What CIX Technology does

CIX Technology (此芯科技, legal name CIX Technology Group Co., Ltd. / 此芯科技集团有限公司) is a Shanghai-headquartered fabless semiconductor company founded in October 2021 that designs general-purpose heterogeneous Arm-based SoCs targeting AI PC, smart cockpit, and edge computing applications. Its core silicon platform is built on the Armv9.2 architecture, integrating CPU, GPU, and NPU into a single chip with first-generation CIX P1 (此芯P1) delivering 45 TOPS combined AI compute at 6nm process, and second-generation ClawCore series (P/A/E) launched in March 2026. The company's go-to-market is overwhelmingly indirect: chips are embedded by OEMs/ODMs into AI PCs (Lenovo AI host mini), single-board computers (Radxa Orion O6, OrangePi 6 Plus, Minisfor MS-R1), NAS systems (飞牛 fnOS), and edge AI servers (六联智能, 贝启科技, 同方鼎欣), supplemented by four authorized regional distributors in China and direct enterprise sales via [email protected].

Revenue is generated through chip unit sales to partners, reference design licensing, and bundled integrated product solutions (e.g., 合一 AI all-in-one systems combining SoC with plug-in accelerator cards). The platform supports six or more operating systems (Windows, Linux, Android, Uniontech UOS, Kylin, deepin, openKylin), passed Arm SystemReady SBSA L6 certification, and natively runs optimized inference for major open-source LLMs (DeepSeek R1 distillates, Qwen3-30B-A3B, ERNIE 4.5, Llama 3) and frameworks (PaddlePaddle, OpenClaw, llama.cpp, MNN). CIX Technology is privately held, has raised over $100M cumulatively including a record ~$145M Series B in March 2026 led by Shanghai IC Fund and Pudong Venture Capital, and operates seven R&D sites across Shanghai, Beijing, Wuhan, Suzhou, Wuxi, and Kunshan with a planned Southeast headquarters in Fuzhou.

Name

CIX Technology

Legal name

此芯科技集团有限公司

Website

https://cixtech.com

Company type

Private

Founded year

2021

Headcount range

11–50 employees

Short description

CIX Technology is a Shanghai-based fabless semiconductor company founded in 2021 that designs Arm-based heterogeneous SoCs delivering 45 TOPS AI compute for AI PCs, smart cockpits, and edge devices, distributing chips through Lenovo, Radxa, OrangePi, and 100+ OEM/ODM partners.

Ownership category

akta.pro rank

Product category

AI Computing Processors

NAICS

Computer and Peripheral Equipment Manufacturing (3341)

SIC

Electronic Computers (3571)

akta.pro primary industry

System-on-Chip (SoC) Platforms (Mobile/Consumer/Embedded) (HDAHAJAC)

akta.pro secondary industry

Edge AI Hardware & NPUs (SoCs, modules, accelerators) (HDAAAJAC)

Keywords

• Heterogeneous SoC chips
• AI computing processors
• Edge computing solutions
• Smart cockpit processors
• AI PC chips

Headquarters

HQ city

Shanghai

HQ country

China

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Marketing or Sales

Revenue model

1. Chip Product Sales: Sale of proprietary heterogeneous SoC chips (此芯P1, ClawCore series) to OEM/ODM partners and device manufacturers for integration into end products. Revenue is generated through chip unit sales to partners who embed the silicon in AI PC, smart cockpit, edge server, robotics, and other products.
2. Reference Design and Solution Licensing: Provides standardized product reference designs and turnkey solutions to ecosystem partners (board designs, EVB, development kits), enabling rapid productization. Revenue includes one-time licensing and per-unit royalties for adopted reference designs.
3. AI Edge一体机 and Integrated Product Solutions: Co-developed integrated AI systems with partners (AI 一体机, AI NAS, edge servers) combining chip + acceleration cards + complete systems, sold as bundled product solutions to enterprise customers.

Go-to-market motion3 records

Distribution channels5 records

Marketing channels3 records

Core offering

CIX Technology designs and sells self-developed general-purpose heterogeneous System-on-Chip (SoC) processors integrating CPU, GPU, and NPU for AI computing applications. The company's flagship CIX P1 chip (6nm process, Armv9.2 architecture) delivers 45 TOPS combined AI compute and powers AI PCs, smart vehicle cockpits, edge servers, and robotics through OEM/ODM partner embedding. The company also offers the CIX ClawCore series of OpenClaw intelligent agent CPUs, development kits, reference designs, and integrated AI system solutions.

