Micross Components
Micross Components is a global Hi-Rel microelectronics provider offering bare die, DC-DC converters, RF solutions, MIL-STD-1553 data bus products, and OSAT services to aerospace, defense, space, and medical customers across 18 manufacturing facilities worldwide.
- Company typePrivate
- Founded1980
- HeadquartersApopka, United States
- Headcount501–1,000
- GTM typeB2B
- OfferingHardware or Manufacturing
What Micross Components does
Micross Components is a global provider of high-reliability (Hi-Rel) microelectronic components and outsourced semiconductor assembly and test (OSAT) services, headquartered in Melville, NY, with 18 manufacturing facilities across North America, EMEA, and APAC and 501-1,000 employees. Founded in 1980, the company serves aerospace, defense, space, medical, and industrial customers with a portfolio spanning bare die and wafer distribution, DC-DC power converters, RF/microwave solutions, MIL-STD-1553 data bus couplers, nuclear event detectors, multi-chip modules, 2.5D/3D heterogeneous integration, and component modification/up-screening/testing services. Micross holds DMEA DoD Trusted Source accreditation, ITAR registration, and MIL-PRF-38534/38535/19500 certifications, positioning it as a critical domestic supplier of trusted microelectronics for U.S. national security programs.
The company generates revenue through a hybrid of direct enterprise field sales (regional sales managers across North America, EMEA, and APAC) and an authorized distributor network including Arrow Electronics, Avnet, RFMW, All Tech Electronics, and USI Electronics. Revenue streams include Hi-Rel product sales, value-added processing and assembly services, EOL/DMSMS sustainment programs with multi-year (up to 20+ years) recurring contracts, and component modification services. All pricing is quote-based; the EDSP offers consignment/pay-on-demand or pre-pay subscription models, providing a recurring revenue backbone tied to long-lifecycle defense and aerospace programs. The largest U.S.-based OSAT provider following the January 2025 Integra Technologies acquisition, Micross is privately held by Behrman Capital and has grown through a serial acquisition strategy, completing at least nine transactions between 2020 and 2025.
Micross Components firmographics
Firmographics- Name
- Micross Components
- Legal name
- Micross Components
- Website
- https://micross.com
- Company type
- Private
- Founded year
- 1980
- Operating status
- Operating
- Headcount range
- 501–1,000 employees
- Short description
- Micross Components is a global Hi-Rel microelectronics provider offering bare die, DC-DC converters, RF solutions, MIL-STD-1553 data bus products, and OSAT services to aerospace, defense, space, and medical customers across 18 manufacturing facilities worldwide.
- Ownership category
- akta.pro rank
Micross Components industry classification
Industry- Product category
- High-Reliability Microelectronic Components
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441), Other Electronic Component Manufacturing (334419)
- SIC
- Electronic Components, Nec (3679)
- akta.pro primary industry
- Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics) (IMAGAGAH)
- akta.pro secondary industry
- Embedded & Compute Modules (SoMs, COM Express/SMARC, industrial SBC modules) (IMAGAJAK)
Keywords
Where Micross Components is headquartered
LocationHeadquarters
- HQ city
- Apopka
- HQ country
- United States
- HQ region
- North America
Offices17 records
Markets served
Micross Components business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Supply Chain, Operations, Infrastructure, Technology or R&D, Marketing or Sales
Revenue model
- Hi-Rel Microelectronic Components & Products: Sale of high-reliability microelectronic components including bare die, wafers, DC-DC converters, discrete diodes, RF solutions, Hi-Rel ICs, memory, logic, analog devices, MIL-STD-1553 data bus couplers, and nuclear event detectors. Products are sold to aerospace, defense, space, medical, and industrial customers. Revenue is generated through direct product sales, with pricing based on part type, screening level, and volume.
- Value-Added Processing & Assembly Services: Processing and assembly services including wafer thinning and dicing, die plating/sorting, lot acceptance testing, component design and packaging (MCMs, SiP, WLP, hermetic, plastic), assembly, up-screening, and electrical/environmental/reliability testing. Revenue generated through service fees per process step or through turnkey fixed-price arrangements.
- EOL/DMSMS Sustainment & Long-Term Storage: Program sustainment services including EOL Die Sustainment Program (EDSP), long-term die/wafer storage, BOM monitoring, supplier managed inventory, product recreation, and form-fit-function equivalent manufacturing. Revenue model includes consignment/pay-on-demand arrangements and pre-pay storage fee structures, providing recurring revenue through multi-year sustainment contracts.
