BizLink

What BizLink does

BizLink Holding Inc. (TAIEX: 3665) is a global manufacturer of interconnect solutions, founded in 1996 and headquartered in Fremont, California, with its operating parent listed on the Taiwan Stock Exchange and a regional headquarters in New Taipei City, Taiwan. The company designs and produces wire harnesses, connectors, cables, busbars, and optical components that transmit power and data across four primary verticals: AI data center infrastructure, automotive (with emphasis on EV and autonomous driving), industrial and medical (CT, MRI, ultrasound, industrial automation), and semiconductor equipment. The product portfolio spans rack-level power distribution (AC Whips, Power Shelf Connectors, HVDC Cables, Data Center and Rack Busbars), high-speed copper and optical solutions (DAC cables, transceivers, WDM, MPO Connectors), and AI-server-rack-specific designs aligned with the NVIDIA MGX reference architecture and 800 VDC and 1.6T+ bandwidth roadmaps. The company holds more than 1,000 patents, operates 50+ manufacturing and R&D facilities across 20 countries, and employs more than 20,000 people globally.

Revenue is generated almost entirely from hardware component sales through direct B2B channels to OEM customers, with quote-based pricing, multi-year contracts, and no publicly disclosed list prices. The go-to-market combines enterprise field sales (designed-in component supply for hyperscale, automotive Tier 1, medical imaging, and industrial equipment customers), active participation in industry trade shows (COMPUTEX, NVIDIA GTC, OFC, automotive and medical expos), and standards-body engagement with OCP, PCI-SIG, and IBTA. Customer concentration is distributed across named anchor segments (NVIDIA MGX ecosystem partners for AI infrastructure, EV manufacturers for automotive wiring and busbars, medical imaging OEMs for CT/MRI/ultrasound cabling, industrial robotics and semiconductor equipment vendors), though specific customer names beyond the NVIDIA ecosystem affiliation are not publicly disclosed.

BizLink is led by Chairman and Founder Roger Liang, CEO and Co-Founder Felix Teng, and Group Managing Director Annie Kuo. The company is executing an aggressive AI-infrastructure growth strategy: in 2025 it raised US$300 million through external commercial borrowings for AI supply chain and overseas manufacturing capacity, completed the acquisition of European cable assembler Easys s. r. o. in October 2024, and in June 2026 announced the US$850 million acquisition of Interplex Datacom from Ennovi/Blackstone — adding approximately US$392 million in annualized revenue, 1,900 employees, and manufacturing sites across China, Vietnam, Malaysia, and Thailand, with closing expected in the second half of 2026.

Name

BizLink

Legal name

BizLink Holding Inc.

Website

https://bizlinktech.com

Company type

Public

Founded year

1996

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

BizLink Holding (TAIEX: 3665) is a global manufacturer of interconnect solutions — wire harnesses, connectors, cables, busbars, and optical components — serving AI data center, automotive, medical, and semiconductor equipment OEMs via 50+ facilities across 20 countries.

Ownership category

akta.pro rank

Product category

Interconnect Solutions

NAICS

Other Communication and Energy Wire Manufacturing (335929)

SIC

Electronic Connectors (3678)

akta.pro primary industry

Operational/Real-Time BI & Streaming Analytics (HDAEAMAH)

Keywords

• Interconnect solutions
• Wire harness manufacturing
• Data center cabling
• Automotive wire harnesses
• Fiber optic components

Headquarters

HQ city

Fremont

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Supply Chain, Operations, Infrastructure, Technology or R&D, Marketing or Sales

Revenue model

1. Hardware Component Sales: Sale of physical interconnect components including cables, connectors, wire harnesses, busbars, and optical components. Revenue is generated through direct manufacturing and supply to OEM customers across multiple industries.

Pricing tiers

Go-to-market motion3 records

Distribution channels1 record

Marketing channels3 records

Core offering

BizLink is a global manufacturer of interconnect solutions, designing and producing wire harnesses, connectors, cables, busbars, and fiber optic components for AI data centers, electric and autonomous vehicles, medical imaging systems, industrial automation, and semiconductor manufacturing equipment. The company offers an end-to-end portfolio spanning raw wire materials through complete box build and system integration, supported by 50+ manufacturing and R&D facilities across 20+ countries with 20,000+ employees and 1000+ patents.

