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SPTS Technologies

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uuid000a7dd

Namestring
SPTS Technologies
Legal namestring
SPTS Technologies
Websiteurl
spts.com
Company typeenum
Private
Founded yearint
2009
Descriptiontext

SPTS Technologies designs, manufactures, sells, and supports etch, PVD, CVD, and thermal capital equipment for the semiconductor industry, operating as a retained subsidiary brand of KLA Corporation (NASDAQ: KLAC). Within KLA's portfolio, SPTS specifically focuses on Physical Vapor Deposition (PVD) systems used for metal deposition in chip manufacturing, with the company's headquarters and innovation center located in Newport, Wales, within the South Wales semiconductor cluster. The company employs 251-500 people and serves advanced logic and memory chip manufacturers, compound semiconductor manufacturers (silicon carbide, gallium nitride), and specialized segments including power devices, RF communications, LEDs, photonics, and MEMS. The product integrates into KLA's broader chip manufacturing equipment portfolio spanning defect inspection, metrology, in situ process management, etch, deposition, chemistry process control, and software solutions.

The underlying technology platform centers on PVD hardware for depositing metal films in semiconductor device fabrication, supporting advanced node transitions including FinFET, gate-all-around FET (GAAFET), 3D NAND, and emerging architectures such as backside power delivery networks (BSPDN). SPTS's products are positioned within KLA's process-enabling solutions that operate at the intersection of electron and photon optics, sensor technology, and artificial intelligence for chip yield management. The subsystem addresses material-specific deposition requirements for compound semiconductors and advanced packaging, with applications extending from leading-edge logic to power electronics and RF devices.

SPTS employs a hardware sales revenue model for capital equipment, complemented by recurring service contracts and software solutions sold through KLA's direct enterprise field sales force. The go-to-market leverages KLA's global sales infrastructure with offices across the US, UK, and continental Europe as well as in Israel, India, Singapore, Taiwan, Japan, and Korea. Customer relationships are anchored by co-development partnerships with TSMC, Intel, NVIDIA, and Samsung on next-generation process technologies. Competitive positioning rests on KLA's 50-year heritage of semiconductor innovation, Fortune Most Innovative Companies recognition, and integration into industry-wide technology roadmaps with peer equipment makers including Applied Materials, ASM International, Lam Research, and Tokyo Electron.

Short descriptiontext

SPTS Technologies, a subsidiary of KLA Corporation, designs and manufactures PVD (Physical Vapor Deposition) and related etch, CVD, and thermal capital equipment for semiconductor chip manufacturers worldwide, serving advanced logic, memory, compound semiconductor, and power device fabs from Newport, Wales.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
251–500
akta.pro rankint
HeadquartersNewport, United Kingdom
HQ citystring
Newport
HQ countrystring
United Kingdom
HQ regionstring
Europe
Markets served

Serves global market

Offices14 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
semiconductor capital equipment, physical vapor deposition, etch systems, chemical vapor deposition, thermal processing equipment
Industry1 code
1Deposition Equipment (CVD/PVD/ALD/Epitaxy)
CodeHDAHAEABPrimaryYes
NAICS code1 code
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Industrial Process Furnaces & Ovens3567
Product category
Semiconductor Capital Equipment
Social media profiles2 records
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model2 records
1Semiconductor Manufacturing Equipment
TypeHardware Sales
Description

KLA generates revenue through the sale of process-control and process-enabling equipment solutions to semiconductor manufacturers globally. The company serves chip manufacturers across advanced logic, memory, power devices, RF communications, LEDs, photonics, and MEMS segments. SPTS contributes PVD systems to this portfolio.

openpr.com
2Process Control Services and Software
TypeSubscription Recurring
Description

Revenue generated from software solutions, service contracts, and support for semiconductor manufacturing equipment

openpr.com
Marketing channels5 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Technology or R&D, Supply Chain, Operations, Personnel, Marketing or Sales, Infrastructure
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

SPTS Technologies designs, manufactures, sells, and supports etch, PVD, CVD, and thermal capital equipment for semiconductor manufacturing. Its core product focus is Physical Vapor Deposition (PVD) systems for metal deposition in chip fabrication, sold directly to advanced logic and memory chip manufacturers globally.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 value
  • 50 years of semiconductor technology innovation and customer success
Product overview1 text field

SPTS Technologies operates as a product line within KLA Corporation's semiconductor manufacturing equipment portfolio. SPTS focuses on physical vapor deposition (PVD) systems for metal deposition processes serving the semiconductor industry. The broader KLA product ecosystem includes process control and process-enabling solutions across chip manufacturing, wafer manufacturing, reticle manufacturing, packaging manufacturing, and PCB/IC substrate manufacturing, with SPTS specifically addressing metal deposition needs.

