Hi-P International

What Hi-P International does

Hi-P International is a Singapore-headquartered, vertically integrated contract manufacturer serving global multinational corporations across telecommunications, consumer electronics, computing, data storage, medical, and consumer goods industries. Founded in 1980 as Hi-P Tool & Die and privatized from the Singapore Exchange in 2021, the company operates 15,000+ employees across manufacturing facilities in China (Shanghai, Suzhou, Nantong, Chengdu, Xiamen), Singapore, and Thailand, complemented by sales and engineering offices in the United States, Taiwan, Japan, Germany, and Vietnam.

The company delivers an end-to-end electro-mechanical manufacturing platform spanning precision tooling (up to 5-micron accuracy), single/double/triple-shot plastic injection molding, insert molding, metal stamping, CNC machining, surface decoration (spray painting, electro plating, PVD, anodizing), electronics manufacturing services (EMS), flexible printed circuitry (HDI, multi-layer, rigid-flex with SMT), antenna manufacturing, and final assembly and testing. It operates four business units — International, Greater China, Consumer Electronics, and EMS/ODM — and an in-house Design Center with approximately 100 R&D staff supporting JDM/ODM services.

Hi-P generates revenue primarily through project-based contract manufacturing fees across multiple product categories (mobile devices, lifestyle products, computing peripherals, industrial equipment). Go-to-market is direct enterprise sales with an Early Supplier Involvement (ESI) model embedding engineering teams with customers from the design phase. Blue-chip customers include Amazon, Colgate-Palmolive, Dyson, Keurig Dr Pepper, Logitech, Meta, Motorola Solutions, Procter & Gamble, Seagate, and Molex. Disclosed revenue was S$1.6 billion in 2021 with over S$2 billion projected in 2024; in July 2024, Hi-P received a S$100 million investment from Temasek-backed 65 Equity Partners to support growth acceleration, leadership succession, and a potential future public listing.

Name

Hi-P International

Legal name

Hi-P International Pte. Ltd.

Website

https://hi-p.com

Company type

Private

Founded year

1980

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Hi-P International is a Singapore-based vertically integrated contract manufacturer serving global blue-chip customers across consumer electronics, telecommunications, data storage, medical, and consumer goods with precision tooling, plastic and metal manufacturing, EMS, FPC, and antenna solutions.

Ownership category

akta.pro rank

Product category

Contract Manufacturing Services

NAICS

Industrial Machinery Manufacturing (3332), Commercial and Service Industry Machinery Manufacturing (333310)

SIC

Misc Industrial & Commercial Machinery & Equipment (3590), Telephone & Telegraph Apparatus (3661), Special Industry Machinery (No Metalworking Machinery) (3550)

akta.pro primary industry

Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD)

Keywords

• Precision contract manufacturing
• Plastic injection molding
• Electronics manufacturing services
• Metal stamping and CNC
• Flexible printed circuitry

Headquarters

HQ city

Singapore

HQ country

Singapore

HQ region

Asia

Offices13 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Supply Chain, Operations, Infrastructure, Technology or R&D

Revenue model

1. Contract Manufacturing Services: Hi-P provides advanced manufacturing and production, assembly, testing and packaging services. Revenue is generated through manufacturing fees for precision tooling, plastic molding, metal forming, surface decoration, EMS, flex circuits, and antenna manufacturing. The company operates as a vertically-integrated turnkey contract manufacturer serving telecommunications, consumer electronics, data storage, medical and automotive industries. Pricing is project-based with no publicly disclosed standard rates.
2. JDM/ODM Services: Joint Design and Development, Quick Spin to ODM services. R&D services, design capabilities, and manufacturing under one roof to reduce cost and lead-time. Revenue from engineering and design services combined with manufacturing.
3. Supply Chain Management Services: Cross-industry expertise and developed analytic tools for supply chain management. Includes EMS sourcing capability and commodity management covering mechanical parts, electronic parts and electrical-mechanical parts for wireless, consumer electronics and computer industry throughout entire product lifecycle.

Pricing tiers

Go-to-market motion2 records

Distribution channels3 records

Marketing channels4 records

Core offering

Hi-P International is a vertically integrated contract manufacturer providing precision tooling, plastic injection molding, metal forming/stamping/CNC machining, surface decoration, flexible printed circuitry, antenna manufacturing, and end-to-end electronic manufacturing services (EMS) including assembly, testing and packaging. The company serves telecommunications, consumer electronics, computing and peripherals, automotive, medical, data storage, and industrial customers through dedicated business units spanning design, prototyping, mass production and global delivery.

Product overview

Hi-P International is a vertically-integrated contract manufacturing services provider offering a comprehensive portfolio of manufacturing solutions. The company operates four main business units: International Business Unit (mobile devices, smartphones, wearables, home appliances), Greater China Business Unit (mobile phones, wearables, home entertainment), Consumer Electronics Business Unit (home appliances, computing peripherals, medical), and EMS/ODM Business Unit (wireless devices). Core service offerings include Mechanical Solutions (tooling, molding, stamping, CNC, surface decoration), Flex (flexible printed circuitry), Antenna Solutions, EMS, and JDM/ODM services. Manufacturing footprint spans multiple global facilities in China (Shanghai, Suzhou, Nantong, Chengdu, Xiamen), Singapore, Thailand, and sales/engineering offices in US, Taiwan, Japan, Germany. Customers include Amazon, Colgate-Palmolive, Dyson, Keurig Dr Pepper, Logitech, Meta, Motorola Solutions, Procter & Gamble, and Seagate.