- Component Modification Services: Modification services including BGA reballing, robotic hot solder dip, lead attach, CGA attach, trim/form/reconditioning, PCB solutions (assembly, rework, repair, component harvesting), and support solutions (tape & reel, 3D scanning, bake and package, marking/labeling/kitting). Revenue generated through per-service fees or turnkey arrangements.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom quotation-based pricing |
| Transaction based/ take rate | Pay-as-you-go | EOL Die Sustainment Program (EDSP) - Consignment/Pay-On-Demand |
| Subscription | Annual | EOL Die Sustainment Program (EDSP) - Pre-Pay |
Go-to-market motion2 records
Distribution channels3 records
Marketing channels7 records
Micross Components product offering
Product offeringCore offering
Micross Components is a global provider of specialty high-reliability microelectronic components and value-added services for aerospace, defense, space, medical, and industrial markets. Its portfolio encompasses bare die and wafer distribution, MIL-spec qualified DC-DC power converters, Hi-Rel RF and IC components, MIL-STD-1553 data bus products, EOL/DMSMS sustainment services, and outsourced semiconductor assembly and test (OSAT) capabilities. The company operates 18 manufacturing facilities across North America, EMEA, and APAC as the largest U.S.-based OSAT provider with DMEA DoD Trusted Source accreditation.
Product overview
Micross Components is a comprehensive provider of high-reliability microelectronic products and services serving aerospace, defense, space, medical, and industrial markets. The portfolio is organized around three core pillars: Die & Wafer Solutions (bare die distribution, wafer processing, EOL sustainment), Power Solutions (DC-DC converters, Hi-Rel diodes), and Component/Assembly Services (ICs, RF solutions, data bus products, testing, OSAT). Key products include MIL-PRF-38534/38535 certified components, radiation-tolerant DC-DC converters (AFLS28XX series), Nuclear Event Detectors (NED), 2.5/3D heterogeneous integration, and multi-chip modules. The company operates as the largest U.S.-based OSAT provider with DMEA DoD Trusted Source accreditation and 18 manufacturing facilities worldwide.
Differentiator
Problem solved
Functional benefit
Brands
- SemiDice: A Micross Company - High-reliability die and wafer products subsidiary.
- Integra Technologies
- Micross AIT
- ISOPAC
Products and services
- Die & Wafer Solutions Comprehensive bare die and wafer distribution, processing, and value-added services. Includes wafer thinning, dicing (up to 300mm/12-inch wafers), plating, visual inspection, lot acceptance testing, and wafer bumping/WLP. Access to thousands of part types from leading authorized semiconductor manufacturers. For aerospace, defense, space, medical, and industrial OEMs.
- DC-DC Power Converters High-reliability DC-DC converters for aerospace, defense, and space applications. Includes hybrid and PCB converters, EMI filters, and radiation-tolerant models meeting MIL-PRF-38534 specifications (Class H and K). QPL and JAN/JANTX/JANTXV/JANS qualified.
- Hi-Rel ICs & Components MIL-PRF-38535 Class Q & V and MIL-PRF-38534 Class H certified components including memory, analog, logic, RF/microwave, and SMD/5962 qualified products for high-reliability defense and aerospace applications.
- Hi-Rel RF Solutions RF and microwave components including control products (PIN switches, GaAs FET switches, digital step attenuators), amplifiers (low noise, power), and custom multi-chip modules for defense and aerospace applications.
- Hi-Rel Data Bus Couplers & Harnesses MIL-STD-1553 data bus couplers, harnesses, accessories, and wide-band RF transformers including micro in-line couplers, tab mounted couplers, through hole mounted couplers, box couplers, custom design couplers, coupling transformers, bus relays, and harnesses for military avionics and defense platforms.
- Hi-Rel Diodes Discrete power diodes and ISOPAC assemblies including QPL and JAN qualified rectifier, Schottky, TVS, and Zener diodes. Also includes COTS discrete diodes and custom assemblies for harsh environment applications.
- Component Modification Services Component modification services including BGA reballing, robotic hot solder dip (RHSD), lead attach, CGA attach, trim/form/reconditioning, PCB solutions, and tape & reel services. S20.20 certified. Over 40 years of expertise in hi-rel microelectronic product and packaging modification.
- EOL/DMSMS Sustainment Services End-of-life component management including original qualified products, form-fit-function equivalents, program sustainment management, and long-term die/wafer storage for up to 20+ years. Extends product lifecycles 5-20+ years past OEM EOL dates.
- Testing & Qualification Services Comprehensive testing services including counterfeit mitigation (AS6171/ISO17025), up-screening, electrical testing (RF, digital, analog), environmental testing, reliability testing, and component inspection. DLA Lab Suitability certified.
- OSAT Services Outsourced semiconductor assembly and test services. Largest U.S.-based OSAT provider offering die prep, assembly, 2.5/3D heterogeneous packaging, hermetic and plastic packaging, wafer bumping, component modification, reliability and counterfeit testing, wafer probe, and full electrical/RF/environmental testing. DMEA DoD Trusted Source accredited.
