What Jcet does

JCET Group (Jiangsu Changjiang Electronics Technology Co., Ltd.), founded in 1972 and listed on the Shanghai Stock Exchange (SSE: 600584), is the world's third-largest and China's mainland No.1 OSAT (Outsourced Semiconductor Assembly and Test) provider. The company operates eight manufacturing campuses across China, Korea, and Singapore, employs approximately 20,000 people, and holds a global patent portfolio exceeding 3,030 patents. Since 2024, it has operated as a subsidiary of China Resources (CRC), a major Chinese state-owned conglomerate, following CRC's assumption of control. JCET provides comprehensive IC back-end manufacturing services through four core pillars: turnkey solutions spanning IC design through final test and shipment, package design and simulation, advanced packaging services (wirebond, flip chip, wafer bumping, wafer-level packaging, System-in-Package, MEMS/sensors, and power device packaging), and test services for mixed signal, RF, analog, and high-performance digital devices.

The company's technology platform centers on its proprietary XDFOI™ multi-dimensional fan-out heterogeneous integration chiplet technology, which has entered high-volume manufacturing, alongside co-packaged optics (CPO), fcBGA packaging, glass substrates, and HFBP dual-sided heat dissipation packaging. Advanced packaging accounts for over 72% of total revenue (Q4 2024), reflecting deliberate mix shift toward higher-value services. JCET serves five primary application segments—Automotive, Computing/HPC, Storage, Edge AI, and Power & Energy—with secondary exposure to Communication, Industrial, and Medical Electronics. Named customers and partners include Qualcomm, Analog Devices, SanDisk, and major global car manufacturers.

JCET generates revenue through B2B professional services—manufacturing fees for semiconductor assembly, test, and packaging—priced per quote based on complexity, volume, and technology node. Distribution is direct enterprise sales supported by global sales offices and 20+ business offices worldwide, with marketing executed primarily through SEMICON and industry conferences, investor relations, ESG communications, and corporate awards channels. FY2024 revenue reached RMB 35.96 billion (21.2% YoY), with computing electronics revenue growing 38.1% YoY and automotive electronics 20.5% YoY. Capital structure includes a 2021 RMB 5 billion private placement backed by Abu Dhabi Investment Authority and JP Morgan Chase Bank, and an inaugural RMB 2.4 billion sci-tech innovation medium-term note issuance in 2025-2026.

Name

Jcet

Legal name

Jiangsu Changjiang Electronics Technology Co., Ltd. (江苏长电科技股份有限公司)

Website

https://jcetglobal.com

Company type

Public

Founded year

1972

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

JCET Group is the world's No.3 and China's mainland No.1 OSAT provider, offering turnkey IC back-end manufacturing and advanced packaging services across automotive, computing, storage, edge AI, and power applications to global semiconductor customers.

Ownership category

akta.pro rank

Product category

Semiconductor Assembly and Test Services (OSAT)

SIC

Services-Testing Laboratories (8734)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Semiconductor packaging services
• IC assembly testing
• Wafer level packaging
• Advanced chip packaging
• OSAT services

Headquarters

HQ city

Jiangyin

HQ country

China

HQ region

Asia

Offices11 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Technology or R&D, Personnel, Operations, Supply Chain, Infrastructure, Marketing or Sales

Revenue model

1. IC Back-end Manufacturing and Assembly Services: Comprehensive semiconductor manufacturing and technology services including turnkey solutions from IC design through final test, packaging and shipment. Revenue is generated through manufacturing fees for semiconductor assembly, test services, and advanced packaging solutions provided to global integrated circuit manufacturers.
2. Advanced Packaging Services: High-value advanced packaging services including wafer-level packaging, 2.5D/3D packaging, SiP, flip chip, and wire bonding. Revenue derived from premium packaging services for high-performance computing, automotive, and communication applications.
3. Test Services: Full suite of test platforms and engineering services supporting mixed signal, RF, analog, and high-performance digital semiconductor devices
4. Design Services: IC package design and simulation services helping customers optimize package design for reliability and performance

Go-to-market motion1 record

Distribution channels1 record

Marketing channels8 records

Core offering

JCET Group is the world's No.3 and China's mainland No.1 OSAT (Outsourced Semiconductor Assembly and Test) provider, offering comprehensive IC back-end manufacturing and technology services to global integrated circuit manufacturers. The company delivers turnkey solutions spanning IC design, wafer bump, wafer probe, multi-die stacked assembly, final test, advanced packaging (including wirebond, flip chip, wafer-level packaging, SiP, MEMS/sensors, and power device packaging), and shipment to end customers. Services are supported by proprietary platforms including XDFOI multi-dimensional fan-out heterogeneous integration, co-packaged optics (CPO), fcBGA, and high-density SiP solutions.

