PCB Technologies

Name

PCB Technologies

Legal name

PCB Technologies Ltd.

Website

https://pcb-technologies.com

Company type

Public

Founded year

1981

Operating status

Operating

Headcount range

501–1,000 employees

Short description

PCB Technologies is an Israeli PCB manufacturer and OSAT provider serving high-reliability industries (aerospace, defense, medical, automotive, semiconductor) with vertically integrated fabrication, turnkey assembly, and advanced IC packaging via its iNPACK subsidiary.

Ownership category

akta.pro rank

Product category

PCB Manufacturing

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Bare Printed Circuit Board Manufacturing (334412), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

PCB Assembly (PCBA/EMS) (HDAHAOAI)

akta.pro secondary industries

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK), PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH), PCB Fabrication (Rigid PCBs) (HDAHAOAG)

Keywords

• PCB fabrication services
• HDI microvia technology
• PCB assembly services
• Advanced IC packaging
• Flex rigid-flex PCBs

Headquarters

HQ city

Migdal

HQ country

Israel

HQ region

Middle East

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Infrastructure

Revenue model

1. PCB Manufacturing: Core business manufacturing printed circuit boards including rigid, HDI, flex, and rigid-flex PCBs for various industries. Revenue generated from fabrication services ranging from prototype to mid/high-volume production.
2. PCB Assembly (PCBA): Complete assembly services including POP – Package on Package, 01/005 Components, Micro BGAs, Flexible PCBs, Multi-Layered Prints, mechanical assembly, integration, ICT, J-TAG, and final testing. Full turnkey solutions transforming part integration, cabling, and electronics into modules or end products.
3. iNPACK IC Packaging & Miniaturization: Advanced IC packaging and miniaturization solutions through iNPACK subsidiary including SiP, organic substrates, and 3D packaging. Quick turn fabrication with delivery in 6 months and ability to ramp to mass production.
4. Offshore PCB Solutions: All-in-one off-shore department offering production floor services with local offices providing competitive pricing, lead time advantages, and logistics support.

Pricing tiers

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

PCB Technologies manufactures printed circuit boards (rigid, HDI, flex, rigid-flex) and provides full turnkey PCB assembly services, plus advanced IC packaging and miniaturization solutions through its iNPACK subsidiary. The company operates as an All-in-One solutions provider covering design, fabrication, assembly, and system integration for high-reliability industries including aerospace, defense, medical, semiconductor, automotive, communications, and energy.

Product overview

PCB Technologies operates as an All-in-One Solutions provider encompassing three integrated divisions: PCB Solutions (manufacturing of rigid, flex, and rigid-flex PCBs), PCB Assembly (full turnkey PCBA services), and iNPACK (advanced IC packaging and miniaturization subsidiary). The company offers a vertical integration model from design through fabrication, assembly, and system integration—all within the same facility. Key products include HDI microvia technology, mSAP (Modified Semi Additive Process), X-VIA thermal technology, flex/rigid-flex PCBs, SiP (System-in-Package) solutions, organic substrates with 25-micron line/space capability, QFN IC packages, and thermal management solutions including embedded coins. The company serves high-reliability industries including aerospace, defense, medical, automotive, communications, energy, and semiconductor sectors. iNPACK, the company's miniaturization subsidiary, provides advanced packaging solutions including 3D, 2.5D, and 2D packaging, turn-key solutions, and substrate manufacturing.

Differentiator

Problem solved

Functional benefit

Brands

• iNPACK: Advanced heterogeneous integration provider of System-in-Package (SiP) solutions. Focuses on IC packaging, organic substrates with 25-micron lines and spacing, 3D/2.5D/2D packaging solutions for aerospace, defense, medical, consumer electronics, automotive, energy, and communications industries worldwide.

Products and services

• PCB Solutions Core PCB manufacturing capabilities including rigid, multilayer, HDI, flex, and rigid-flex PCBs for analog, RF, and high-speed digital designs, serving aerospace, defense, medical, semiconductor, automotive, communications, and energy customers.
• PCB Assembly (PCBA)

Quantifiable outcome

• Quick turn fabrication delivery in 6 months
• +2 more outcomes

Named customers4 records

Segments7 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Partnerships

Two partnerships are on record, tiered core.

• iNPACKcoreOthers · 1 June 2022iNPACK is a subsidiary of PCB Technologies launched in July 2022, focusing on advanced microelectronics packaging technology including System-in-Package (SiP) solutions, organic substrates, and 3D/2.5D/2D packaging. Provides quick turn fabrication with 6-month delivery and ability to ramp to mass production.
• Precision Circuits Inc. (PCI)coreOthersFully owned US subsidiary of PCB Technologies located in Neptune City, New Jersey. PCI is responsible for sales, marketing, and customer support for the North American market. Holds manufacturing license agreement (MLA) from US State Department enabling participation in Department of Defense programs.

Scale indicators6 records

Recent moves3 records

Expansion highlights6 records

Direct peers

• Shennan Circuits: Chinese PCB and PCBA manufacturer serving communications, aerospace, and medical with HDI, substrate-like PCBs, and turnkey assembly. Comparable high-reliability and advanced PCB capabilities.
• TTM Technologies: Large US-headquartered PCB and RF/microwave substrate manufacturer with global fabrication footprint. Direct competitor to PCB Technologies across HDI, rigid, flex, and high-reliability PCBs serving aerospace, defense, and medical customers.
• Unimicron Technology: Taiwan-based PCB manufacturer with strong HDI, rigid, flex, and IC substrate businesses. Competes with PCB Technologies in advanced substrates and high-layer-count HDI, though at significantly larger scale.
• AT&S (Austrian Technologie & Systemtechnik): Austrian specialist in HDI PCBs and IC substrates, including advanced packaging substrates. Closely comparable to PCB Technologies on the iNPACK side of the business (organic substrates, 25μm-class feature sizes) and in high-end PCB substrate markets.
• Tripod Technology: Taiwanese PCB manufacturer focused on multilayer, HDI, and rigid-flex boards for automotive, networking, and consumer applications. Directly comparable in PCB fab capabilities and customer verticals.

Broad incumbents

• Jabil: One of the largest global EMS providers, with full turnkey assembly and vertically integrated PCB/PCBA capabilities. Competes with PCB Technologies for high-reliability assembly programs, especially in aerospace, defense, and medical.
• Sanmina: Global EMS/PCBA provider offering full turnkey electronic manufacturing services including PCB fabrication and assembly. Overlaps with PCB Technologies on the Assembly (PCBA) and turnkey solutions side, though at vastly larger scale across diverse end markets.
• Flex (Flextronics): Global EMS giant including its Multek PCB/PCBA division. Provides broad turnkey electronics services and competes with PCB Technologies for high-reliability assembly and packaging programs.

Emerging players

• Aspocomp Group: Finnish PCB manufacturer focused on HDI, multilayer, and quick-turn prototypes for telecom, automotive, and industrial customers. Comparable to PCB Technologies on short-cycle, high-complexity rigid PCB work.

Others

• Shengyi Technology: Leading Chinese copper-clad laminate (CCL) and PCB material supplier. Adjacent rather than directly competitive, supplying the substrate and laminate materials that PCB Technologies uses in its rigid and rigid-flex PCB fab.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• Xx.com/PcbTechnologies
• Facebookfacebook.com/pcbtechnologiesltd
• LinkedInlinkedin.com/company/pcb

Compliance12 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Subsidiaries2 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about PCB Technologies