3D Micromac
3D-Micromac AG is a privately held German laser micromachining system manufacturer, founded in 2002 in Chemnitz, that develops proprietary ultra-short pulse and excimer laser workstations for the semiconductor, photovoltaic, display/glass, medical device and ophthalmic industries.
- Company typePrivate
- Founded2002
- HeadquartersChemnitz, Germany
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What 3D Micromac does
3D-Micromac AG is a privately held German stock corporation (AG) headquartered in Chemnitz, founded in 2002 with six employees and grown to more than 190 employees today. The company develops and manufactures customized laser micromachining workstations and turnkey solutions for industry, research, and science applications, serving industrial growth markets that include semiconductors and sensors, photovoltaics, glass and display technology, micro-diagnostics, and medical device manufacturing. Go-to-market combines direct enterprise field sales with regional trade agencies and distributors, supported by a US subsidiary (3D-Micromac America, LLC, founded 2014) and channel partners in China, Turkey and Scandinavia.
Its core technology centers on ultra-short pulse lasers and excimer lasers for precision material processing with minimal thermal impact. The proprietary process portfolio includes TLS-Dicing (Thermal Laser Separation) for wafer and PV cell dicing, FSLA (Flow Supported Laser Ablation) for microvia drilling, and laser-induced forward transfer (LIFT). These processes are commercialized through a branded product family (microPREP, microVEGA, microDICE, microCELL, microFLEX, microSHAPE, microPOLAR, microMARK, microMIRA, microCETI, microSTRUCT), with over 100 excimer laser systems in industrial use worldwide and ISO 9001 certification continuously held since 2003.
Revenue is generated primarily through one-time system sales of laser micromachining machines and turnkey solutions, supplemented by contract manufacturing services via lasermicroprocessing.com and recurring service and support on the installed base. Pricing is quote-based rather than publicly disclosed. The firm is privately held with no disclosed parent company, no public ticker, and no venture or institutional investor ownership disclosed in the available data.
3D Micromac firmographics
Firmographics- Name
- 3D Micromac
- Legal name
- 3D-Micromac AG
- Website
- https://3d-micromac.com
- Company type
- Private
- Founded year
- 2002
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- 3D-Micromac AG is a privately held German laser micromachining system manufacturer, founded in 2002 in Chemnitz, that develops proprietary ultra-short pulse and excimer laser workstations for the semiconductor, photovoltaic, display/glass, medical device and ophthalmic industries.
- Ownership category
- akta.pro rank
Where 3D Micromac is headquartered
LocationHeadquarters
- HQ city
- Chemnitz
- HQ country
- Germany
- HQ region
- Europe
Offices2 records
Markets served
3D Micromac business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure
Revenue model
- Laser Micromachining Systems: Sale of proprietary laser micromachining machines and turnkey solutions for industrial applications including semiconductors, photovoltaics, glass processing, and medical devices
- Contract Manufacturing Services: Laser microprocessing services offered through lasermicroprocessing.com for customers requiring processing without purchasing equipment
- Service and Support: Ongoing service, maintenance, and technical support for installed base of laser systems
Go-to-market motion2 records
Distribution channels3 records
Marketing channels6 records
3D Micromac product offering
Product offeringCore offering
3D-Micromac AG develops, manufactures, and sells customized laser micromachining workstations, machines, and turnkey production solutions based on proprietary ultra-short pulse laser and excimer laser technologies. The company serves industrial customers in semiconductors, photovoltaics, glass/display, medical devices, and materials analysis with process-specific systems such as laser sample preparation, wafer dicing, laser annealing, roll-to-roll processing, and micro-drilling. In addition, 3D-Micromac provides contract laser microprocessing services and ongoing service/support for its installed base of more than 100 excimer laser micromachining systems.
Product overview
3D-Micromac AG is the industry leader in laser micromachining, offering a comprehensive portfolio of laser systems, processes, and turnkey solutions for high-tech industries. The product portfolio centers on proprietary laser technologies including ultra-short pulse lasers and excimer lasers. Core products include the microPREP PRO series for sample preparation (cross-sections, TEM lift-out, box milling), microDICE for precision wafer dicing, microVEGA systems for laser annealing and magnetic sensor formation, microPRO systems for general micromachining, and microFLEX for roll-to-roll flexible electronics processing. Specialized systems target photovoltaics (microCELL, microFLEX PV), displays and glass processing (microSHAPE, microMIRA, microPOLAR), and medical/ophthalmic applications (microMARK). The company also provides application-specific processes including TLS-Dicing (Thermal Laser Separation), FSLA (Flow Supported Laser Ablation), and laser-induced forward transfer (LIFT). Over 100 excimer laser micromachining systems are in industrial use worldwide.
Differentiator
Problem solved
Functional benefit
Brands
- microPREP: Laser sample preparation system for semiconductor failure analysis, TEM, SEM, and micromechanics sample preparation.
