What Huixi Intelligent does

Huixi Intelligent (辉羲智能), founded in 2022 and headquartered in Beijing with R&D centers in Shanghai, Hefei, Hangzhou, and Yibin, designs and manufactures high-performance, low-power automotive-grade AI chips and full-stack autonomous driving solutions for automotive OEMs, Tier-1 suppliers, and embodied intelligence customers. Its core offering is the RISE computing platform, anchored by the self-developed R1 chip optimized for embodied intelligence, which achieved mass production delivery in October 2025 and is currently deployed in Zhiyuan Spirit G2 humanoid robots and Jiuzhi Smart L4 autonomous logistics vehicles.

The company's technical differentiation rests on a proprietary 'Data Closed-Loop Defined Chip' methodology — a self-reinforcing loop combining compute, algorithms, and data to drive product architecture — supported by full-stack self-research across computing architecture, AI chips, and software toolchains. Notable hardware innovations include the COSA accelerator (industry-first Transformer accelerator achieving 2.95-28.82x speedup) and the FLNA point cloud accelerator (>95% storage overhead reduction), both validated through DAC 2023 best paper nomination and CVPR 2023 3rd place. The product portfolio spans the Rhino first-generation high-level intelligent driving chip, AD Complete Solution with City NOA capability using light maps, Central Computing Unit, and an easy-to-use open toolchain.

Huixi generates revenue primarily through automotive-grade AI chip sales (hardware) supplemented by full-stack autonomous driving solutions and intelligent computing platform offerings to enterprise B2B customers. Distribution is direct to OEMs and Tier-1 suppliers (exemplified by the Jingwei Hengrun strategic partnership for mass-production AD solutions) and to embodied intelligence OEMs. The company has raised over 800 million RMB in cumulative equity financing across multiple rounds from investors including NIO Capital, Yusheng Capital, Jingwei Hengrun, Liangxi Digital Mother Fund, and Jingguorui Fund, with ISO 26262 ASIL D and ASPICE CL2 certifications enabling it to meet OEM and Tier-1 procurement thresholds.

Name

Huixi Intelligent

Legal name

辉羲智能

Website

https://rhino.auto

Company type

Private

Founded year

2022

Operating status

Operating

Headcount range

51–100 employees

Short description

Huixi Intelligent (辉羲智能) is a Beijing-based fabless semiconductor company designing automotive-grade AI chips and full-stack autonomous driving solutions for OEMs, Tier-1 suppliers, and embodied intelligence customers, anchored by its RISE computing platform and R1 chip.

Ownership category

akta.pro rank

Product category

Automotive AI Semiconductors

NAICS

Motor Vehicle Electrical and Electronic Equipment Manufacturing (336320)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Automotive & Industrial ICs (ADAS/Powertrain/Factory/Robotics) (HDAHABAD)

akta.pro secondary industries

Automotive & Safety-Certified Processors (ADAS/Domain/ASIL MCUs) (HDAHAJAJ), Automotive E/E Architecture Components Manufacturing (Domain/Zonal Controllers, Gateways, Network Switches) (IMACAJAI)

Keywords

• Autonomous driving chips
• Automotive AI SoC
• Embodied intelligence compute
• Data closed-loop silicon
• City NOA solutions

Headquarters

HQ city

Hefei

HQ country

China

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Automotive-grade AI chip sales: Sale of high-compute, low-power automotive SoC chips for intelligent driving and embodied intelligence applications. R1 chip delivered for mass production in October 2025.
2. Full-stack autonomous driving solutions: Integrated solutions including intelligent driving chips, open toolchains, and complete autonomous driving systems (AD solutions) for vehicle manufacturers.
3. Intelligent computing platform: RISE computing platform providing domain-general compute for automotive and embodied intelligence applications, potentially with platform licensing or service components.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels10 records

Core offering

Huixi Intelligent designs and sells high-performance, low-power automotive AI chips (R1, Rhino family) and full-stack autonomous driving computing platforms (RISE) for passenger vehicles, embodied-intelligence robots, and L4 logistics vehicles. Its products combine heterogeneous SoC hardware, an open software toolchain, BEV-based perception algorithms, and a "Data Closed-Loop Defined Chip" methodology, sold directly to automotive OEMs, Tier-1 suppliers, and robotics companies.

Product overview

Huixi Intelligent offers a comprehensive embodied intelligence computing platform portfolio centered on the RISE computing platform and self-developed R1 chip. The product lineup includes high-performance heterogeneous SoC automotive chips (Rhino chip family), the AD Complete Solution with City NOA capability, and an easy-to-use open toolchain. These products work together to provide full-stack autonomous driving solutions from chip to algorithm to data, supporting intelligent driving and embodied intelligence applications for automotive and robotics markets.

