Samsung Electro Mechanics

What Samsung Electro Mechanics does

Samsung Electro-Mechanics Co., Ltd. (삼성전기, KRX: 009150) is a South Korea-based electronic components manufacturer founded in 1973 and operated as a subsidiary of Samsung Group. Headquartered in Suwon with major manufacturing operations in Busan (~5,000 employees), Sejong, Pyeongtaek, and Calamba (Philippines), the company employs more than 10,000 people and operates through three divisions: Component Solutions (MLCCs, inductors, chip resistors, tantalum capacitors, and silicon capacitors), Package Solutions (semiconductor package substrates including FC-BGA), and Optical Solutions (camera modules for smartphones and automotive ADAS).

The company's technology portfolio centers on proprietary ceramic dielectric and electrode materials for multi-layer ceramic capacitors, advanced semiconductor packaging (FC-BGA substrates and next-generation glass core substrates developed with Sumitomo Chemical), and integrated camera modules with automotive-grade features such as water-repellent coatings and the world's first automotive IRIS aperture module. Samsung Electro-Mechanics holds approximately 25% global MLCC market share, making it the world's second-largest MLCC manufacturer after Murata, and commands more than 40% share in the higher-spec AI server MLCC segment, where AI servers consume up to 600,000 MLCCs per rack versus 1,000–1,300 per smartphone. The company was the first Korean firm to achieve mass production of server-grade FC-BGA substrates (October 2022) and supplies substrates for Qualcomm's AI200 data center accelerator.

Samsung Electro-Mechanics generates revenue through B2B direct enterprise sales via 1-year long-term supply contracts (increasingly with advance payments exceeding 10%), an EDI/B2Bi system, and a network of regional sales partners. 2025 full-year revenue reached KRW 11.3 trillion (highest in company history, +10% YoY) with operating profit of KRW 913.3 billion (+24% YoY) and Q4 2025 operating profit up 108% YoY; AI/cloud server, automotive (forecast to grow from ~10% of revenue in 2023 to ~24% by 2025), mobile/IT, and network/5G are the primary customer segments, with named customers including Qualcomm, Hyundai Motor Group/Kia, and undisclosed US-based cloud hyperscalers.

Name

Samsung Electro Mechanics

Legal name

Samsung Electro-Mechanics Co., Ltd. (삼성전기 주식회사)

Website

https://samsungsem.com

Company type

Public

Founded year

1973

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Samsung Electro-Mechanics is a South Korea-based electronic components manufacturer producing MLCCs, FC-BGA semiconductor substrates, silicon capacitors, and camera modules. The company serves AI server, automotive, mobile, and 5G infrastructure markets globally as part of Samsung Group.

Ownership category

akta.pro rank

Product category

Electronic Components

NAICS

Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing (334416), Semiconductor and Other Electronic Component Manufacturing (3344), Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Related Device Manufacturing (334413)

SIC

Electronic Components & Accessories (3670), Electronic Components, Nec (3679), Electronic Coils, Transformers & Other Inductors (3677), Optical Instruments & Lenses (3827)

akta.pro primary industry

Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film) (IMAGAJAM)

akta.pro secondary industries

Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH), EV/Industrial Charging Power Electronics (Chargers, rectifiers, power stages) (IMAGADAF), Smartphone Components & Modules (Displays, Cameras, Batteries, Sensors, RF modules) (CRACALAD)

Keywords

• Passive electronic components
• MLCC capacitors
• Semiconductor package substrates
• Camera modules
• Automotive electronics

Headquarters

HQ city

Suwon

HQ country

South Korea

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Operations, Infrastructure, Personnel

Revenue model

1. Component Solutions (MLCCs, Inductors, Chip Resistors, Tantalum, Silicon Capacitors): The Component Solutions division generates revenue from selling passive electronic components including MLCCs, inductors, chip resistors, tantalum capacitors, and silicon capacitors. Q4 2025 revenue was KRW 1.32 trillion. AI server and automotive MLCC demand drives growth, with the division holding approximately 25% global MLCC market share and over 40% share in AI server MLCCs.
2. Package Solutions (FC-BGA, BGA Substrates): The Package Solutions division (semiconductor package substrates) recorded Q4 2025 revenue of KRW 644.6 billion. Revenue is driven by supply of FC-BGA substrates for AI accelerators and servers to global big tech customers, as well as memory BGA for semiconductor manufacturers. Long-term supply contracts with advance payments exceeding 10% support cash flow.
3. Optical Solutions (Camera Modules): The Optical Solutions division recorded Q4 2025 revenue of KRW 937.2 billion. Revenue comes from supplying camera modules for smartphones, automotive (ADAS/surround view monitors), and other optical applications. Hyundai Motor and Kia have been designated as primary partners for automotive camera supply.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels7 records

Core offering

Samsung Electro-Mechanics manufactures and sells electronic components across three divisions: Component Solutions (MLCCs, silicon capacitors, inductors, chip resistors, tantalum capacitors), Package Solutions (FC-BGA semiconductor package substrates for AI accelerators and servers, including glass core substrates for next-generation packaging), and Optical Solutions (camera modules for smartphones and automotive ADAS). The company supplies these components to AI/cloud server operators, automotive OEMs, smartphone manufacturers, and network/5G infrastructure providers globally.