- microVEGA
- microDICE
- microCELL
- microFLEX
- microSHAPE
- microSTRUCT
- microMIRA
- microCETI
- microMARK
- microPOLAR
- TLS-Dicing
- FSLA
- ILACOS
Products and services
- microPREP PRO High-throughput laser-based sample preparation system used for cross-sectioning, micro-milling, and site-specific sample preparation for SEM, TEM, and APT analysis. Targets semiconductor failure-analysis labs and materials research organizations.
- microPREP PRO FEMTO Femtosecond laser ablation-based sample preparation system delivering virtually damage-free preparation for TEM and atom probe tomography specimens, targeting high-resolution materials characterization and semiconductor failure analysis.
- microDICE Laser dicing system for precision cutting of semiconductor wafers and microelectronic components with minimal heat-affected zones, used in semiconductor back-end processing.
- microVEGA xMR Laser annealing system that programs GMR/TMR magnetic field sensor structures at wafer level by reaching Curie temperature with a selective laser spot combined with an in-situ rotatable magnetic field.
- microVEGA FC Laser annealing system for precision thermal processing of semiconductor materials and electronic components, used in semiconductor manufacturing.
- microPRO XS OCF Precision laser system for selective annealing enabling ohmic contact formation in semiconductor manufacturing, used for power electronics and advanced packaging.
- microPRO Industrial-grade laser micromachining system for general high-precision microprocessing, used across semiconductor, photovoltaic, display, and medical device production.
- microCETI Laser-induced forward transfer (LIFT) system used for precise material deposition and device fabrication, supporting R&D and prototyping workflows.
- microFLEX Roll-to-roll laser processing system for flexible electronics manufacturing, providing contactless, forceless high-precision machining on flexible substrates.
- microFLEX PV Roll-to-roll laser processing system configured specifically for photovoltaic manufacturing, including CIGS and flexible solar cell production.
- microCELL Laser system for photovoltaic cell cutting using Thermal Laser Separation (TLS) technology, providing higher mechanical strength and reduced recombination losses compared to conventional methods.
- microPOLAR Laser cutting system for high-index glass used in augmented reality (AR) waveguide eyepiece manufacturing, featuring fully automated free-form cutting capabilities.
- microSHAPE Laser cutting and structuring system for precision glass processing used in display, electronics, and medical device manufacturing.
- microMIRA Laser lift-off system used in microelectronics and display manufacturing for separating processed layers from carrier substrates.
- microSTRUCT C Laser structuring system for precision micro-machining applications across electronics, display, and medical device manufacturing.
- microMARK Laser marking system for ophthalmic lenses and medical device applications, providing permanent marking without damage.
- microPREP L Next-generation laser sample preparation platform for whole semiconductor wafer and system-level failure analysis, targeted at semiconductor manufacturers and failure analysis laboratories.
- Contract Laser Microprocessing Services Contract laser microprocessing services for customers needing laser processing without purchasing equipment, delivered through lasermicroprocessing.com for prototyping, pilot runs, and small-batch production.
Quantifiable outcome
- Sample preparation time reduced from hours to minutes
- +2 more outcomes
Companies that use 3D Micromac
Customer profileNamed customers5 records
Segments6 records
Ideal customer profiles5 records
3D Micromac technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
3D Micromac partnerships and signals
Strategic signalPartnerships
17 partnerships are on record, tiered minor and core.
- DymekminorWell-established trade agency expanding market reach of 3D-Micromac products in China.
- Mems Enerji SistemleriminorTurkish market representative strengthening 3D-Micromac AG presence in Turkey.
- SCHOTT AGcoreCoordinator of SHARP joint project developing scalable high-power reflectors for petawatt laser fusion reactors. 3D-Micromac developing FSLA processes for precise cooling structures in glass substrates.
- Andus Elektronik GmbHcoreHILaM project partner developing highly dynamic inline control of laser drilling for microvias, combining real-time control of ablation processes with 100% quality testing.
- Fraunhofer-Institut für Physikalische Messtechnik IPMcoreHILaM project partner working on real-time control algorithms and system integration for laser drilling of microvias.
- TNO (Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek)coreProject coordinator for SuPerTandem consortium developing high-efficiency flexible all-perovskite tandem photovoltaic modules. 3D-Micromac's role includes upscaling and demonstration of laser patterning process for R2R manufacturing.
- Helmholtz-Zentrum Berlin für Materialien und Energie GmbH (HZB)coreSuPerTandem consortium partner focused on developing innovative photovoltaic manufacturing technologies for 2-terminal tandem cells on flexible foils.
- Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.v.coreSuPerTandem consortium partner for scalable manufacturing processes on film substrates. Also involved in HILaM and SHARP projects.
- Commissariat a l Energie Atomique et aux Energies Alternatives (CEA)coreSuPerTandem consortium partner contributing to development of high-efficiency photovoltaic modules.
- QubeDot GmbHcoreProject coordinator for SciLine (QVLS-iLabs), developing scalable connecting technology for photonic integrated circuits using LIFT technique for hybrid integration.
- TESCAN GroupcoreCollaboration on Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis, combining plasma FIB technology with high-speed laser ablation (microPREP PRO). Part of European FA4.0 project.
