The portfolio consists of five core service offerings: AI Circuit Design Services (compute-in-memory architectures, in-memory neural networks since 2015), Analog & Mixed Signal Design Services (custom ASICs from transistor level), Emerging Memory Development Services (volatile and non-volatile memories), Special Purpose Applications Services (custom circuits for aerospace/defense), and Interface Solutions Services (high-speed PHY development). These services are complemented by specific IP products including LPDDR4x/5 Secondary/Slave PHY IP, LPDDR5X PHY IP, and Slave Side SPI/QPI Controller IP, plus an In-Memory Computing Solutions sub-product for neuromorphic compute. The company also offers access to its White Paper Library covering technical topics. GMS specializes in Custom Analog, Digital & Mixed Signal design with deep roots in Memory Design (DRAM, SRAM, Emerging NVM) and Compute-In-Memory architectures.

Differentiator

Problem solved

Functional benefit

Products and services

• AI Circuit Design Services Custom compute-in-memory architecture development from design scope assessment to architecture, circuit design, simulation, layout, integration, and application optimization. Includes in-memory neural network design for ultra-low power AI inferencing for enterprise, aerospace, and HPC customers.
• Analog & Mixed Signal Design Services Custom ASIC analog and mixed-signal design including regulated internal voltages, charge pumps, level shifters, programmable H-bridge current drivers, low-noise differential amplifiers, DLLs, PLLs, A/D and D/A converters, and high-speed receivers/output drivers.
• Emerging Memory Development Services Development and qualification of volatile and non-volatile emerging memories including full memory chip design, prototype development, test structures for CMOS+X architectures, high-speed interface IP, and 3D integration toward HBM products.
• Special Purpose Applications Services Custom circuit design for special applications where commercial off-the-shelf chips do not meet requirements, including aerospace and defense custom ASIC design, radiation-hard AI memory IP, ground penetrating radar feature extraction, and advanced 3D-packaging architectures.
• Interface Solutions Services High-speed PHY interface development based on memory expertise, including a family of secondary LPDDR4/4X/5 PHY and SPI/QPI interfaces for JEDEC-compliant data transfer at advanced technology nodes such as TSMC 7nm.
• LPDDR4/4X/5 Secondary/Slave PHY IP Memory-side (slave) interface IP providing LPDDR5 at up to 6400 Mbps and LPDDR4/4X at up to 4267 Mbps, JEDEC compliant, designed for TSMC 7nm FinFET process. Enables data transmission between AI coprocessors, in-memory compute solutions, and emerging memory products. Available as hard IP or soft IP with customization and porting services.
• Slave Side SPI/QPI Controller IP SPI/QPI PHY IP compatible with Macronix NOR Flash SPI products at maximum frequency 133 MHz, with test bench included. Suitable for memory products and in-memory AI embedded systems. Available as hard IP or soft IP and portable to various CMOS technology nodes.
• In-Memory Computing Solutions Self-contained in-memory compute solution based on SRAM, DRAM, and Phase Change Memory, including a Multiply Accumulator, Programmable Activation Function, Multi-layer control sequencer, and sparse network support for HPC and AI applications.

Quantifiable outcome

• 100X reduction in energy consumption and >10X acceleration in parallel processing for NV-1 AI processor
• +4 more outcomes

Named customers4 records

Segments5 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability5 records

Feature8 records

Partnerships

Eight partnerships are on record, tiered core and minor.

• Non-Von LLCcoreStrategic or Co-development Partner · 23 September 2024Extended contract as core design house for Non-Von LLC's innovative multi-core architecture. Following 3000+ core chip tape-out, continued development on improved architecture with larger core count and optimized communication protocol.
• University of VermontcoreStrategic or Co-development Partner · 31 October 2023Led the successful GaN Tech Hub consortium in Vermont. GMS part of consortium advancing Gallium Nitride technology innovation and prototype demonstrations for semiconductor applications.
• IBMcoreStrategic or Co-development Partner · 25 October 2017Engaged to design full turn-key emerging memory product for IBM licensing client. Providing qualification test vehicles and embedded memory IP to support technology development and customer's product roadmap.
• Global FoundriescoreTechnology or IntegrationFoundry partner for semiconductor manufacturing. GMS tape-out performed at Global Foundries 22FDX Plus for CMOS+X low-power AI processing architecture.
• SUNY AlbanyminorStrategic or Co-development PartnerAcademic partner providing research collaboration and access to advanced research facilities. GMS presented at IEEE symposium in Albany.
• TSMCcoreTechnology or IntegrationFoundry partner for advanced node manufacturing. GMS LPDDR4/4X/5 PHY IP designed for TSMC 7nm FinFET process.
• National Science Foundation (NSF)coreStrategic or Co-development PartnerGovernment research funding partner. Multiple Phase I and Phase II SBIR grants supporting in-memory search and AI IP development since 2016.
• NASAcoreStrategic or Co-development PartnerGovernment space agency and research sponsor. NASA Phase I/II contracts for radiation-hard neuromorphic processors, SBIR awards for rad-hard neural processor with embedded MRAM.

Scale indicators7 records

Recent moves6 records

Expansion highlights6 records

Market position

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/green-mountain-semiconductor-inc-
• Xx.com/GreenMntnSemi
• Facebookfacebook.com/greenmountainsemi

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Funding overview

Funding rounds2 records

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Green Mountain Semiconductor