ClassOne Technology
ClassOne Technology designs and manufactures single-wafer electroplating and wet processing tools (the Solstice platform) for semiconductor and compound semiconductor manufacturers serving advanced packaging, photonics, AI optical interconnect, MEMS, and RF/power markets globally.
- Company typePrivate
- Founded2013
- HeadquartersMontaña, Costa Rica
- Headcount51–100
- GTM typeB2B
- OfferingHardware or Manufacturing
What ClassOne Technology does
ClassOne Technology, Inc. is a privately held semiconductor equipment manufacturer headquartered in Kalispell, Montana, with a wholly owned German subsidiary (ClassOne Technology GmbH in Freilassing) and a global channel partner network spanning China, Taiwan, Japan, Korea, Israel, India, and Southeast Asia. The company designs and builds single-wafer electroplating and wet processing tools used to manufacture compound semiconductor and advanced packaging devices, serving customers in VCSELs/microLEDs/laser diodes, photonics, MEMS and sensors, RF and power semiconductors, and advanced packaging including 2.5D/3D integration. Itself-founded as a focused wet-process specialist, the company operates a Technology Development Center with a cleanroom for customer wafer processing and product development.
The company's product portfolio is organized around the Solstice platform, available in two main configurations: the Solstice Max (supporting 200mm and 300mm wafers, modular 2-16 chamber architecture) and the Solstice S-Series (supporting 3-inch to 200mm wafers, monolithic 2-8 chamber design with the industry's smallest footprint). Onto this platform, ClassOne delivers specialized processes including copper TSV fill plating, copper RDL plating, copper pillar plating, gold TWV plating, through-mask gold plating, fine-feature gold fill, TGVs, indium bump plating, hybrid bonding, single-wafer wet etch and cleans, Gen4 ECD reactors, bevel etch chambers, and Solstice Metal Lift-Off. Products are typically arranged as the GoldPro (gold plating) and CopperMax (copper damascene and RDL) modules.
ClassOne generates revenue primarily through capital equipment sales of Solstice platform systems with custom configurations, supplemented by process development, technical training, and ongoing customer service. Pricing is quote-based and not publicly disclosed. Distribution is direct enterprise sales from Kalispell and Freilassing for strategic accounts, complemented by a network of regional channel partners including PicoTech (Israel), Semi-ence (Korea), Scientech (China and Taiwan), Global Marketing Services (India), Canon Marketing Japan, and ZMC Technologies (Southeast Asia). The company actively participates in SEMICON West and SEMICON Europa trade shows and maintains a content presence via its website, LinkedIn, X, and YouTube channels. Named enterprise customers include Applied Optoelectronics, Samtec, FUJIFILM Dimatix, an unnamed top MRAM maker, IBM Research, and academic users including Georgia Tech, Penn State, and Université de Sherbrooke.
ClassOne Technology firmographics
Firmographics- Name
- ClassOne Technology
- Legal name
- ClassOne Technology, Inc.
- Website
- https://classone.com
- Company type
- Private
- Founded year
- 2013
- Operating status
- Operating
- Headcount range
- 51–100 employees
- Short description
- ClassOne Technology designs and manufactures single-wafer electroplating and wet processing tools (the Solstice platform) for semiconductor and compound semiconductor manufacturers serving advanced packaging, photonics, AI optical interconnect, MEMS, and RF/power markets globally.
- Ownership category
- akta.pro rank
ClassOne Technology industry classification
Industry- Product category
- Semiconductor Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- akta.pro primary industry
- Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)
- akta.pro secondary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
Keywords
Where ClassOne Technology is headquartered
LocationHeadquarters
- HQ city
- Montaña
- HQ country
- Costa Rica
- HQ region
- Latin America
Offices10 records
Markets served
ClassOne Technology business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Supply Chain, Personnel, Marketing or Sales, Operations
Revenue model
- Equipment Sales - Capital Systems: ClassOne generates revenue through the sale of capital equipment - the Solstice platform systems including Max and S-Series configurations. Systems are sold with varying levels of automation and chamber configurations to meet customer-specific requirements. The company also provides associated process technologies and customization services as part of equipment deployment.
- Process Development and Support Services: The company provides process development support, technical training, and ongoing customer service as part of its revenue model, supporting equipment installation and optimization.
Go-to-market motion1 record
Distribution channels2 records
Marketing channels3 records
ClassOne Technology product offering
Product offeringCore offering
ClassOne Technology designs and manufactures advanced electroplating and wet-chemical process equipment for semiconductor and microelectronic device manufacturing. The company's flagship Solstice platform is a configurable single-wafer processing system supporting wafer sizes from 3-inch to 300mm, with specialized process modules for copper and gold plating, wet etch, cleans, solvent processing, and metal lift-off used in advanced packaging, photonics, MEMS, and RF/power device production.