- Montanuniversität Leoben (Prof. Dr. Thomas Höche)minorAcademic partnership for specimen preparation research combining fs-laser ablation with FIB and BIB polishing devices for TEM and APT.
- Fraunhofer IMWSminorPartnership with Fraunhofer Institute for Microstructure of Materials and Systems for laser sample preparation and microstructure diagnostics workflows.
- Scandinavian DistributorsminorRegional partners extending 3D-Micromac AG presence in Scandinavian markets.
- Laser Institut Mittelsachsen (LIM)minorRegional research institute membership supporting laser technology research and development.
- Photonics21minorEuropean technology platform membership for photonics industry collaboration.
- SEMIminorGlobal semiconductor industry association membership supporting semiconductor market engagement.
Scale indicators4 records
Recent moves10 records
Expansion highlights6 records
3D Micromac competitors and assessment
Company assessmentDirect peers
- MKS Instruments (ESI / Electro Scientific Industries): Provides laser-based micromachining systems for semiconductor packaging, PCB drilling, and microelectronics, overlapping with 3D-Micromac's FSLA and microPRO product lines in the same end markets.
- DISCO Corporation: Japanese manufacturer of precision cutting, grinding, and dicing equipment for semiconductors, including laser-based dicing systems. Directly competes with 3D-Micromac's microDICE and TLS-Dicing offerings.
- LPKF Laser & Electronics AG: German-headquartered specialist in laser-based micromachining, structuring, and plastic welding for electronics, semiconductor, and solar applications. The closest comparable by size, geography, and product scope to 3D-Micromac.
Broad incumbents
- IPG Photonics Corporation: Dominant fiber laser manufacturer with growing exposure to ultrafast and green lasers for precision micromachining applications, overlapping with several of 3D-Micromac's end markets.
- Coherent Corp: Global leader in laser materials processing, including excimer, ultrashort-pulse, and fiber lasers. Competes broadly with 3D-Micromac across multiple end markets but with a much larger and more diversified portfolio.
- TRUMPF SE + Co. KG: German industrial laser and machine tool giant offering a broad range of laser sources and systems, including ultrashort-pulse lasers relevant to precision micromachining markets that 3D-Micromac addresses.
Regional players
- Han's Laser Technology Industry Group: China's largest industrial laser equipment maker with broad coverage of laser cutting, marking, and micromachining systems, competing with 3D-Micromac primarily in Asian markets through overlapping product categories.
- JPT Opto-electronics Co., Ltd. China-based manufacturer of ultrafast and specialty fiber lasers used in precision micromachining, similar in laser source technology to what 3D-Micromac integrates into its systems, primarily serving Asian customers.
Others
- SCANLAB GmbH: German supplier of laser scanning components and subsystems that integrate into laser micromachining systems comparable to 3D-Micromac's products, acting as an enabling technology provider in the same ecosystem.
Emerging players
- Oxford Lasers Ltd: UK-based specialist in laser micromachining and materials processing serving similar specialty industrial and research applications as 3D-Micromac but at a smaller scale.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat4 records
Key risks6 records
Key highlights7 records
Customer concentration
3D Micromac social profiles
Digital presence3D Micromac compliance and trust
Trust signalCompliance1 record
3D Micromac financial estimates
Financial estimateRevenue estimate
Valuation estimate
3D Micromac leadership team
Management profileNumber of profiles
Profiles4 records
3D Micromac subsidiaries and ownership
Company hierarchySubsidiaries1 record
3D Micromac funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
3D Micromac M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about 3D Micromac
What does 3D Micromac do?
3D-Micromac AG develops, manufactures, and sells customized laser micromachining workstations, machines, and turnkey production solutions based on proprietary ultra-short pulse laser and excimer laser technologies. The company serves industrial customers in semiconductors, photovoltaics, glass/display, medical devices, and materials analysis with process-specific systems such as laser sample preparation, wafer dicing, laser annealing, roll-to-roll processing, and micro-drilling. In addition, 3D-Micromac provides contract laser microprocessing services and ongoing service/support for its installed base of more than 100 excimer laser micromachining systems.
Is 3D Micromac a public or private company?
3D Micromac is a private company. It is classified as unknown and is currently operating.
When was 3D Micromac founded?
3D Micromac was founded in 2002. It employs 101 to 250 people.
Where is 3D Micromac based?
3D Micromac is headquartered in Chemnitz, Germany, in the Europe region.
How does 3D Micromac make money?
Three revenue lines are on record. Laser Micromachining Systems are the primary driver. The others are contract Manufacturing Services and service and Support.
Who are 3D Micromac's main competitors?
Direct peers on record are MKS Instruments (ESI / Electro Scientific Industries), DISCO Corporation and LPKF Laser & Electronics AG. Broad incumbents are IPG Photonics Corporation, Coherent Corp and TRUMPF SE + Co. KG. Regional players are Han's Laser Technology Industry Group and JPT Opto-electronics Co., Ltd.. SCANLAB GmbH is listed as an others. Oxford Lasers Ltd is listed as an emerging player.
Does 3D Micromac have an API?
No public API is recorded for 3D Micromac.