Differentiator

Problem solved

Functional benefit

Brands

• RISE: Core computing platform equipped with the self-developed R1 chip, optimized for embodied intelligence applications including autonomous driving and robotics.
• Rhino

Products and services

• RISE Computing Platform (RISE计算平台) High-performance domain-general computing platform for embodied intelligence, combining self-developed R1 chip hardware with algorithms and data infrastructure. Sold to automotive OEMs, Tier-1 suppliers, and embodied-intelligence robot OEMs to deliver full-stack autonomous driving and robotics compute.
• R1 Chip (R1芯片) Self-developed automotive-grade high-compute, low-power AI SoC optimized for embodied intelligence; serves as the core of the RISE computing platform and supports large-model algorithms and cross-domain computing requirements for vehicles and robots.
• Rhino First-Generation High-Level Intelligent Driving Chip First-generation high-level intelligent driving chip from Huixi's Rhino family, designed to power Level 2+ autonomous driving solutions with advanced BEV architecture. Targeted at automotive OEMs and Tier-1 suppliers.
• AD Complete Solution (AD整体解决方案) Full-stack autonomous driving solution combining Huixi's high-performance intelligent driving chips, AD algorithms, and toolchain to enable rapid mass-production deployment of advanced driver-assistance features for passenger vehicles.
• City NOA Solution (城市NOA解决方案) City Navigate-on-Autopilot solution built on advanced BEV architecture with multi-modal 4D perception, using light mapping instead of heavy HD maps to reduce labeling cost and enable smoother handling of complex urban scenarios. Targeted at passenger-vehicle OEMs and Tier-1 suppliers.
• Central Computing Unit (中央计算单元) High-performance vehicle central computing unit that integrates intelligent driving, intelligent cockpit, intelligent gateway, and vehicle control into one unit, supporting City NOA and other vehicle-end applications for automotive OEMs.

Quantifiable outcome

• COSA achieves 2.95-28.82x speedup and 1.61-21.6x energy efficiency improvement over prior designs
• +3 more outcomes

Named customers3 records

Segments3 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability9 records

Feature5 records

Partnerships

Four partnerships are on record, tiered core and minor.

• ModelBestcoreTechnology or Integration · 19 September 2025Strategic cooperation agreement signed on September 19, 2025 to advance edge AI innovation for automotive and embodied intelligence. Combines HUIXI's high-compute AI chips with ModelBest's MiniCPM large-model series for on-device AI applications through joint optimization, co-debugging, deployment validation, and co-development. Targeting applications in cars, smartphones, PCs, and embodied intelligence systems.
• Jingwei Hengrun (经纬恒润)coreStrategic or Co-development Partner · 1 July 2023Leading automotive electronics and autonomous driving company (stock code 688326) that led a strategic investment and signed a strategic cooperation agreement. Both parties are jointly developing mass production autonomous driving solutions based on domestic high-performance SoC for city NOA features.
• Shanghai Jiao Tong University (上海交通大学)coreStrategic or Co-development Partner · 1 January 2023Long-standing academic research partnership. Joint research led to multiple papers at DAC 2023 (best paper nomination) and CVPR 2023 (3rd place challenge award). Co-developed COSA and FLNA accelerator architectures. Professor He Guanghui (co-founder) is from Shanghai Jiao Tong University.
• Ouyang Minggao Academician Workstation (欧阳明高院士工作站)minorStrategic or Co-development Partner · 1 January 2023Yibin Huixi Intelligence is an incubated enterprise under the workstation at the 2023 World Power Battery Conference, showcasing intelligent driving chip products at the workstation's industrialization team exhibition.

Scale indicators5 records

Recent moves7 records

Expansion highlights6 records

Emerging players

• Ambarella: US-listed fabless designer of low-power edge AI vision SoCs (CV series) used in automotive ADAS, robotics, and surveillance. Comparable as a fabless edge-AI silicon vendor targeting similar computer-vision workloads, though with broader consumer/security exposure.
• Hailo: Israel-based fabless developer of edge AI processors (Hailo-8/15) targeting automotive ADAS, robotics, and industrial vision. Comparable as a fabless edge-AI chip designer, though automotive penetration is more limited than Mobileye/NVIDIA.
• Iluvatar CoreX: Chinese fabless AI accelerator company (Tianjic/CX series) with edge and data-center inference products. Adjacent peer sharing the Chinese fabless AI silicon ecosystem with Huixi but less automotive-specialized.
• Biren Technology: Chinese fabless AI GPU/chip designer (BR series) primarily targeting training/inference. Adjacent peer in the Chinese domestic AI compute ecosystem but not yet a direct automotive competitor.

Broad incumbents

• NVIDIA: Dominant provider of high-performance autonomous driving compute platforms (DRIVE Orin/Thor) used by many premium and Chinese OEMs for high-level ADAS. Defines the performance/compute benchmark against which Huixi's R1 and future SoCs are measured.
• Qualcomm: Provider of Snapdragon Ride platform and automotive digital cockpit SoCs serving global and Chinese OEMs. Competes with Huixi for the same ADAS compute sockets inside Chinese vehicle programs.
• Mobileye: Intel-owned global leader in ADAS and autonomous driving compute (EyeQ SoCs) serving most major global OEMs. Represents the incumbent standard that Huixi's domestic OEMs are partially seeking to substitute with local chips.
• Cambricon Technologies: China-listed AI chip designer (思元/MLU series) historically focused on data-center AI but expanding into edge and automotive applications. Comparable as a domestic Chinese AI silicon player, though with a different primary market focus.

Direct peers

• Horizon Robotics: Chinese fabless developer of energy-efficient AI SoCs (Journey series) for ADAS and autonomous driving, with design wins across major Chinese OEMs. Closest direct competitor to Huixi in domestic automotive AI compute, targeting the same Tier-1/OEM customers.
• Black Sesame Technologies: Hong Kong-listed fabless designer of automotive-grade AI SoCs (华山/A1000 series) for intelligent driving applications. Competes head-to-head with Huixi for Chinese OEM ADAS design wins with similar fabless model and full-stack solution positioning.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Funding overview

Funding rounds5 records

Investors22 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Huixi Intelligent