- 2.5 & 3D Heterogeneous Integration Advanced interconnect technologies including through-silicon via (TSV) interconnects (2-10μm diameter, up to 8:1 aspect ratio), wafer thinning to <20μm Si thickness, flip-chip and high-density metal-metal bonding down to <10μm pitch, and Cu/Cu thermocompression bonding demonstrated down to 5μm pitch for 2.5D and 3D IC integration.
- Nuclear Event Detector (NED) Radiation detection device for critical defense electronics including aircraft, military satellites, missile platforms, and ground vehicles. Integrates differential drivers and receivers directly on-chip, cutting response times by over 50% under high-dose conditions while achieving more than twice the radiation dose-rate sensitivity of legacy designs. Manufactured in the US using custom ASIC by Jazz Semiconductor Trusted Foundry.
- Class H+ AFLS28XX Series DC-DC Converters Radiation-tolerant 28V/120W DC-DC converters meeting MIL-PRF-38534 Class H screening requirements with 50kRad (Si) TID radiation tolerance and 60MeV·cm²/mg SEE specifications. Derived from AFL series deployed in PAC-3 and Patriot missile systems. Designed for low-earth-orbit satellite constellations, space missions, and launch vehicles.
- EOL Die Sustainment Program (EDSP) End-of-Life Die Sustainment Program providing continued device availability for products that have or may become EOL. Includes long-term storage in secure nitrogen/atmosphere-controlled environment for up to 20+ years, supplier managed inventory, and form-fit-function recreation.
- Quick Turn Services Expedited die and wafer services with quotes processed in 24-48 hours and parts ready to ship in 4 days or sooner. Available via [email protected].
Quantifiable outcome
- Radiation response time reduced by over 50% under high-dose conditions, with more than twice the dose-rate sensitivity of legacy NED designs
- +4 more outcomes
Companies that use Micross Components
Customer profileNamed customers4 records
Segments5 records
Ideal customer profiles4 records
Micross Components technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature9 records
Micross Components partnerships and signals
Strategic signalPartnerships
Eight partnerships are on record, tiered unclear, core and minor.
- SPANunclearMicross announced a strategic partnership with SPAN (note: this appears in the context of an Eaton news article, and may refer to a partnership involving Micross's OSAT or power solutions capabilities).
- SITAL TechnologycoreMicross and SITAL announced a Global Manufacturing & Distribution Partnership in May 2024. The partnership covers global manufacturing and distribution of SITAL's products through Micross's worldwide sales channels. SITAL specializes in MIL-STD-1553 technology and data bus products.
- Apogee SemiconductorcoreMicross and Apogee Semiconductor announced a Global Partnership in March 2022. Apogee Semiconductor is a leader in Radiation-Hardened-by-Design semiconductors using its patented TalRad process, providing products for space and extreme environments. Micross distributes Apogee's radiation-hardened analog and logic die/wafer products.
- C-MACminorMicross and C-MAC announced a partnership in August 2021 for the distribution and/or manufacturing of C-MAC products through Micross's global sales channels.
- Avalanche TechnologycoreMicross expanded its exclusive partnership with Avalanche Technology in June 2021. Avalanche Technology is the leader in next-generation Spin Transfer Torque Magnetic RAM (STT-MRAM). Micross serves as the primary distributor for Avalanche's radiation-hardened MRAM products for aerospace and space applications.
- EPC (Efficient Power Conversion)minorMicross and EPC signed a Global Bare Die Distribution Agreement in October 2020. EPC is a leader in enhancement-mode gallium nitride (eGaN) power transistors. Micross distributes EPC's GaN die and wafer products globally.
- SemiQ Inc.minorMicross and SemiQ signed a Global Bare Die Distribution Agreement in October 2020. SemiQ designs and manufactures Silicon Carbide (SiC) power semiconductors including diodes and MOSFETs in discrete, module, and bare die/wafer form. Micross distributes SemiQ's SiC products globally.
- Jazz Semiconductor Trusted FoundrycoreJazz Semiconductor Trusted Foundry is the US-based custom ASIC manufacturer used for Micross's Standard-Performance Nuclear Event Detector (NED). The NED is manufactured in the United States using a custom ASIC produced by Jazz Semiconductor Trusted Foundry. This is an inbound technology partnership for manufacturing.
Scale indicators12 records
Recent moves6 records
Expansion highlights7 records
Micross Components competitors and assessment
Company assessmentDirect peers
- Vishay Intertechnology: Global manufacturer of discrete semiconductors (diodes, MOSFETs, optoelectronics) and passive components, including QPL/JAN-qualified military/aerospace products. Comparable as a Hi-Rel discrete component manufacturer serving defense and aerospace customers.