Product overview

BizLink is a global provider of end-to-end interconnect solutions encompassing wire harnesses, connectors, and cables across four broad solution verticals. The Data Center Solutions portfolio (Server Connectors, Server Cables, Power Whip, Data Center Busbar, Rack Busbar, WDM, DAC, Loopback, Optics, Connectors, Cables, MPO Connectors, Data Center Raw Wires & Cables, and BizLink on NVIDIA MGX Architecture) provides the physical layer for AI server racks and data center infrastructure, including high-power busbars, high-speed copper and optical interconnects, and NVIDIA MGX/Vera Rubin compatible solutions. The Automotive & Drone Solutions portfolio (EV Busbar, EV Charging Solutions, Autonomous Driving Solutions, Automotive Wire Harnesses, High Voltage Wire Harnesses, Automotive Smart Cockpit, Automotive Power Distribution, and Drone Interconnects) addresses vehicle electrification, autonomous driving, and UAV connectivity. The Industrial & Medical Solutions portfolio (Computerized Tomography, Magnetic Resonance Imaging System, Ultrasound Systems, Medical Raw Wires, Medical Equipment Box Build & System Integration, Industrial & Medical Wire Harnesses & Raw Cables, Semiconductor Equipment Cables, and AI Docking & Dongle) serves medical imaging, industrial automation, and semiconductor fabrication equipment. The Semiconductor Equipment Solutions portfolio (Box Build and System Integration) provides turnkey assembly for semiconductor manufacturing equipment. The portfolio also includes acquired entities such as Interplex Datacom (specializing in precision mechanical and structural components for AI server racks), Easys s. r. o., and elocab, extending capabilities in precision metals fabrication, cable assemblies, and optical fiber connectivity.

Differentiator

Problem solved

Functional benefit

Products and services

• Server Connectors Precision electrical connectors designed for server and computing infrastructure, enabling reliable signal and power transmission in data center environments.
• Server Cables Cabling solutions engineered for server-to-server and server-to-storage interconnections in data center racks, supporting high-speed data transmission.
• Power Whip Pre-assembled power cabling assemblies that deliver electrical power from busbar systems or PDUs to server racks, facilitating rapid deployment and reliable power delivery in data center environments.
• Data Center Busbar Busbar-based power distribution systems for data centers, enabling efficient and scalable power delivery across rack infrastructure with reduced cabling complexity.
• Rack Busbar Busbar systems installed within or adjacent to server racks for distributing power to individual server units with high efficiency and lower impedance than traditional cabling.
• WDM (Wavelength Division Multiplexing) Optical multiplexing technology that combines multiple wavelengths onto a single fiber to increase bandwidth capacity in data center interconnect and backbone networks.
• DAC (Direct Attach Cables) High-speed direct-attach copper and fiber cable assemblies for short-reach interconnects between servers, switches, and storage devices within racks, offering cost-effective high-bandwidth connectivity.
• Loopback Loopback adapters and cables used for testing, diagnostics, and network redundancy in data center infrastructure, enabling self-referencing of optical or electrical signals.
• Optics Optical transceivers and modules that convert electrical signals to optical signals and vice versa for high-speed data transmission over fiber in AI data center and networking applications.
• MPO Connectors Multi-fiber push-on (MPO) optical connectors enabling high-density fiber optic connections for data center and AI infrastructure applications.
• Data Center Raw Wires & Cables Raw wire and cable materials optimized for data center power and signal distribution applications, serving as foundational conductors for data center infrastructure.
• BizLink on NVIDIA MGX Architecture Interconnect solutions designed specifically for NVIDIA's MGX modular reference architecture, supporting AI systems from single-node platforms to rack-scale deployments including solutions for NVIDIA Vera Rubin platform and 800 VDC-related data center applications.
• EV Busbar Busbar assemblies designed for electric vehicle power distribution systems, delivering high-current power within vehicle electrical architectures.
• EV Charging Solutions Interconnect and cabling products for electric vehicle charging infrastructure, including charging station cable assemblies and connectors.
• Autonomous Driving Solutions Specialized wire harnesses and interconnect solutions designed for autonomous vehicle sensor systems, computing platforms, and vehicle-to-infrastructure communication.
• Automotive Wire Harnesses Complete wire harness assemblies for automotive applications, routing electrical power and signals throughout vehicle systems.
• High Voltage Wire Harnesses Specialized wire harnesses rated for high-voltage applications in electric vehicles, designed to handle elevated electrical loads with safety and reliability.
• Automotive Smart Cockpit Interconnect solutions for automotive smart cockpit systems including infotainment, digital displays, and integrated cabin electronics.
• Automotive Power Distribution Power distribution solutions and components for automotive electrical architectures, supporting the increasing power demands of modern vehicle systems.
• Drone Interconnects Lightweight, high-reliability interconnect solutions designed for unmanned aerial vehicles, optimizing size, weight, and power (SWaP) characteristics.
• Computerized Tomography Interconnects Specialized cable assemblies and interconnect solutions for medical CT (computed tomography) imaging systems, meeting stringent medical device quality and reliability standards.
• Magnetic Resonance Imaging System Interconnects Interconnect solutions for MRI systems, providing signal and power connectivity optimized for the unique electromagnetic environment of MRI machines.
• Ultrasound Systems Interconnects Cable and interconnect products for medical ultrasound imaging equipment, supporting high-frequency signal transmission for diagnostic accuracy.
• Medical Raw Wires Raw wire materials and conductors meeting medical-grade specifications for use in diagnostic and therapeutic medical equipment.
• Medical Equipment Box Build & System Integration End-to-end box build and system integration services for medical equipment, assembling complete electrical cabinets and sub-assemblies to medical device specifications.
• Semiconductor Equipment Cables High-performance cable assemblies and interconnect solutions designed for semiconductor fabrication and testing equipment, meeting the precision and cleanliness requirements of the semiconductor industry.
• AI Docking & Dongle AI-enabled docking stations and dongle devices that provide connectivity and AI acceleration for edge computing and industrial applications.
• Box Build Comprehensive box build services ranging from simple sub-assemblies to complex fully wired electrical cabinets, delivered to specification and certified for industrial and semiconductor environments.
• System Integration Full system integration services for semiconductor equipment, combining multiple interconnect components and subsystems into complete functional assemblies.

