What Dycotec Materials does

Dycotec Materials Ltd is a UK-based specialty manufacturer of advanced electronic materials, founded in 2015 and headquartered in Calne. The company develops and produces functional inks, pastes, films, and thermal interface materials that enable the manufacture of electronic circuits on substrates and through processes that conventional PCB fabrication cannot support — including flexible polymers (PET, polyimide), elastomers, textiles, ceramics, and steel, with deposition methods spanning screen, inkjet, aerosol jet, and stencil printing.

Its portfolio is organised into four business pillars: Printed Electronics (silver, carbon, and graphene conductors, dielectrics, overcoats, stretchable and biosensor pastes, in-mold electronics materials, polyimide systems); Thick Film Paste (silver, gold, platinum, silver-platinum, and silver-palladium cermet conductors, resistor pastes, dielectrics, overglazes, and polymer overcoats firing up to 1300°C on ceramic and steel substrates); Thermal Interface Materials (non-silicone gels and putties 2.5–8.5 W/m·K, phase change materials 1.75–3.3 W/m·K, and thermally conductive epoxy adhesives 2.3–3.7 W/m·K); and Assembly Materials (conductive and structural adhesives, encapsulants, underfills, pressureless nanosilver sintering die attach pastes for SiC and GaN power modules, and UV-curable barrier layers for perovskite and OPV solar cells). Products carry ISO 9001:2015 certification, with biosensor materials additionally tested to ISO 10993-5 for biocompatibility.

The business model is direct B2B materials sales via website quotation requests for bulk and custom orders, supported by a services offering covering custom formulation, prototyping, durability testing, and design and modelling. Customers are manufacturers in semiconductor, automotive, aerospace and defence, medical and wearables, solar cell, batteries, display, smart glass, and agriculture end-markets. Founders include Aaron Chan, Richard Dixon (founder and managing director), and Dr Kerry Yu (founder and scientist). The company has not disclosed equity funding; an Innovate UK grant was awarded in September 2023.

Name

Dycotec Materials

Legal name

Dycotec Materials Ltd

Website

https://dycotecmaterials.com

Company type

Private

Founded year

2015

Operating status

Operating

Headcount range

11–50 employees

Short description

Dycotec Materials is a UK-based manufacturer of conductive inks, dielectric pastes, thermal interface materials, and assembly materials for printed and thick-film electronics, serving manufacturers in semiconductor, automotive, aerospace, medical, and solar end-markets.

Ownership category

akta.pro rank

Product category

Printed Electronics Materials

NAICS

Printing Ink Manufacturing (325910), Paint and Coating Manufacturing (325510)

SIC

Paints, Varnishes, Lacquers, Enamels & Allied Prods (2851)

akta.pro primary industry

Digital & Specialty Inks (Inkjet, UV, Conductive) (IMAEAHAI)

akta.pro secondary industry

Specialty Polymers & Resins (Engineered Materials) (IMAEABAK)

Keywords

• Printed electronic inks
• Thick film pastes
• Thermal interface materials
• Conductive silver inks
• Flexible electronics materials

Headquarters

HQ city

Calne

HQ country

United Kingdom

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales, Infrastructure

Revenue model

1. Materials and Formulations Sales: Sale of advanced electronic materials including conductive inks, pastes, thermal interface materials, and assembly materials to manufacturers in semiconductor, automotive, aerospace, medical, and consumer electronics sectors.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Core offering

Dycotec Materials manufactures and supplies advanced electronic materials — conductive inks and pastes (silver, carbon, graphene), dielectric insulators, protective overcoats, thermal interface materials, and assembly adhesives — for printed electronics, thick film hybrid circuits, thermal management, and semiconductor packaging. The portfolio spans four business areas: printed electronics, thick film paste, thermal interface materials, and assembly materials, sold to manufacturers in semiconductor, automotive, aerospace, medical, wearables, and solar cell industries.

Product overview

Dycotec Materials is a UK-based manufacturer of advanced electronic materials for printed electronics, thick film, thermal management, and assembly applications. The product portfolio spans four core business areas: (1) Printed Electronics - conductive silver, carbon, and graphene inks plus dielectrics for screen, inkjet, and aerosol jet deposition on flexible and rigid substrates; (2) Thick Film Paste - cermet conductor, resistor, and dielectric systems for hybrid circuits on ceramic and steel at high firing temperatures; (3) Thermal Interface Materials - electrically insulative gap fillers, phase change materials, and thermally conductive epoxies ranging 1.75-8.5 W/m·K; and (4) Assembly Materials - conductive adhesives, structural adhesives, encapsulants, underfills, and die attach pastes. Key application domains include wearables, sensors, biosensors, heaters, automotive electronics, aerospace, solar cells (perovskite and OPV), and semiconductor packaging. The company operates under ISO 9001:2015 certification and offers custom formulation services.