Product overview

CIX Technology (此芯科技) 是一家专注于研发高性能智能体CPU芯片及高能效算力解决方案的科技企业，采用一芯多用战略，构建覆盖个人计算、车载计算、边缘计算三大计算平台的通用异构SoC产品体系。核心产品为于2024年7月发布的首款6nm异构智能SoC芯片此芯P1（综合算力45 TOPS），以及2026年3月发布的CIX ClawCore螯芯系列（劲螯芯ClawCore-P、智螯芯ClawCore-A、灵螯芯ClawCore-E）。围绕芯片产品，公司提供星睿O6 AI PC开发套件、Project Pavo AI PC笔记本参考设计、CS8180边缘计算平台等硬件产品，以及合一AI加速计划（覆盖NeuralONE SDK、Model Hub、NOE SDK、DSP SDK等软件开发工具）。公司产品采用自研通用异构SoC，兼顾高性能与低功耗，通过端、边、云全域AGI产品体系驱动全场景AI，聚焦智能体CPU核心领域，以Agentic Compute赋能AGI发展。

Differentiator

Problem solved

Functional benefit

Products and services

• CIX P1 Heterogeneous Intelligent SoC (此芯P1) CIX Technology's first 6nm process general-purpose heterogeneous intelligent SoC chip released in July 2024, integrating 12-core Armv9.2 CPU, 10-core Immortalis-G720 GPU, and 30 TOPS NPU for 45 TOPS combined AI compute. Supports up to 64GB LPDDR5 shared memory and high-bandwidth I/O, balancing high performance with low power consumption. Provides a high-efficiency computing foundation for endpoint AI scenarios including AI PCs, smart cockpits, edge computing, and robotics.
• CIX ClawCore OpenClaw Intelligent Agent CPU Series (ClawCore-P/A/E) CIX Technology's first OpenClaw intelligent agent CPU series released in March 2026, including ClawCore-P (劲猛芯, 12-core 3.2GHz, 45 TOPS NPU, 64GB LPDDR5), ClawCore-A (智猛芯, 8-core 3.0GHz, 80 TOPS NPU with PCIe AI card expansion up to 200 TOPS), and ClawCore-E (灵猛芯, ultra-low-power design). Provides complete coverage from endpoint low-power to edge high-performance scenarios for intelligent terminal ecosystems.
• Radxa Orion O6 (星睿O6) AI PC Development Kit World's first Armv9 open-source motherboard jointly developed by CIX Technology with Arm China and Radxa Computer, launched December 2024. Based on CIX P1 processor with heterogeneous integration of Armv9 CPU cores, Arm Immortalis GPU, and Arm China Zhouyi NPU. Provides strong multimedia processing and flexible interface expansion, supports multiple Linux distributions and desktop environments. Passed Arm SystemReady certification in May 2025 enabling plug-and-play across multiple operating systems.
• Project Pavo AI PC Notebook Reference Design AI PC notebook reference design based on CIX P1. Built on UEFI+ACPI standard firmware, capable of running Debian 12 and Windows 11 operating systems separately. When running Debian 12, leverages CIX P1 heterogeneous computing to locally run multiple large language models, text-to-image, and multimodal models. When running Windows 11, smoothly runs Office, Edge browser, and audio-visual applications. Targeted at solution providers and customers, closer to actual product requirements, shortening time-to-market.
• CS8180 Edge Computing Platform CIX Technology's edge computing scenario hardware platform using high-efficiency multi-core Arm architecture CPU with built-in new architecture multi-core GPU. Features hardware ray tracing capability, integrates multi-core high-performance video codec processor, supports multi-channel ultra-high image quality high frame rate concurrent task processing. Provides stable mature edge computing solutions with full support for Android and Linux virtualization container solutions, accelerating customer mass production and deployment.
• Heyi AI Acceleration Plan (合一AI加速计划) Full-stack computing solution for edge computing and endpoint AI scenarios released in May 2025. Based on CIX P1 SoC and CIX P1+AI acceleration card product combinations, covering endpoint AI model inference requirements from 1.5B to 32B parameter scales. Integrates NeuralONE SDK, AI acceleration card SDK, open model marketplace (Model Hub), and industry alliances. Empowers AI Box, AI NAS, embodied intelligent devices, and other product forms.

Quantifiable outcome

• First chip (此芯P1) achieved mass production in July 2024; mass production milestone completed in 2024.
• +5 more outcomes

Named customers9 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration18 records

AI capability10 records

Feature6 records

Partnerships

27 partnerships are on record, tiered core, notable and minor.