Product and service4 records
1SPTS PVD (Physical Vapor Deposition) Systems
CategorySemiconductor Capital Equipment / Deposition
Description

Physical vapor deposition systems for metal deposition processes in semiconductor manufacturing, targeted at advanced logic and memory chip manufacturers.

2Etch Capital Equipment
CategorySemiconductor Capital Equipment / Etch
Description

Etch process solutions for semiconductor chip manufacturing, part of the broader SPTS process-enabling capital equipment portfolio.

3CVD Capital Equipment
CategorySemiconductor Capital Equipment / Deposition
Description

Chemical Vapor Deposition capital equipment for thin film deposition in semiconductor fabrication processes.

4Thermal Capital Equipment
CategorySemiconductor Capital Equipment / Thermal Processing
Description

Thermal processing capital equipment used in semiconductor manufacturing for heat-based wafer processing steps.

Scale indicator8 records

Each record includes

Type, Value, Description, Source

Partnership8 partners
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-07-03
Description

Samsung actively co-developing or adopting advanced semiconductor technologies alongside equipment makers, including BSPDN (Backside Power Delivery Network) and other process innovations for AI SoCs at VLSI 2025 conference

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-07-03
Description

TSMC actively co-developing or adopting advanced semiconductor technologies alongside equipment makers for power efficiency and thermal challenges in AI SoCs

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-07-03
Description

Intel actively co-developing or adopting advanced semiconductor technologies alongside equipment makers for next-generation chip architectures

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-07-03
Description

NVIDIA actively co-developing or adopting advanced semiconductor technologies alongside equipment makers to address power efficiency and thermal challenges in AI chips

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-07-03
Description

Applied Materials collaborating with equipment makers to address power efficiency and thermal challenges in AI SoCs through BSPDN and other advanced process technologies

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-07-03
Description

ASM International collaborating with equipment makers on advanced semiconductor process technologies for AI applications

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-07-03
Description

Lam Research collaborating with equipment makers on advanced semiconductor manufacturing processes including etch and deposition technologies

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-07-03
Description

Tokyo Electron collaborating with equipment makers on advanced semiconductor manufacturing process solutions

Recent move5 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight5 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Leading semiconductor etch and deposition equipment maker. Directly competes with SPTS in etch and adjacent deposition segments for advanced logic and memory manufacturing customers.

TypeDirect peer
Description

Specialist in MOCVD and CVD deposition systems for compound semiconductors (GaN, SiC, GaAs). Competes with SPTS in deposition tools for LED, power electronics and RF device manufacturers.

TypeDirect peer
Description

Major Japanese semiconductor equipment manufacturer with overlapping deposition and etch product lines. Competes with SPTS for the same leading-edge fab customers in Asia and globally.

TypeDirect peer
Description

Largest semiconductor equipment company globally and the dominant incumbent in PVD (physical vapor deposition). Competes head-to-head with SPTS for metal deposition sockets at TSMC, Intel, Samsung and memory fabs.

TypeDirect peer
Description

Japanese manufacturer of sputtering systems and semiconductor production equipment. Competes with SPTS in PVD deposition for semiconductor and HDD/sensor manufacturing.

TypeDirect peer
Description

Specialized deposition and etch equipment maker focused on compound semiconductors (GaN, SiC), photonics and MEMS — directly overlapping SPTS's compound semiconductor PVD focus.

TypeEmerging player
Description

US-based supplier of plasma etch and deposition equipment for semiconductor, MEMS and compound semiconductor markets. Smaller competitor to SPTS in specialized etch/deposition tools.

TypeDirect peer
Description

Specialist in atomic layer deposition (ALD), epitaxy and related deposition technologies. Overlaps with SPTS in deposition equipment for advanced logic and memory nodes.