Differentiator

Problem solved

Functional benefit

Products and services

• Silver Conductors Conductive silver inks and pastes for screen, inkjet and aerosol jet printing, curing from 80°C on PET, paper and polyimide substrates. Includes general-purpose, low-fire, fine-line, and specialized variants for touch screens, displays, sensors, OPV solar cells, and smart glass applications.
• Carbon Conductive Inks and Pastes Thermoset and thermoplastic carbon inks and pastes for inkjet, flatbed and rotary screen printing. Includes low-resistivity, mid-range, and high-resistivity variants plus nanocarbon inkjet inks for flexible electronics.
• In-Mold Electronics (IME) Materials Thermoformable thermoplastic silver and carbon conductive pastes compatible with polycarbonate substrates for injection molding and thermoforming. Includes dielectric crossover materials for multilayer circuit construction in automotive, aerospace, and domestic appliance applications.
• Stretchable Electronics Materials Stretchable conductive and dielectric pastes for elastomeric and textile substrates, achieving up to 170% stretchability with wash durability up to 50 wash cycles. Includes thermoplastic silver pastes, carbon pastes (up to 200% stretch), stretchable insulators, and encapsulation coatings for wearables, sensors, and medical devices.
• Biosensor Materials Specialized pastes for electrochemical biosensors including silver/silver chloride reference electrodes (60:40, 70:30, 80:20 ratios), hydrophobic carbon for ion-selective electrodes, high-sensitivity carbon for working electrodes, solid-state electrolytes, and protective overcoats. Tested to ISO 10993-5 for medical applications.
• Graphene Inks Inkjet and screen printed few-layer and single-layer graphene-based inks for high-purity graphene performance in electrical conductivity, heater, and barrier layer applications on ceramic, glass, and flexible substrates. Sinters at 300-350°C on ceramic/glass; low-temperature variant cures at 120°C on PET.
• Insulator Materials UV and thermally cured screen and inkjet printable dielectric layers for multilayer circuit construction. Includes crossover dielectrics, protective coatings, and UV-LED curable insulators with high dielectric strength for circuits on glass, ITO-glass, PET, and flexible substrates.
• Overcoat Materials Protective overcoat pastes for sealing and protecting printed circuits, including UV and thermally cured formulations with options for laser marking, solder dams, and color variants (blue, white, translucent) for thick film and flexible electronics.
• Polyimide Materials High-temperature polyimide-forming dielectric and conductive pastes rated for use up to 300°C, providing chemical resistance and thermal stability for aerospace, defense, semiconductor, and heater applications.
• Thick Film Silver Conductor Paste Solderable silver cermet pastes for screen printing conductor tracks on ceramic and steel substrates. Includes general-purpose, fine-line, and low-fire variants firing at 525-850°C for hybrid circuits, chip resistors, and heater applications.
• Platinum Conductors Ultra-high-fire fritted platinum conductor pastes for electrodes and circuits surviving firing up to 1300°C, including co-firing with zirconia oxygen sensors. Prints fine lines for high-temperature heaters and sensors on ceramic.
• Gold Conductors Wire-bondable gold conductor pastes for fine-line circuits (100µm line/space) in semiconductor and sensor applications, plus solderable gold/platinum/palladium variants for high-reliability circuits on alumina.
• Silver Platinum Conductors Silver/platinum solderable cermet pastes for terminations with solder leach resistance, available in 1%, 2%, and 3% platinum content grades firing at 850°C on alumina, glass, and ceramic substrates.
• Silver Palladium Conductors Silver/palladium solderable cermet pastes providing solder leach resistance for repeated assembly operations, available in various ratios (85:15 to 3:1) firing at 850°C for heater terminations on ceramic, glass, and steel.
• Resistor Pastes Resistor pastes for printing heating elements on ceramics and dielectric-coated steel, with TCR values from 1500-3300 ppm/°C and resistance ranges from 100-500 mΩ/□.
• Thick Film Dielectric Materials Insulating dielectric pastes for ferritic 430 stainless steel and austenitic 304 stainless steel, forming base insulation layers for printed heaters and circuits on steel. Includes multilayer dielectrics for hybrid circuits on alumina.
• Overglaze Acid-resistant low-fire overglaze for protective seals over resistors in hybrid circuits. Fires at 525-650°C, below resistor firing temperatures to avoid shifting resistance values. Lead and cadmium free.
• Polymer Overcoats Thermoset polymer overcoats for protective layers, solder dams, and marking over thick film circuits, available in blue, white, and semi-translucent variants with solderability for downstream assembly.
• Non-Silicone Thermal Gels and Putties Electrically insulative thermal gap fillers with thermal conductivity from 2.5-8.5 W/m·K. Silicone-free chemistry eliminates oil leach contamination. Available in manual syringe and pressure-time dispense formats for prototyping and automated production.
• Phase Change Thermal Materials Screen and stencil printable phase change thermal pastes that soften at ~55°C to fill interface voids. Available in 1.75 W/m·K and 3.3 W/m·K variants for power devices, heat sinks, and semiconductor applications.
• Thermally Conductive Epoxy Adhesives Single-part thermally conductive epoxy adhesives (2.3-3.7 W/m·K) that bond and conduct heat simultaneously while providing high voltage isolation. Available in manual syringe and bulk packaging for LEDs, heat sinks, and semiconductor device surfaces.
• Encapsulant and Underfill Materials Aqueous-based stretchable encapsulation coatings and two-part epoxy underfills for protecting conductive circuits. Includes stretchable formulations for wearables and transparent options for LED applications, compatible with thermoforming and injection molding.
• Conductive Adhesives Solvent-free silver epoxy conductive adhesives and stretchable silver polyurethane ECAs for component attachment, available in manual syringe, pressure-time dispense, and stencil printing formats for flexible, IME, and medical device assembly.
• Structural Adhesives Solvent-free epoxy structural adhesives for non-conductive structural bonding in printed electronics and sensor assemblies, providing strong mechanical adhesion to glass and PET at 140°C cure.
• Die Attach Materials Pressureless nanosilver sintering die attach pastes for wide-bandgap power electronics and optoelectronics. Sinters at 250°C without applied pressure, delivering die shear strength above 20 MPa for SiC and GaN IGBT power modules.
• Barrier Layer Materials UV-curable barrier adhesives for roll-to-roll lamination of flexible perovskite and organic photovoltaic solar cells, providing high moisture barrier properties while enabling high-throughput R2R production.
• Custom Formulations Service Bespoke material formulation service tailoring inks, pastes, and adhesives to specific customer substrates, processes, and performance requirements.
• Prototyping Development Service Prototyping support service for customers developing printed electronics, thick film, thermal management, and assembly material applications.
• Durability Testing Service Durability and reliability testing service for materials under thermal cycling, wash, stretch, and other environmental stress conditions.
• Design and Modelling Service Design and modelling service supporting customer development of printed electronic circuits, thermal interfaces, and material integration.