• ArmcoreTechnology or IntegrationCIX's chip architecture is based on Arm designs (Armv9.2). Arm's KleidiAI software library integrated into CIX's P1 chip. Joint Arm PC ecosystem initiatives including Project ARP (with Microsoft and Linaro). Arm provided SystemReady certification support. Arm Unlocked 2025 collaboration.
• Arm China (安谋科技)coreTechnology or IntegrationStrategic collaboration on Arm v9 ecosystem development board. 安谋科技's '周易' NPU integrated into 星睿O6 development kit alongside CIX P1. Signed MoU in August 2023 for deepened collaboration. Co-hosted Arm PC strategy seminar. Joint Arm PC SIG with deepin community.
• Linaro (Windows on Arm Working Group)coreTechnology or IntegrationCIX joined Linaro in June 2022 as the first Chinese member of the Windows on Arm Working Group. Established Client PC project within Linaro. Co-initiated Project ARP with Microsoft and Arm. Active contributor to ACPI standardization for Arm PC.
• Unisoc (紫光展锐)notableStrategic or Co-development PartnerStrategic cooperation signed April 2025 to comprehensively deepen smart automotive industry layout. CIX P1 chip integrated with Unisoc's automotive solutions.
• Uniontech (统信软件)coreTechnology or IntegrationStrategic cooperation signed August 2022. Joint lab established June 2023. Full collaboration on Arm PC and intelligent terminal products. CIX P1 adapted to UOS operating system with AI assistant, smart search, and data management features.
• deepin Community (深度科技)coreCIX joined deepin community in April 2023. Jointly established Arm PC SIG with 安谋科技 and deepin. Ran CIX P1 on deepin kernel with UEFI+ACPI boot architecture. Product compatibility certification achieved with deepin v23.
• openKylin (开放麒麟)coreTechnology or IntegrationJoined openKylin community in July 2023. CIX P1 achieved compatibility certification with openKylin 2.0. Contributed 117,000 lines of Linux kernel code to openKylin. Won openKylin annual most influential project award 2025.
• Kylin Software (麒麟软件)notableTechnology or IntegrationCIX presented at Arm PC strategy seminar. Kylin has 450,000+ ARM applications and 520,000+ app software support. Exploring deep cooperation on Arm v9, graphics, AI, and UHQL.
• China Standard Software (神州网信)notableTechnology or IntegrationParticipated in Arm PC strategy seminar. CIX exploring Windows on Arm ecosystem development with 神州网信's Windows China government edition.
• UCloud (优刻得)notableTechnology or IntegrationStrategic cooperation signed November 2022. Joint development of endpoint-edge-cloud collaborative integrated solutions.
• Baidu AI Cloud (百度)coreTechnology or IntegrationJoined Baidu PaddlePaddle Hardware Ecosystem Co-creation Plan in September 2023. Jointly released ERNIE 4.5 on CIX P1. ERNIE-4.5-21B-A3B achieves ~20 tokens/s. Partnership includes model deployment, developer ecosystem, and WAVE SUMMIT collaboration.
• Radxa (瑞莎计算机)coreOEM/ Whitelabel/ Licensing PartnerJointly launched 星睿O6 AI PC development kit (December 2024) with 安谋科技 and CIX. World's first Armv9 open-source motherboard. Passed Arm SystemReady certification. World's first Armv9 open-source hardware '星睿O6' released March 2026.
• Xunlong Software (迅龙软件)coreOEM/ Whitelabel/ Licensing PartnerLaunched OrangePi 6 Plus development board based on CIX P1 (October 2025). Supports mainstream LLM including Qwen3-30B-A3B at >15 tokens/s. Open-source hardware with published underlying code.
• Minimax (美高创新)notableOEM/ Whitelabel/ Licensing PartnerMinisfor brand — MS-R1 mini workstation and N5R NAS with AI agent capabilities based on CIX P1. PCIe expansion support. Gaming and AI NAS products. CIX ClawCore launch ecosystem partner.
• LiuLian Intelligence (六联智能)notableOEM/ Whitelabel/ Licensing PartnerAI server and general-purpose server products. Flexible topology design supporting GPU and PCIe modules. AI all-in-one machine and laptop products. Strategic cooperation signed April 2025.
• BeiQi Technology (贝启科技)minorOEM/ Whitelabel/ Licensing PartnerAI PC development board and AI Mini PC products based on CIX P1. PCIe flexible extension for digital twin and smart exhibition hall applications.
• FlyNiu (飞牛)notableOEM/ Whitelabel/ Licensing PartnerfnOS NAS operating system adapted to CIX P1 (January 2026). GPU/VPU codec and NPU acceleration validated on Linux kernels 6.12/6.18. Supports vector and structured data processing for enterprise knowledge base.
• Tongfang Dingxin (同方鼎欣)minorStrategic or Co-development PartnerStrategic cooperation signed July 2023. CIX chip for digital all-in-one machine solutions targeting industry applications.
• Global Computing Consortium (全球计算联盟GCC)notableTechnology or IntegrationJoined GCC Green Computing Development Committee (March 2025). CIX's 周杰 appointed as GC DG Management Committee member and AIPC Working Group leader. Contributing to Arm compute ecosystem and green computing standards.
• Xidian University Hangzhou Research Institute (西电杭州研究院)notableOthersCooperation agreement signed March 2025. Joint Innovation Center established focusing on chip frontier technology R&D and industry ecosystem. CIX CEO 孙文剑 (西电 alumnus) gave keynote.
• Wuhan East Lake High-Tech Zone (武汉东湖高新区)notableOthersWuhan R&D center formally signed and established in Optics Valley Central City (March 2025). Focus on chip design R&D, OS adaptation, software testing, and customer technical support.
• Fuzhou New Area Group (福州新区集团)notableOthersStrategic cooperation signed September 2025. Exploring technology-empowering-industry, industry-nurturing-innovation sustainable development path. CIX Southeast headquarters planned.
• MetaComputingminorStrategic or Co-development PartnerStrategic partnership signed May 2026 for joint promotion of Agentic Compute high-performance AI agent computing products.
• Denglin AI (登临科技)minorStrategic or Co-development PartnerAI acceleration card KS20 combined with CIX P1 SoC in AI edge all-in-one machine (June 2025). '合一' AI acceleration plan partner for edge AI solutions.
• Banwei Technology (半微科技)minorStrategic or Co-development PartnerHardware R&D and production partner in '合一' AI acceleration plan. AI edge all-in-one machine BW-TC11 jointly launched with CIX P1 and 登临 KS20.
• Cambricon (后摩智能)minorStrategic or Co-development PartnerM50 NPU combined with CIX CPU provides up to 160 TOPS at ~15W total card power for AI agent applications. ClawCore product launch ecosystem partner.
• CoreCollective (Linaro/Arm Alliance)coreTechnology or IntegrationFounding member of CoreCollective (February 2026), an open alliance initiated by Linaro and supported by Arm. Other founding members include AMD, Ampere, Canonical, Qualcomm, Microsoft, Google, Graphcore, Red Hat, Samsung, SUSE. CIX participating in Linux foundation, edge computing, Android, Windows on Arm, and confidential computing working groups.