Product overview

Samsung Electro-Mechanics (삼성전기) is a manufacturer of electronic components and modules organized into three main business divisions: Component Solutions (passive components including MLCCs, inductors, chip resistors, tantalum capacitors, and silicon capacitors), Package Solutions (semiconductor packaging substrates including FC-BGA for AI accelerators and glass core substrates), and Optical Solutions (camera modules for mobile and automotive applications). The company serves diverse markets including AI servers, autonomous driving, mobile devices, and industrial equipment, with manufacturing facilities in Suwon, Sejong, and Busan in South Korea, as well as international locations in Vietnam, China, and the Philippines. Samsung Electro-Mechanics recently established a joint venture named GlaSSEM with Sumitomo Chemical's subsidiary Dongwoo Fine-Chem for glass core substrate production targeting AI and HPC applications.

Differentiator

Problem solved

Functional benefit

Products and services

• MLCC (Multi-Layer Ceramic Capacitor) Multi-layer ceramic capacitors regulate current flow in circuits by storing and releasing electrical energy. Samsung Electro-Mechanics produces MLCCs in various form factors (standard, high-capacitance, high-voltage, high-temperature, and automotive-grade variants) for applications spanning mobile devices, AI servers, automotive electronics, and industrial equipment. The company holds approximately 25% global MLCC market share and over 40% share in AI server MLCCs.
• Silicon Capacitor Ultra-thin capacitors using semiconductor technology to achieve high capacitance density in minimal space. Features extremely low parasitic inductance (below 1pH), high reliability, and stable performance at temperatures exceeding 250°C. Optimized for AI server chipsets, autonomous vehicles, and aerospace applications where miniaturization and high-frequency performance are critical.
• Inductor Passive electronic components that store energy in magnetic fields, used for power management, signal filtering, and energy storage in various electronic circuits across consumer and industrial applications.
• Chip Resistor Surface-mount resistors that limit current flow in electronic circuits, available in various resistance values and power ratings for general electronic applications.
• Tantalum Capacitor Electrolytic capacitors using tantalum metal known for high capacitance per volume, stable electrical properties, and reliability, used in applications requiring compact size and consistent performance.
• Camera Module Integrated camera units combining image sensors, lenses, actuators, and processing components. Samsung Electro-Mechanics produces camera modules for smartphones, automotive ADAS, and surround view monitors, featuring technologies like OIS, variable aperture, folded zoom, and water-repellent coating for all-weather automotive operation.
• Package Substrate (FC-BGA) Semiconductor packaging substrates that electrically connect chips to motherboards while protecting against external stress. Includes Flip-Chip Ball Grid Array (FC-BGA) substrates for AI accelerators, servers, mobile APs, and memory packages, as well as glass core substrates for next-generation high-performance computing applications.
• Automotive MLCC (AEC-Q200) MLCCs specifically designed and certified to AEC-Q200 standards for automotive applications, featuring enhanced reliability, temperature tolerance, and durability for use in powertrain, safety, ADAS, and infotainment systems.
• Automotive MFC (Molded Frame Capacitor) Molded frame capacitors combining ceramic capacitor technology with molded packaging for high-voltage automotive applications including EV charging systems, inverters, and DC-DC converters.

Quantifiable outcome

• AI server MLCC market share >40%, enabling dominance in a segment where AI servers require 600,000 MLCCs per rack vs. 1,000–1,300 for smartphones
• +3 more outcomes

Named customers5 records

Segments4 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Eight partnerships are on record, tiered flagship, core, regional and minor.