Product overview
ClassOne Technology provides advanced electroplating and wet processing systems for semiconductor and microelectronic device manufacturing. The company's flagship Solstice platform serves as a common, easy-to-use, high-performance flexible foundation supporting multiple process technologies. The portfolio includes two main platform lines: the Solstice Max (200/300mm) for larger wafer processing with modular chamber configurations (2-16 chambers), and the Solstice S-Series (≤200mm) with compact monolithic design (2-8 chambers) for smaller wafer formats. Both platforms support specialized process modules including GoldPro for gold plating, CopperMax for copper damascene and RDL, wet etch, and metal lift-off processes. These systems are used to manufacture compound semiconductor devices including VCSELs, microLEDs, LEDs, laser diodes, MEMS, power semiconductors, RF devices, photonics components, and sensors across advanced packaging, photonics, AI, MEMS, and RF/power markets.
Differentiator
Problem solved
Functional benefit
Brands
- Solstice: ClassOne's flagship platform for electroplating and wet processing systems, available in Solstice Max (200/300mm) and Solstice S-Series (≤200mm) configurations.
- Solstice S8
- Solstice Max
- Solstice S-Series
- GoldPro
- CopperMax
Products and services
- Solstice Max (200/300mm) High-performance wet processing platform supporting 200mm and 300mm wafers with modular architecture configurable from 2 to 16 chambers. Designed for advanced plating, photoresist strip, and wet etch applications in both production and R&D environments serving semiconductor and compound semiconductor manufacturers.
- Solstice S-Series (≤200mm) Single-wafer wet processing platform supporting 3-inch to 200mm wafers with monolithic frame design configurable from 2 to 8 chambers. Features the smallest footprint in the industry for compound semiconductor and microelectronics manufacturing including VCSELs, microLEDs, LEDs, laser diodes, MEMS, sensors, RF, and power devices.
- Solstice GoldPro Specialized single-wafer gold plating system optimized for fine-feature gold fill applications in RF, sensor, inkjet printhead, and high-reliability semiconductor devices. Built on the Solstice platform architecture for high-purity gold plating with tight uniformity.
- Solstice CopperMax Copper electroplating system for damascene, pillar, and redistribution layer (RDL) processes, supporting TSV fill and advanced packaging metallization on the Solstice platform.
- Solstice Wet Etch Single-wafer wet etch capabilities for precise seed and barrier layer removal, including UBM etch and patterned metal wet etch processes for compound and power semiconductor devices.
- Solstice Metal Lift-Off (MLO) Solvent processing system for precision metal lift-off processes with faster, safer, and cleaner single-wafer design compared to traditional batch processing.
Quantifiable outcome
- Hundreds of tools installed in advanced production fabs and research organizations worldwide
Companies that use ClassOne Technology
Customer profileNamed customers7 records
Segments5 records
Ideal customer profiles3 records
ClassOne Technology technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature16 records
ClassOne Technology partnerships and signals
Strategic signalPartnerships
13 partnerships are on record, tiered core, strategic and secondary.
- Applied Optoelectronics (AAOI)coreApplied Optoelectronics is a major customer that placed record-breaking follow-on orders for multiple Solstice S8 wet processing systems to expand optical device manufacturing in Houston, including transition to 6-inch InP wafer manufacturing for AI datacenter optical interconnect demand.
- Silicon Austria Labs (SAL)strategicJoint development agreement centered on processes and hardware for advanced packaging. The partnership aims to develop new advanced packaging processes and hardware leveraging combined expertise.
- Penn State UniversitysecondaryPenn State ordered Solstice S8 single-wafer wet processing system for advanced packaging development focused on glass substrates, scheduled for installation.
- Université de Sherbrooke (3IT)secondaryFirst Canadian customer purchased Solstice LT single-wafer processing system for advanced packaging R&D at the Interdisciplinary Institute for Technological Innovation.
- IBM ResearchstrategicJoint development agreement focused on wet processing for advanced packaging. Companies are developing non-NMP solvent processing solutions for semiconductor manufacturing. IBM has been a ClassOne supplier since 2014 and selected ClassOne as a strategic supplier in 2024 for electroplating, metal lift-off, and wet cleaning processes.
- Georgia Institute of TechnologysecondaryGeorgia Tech selected Solstice S8 for advanced packaging R&D program. ClassOne supports the establishment of the 3D Heterogeneous Integration Hub, providing onsite senior process and service engineers, technical support, three internships per year, and jointly pursuing research.