- Ducommun: Provider of engineered products and manufacturing services for aerospace and defense, including electronics manufacturing and assembly. Comparable in serving Hi-Rel aerospace/defense customers with electronics manufacturing and testing capabilities.
- MACOM Technology Solutions: Provider of high-performance analog RF, microwave, millimeterwave, and photonic semiconductor products for aerospace, defense, and industrial markets. Comparable as a Hi-Rel RF/microwave component provider with similar end-market and customer focus.
- Mercury Systems: Provider of mission-critical processing subsystems for defense and aerospace applications. Comparable to Micross in serving Hi-Rel defense electronics with ruggedized, secure processing solutions and a similar go-to-market through prime contractors.
- TT Electronics: UK-based provider of engineered electronics for performance-critical applications in aerospace, defense, and medical markets. Comparable in offering Hi-Rel electronic components and assemblies for similar end-markets with overlapping customer profiles.
- Amkor Technology: One of the world's largest OSAT providers, offering semiconductor packaging, assembly, and test services. Directly comparable to Micross's OSAT services business, though with substantially larger scale and broader commercial focus.
Broad incumbents
- Jabil: Global manufacturing services provider offering electronics manufacturing services (EMS) and ODM capabilities across multiple end-markets including aerospace/defense. Comparable as a broad-based electronics manufacturing peer with defense segment exposure.
- Curtiss-Wright: Diversified defense and aerospace company providing electronic systems, including Hi-Rel components and subsystems for naval, aerospace, and industrial applications. Comparable as a broader defense electronics incumbent with overlapping Hi-Rel product categories.
- Teledyne Technologies: Diversified industrial conglomerate with significant aerospace/defense electronics exposure including imaging, sensors, and engineered systems. Acquired FLIR (Micross CEO Cannon's prior company); comparable as a defense electronics incumbent with Hi-Rel product portfolio.
Emerging players
- API Technologies (now part of Spectrum Control): Provider of Hi-Rel RF/microwave, microelectronics, and electromagnetic solutions for aerospace, defense, and industrial applications. Comparable as a focused Hi-Rel component and subsystem provider serving overlapping defense and aerospace customer programs.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks6 records
Key highlights6 records
Customer concentration
Micross Components social profiles
Digital presenceMicross Components compliance and trust
Trust signalCompliance14 records
Micross Components financial estimates
Financial estimateRevenue estimate
Valuation estimate
Micross Components leadership team
Management profileNumber of profiles
Profiles18 records
Micross Components subsidiaries and ownership
Company hierarchySubsidiaries9 records
Micross Components funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Micross Components M&A and investment
M&A and investmentM&A11 records
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Micross Components
What does Micross Components do?
Micross Components is a global provider of specialty high-reliability microelectronic components and value-added services for aerospace, defense, space, medical, and industrial markets. Its portfolio encompasses bare die and wafer distribution, MIL-spec qualified DC-DC power converters, Hi-Rel RF and IC components, MIL-STD-1553 data bus products, EOL/DMSMS sustainment services, and outsourced semiconductor assembly and test (OSAT) capabilities. The company operates 18 manufacturing facilities across North America, EMEA, and APAC as the largest U.S.-based OSAT provider with DMEA DoD Trusted Source accreditation.
Is Micross Components a public or private company?
Micross Components is a private company. It is classified as private equity controlled and is currently operating.
When was Micross Components founded?
Micross Components was founded in 1980. It employs 501 to 1,000 people.
Where is Micross Components based?
Micross Components is headquartered in Apopka, United States, in the North America region.
How does Micross Components make money?
Four revenue lines are on record. Hi-Rel Microelectronic Components & Products are the primary driver. The others are value-Added Processing & Assembly Services, EOL/DMSMS Sustainment & Long-Term Storage and component Modification Services.
Who are Micross Components's main competitors?
Direct peers on record are Vishay Intertechnology, Ducommun, MACOM Technology Solutions, Mercury Systems, TT Electronics and Amkor Technology. Broad incumbents are Jabil, Curtiss-Wright and Teledyne Technologies. API Technologies (now part of Spectrum Control) is listed as an emerging player.
Does Micross Components have an API?
No public API is recorded for Micross Components.
What industry is Micross Components in?
Micross Components's product category is High-Reliability Microelectronic Components. Its primary akta.pro industry code is IMAGAGAH, Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics), with a secondary code of IMAGAJAK, Embedded & Compute Modules (SoMs, COM Express/SMARC, industrial SBC modules). Its NAICS code is 33441 and its SIC code is 3679.