EMASS
EMASS, a Nanoveu (ASX: NVU) subsidiary headquartered in Singapore, designs ultra-low-power RISC-V edge AI SoCs (ECS-DoT) for OEMs building wearables, hearables, drones, industrial IoT, and sensor devices requiring sub-1mW always-on AI inference.
- Company typePrivate
- Founded2020
- HeadquartersSingapore, Singapore
- Headcount1–10
- GTM typeB2B
- OfferingHardware or Manufacturing
What EMASS does
EMASS is a Singapore-headquartered semiconductor subsidiary of Nanoveu (ASX: NVU) that designs ultra-low-power RISC-V based Edge AI system-on-chips under the ECS-DoT family. The company builds silicon for always-on AI inference at the sensor edge, with the current 22nm part delivering up to 12 TOPs/Watt and 30 GOPS at 5mW, sub-1mW average operation supporting sub-2-bit models, and event-driven inference at sub-10ms latency. The roadmap extends to a 16nm chip fabricated at TSMC that integrates Bluetooth Low Energy, an object-detection accelerator, floating-point unit support, and expanded on-chip SRAM while preserving software compatibility with the 22nm part via the Atoms-to-Apps methodology.
The company serves OEMs in wearables, hearables, smart devices, industrial IoT and robotics, drones, and environmental sensing, with adjacent engineering services for custom integration. Revenue mechanics span chip sales, technology licensing, and engineering services, executed through direct enterprise sales, channel distribution via Arrow Electronics, and technology partnerships with Semtech (LoRaWAN integration) and MosChip (silicon implementation). R&D is anchored in Singapore and Cairo, with sales build-out underway in the United States and Europe.
EMASS is pre-commercial at scale: the 16nm chip taped out in January 2026 and is in TSMC fabrication; named customer logos, revenue figures, and funding rounds are not disclosed. The company's commercial readiness rests on a recent cluster of awards (CES 2026 and embedded world 2026 Best in Show) and a bundled ecosystem of reference designs, evaluation boards, and connectivity integrations intended to accelerate OEM design-ins in 2026 and beyond.
EMASS firmographics
Firmographics- Name
- EMASS
- Legal name
- EMASS
- Website
- https://emass.ai
- Company type
- Private
- Founded year
- 2020
- Operating status
- Operating
- Headcount range
- 1–10 employees
- Short description
- EMASS, a Nanoveu (ASX: NVU) subsidiary headquartered in Singapore, designs ultra-low-power RISC-V edge AI SoCs (ECS-DoT) for OEMs building wearables, hearables, drones, industrial IoT, and sensor devices requiring sub-1mW always-on AI inference.
- Ownership category
- akta.pro rank
EMASS industry classification
Industry- Product category
- Edge AI Semiconductors
- NAICS
- Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (3344)
- SIC
- Electronic & Other Electrical Equipment (No Computer Equip) (3600)
- akta.pro primary industry
- Edge AI Hardware & NPUs (SoCs, modules, accelerators) (HDAAAJAC)
- akta.pro secondary industries
- Advanced SoCs & Application Processors (HDAHAAAB), UWB, NFC & Short-Range Connectivity ICs (HDAHAMAI), Embedded Software & Firmware Tools (Compilers, Debug, RTOS tooling) (HDAHAFAE)
Keywords
Where EMASS is headquartered
LocationHeadquarters
- HQ city
- Singapore
- HQ country
- Singapore
- HQ region
- Asia
Offices5 records
Markets served
EMASS business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales
Revenue model
- Semiconductor Chip Sales: EMASS generates revenue through the sale of its ECS-DoT ultra-low-power AI system-on-chip products to OEM manufacturers and device makers in wearables, IoT, drones, and industrial applications.
- Technology Licensing: The company offers its ECS-DoT architecture and technology for licensing to manufacturers seeking to integrate always-on AI capabilities into their products, supporting the Atoms-to-Apps methodology.
- Engineering Services: EMASS provides embedded systems and edge AI software development operations, custom integration, and technical support services for customers implementing the ECS-DoT platform.