TypeDirect peer
Description

Japanese manufacturer of vacuum and deposition equipment including sputtering (PVD) and CVD systems. Directly comparable to SPTS in semiconductor and flat panel deposition tools.

TypeEmerging player
Description

Swiss specialist in thin-film deposition equipment for advanced packaging, photonics and MEMS. Smaller than SPTS but addresses adjacent deposition applications with similar PVD/CVD technology.

Market position
Strengths4 records

Each record includes

Headline, Details, Source

Weaknesses4 records

Each record includes

Headline, Details, Source

Competitive moat6 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights6 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers6 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment3 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile2 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature7 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

SPTS Technologies

Semiconductor Capital Equipmentspts.com

SPTS Technologies, a subsidiary of KLA Corporation, designs and manufactures PVD (Physical Vapor Deposition) and related etch, CVD, and thermal capital equipment for semiconductor chip manufacturers worldwide, serving advanced logic, memory, compound semiconductor, and power device fabs from Newport, Wales.

What SPTS Technologies does

SPTS Technologies designs, manufactures, sells, and supports etch, PVD, CVD, and thermal capital equipment for the semiconductor industry, operating as a retained subsidiary brand of KLA Corporation (NASDAQ: KLAC). Within KLA's portfolio, SPTS specifically focuses on Physical Vapor Deposition (PVD) systems used for metal deposition in chip manufacturing, with the company's headquarters and innovation center located in Newport, Wales, within the South Wales semiconductor cluster. The company employs 251-500 people and serves advanced logic and memory chip manufacturers, compound semiconductor manufacturers (silicon carbide, gallium nitride), and specialized segments including power devices, RF communications, LEDs, photonics, and MEMS. The product integrates into KLA's broader chip manufacturing equipment portfolio spanning defect inspection, metrology, in situ process management, etch, deposition, chemistry process control, and software solutions.

The underlying technology platform centers on PVD hardware for depositing metal films in semiconductor device fabrication, supporting advanced node transitions including FinFET, gate-all-around FET (GAAFET), 3D NAND, and emerging architectures such as backside power delivery networks (BSPDN). SPTS's products are positioned within KLA's process-enabling solutions that operate at the intersection of electron and photon optics, sensor technology, and artificial intelligence for chip yield management. The subsystem addresses material-specific deposition requirements for compound semiconductors and advanced packaging, with applications extending from leading-edge logic to power electronics and RF devices.

SPTS employs a hardware sales revenue model for capital equipment, complemented by recurring service contracts and software solutions sold through KLA's direct enterprise field sales force. The go-to-market leverages KLA's global sales infrastructure with offices across the US, UK, and continental Europe as well as in Israel, India, Singapore, Taiwan, Japan, and Korea. Customer relationships are anchored by co-development partnerships with TSMC, Intel, NVIDIA, and Samsung on next-generation process technologies. Competitive positioning rests on KLA's 50-year heritage of semiconductor innovation, Fortune Most Innovative Companies recognition, and integration into industry-wide technology roadmaps with peer equipment makers including Applied Materials, ASM International, Lam Research, and Tokyo Electron.

SPTS Technologies firmographics

Firmographics
Name
SPTS Technologies
Legal name
SPTS Technologies
Website
https://spts.com
Company type
Private
Founded year
2009
Operating status
Operating
Headcount range
251–500 employees
Short description
SPTS Technologies, a subsidiary of KLA Corporation, designs and manufactures PVD (Physical Vapor Deposition) and related etch, CVD, and thermal capital equipment for semiconductor chip manufacturers worldwide, serving advanced logic, memory, compound semiconductor, and power device fabs from Newport, Wales.
Ownership category
akta.pro rank

SPTS Technologies industry classification

Industry
Product category
Semiconductor Capital Equipment
NAICS
Semiconductor Machinery Manufacturing (333242)
SIC
Industrial Process Furnaces & Ovens (3567)
akta.pro primary industry
Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)

Keywords

  • Semiconductor capital equipment
  • Physical vapor deposition
  • Etch systems
  • Chemical vapor deposition
  • Thermal processing equipment