Scale indicators9 records

Recent moves9 records

Expansion highlights6 records

Broad incumbents

• AMD: AMD's Ryzen AI PC processors and EPYC embedded chips compete at the high end of CIX's addressable market. The CIX CEO's AMD pedigree and AMD's CoreCollective co-membership make AMD both a competitor and ecosystem ally.
• Apple: Apple's M-series SoCs are the benchmark for high-performance, low-power Arm-based AI PC chips. CIX's CTO led CPU/GPU/SoC architecture for multiple A-series and M-series generations at Apple, and Apple's product positioning frames the opportunity CIX is targeting in the broader PC market.
• NVIDIA: NVIDIA's Jetson Orin and IGX platforms compete with CIX in edge AI robotics and industrial AI applications, while NVIDIA's PC GPU efforts (RTX AI PCs) overlap with CIX's AI PC thesis. Different price/power positioning but same end customers in many cases.

Direct peers

• UNISOC: Chinese fabless chip designer with Arm-based mobile and smart cockpit SoCs. Already a strategic partner with CIX (April 2025 cooperation), but also competes in the smart cockpit and edge AI chip markets where both firms are active.
• Allwinner Technology: Chinese Arm SoC designer focused on AIoT, smart cockpit, and edge AI applications. Competes with CIX in cost-sensitive edge AI and automotive infotainment segments, with overlapping Chinese OEM customers.
• MediaTek: MediaTek's Kompanio and Genio lines are Arm-based SoCs targeting Chromebooks, AI PCs, and edge AI — directly overlapping with CIX's AI PC, AI NAS, and edge server applications. Both serve OEM/ODM partners in Asia.
• Rockchip: Fuzhou-based Chinese Arm SoC designer producing RK3588 and successors for edge AI, single-board computers, and developer boards. Directly competes with CIX P1 in OrangePi-class developer boards and AI NAS/box markets in China.
• Qualcomm: Qualcomm's Snapdragon X Elite and Snapdragon 8cx are direct Arm-based PC and edge AI competitors to CIX P1 and ClawCore. Both target the same AI PC and always-connected device OEM customers with integrated CPU/GPU/NPU SoCs.
• Loongson: Leading Chinese domestic CPU designer (LoongArch ISA, though transitioning toward Arm-compatible). Competes with CIX for Chinese government and enterprise PC design wins driven by domestic substitution policies.

Emerging players

• Cambricon: Chinese AI accelerator company whose NPU IP (e.g., Cambricon M50) integrates with CIX ClawCore to deliver up to 160 TOPS at ~15W. Both firms are part of the China domestic AI compute ecosystem and overlap in edge AI inference use cases.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/cix-technology

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Funding overview

Funding rounds6 records

Investors26 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about CIX Technology