• Dongwoo Fine-Chem (Sumitomo Chemical Group)flagshipStrategic or Co-development Partner · 2 July 2026Samsung Electro-Mechanics signed a definitive agreement to form a joint venture named GlaSSEM (tentative) with Dongwoo Fine-Chem, Sumitomo Chemical's Korean subsidiary. Total investment is approximately 480 billion won. Samsung Electro-Mechanics holds a 66% stake and Dongwoo Fine-Chem holds 34%. The JV will produce glass cores — key materials for next-generation semiconductor package substrates targeting AI, HPC, and data center applications. The JV will be based at Dongwoo Fine-Chem's Pyeongtaek plant, with incorporation expected by end of 2026 and full-scale production in H2 2027. The venture combines Samsung Electro-Mechanics' substrate design capabilities with Sumitomo Chemical Group's glass materials technology.
• Sumitomo Chemical Group (Japan)flagshipStrategic or Co-development Partner · 5 November 2025Samsung Electro-Mechanics and Sumitomo Chemical Group signed an MOU in Tokyo to explore establishment of a joint venture for glass core substrate manufacturing. Samsung Electro-Mechanics will hold majority stake as the primary investor, with Sumitomo Chemical Group as additional investor. The MOU was signed by Samsung Electro-Mechanics CEO Jang Deok-hyun and Sumitomo Chemical Chairman Keiichi Iwata, with the JV headquarters planned at Dongwoo Fine-Chem's Pyeongtaek site.
• QualcommcoreStrategic or Co-development PartnerSamsung Electro-Mechanics began mass production of FC-BGA substrates for Qualcomm's first data center AI accelerator (AI200) at its Busan plant. This extends the existing partnership from mobile and PC chips into server-class semiconductors. The AI200 features Qualcomm's custom Oryon CPU cores and Hexagon NPU, scheduled for launch in H2 2025. This positions Samsung Electro-Mechanics as a key supplier in Qualcomm's AI infrastructure push.
• Hyundai Motor Group (Hyundai Motor, Kia)coreStrategic or Co-development PartnerSamsung Electro-Mechanics was selected as a primary (1st-tier) supplier for Hyundai Motor and Kia's automotive camera needs, including Surround View Monitor (SVM) cameras and rear monitoring cameras for parking assistance systems. The designation recognizes Samsung Electro-Mechanics' technology, quality, and stable supply capabilities for automotive camera modules.
• Busan Metropolitan CityregionalStrategic or Co-development PartnerSamsung Electro-Mechanics announced plans to invest 15 trillion won by 2040 at its Busan plant, transforming it into a cutting-edge high value-added manufacturing hub for AI server package substrates and MLCCs. The announcement was made at the Yeongnam Region Advanced Industry Development Vision National Report Meeting, attended by President Lee Jae-myung and Busan Mayor Jeon Jae-soo.
• Pohang University of Science and Technology (POSTECH)minorOthersSamsung Electro-Mechanics signed a talent cultivation MOU with POSTECH, operating a recruitment-linked talent development program with customized curriculum for materials and components, conducting 9 joint research projects in MLCC and semiconductor package substrates.
• Washington University in St. LouisminorOthersSamsung Electro-Mechanics provided a $1.8 million research grant to Washington University researchers developing improved electrostatic capacitors using a 2D/3D/2D ferroelectric material structure only 30 nanometers thick, which reduces energy loss and enhances energy storage efficiency for electronic devices and electric vehicles.
• Educational Institutions (Philippines)minorOthersSamsung Electro-Mechanics Philippines Corp. (SEMPHIL) launched the APEX Academe Partnership Program, collaborating with Mapua Malayan Colleges Laguna, Mapua University, MFI Polytechnic Institute Inc., MSU-Iligan, TESDA CALABARZON, and University of the Philippines Diliman to develop Filipino engineers through scholarships and applied training programs.

Scale indicators11 records

Recent moves10 records

Expansion highlights7 records

Direct peers

• Murata Manufacturing: World's #1 MLCC manufacturer and SGMI's primary competitor in passive components. Both companies compete directly in AI server MLCCs, automotive MLCCs, and high-spec capacitors, with Murata holding the global MLCC leadership position SGMI is challenging.
• Shinko Electric Industries: Japanese manufacturer of FC-BGA semiconductor package substrates, a market in which SGMI is now directly competing. Both companies supply high-end packaging substrates into AI accelerators and HPC chips for major semiconductor customers.
• Yageo Corporation: Taiwanese passive component leader in MLCCs and resistors. Yageo expanded MLCC capacity through its Pulihon acquisition and competes with SGMI in MLCCs for automotive, industrial, and consumer applications.
• Kyocera (AVX): Japanese electronics conglomerate whose AVX subsidiary produces MLCCs, tantalum capacitors, and other passive components. Overlaps with SGMI across automotive-grade capacitors, MLCCs, and high-reliability components for industrial markets.
• Vishay Intertechnology: US-based global manufacturer of discrete semiconductors and passive components including MLCCs, inductors, and resistors. Competes with SGMI in automotive and industrial passive components, particularly in Western OEM and Tier 1 automotive supply chains.
• LG Innotek: Korean electronics component maker and Samsung Group home-country rival. Directly competes with SGMI in camera modules for smartphones and automotive, and also produces FC-BGA substrates targeting similar AI/HPC customers.
• Taiyo Yuden: Japanese MLCC manufacturer and one of the top global passive component makers. Competes with SGMI across standard, high-capacitance, and automotive-grade MLCCs serving similar smartphone, automotive, and industrial customers.
• TDK Corporation: Major Japanese electronic components manufacturer with overlapping MLCC, inductor, and capacitor portfolios. TDK competes directly with SGMI in automotive and AI server passive components and also produces substrate and sensor solutions.
• Unimicron Technology: Taiwanese PCB and IC substrate manufacturer with significant FC-BGA capacity. Competes with SGMI's Package Solutions business in advanced packaging substrates for AI accelerators, servers, and high-end computing applications.
• Ibiden: Japanese substrate manufacturer producing IC substrates including FC-BGA and high-end build-up PCB substrates. Competes with SGMI's Package Solutions division in advanced semiconductor packaging for AI servers and high-performance computing.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UCqJ5l0KHjFoC4Gb__A0sKcg
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• LinkedInlinkedin.com/company/samsung-electro-mechanics-%EC%82%BC%EC%84%B1%EC%A0%84%EA%B8%B0

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Samsung Electro Mechanics