Where SPTS Technologies is headquartered

Location

Headquarters

HQ city
Newport
HQ country
United Kingdom
HQ region
Europe

Offices14 records

Markets served

SPTS Technologies business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Technology or R&D, Supply Chain, Operations, Personnel, Marketing or Sales, Infrastructure

Revenue model

  1. Semiconductor Manufacturing Equipment: KLA generates revenue through the sale of process-control and process-enabling equipment solutions to semiconductor manufacturers globally. The company serves chip manufacturers across advanced logic, memory, power devices, RF communications, LEDs, photonics, and MEMS segments. SPTS contributes PVD systems to this portfolio.
  2. Process Control Services and Software: Revenue generated from software solutions, service contracts, and support for semiconductor manufacturing equipment

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

SPTS Technologies product offering

Product offering

Core offering

SPTS Technologies designs, manufactures, sells, and supports etch, PVD, CVD, and thermal capital equipment for semiconductor manufacturing. Its core product focus is Physical Vapor Deposition (PVD) systems for metal deposition in chip fabrication, sold directly to advanced logic and memory chip manufacturers globally.

Product overview

SPTS Technologies operates as a product line within KLA Corporation's semiconductor manufacturing equipment portfolio. SPTS focuses on physical vapor deposition (PVD) systems for metal deposition processes serving the semiconductor industry. The broader KLA product ecosystem includes process control and process-enabling solutions across chip manufacturing, wafer manufacturing, reticle manufacturing, packaging manufacturing, and PCB/IC substrate manufacturing, with SPTS specifically addressing metal deposition needs.

Differentiator

Problem solved

Functional benefit

Products and services

  • SPTS PVD (Physical Vapor Deposition) Systems Physical vapor deposition systems for metal deposition processes in semiconductor manufacturing, targeted at advanced logic and memory chip manufacturers.
  • Etch Capital Equipment Etch process solutions for semiconductor chip manufacturing, part of the broader SPTS process-enabling capital equipment portfolio.
  • CVD Capital Equipment Chemical Vapor Deposition capital equipment for thin film deposition in semiconductor fabrication processes.
  • Thermal Capital Equipment Thermal processing capital equipment used in semiconductor manufacturing for heat-based wafer processing steps.

Quantifiable outcome

  • 50 years of semiconductor technology innovation and customer success

Companies that use SPTS Technologies

Customer profile

Named customers6 records

Segments3 records

Ideal customer profiles2 records

SPTS Technologies technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature7 records

SPTS Technologies partnerships and signals

Strategic signal

Partnerships

Eight partnerships are on record, tiered core.

  • SamsungcoreStrategic or Co-development Partner · 3 July 2025Samsung actively co-developing or adopting advanced semiconductor technologies alongside equipment makers, including BSPDN (Backside Power Delivery Network) and other process innovations for AI SoCs at VLSI 2025 conference
  • TSMCcoreStrategic or Co-development Partner · 3 July 2025TSMC actively co-developing or adopting advanced semiconductor technologies alongside equipment makers for power efficiency and thermal challenges in AI SoCs
  • IntelcoreStrategic or Co-development Partner · 3 July 2025Intel actively co-developing or adopting advanced semiconductor technologies alongside equipment makers for next-generation chip architectures
  • NVIDIAcoreStrategic or Co-development Partner · 3 July 2025NVIDIA actively co-developing or adopting advanced semiconductor technologies alongside equipment makers to address power efficiency and thermal challenges in AI chips
  • Applied MaterialscoreTechnology or Integration · 3 July 2025Applied Materials collaborating with equipment makers to address power efficiency and thermal challenges in AI SoCs through BSPDN and other advanced process technologies
  • ASM InternationalcoreTechnology or Integration · 3 July 2025ASM International collaborating with equipment makers on advanced semiconductor process technologies for AI applications
  • Lam ResearchcoreTechnology or Integration · 3 July 2025Lam Research collaborating with equipment makers on advanced semiconductor manufacturing processes including etch and deposition technologies
  • Tokyo ElectroncoreTechnology or Integration · 3 July 2025Tokyo Electron collaborating with equipment makers on advanced semiconductor manufacturing process solutions