Product overview

JCET Group is the world's third-largest and China's mainland No.1 OSAT ( Outsourced Semiconductor Assembly and Test) provider, offering integrated circuit back-end manufacturing and technology services. The company provides a comprehensive portfolio organized around four core service pillars: Turnkey Services (full IC lifecycle management from design to shipment), Design Services (package design and simulation), Packaging Services (wirebond, flip chip, wafer bumping, wafer level packaging, SiP, MEMS/sensors, power devices, and mainstream package advancement), and Test Services (mixed signal, RF, analog, and digital testing). Key technology platforms include XDFOI multi-dimensional fan-out heterogeneous integration, co-packaged optics (CPO), fcBGA packaging, and high-density SiP solutions. The company serves five primary application segments: Automotive, Computing (high-performance computing and edge AI), Storage, Edge AI, and Power & Energy. JCET operates 8 manufacturing campuses and over 20 business offices worldwide across China, Korea, and Singapore.

Differentiator

Problem solved

Functional benefit

Brands

• XDFOI: Multi-dimensional fan-out heterogeneous integration technology platform for 2.5D/3D packaging
• XDFOI™
• JCET Microelectronics
• STATS ChipPAC

Products and services

• Turnkey Services Comprehensive IC back-end manufacturing services from IC design through test program development, wafer bump, wafer probe, multi-die stacked assembly, final test, packaging, and shipment to end customers. Targeted at global semiconductor manufacturers needing a single-vendor full-lifecycle partner.
• Design Services IC package design and simulation services providing in-depth analysis of key package measurements to optimize reliability and performance while fitting more powerful components into smaller areas. For IC manufacturers facing miniaturization and reliability challenges.
• Wirebond Packaging Traditional leadframe-based wire bonding interconnect technology for semiconductor packaging solutions at scale. Serves high-volume semiconductor assembly needs.
• Flip Chip Packaging Advanced flip chip interconnect technology providing higher density and better electrical performance than wire bonding. For high-performance semiconductor devices requiring smaller form factors.
• Wafer Bumping Wafer-level bumping services for flip chip assembly and advanced packaging applications. Supports high-density interconnect requirements for advanced semiconductor devices.
• Wafer Level Packaging Fan-out wafer-level packaging (WLP) and other wafer-level technologies for miniaturized, high-performance semiconductor solutions. Used in compact and high-performance device applications.
• System-in-Package (SiP) Multi-dimensional fan-out heterogeneous integration solutions (XDFOI) enabling multiple chips to be integrated in a single package for high-performance computing applications. Targeted at chiplet-based designs.
• MEMS and Sensors Packaging Specialized packaging solutions for micro-electro-mechanical systems and sensor devices. Serves sensor manufacturers in automotive, industrial, medical, and consumer applications.
• Power Device Packaging Advanced packaging for power semiconductor devices including wide bandgap materials (SiC, GaN), addressing heat dissipation and power management requirements. Targeted at power electronics and EV applications.
• Advancement of Mainstream Package Technology upgrades and improvements to traditional packaging solutions for enhanced performance and reliability. For mainstream semiconductor packaging needs.
• Test Services Full suite of test platforms and engineering services supporting mixed signal, RF, analog, and high-performance digital semiconductor devices. For IC manufacturers needing comprehensive test capabilities.

Quantifiable outcome

• Advanced packaging revenue exceeds 72% of total revenue
• +4 more outcomes

Named customers5 records

Segments8 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature15 records

Partnerships

Four partnerships are on record, tiered core.