Quantifiable outcome

• Stretchable materials achieve up to 170% elongation and >50 wash cycles durability
• +3 more outcomes

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Scale indicators4 records

Recent moves6 records

Expansion highlights5 records

Emerging players

• Vorbeck Materials: US-based specialty materials company focused on graphene-based conductive inks and composites. Direct competitor in the graphene inks segment with overlap in wearables and printed electronics applications.
• C3Nano: US-based company developing silver nanowire and hybrid conductive inks for flexible and printed electronics. Comparable to Dycotec's silver conductors and emerging printed electronics offerings.

Direct peers

• Creative Materials Inc. US specialty manufacturer of conductive inks, coatings, and adhesives for printed electronics, including stretchable and flexible formulations. Most comparable peer to Dycotec in product scope and target applications (wearables, medical, sensors).
• MacDermid Alpha Electronics Solutions: Global supplier of specialty chemicals and materials for electronics manufacturing including thick film pastes, conductive inks, and assembly materials. Direct overlap with Dycotec's thick film and assembly materials product lines.
• EMS/Namics Corporation: Japanese specialty chemicals company producing conductive inks, underfills, encapsulants, and die attach materials for semiconductor packaging. Direct overlap with Dycotec's assembly materials portfolio.
• Heraeus Electronics: Leading supplier of precious metal conductive inks and pastes (silver, gold, platinum, palladium) for thick film, hybrid circuits, and die attach. Directly competes with Dycotec's thick film conductor portfolio and shares semiconductor and automotive customer base.

Broad incumbents

• Sun Chemical (DIC): Global inks and pigments manufacturer (part of DIC Corporation) with significant conductive inks portfolio following acquisition of Gwent Electronic Materials. Competes with Dycotec's printed electronics inks, particularly silver and carbon conductive lines.
• DuPont (Electronics & Industrial): Major specialty materials company with conductive inks, pastes, and electronic materials business (formerly Microcircuit Materials). Competes with Dycotec across thick film pastes and printed electronics materials with much greater scale.
• Henkel AG: Major German specialty chemicals company with a large electronics materials portfolio including conductive inks, die attach materials, encapsulants, and thermal management products. Comparable to Dycotec across most product categories but operates at vastly larger scale with broader geographic reach.

Regional players

• Nagase & Co. Japanese specialty chemicals distributor and manufacturer with electronic materials portfolio including conductive inks and pastes via subsidiary Nagase ChemteX. Comparable to Dycotec, but primarily serves the Japanese/Asian market.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks7 records

Key highlights7 records

Customer concentration

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Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Dycotec Materials