Differentiator

Problem solved

Functional benefit

Products and services

• Mechanical Solutions (Tooling, Molding, Stamping, Metal CNC, Surface Decoration) Vertically integrated mechanical manufacturing services covering precision tooling, plastic injection molding (single/double/triple shot, insert molding, IMD/IML), metal stamping, CNC machining (turning, milling, grinding) and surface decoration (spray painting, electro plating, PVD, anodizing). Serves consumer portables, electronics, personal care, industrial, recreational, and medical device industries.
• Flex (Flexible Printed Circuitry) Flexible printed circuitry manufacturing including single-sided, double-sided, impedance controlled, HDI, multi-layer flex and rigid-flex with SMT assembly capabilities, backed by a management and engineering team with over 15 years of industry experience.
• Antenna Solutions Mobile terminal antenna manufacturing with in-house capabilities including tooling, plastic injection, laser activation, chemical plating, assembly and RF testing for smartphones, notebooks and portable communication equipment.
• EMS (Electronics Manufacturing Services) End-to-end electronics production including board-level assemblies, module assemblies and final product assemblies with testing capabilities, located in Suzhou and certified for ISO 9001:2008 and ISO 13485. Supports mobile devices, enterprise solutions, medical instruments and lifestyle accessories.
• JDM/ODM Services (Joint Design and Development / Original Design Manufacturing) Joint Design and Development, Quick Spin and ODM services with in-house R&D capabilities at Hi-P Design Center (~100 experienced R&D and supporting staff), covering hardware development and integration (electrical and mechanical), software integration and customization, project and product management, and advance engineering including process development, simulation and prototyping.

Quantifiable outcome

• Revenue growth from S$1.6 billion (2021) to projected S$2 billion+ (2024)
• +2 more outcomes

Named customers16 records

Segments9 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Four partnerships are on record, tiered core.

• Motorola Singapore Design CentercoreStrategic or Co-development Partner · 1 January 2011Hi-P acquired Motorola Singapore Design Center in 2011 to enhance design capabilities for wireless devices
• G-FlexcoreStrategic or Co-development Partner · 1 January 2009Hi-P acquired G-Flex in 2009 to expand flex circuit manufacturing capabilities
• HaiercoreStrategic or Co-development Partner · 1 January 2001Haier Hi-P JV in Qingdao established in 2001 for joint manufacturing operations
• MolexcoreStrategic or Co-development Partner · 1 January 1987Joint venture formed in 1987 to supply US multinational with electronic connectors - Yao's big break that led to Hi-P's growth

Scale indicators7 records

Recent moves9 records

Expansion highlights4 records

Direct peers

• Venture Corporation: Singapore-based diversified EMS/ODM provider serving similar end-markets (consumer electronics, computing, medical, industrial) at comparable scale. The closest geographic and capability peer to Hi-P, making it the natural benchmark for valuation and operating performance.
• Flex Ltd: Global tier-1 EMS/ODM offering vertically integrated design, manufacturing, logistics and supply chain services to consumer electronics, automotive, health and industrial customers. Competes head-to-head with Hi-P for outsourced electro-mechanical programs.
• Jabil: Major global EMS/ODM serving consumer electronics, automotive, healthcare and industrial customers with end-to-end manufacturing solutions. Directly comparable in scope of services and customer overlap, though at meaningfully larger scale.
• Sanmina: US-headquartered EMS provider focused on communications, computing, medical, automotive and industrial end-markets. Closely comparable vertically-integrated capabilities and customer mix to Hi-P.
• Pegatron: Taiwan-based EMS/ODM specializing in computing, communications and consumer electronics. Competes directly with Hi-P in mobile device and wireless programs for global OEM customers.
• Wistron: Taiwan-based EMS/ODM serving computing, communications and consumer electronics OEMs. Comparable vertically-integrated offerings and active in similar product categories as Hi-P.
• Fabrinet: Specialist EMS provider focused on optical communications, complex industrial and medical end-markets. Comparable vertically-integrated model with higher-mix, higher-margin focus than tier-1 EMS players.
• Benchmark Electronics: US-based mid-tier EMS serving industrial, aerospace, medical and computing customers. Comparable vertically-integrated capabilities targeting complex, higher-mix programs similar to Hi-P's industrial/medical verticals.
• SIIX Corporation: Japan-headquartered EMS provider with significant Asia manufacturing footprint serving consumer electronics, industrial and automotive customers. Comparable size, Asia-centric manufacturing model and customer profile to Hi-P.

Broad incumbents

• Foxconn (Hon Hai Precision): The world's largest EMS/ODM and primary supplier to Apple, serving consumer electronics, computing and communications. Sets pricing benchmarks Hi-P must compete against, especially in mobile/wireless device manufacturing.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance23 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries12 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hi-P International