• SanDiskcoreStrategic or Co-development Partner · 1 January 2024JCET acquired 80% equity of SanDisk (Shanghai) in 2024, a global leading factory for memory chip packaging. This acquisition enhances JCET's intelligent manufacturing capabilities and expands market share in memory and computing electronics. JCET was honored with SanDisk's Global Strategic Partnership Award in 2025.
• Global Semiconductor Industry ClientscoreStrategic or Co-development Partner · 1 January 2023JCET collaborates with well-known industry clients on high-standard UWB products for enhanced automotive safety, millimeter-wave radar advanced packaging solutions, and various advanced packaging technologies for 5G, automotive, and high-performance computing applications.
• QualcommcoreStrategic or Co-development Partner · 1 January 2022JCET subsidiary STATS ChipPAC Korea (SCK) received Qualcomm RFFE Excellent Supplier Award in 2022, recognizing excellence in radio frequency front-end manufacturing and quality.
• Analog Devices Inc.coreStrategic or Co-development Partner · 1 June 2021JCET completed the acquisition of Analog Devices Inc.'s Singapore test facility in June 2021, enabling continued expansion of JCET's test business in Singapore and rapid advancement of its global business strategies.

Scale indicators11 records

Recent moves9 records

Expansion highlights6 records

Broad incumbents

• TSMC: Global No.1 semiconductor foundry that has expanded into advanced packaging through its 3DFabric platform (InFO, CoWoS, SoIC) for AI/HPC customers. While primarily a foundry, TSMC competes with JCET in advanced packaging for high-end customers, and the vertical integration raises competitive pressure on pure-play OSATs like JCET.
• Intel Foundry (Intel): IDM with growing foundry and advanced packaging capabilities including EMIB and Foveros 2.5D/3D technologies. As Intel expands foundry services and chiplet packaging offerings, it represents a broader incumbent competitive threat in advanced packaging where JCET competes for leading-edge HPC/AI customer business.

Direct peers

• Amkor Technology: Global No.2 OSAT and a US-headquartered advanced packaging leader with deep relationships with leading fabless customers (Apple, Nvidia, AMD). Competes directly with JCET in advanced packaging, automotive, and high-performance computing end markets, with significant capacity in Korea, Vietnam, Portugal, and the US.
• ASE Technology Holding: Global No.1 OSAT provider offering the full spectrum of IC packaging and test services including advanced packaging (VIPack), SiP, flip chip, and wafer-level packaging. Direct competitor to JCET across automotive, computing, communication, and consumer end markets, with overlapping technology platforms and global manufacturing footprints.
• Hana Microelectronics: Thailand-headquartered OSAT with operations across Southeast Asia and China providing IC assembly and test services. Direct competitor to JCET particularly in Southeast Asia footprint and in microelectronics/IC packaging for consumer, industrial, and automotive applications.
• Powertech Technology (PTI): Taiwan-based OSAT offering memory packaging and testing (DRAM, NAND), logic packaging, and advanced packaging services. Direct competitor to JCET especially in memory packaging after JCET's SanDisk acquisition, and overlaps in flip chip, BGA, and wafer-level packaging offerings.
• ChipMOS Technologies: Taiwan-based OSAT focused on display driver IC packaging, memory testing, and mixed-signal IC testing. Competes with JCET in test services and certain assembly services, particularly for memory and display driver semiconductor customers across Asia.
• King Yuan Electronics (KYEC): Taiwan-based OSAT specializing in IC final testing services for memory, logic, mixed-signal, and RF semiconductors. Directly comparable to JCET's test services business, with overlapping customer base and similar service offerings across the OSAT test segment.
• UTAC Holdings: Singapore-based OSAT offering analog and mixed-signal IC assembly and test services with focus on automotive, industrial, and consumer end markets. Competes with JCET in Singapore manufacturing operations and in similar packaging/test technology offerings for analog and power semiconductors.
• Tongfu Microelectronics: China-based OSAT providing IC packaging and testing services across leadframe, substrate-based, and advanced packaging technologies. Competes with JCET directly in mainland China across automotive, computing, and consumer end markets, with similar BGA, QFN, and flip chip offerings.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.cn/incareer/company/jcet-group

Compliance19 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles6 records

Subsidiaries11 records

Funding overview

Funding rounds1 record

Investors4 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Jcet