Named customers4 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Eight partnerships are on record, tiered core and minor.

• Ennovi / BlackstonecoreStrategic or Co-development Partner · 10 June 2026BizLink acquired Interplex Datacom from Ennovi, a Blackstone portfolio company, for US$850 million enterprise value plus up to US$50 million contingent consideration. The transaction strengthens BizLink's data center connectivity and infrastructure business.
• NVIDIA MGX EcosystemcoreTechnology or IntegrationBizLink is part of the NVIDIA MGX ecosystem, showcasing integrated interconnect solutions supporting next-generation AI infrastructure including high-power delivery and high-speed data transmission for NVIDIA platforms
• OCP (Open Compute Project)coreTechnology or IntegrationAssociation partner and contributor to open data center infrastructure standards
• PCI-SIG (PCI Express)coreTechnology or IntegrationAssociation member contributing to PCI Express standards development
• IBTA (InfiniBand Trade Association)coreTechnology or IntegrationAssociation member supporting InfiniBand interconnect standards
• UN Global CompactminorOthersSignatory to UN Global Compact for corporate sustainability
• Baker McKenzieminorImplementation/ SI/ Consulting PartnerLegal advisor to BizLink for the Interplex Datacom acquisition
• EY-ParthenonminorImplementation/ SI/ Consulting PartnerFinancial and tax due diligence advisor to BizLink for the Interplex Datacom acquisition

Scale indicators10 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• TE Connectivity: Global leader in electronic connectors, sensors, and interconnect components serving data center, automotive, industrial, and medical markets. Directly comparable product portfolio and end-market exposure to BizLink, with significantly greater scale.
• Amphenol: Diversified interconnect, antenna, and sensor manufacturer with major exposure to IT/datacom, automotive, and industrial markets. Closely comparable in terms of broad connector and cable assembly portfolio serving AI data center and EV applications.
• Molex (Koch Industries): Major manufacturer of electronic interconnect solutions including connectors, cable assemblies, and optical products for data center, automotive, and industrial customers. Direct competitor in high-speed and power interconnect for AI infrastructure.
• Aptiv: Global technology company focused on automotive and commercial vehicle electrical architectures, including high-voltage wiring harnesses, connectors, and EV charging solutions. Comparable in automotive wire harness and EV interconnect offerings.
• Luxshare Precision: Chinese-headquartered interconnect and component manufacturer serving data center, consumer electronics, and automotive markets. Comparable in cables, connectors, and increasingly in AI server interconnect components.
• Foxconn Interconnect Technology (FIT): Subsidiary of Foxconn focused on connector and cable solutions for mobile, computing, datacom, and automotive markets. Direct peer in high-speed interconnect and AI server infrastructure components.
• Leoni AG: European specialist in wires, cables, and wiring systems primarily serving automotive and industrial markets. Comparable in wire harness and cable assembly portfolio, though more concentrated in automotive.

Broad incumbents

• Sumitomo Electric Industries: Diversified Japanese manufacturer with major wire harness, automotive, and information/communications technology businesses. Comparable in automotive wire harnesses and specialty cabling for industrial and data center use.
• Furukawa Electric: Japanese manufacturer of optical fibers, cables, and electronic components serving telecommunications, data center, and automotive end markets. Comparable in fiber optic and specialty cable offerings for AI and telecom infrastructure.

Regional players

• Yazaki Corporation: Japanese-headquartered global supplier of automotive wire harnesses, electrical components, and instrumentation. Comparable in automotive-focused interconnect solutions but with less data center exposure.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks7 records

Key highlights7 records

Customer concentration

• Xx.com/bizlinkholding
• LinkedInlinkedin.com/company/4868419
• Facebookfacebook.com/384574471644985

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A2 records

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about BizLink