- PicoTech (Israel)secondaryRegional sales and support partner for Israel market, located at 17 Hamefalsim St., Petah-Tikva 49514.
- Semi-ence Co., Ltd. (Korea)secondaryRegional sales and support partner for Korea market.
- Scientech Engineering Corp. (China)secondaryRegional sales partner for China market, located in Shanghai.
- Scientech Corporation (Taiwan)secondaryRegional sales partner for Taiwan market, located in Hsinchu City.
- Global Marketing Services (India)secondaryRegional sales partner for India market, located in Bangalore.
- Canon Marketing Japan Inc.secondaryRegional sales partner for Japan market, part of Canon group.
- ZMC Technologies (Singapore)secondaryRegional sales partner covering Singapore, Malaysia, Indonesia, Philippines, Thailand, and Vietnam markets.
Scale indicators3 records
Recent moves6 records
Expansion highlights6 records
ClassOne Technology competitors and assessment
Company assessmentBroad incumbents
- Applied Materials: Largest semiconductor wafer fab equipment supplier, with extensive advanced packaging and wet-processing portfolios. Competes broadly with ClassOne in advanced packaging, electroplating, and metallization, particularly for foundry/OSAT customers.
- Veeco Instruments: Equipment supplier for compound semiconductor and photonics manufacturing (MOCVD, etc.). Competes with ClassOne for compound semi and photonics customer capex, particularly for GaN, GaAs, and InP device makers.
- Tokyo Electron: One of the largest semiconductor equipment OEMs, with broad coverage in deposition, etch, cleaning, and advanced packaging. Competes with ClassOne across multiple Solstice process applications, particularly in advanced packaging metallization.
Direct peers
- ACM Research: Specializes in single-wafer wet cleaning, electroplating, and stress-free polishing equipment for advanced packaging and semiconductor manufacturing. Directly comparable in serving advanced packaging, MEMS, and compound semi customers with modular platforms.
- Lam Research: Global leader in semiconductor deposition and wet-cleaning equipment, including the industry-standard electroplating/deposition tools ClassOne competes against. Closest direct peer for Solstice's core copper damascene, TSV fill, and advanced packaging metallization applications.
- SCREEN Holdings: Major supplier of semiconductor cleaning equipment (single-wafer wet processing) globally. Competes with ClassOne's Solstice wet etch and cleans modules across front-end and back-end semiconductor manufacturing.
Others
- Onto Innovation: Supplies inspection, metrology, and advanced packaging process control equipment. Adjacent peer serving similar advanced packaging and compound semiconductor customers, enabling potential ecosystem partnerships.
Regional players
- NAURA Technology Group: China's leading domestic semiconductor equipment supplier, including wet processing and advanced packaging tools. Comparable regional competitor for ClassOne's China-distributed Solstice systems.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat5 records
Key risks5 records
Key highlights6 records
Customer concentration
ClassOne Technology social profiles
Digital presenceClassOne Technology financial estimates
Financial estimateRevenue estimate
Valuation estimate
ClassOne Technology leadership team
Management profileNumber of profiles
Profiles1 record
ClassOne Technology subsidiaries and ownership
Company hierarchySubsidiaries1 record
ClassOne Technology funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
ClassOne Technology M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about ClassOne Technology
What does ClassOne Technology do?
ClassOne Technology designs and manufactures advanced electroplating and wet-chemical process equipment for semiconductor and microelectronic device manufacturing. The company's flagship Solstice platform is a configurable single-wafer processing system supporting wafer sizes from 3-inch to 300mm, with specialized process modules for copper and gold plating, wet etch, cleans, solvent processing, and metal lift-off used in advanced packaging, photonics, MEMS, and RF/power device production.
Is ClassOne Technology a public or private company?
ClassOne Technology is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was ClassOne Technology founded?
ClassOne Technology was founded in 2013. It employs 51 to 100 people.
Where is ClassOne Technology based?
ClassOne Technology is headquartered in Montaña, Costa Rica, in the Latin America region.
How does ClassOne Technology make money?
Two revenue lines are on record. Equipment Sales - Capital Systems are the primary driver. The others are process Development and Support Services.
Who are ClassOne Technology's main competitors?
Broad incumbents on record are Applied Materials, Veeco Instruments and Tokyo Electron. Direct peers are ACM Research, Lam Research and SCREEN Holdings. Onto Innovation is listed as an others. NAURA Technology Group is listed as a regional player.
Does ClassOne Technology have an API?
No public API is recorded for ClassOne Technology.
What industry is ClassOne Technology in?
ClassOne Technology's product category is Semiconductor Equipment. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 333242.