Scale indicators8 records

Recent moves5 records

Expansion highlights5 records

SPTS Technologies competitors and assessment

Company assessment

Direct peers

  • Lam Research: Leading semiconductor etch and deposition equipment maker. Directly competes with SPTS in etch and adjacent deposition segments for advanced logic and memory manufacturing customers.
  • Aixtron: Specialist in MOCVD and CVD deposition systems for compound semiconductors (GaN, SiC, GaAs). Competes with SPTS in deposition tools for LED, power electronics and RF device manufacturers.
  • Tokyo Electron (TEL): Major Japanese semiconductor equipment manufacturer with overlapping deposition and etch product lines. Competes with SPTS for the same leading-edge fab customers in Asia and globally.
  • Applied Materials: Largest semiconductor equipment company globally and the dominant incumbent in PVD (physical vapor deposition). Competes head-to-head with SPTS for metal deposition sockets at TSMC, Intel, Samsung and memory fabs.
  • Canon Anelva: Japanese manufacturer of sputtering systems and semiconductor production equipment. Competes with SPTS in PVD deposition for semiconductor and HDD/sensor manufacturing.
  • Veeco Instruments: Specialized deposition and etch equipment maker focused on compound semiconductors (GaN, SiC), photonics and MEMS — directly overlapping SPTS's compound semiconductor PVD focus.
  • ASM International: Specialist in atomic layer deposition (ALD), epitaxy and related deposition technologies. Overlaps with SPTS in deposition equipment for advanced logic and memory nodes.
  • Ulvac: Japanese manufacturer of vacuum and deposition equipment including sputtering (PVD) and CVD systems. Directly comparable to SPTS in semiconductor and flat panel deposition tools.

Emerging players

  • Plasma-Therm: US-based supplier of plasma etch and deposition equipment for semiconductor, MEMS and compound semiconductor markets. Smaller competitor to SPTS in specialized etch/deposition tools.
  • Evatec: Swiss specialist in thin-film deposition equipment for advanced packaging, photonics and MEMS. Smaller than SPTS but addresses adjacent deposition applications with similar PVD/CVD technology.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat6 records

Key risks6 records

Key highlights6 records

Customer concentration

SPTS Technologies social profiles

Digital presence

SPTS Technologies financial estimates

Financial estimate

Revenue estimate

Valuation estimate

SPTS Technologies leadership team

Management profile

Number of profiles

Profiles1 record

SPTS Technologies funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

SPTS Technologies M&A and investment

M&A and investment

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SPTS Technologies

What does SPTS Technologies do?

SPTS Technologies designs, manufactures, sells, and supports etch, PVD, CVD, and thermal capital equipment for semiconductor manufacturing. Its core product focus is Physical Vapor Deposition (PVD) systems for metal deposition in chip fabrication, sold directly to advanced logic and memory chip manufacturers globally.

Is SPTS Technologies a public or private company?

SPTS Technologies is a private company. It is classified as corporate owned and is currently operating.

When was SPTS Technologies founded?

SPTS Technologies was founded in 2009. It employs 251 to 500 people.

Where is SPTS Technologies based?

SPTS Technologies is headquartered in Newport, United Kingdom, in the Europe region.

How does SPTS Technologies make money?

Two revenue lines are on record. Semiconductor Manufacturing Equipment is the primary driver. The others are process Control Services and Software.

Who are SPTS Technologies's main competitors?

Direct peers on record are Lam Research, Aixtron, Tokyo Electron (TEL), Applied Materials, Canon Anelva, Veeco Instruments, ASM International and Ulvac. Emerging players are Plasma-Therm and Evatec.

Does SPTS Technologies have an API?

No public API is recorded for SPTS Technologies.

What industry is SPTS Technologies in?

SPTS Technologies's product category is Semiconductor Capital Equipment. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy). Its NAICS code is 333242 and its SIC code is 3567.