Go-to-market motion3 records
Distribution channels4 records
Marketing channels4 records
EMASS product offering
Product offeringCore offering
EMASS designs and sells the ECS-DoT family of ultra-low-power RISC-V based Edge AI System-on-Chips (22nm and 16nm) that enable always-on AI inference at the sensor edge for battery-constrained devices. The company sells chips directly to OEMs in wearables, hearables, drones, industrial IoT, robotics, and smart devices, and complements chip sales with evaluation boards, reference designs, technology licensing, and embedded software engineering services.
Product overview
EMASS delivers ultra-low-power AI system-on-chips designed to bring intelligence directly to the Sensor Edge. The company's product portfolio centers on the ECS-DoT family of edge AI SoCs, available in 22nm and 16nm process technologies, which enable always-on sensing, multimodal sensor fusion, and real-time AI inference for the next generation of battery-constrained devices. The product line is complemented by developer tools including evaluation boards and reference designs developed through partnerships with Arrow Electronics. The ECS-DoT family supports applications across wearables, hearables, smart devices, industrial robotics, and drones, with key differentiators including sub-1mW operation, event-driven inference with <10ms latency, and integration with LoRaWAN connectivity via the Semtech partnership.
Differentiator
Problem solved
Functional benefit
Brands
- ECS-DoT: Ultra-low-power Edge AI System-on-Chip (SoC) family designed for always-on intelligence at the sensor edge, featuring sub-1mW operation, real-time multimodal sensing (audio, vision, sensor fusion), and event-driven inference with less than 10ms latency.
Products and services
- ECS-DoT Edge AI System-on-Chip (22nm) Ultra-low-power RISC-V based Edge AI SoC delivering up to 12 TOPs/Watt and 30 GOPS at 5mW, supporting sub-2-bit AI models, multimodal sensing, and sub-1mW always-on operation. Sold to OEMs in wearables, hearables, drones, industrial IoT, robotics, and smart devices.
- 16nm ECS-DoT SoC Next-generation 16nm ECS-DoT SoC fabricated at TSMC with enhanced compute density, integrated Bluetooth Low Energy, object-detection accelerator, and floating-point unit support. Maintains full software compatibility with the 22nm ECS-DoT family via the Atoms-to-Apps methodology.
- ECS-DoT Evaluation Boards Hardware evaluation platforms developed through partnership with Arrow Electronics for testing and development of ultra-low-power edge AI applications using the ECS-DoT SoC family.
- ECS-DoT Reference Designs Pre-validated reference designs developed with Arrow Electronics to accelerate deployment of edge AI solutions across wearables, drones, IoT, and smart devices applications.
Quantifiable outcome
- 100x lower energy consumption (~1-10 µJ per AI inference) compared to conventional solutions
- +5 more outcomes
Companies that use EMASS
Customer profileSegments6 records
Ideal customer profiles3 records
EMASS technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Integration2 records
AI capability10 records
Feature5 records
EMASS partnerships and signals
Strategic signalPartnerships
Five partnerships are on record, tiered core.
- TSMCcoreTSMC (Taiwan Semiconductor Manufacturing Company) is fabricating EMASS's 16nm ECS-DoT SoC, marking the progression from design to production silicon. The 16nm chip offers enhanced compute density, memory bandwidth, and system integration capabilities.
- Semtech CorpcoreStrategic partnership to combine EMASS's ECS-DoT edge AI SoC technology with Semtech's LoRaWAN wireless connectivity for industrial and IoT applications. The collaboration integrates Semtech's LoRa transceiver technology into EMASS's AI-enabled chips, enabling on-device data processing to reduce bandwidth requirements while supporting always-on intelligence in power-limited environments. Companies plan to demonstrate combined capabilities through reference designs at CES 2026, including predictive maintenance and security applications.
- MosChip TechnologiescoreMosChip Technologies supports EMASS's RISC-V based ECS-DoT Edge AI System-on-Chip by contributing to silicon implementation, physical design, and validation. The collaboration facilitates performance and energy efficiency improvements for the low-power AI SoC designed for edge applications without reliance on the cloud.
- Arrow ElectronicscoreArrow Electronics and EMASS announced collaboration to accelerate deployment of ultra-low-power edge AI solutions using the ECS-DoT SoC. The partnership involves developing developer tools, reference designs, and showcasing evaluation boards to improve on-device AI applications across various industries.