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Live signals
TalkMarketsGlobal Semiconductor Etch Equipment Market Growing at 5.3% CAGR Through 2032Intel Market Research published a report estimating the global Semiconductor Etch Equipment Market at USD 21.87 billion in 2024, projected to reach USD 31.24 billion by 2032 at a CAGR of 5.3%, driven by rising demand for semiconductor chips in consumer electronics, automotive, and industrial applications along with adoption of advanced manufacturing technologies such as 3D NAND and FinFET, and expansion of 5G, AI, and IoT. Asia-Pacific dominates semiconductor production, while North America remains a key player with significant investments; China is projected to expand at a remarkable CAGR of 30.6%. Key players including Lam Research, TEL, Applied Materials, Hitachi High-Tech, Oxford Instruments, SPTS Technologies, Plasma-Therm, GigaLane, SAMCO, AMEC, and NAURA collectively hold over 90% of market share.PR NewswireMicralyne Increases Capability with New Equipment Acquisition from SPTS TechnologiesMicralyne Inc., a Edmonton-based MEMS design and fabrication company, announced the purchase of a Versalis fxP Cluster System from SPTS Technologies to increase production capacity for biomedical, optical, and industrial MEMS products. The system includes a Rapier silicon deep reactive ion etch chamber along with dielectric etch and PECVD modules, which will enable Micralyne to offer a broader range of process technologies with improved throughput and yield. CEO John Harley stated this represents state-of-the-art DRIE technology that will expand capabilities and fuel growth to meet increasing global demand for MEMS devices.PR NewswireOrbotech's SPTS Technologies Awarded '2017 Supplier of the Year - Customized Frontend Equipment' by InfineonSPTS Technologies, an Orbotech company, was awarded 'Supplier of the Year - Customized Frontend Equipment' by Infineon at its Supplier Day held in Singapore. The award recognized SPTS for outstanding support and performance of its plasma etch and physical vapor deposition equipment serving Infineon's Power and MEMS business, marking SPTS's third Supplier Excellence Award from Infineon. Orbotech and Infineon reaffirmed their long-term partnership, with SPTS continuing to supply etch, deposition, and thermal wafer processing equipment to Infineon's fabrication facilities.PR NewswireOrbotech's SPTS Technologies Receives $37M in Multiple System Orders From RF Device ManufacturersOrbotech Ltd.'s subsidiary SPTS Technologies received approximately $37 million in orders for multiple etch and deposition systems from two GaAs foundry customers. The systems — Omega plasma etch, Delta PECVD, and Sigma PVD — will be used to manufacture RF devices for 4G and emerging 5G wireless infrastructure and mobile device markets, with delivery split between Q1 and Q2 2018. Industry analysts project the RF GaAs device market will grow from over $8.1 billion in 2017 to over $9 billion by 2021, driven by 4G proliferation and the 5G rollout.PR NewswireOrbotech's SPTS Technologies' Sigma® fxP PVD Solution Selected for imec's 3D System Integration ProgramOrbotech's subsidiary SPTS Technologies has been selected by imec, a world-leading nano-electronics research center, as a new supplier of physical vapor deposition solutions for under bump metallization and redistribution layer processes in next generation fan-out packaging technologies. Imec has named SPTS's Sigma fxP PVD system as the process tool of record for low temperature PVD development, specifically targeting flexible micro-bumps for chip scale packaging applications. Kevin Crofton, President of SPTS Technologies, stated that the selection reflects their PVD solutions' strong results in low temperature RDL and copper pillar creation, and the company looks forward to working with imec and its partners on developing innovative interconnect and fan-out technologies.PR NewswireOrbotech's SPTS Technologies Accelerates Industry Adoption of its Mosaic Plasma Dicing Solution with Order from JCAP CorporationOrbotech's subsidiary, SPTS Technologies, secured an order from JCAP Corporation for its Mosaic Plasma Dicing System to support advanced packaging services. This deal follows industry validation where System Plus Consulting confirmed that Orbotech equipment was used to plasma dice ASICs in the iPhone 7 Plus.PR NewswireOrbotech's SPTS Division Receives Repeat Order for Sigma fxP PVD Systems from Huatian Technology for 300mm Wafer Level Packaging ApplicationsSPTS Technologies, a division of Orbotech Ltd., has received a repeat order from Huatian Technology (Kunshan) Electronics Co., Ltd. for its Sigma fxP physical vapor deposition (PVD) systems for 300mm wafer level packaging applications. The systems will be used to expand capacity for under bump metallization and CMOS image sensor packaging services. According to industry data, China represents the largest regional market for packaging equipment at 30% of global demand, and the Chinese government's guideline aims for the country to achieve 70% self-sufficiency in integrated circuits by 2025.