- Centre of Nanoelectronics and Devices (CND) at American University in CairocoreEMASS collaborates with CND at American University in Cairo for semiconductor R&D, talent development, and technology advancement. The partnership supports EMASS's expansion of embedded systems and edge AI software development operations in Egypt, targeting 10-15 engineers.
Scale indicators8 records
Recent moves6 records
Expansion highlights6 records
EMASS competitors and assessment
Company assessmentDirect peers
- QuickLogic: QuickLogic provides low-power FPGA and AI-enabled SoCs for wearables, hearables, and IoT edge devices. Overlaps with EMASS in ultra-low-power AI/ML sensor edge use cases.
- Himax Technologies: Himax offers AI-enabled imaging and ultra-low-power display drivers for wearables and smart devices. EMASS cites Himax directly as a benchmark in low-power edge AI inference.
- Maxim Integrated (Analog Devices): Maxim's low-power microcontrollers and sensor signal chain ICs serve wearables and IoT. EMASS lists Maxim as a competing reference for ultra-low-power edge AI.
- BrainChip: BrainChip develops neuromorphic processors for ultra-low-power on-device AI. Comparable to EMASS in targeting event-driven, milliwatt-class always-on inference at the sensor edge.
- Syntiant: Syntiant produces ultra-low-power neural decision processors for always-on edge AI in hearables, wearables, and IoT. EMASS explicitly names Syntiant as a performance benchmark, making it the closest direct competitor.
- Ambiq Micro: Ambiq builds sub-threshold power SoCs targeting wearables and battery-constrained edge devices. EMASS names Ambiq as a competitor and targets the same low-power always-on AI use cases.
Broad incumbents
- NXP Semiconductors: NXP's i.MX and MCU families target edge AI in industrial, automotive, and IoT. Listed by EMASS as a major market competitor in low-power on-device AI processing.
- Qualcomm: Qualcomm's wearable and IoT platforms compete for the same always-on AI design wins across hearables and smart devices, with significantly larger scale and software ecosystem.
- STMicroelectronics: STM32 microcontrollers and recent AI-enhanced variants serve wearables, industrial, and IoT. A broad incumbent providing low-power MCUs with growing on-device AI capability.
- Nordic Semiconductor: Nordic's nRF series dominates low-power wireless SoCs for wearables, hearables, and IoT. Comparable as a broader incumbent offering integrated BLE/connectivity plus low-power compute, often competing for the same design wins.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
EMASS social profiles
Digital presenceEMASS financial estimates
Financial estimateRevenue estimate
Valuation estimate
EMASS leadership team
Management profileNumber of profiles
EMASS funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
EMASS M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about EMASS
What does EMASS do?
EMASS designs and sells the ECS-DoT family of ultra-low-power RISC-V based Edge AI System-on-Chips (22nm and 16nm) that enable always-on AI inference at the sensor edge for battery-constrained devices. The company sells chips directly to OEMs in wearables, hearables, drones, industrial IoT, robotics, and smart devices, and complements chip sales with evaluation boards, reference designs, technology licensing, and embedded software engineering services.
Is EMASS a public or private company?
EMASS is a private company. It is classified as corporate owned and is currently operating.
When was EMASS founded?
EMASS was founded in 2020. It employs 1 to 10 people.
Where is EMASS based?
EMASS is headquartered in Singapore, Singapore, in the Asia region.
How does EMASS make money?
Three revenue lines are on record. Semiconductor Chip Sales are the primary driver. The others are technology Licensing and engineering Services.
Who are EMASS's main competitors?
Direct peers on record are QuickLogic, Himax Technologies, Maxim Integrated (Analog Devices), BrainChip, Syntiant and Ambiq Micro. Broad incumbents are NXP Semiconductors, Qualcomm, STMicroelectronics and Nordic Semiconductor.
Does EMASS have an API?
No public API is recorded for EMASS.
What industry is EMASS in?
EMASS's product category is Edge AI Semiconductors. Its primary akta.pro industry code is HDAAAJAC, Edge AI Hardware & NPUs (SoCs, modules, accelerators), with a secondary code of HDAHAAAB, Advanced SoCs & Application Processors. Its NAICS code is 334413 and its SIC code is 3600.