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Heller Industries

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uuid000au1r

Namestring
Heller Industries
Legal namestring
Heller Industries, Inc.
Company typeenum
Private
Founded yearint
1960
Descriptiontext

Heller Industries, Inc. is a privately held American manufacturer of thermal processing equipment for the global electronics manufacturing industry, headquartered in Florham Park, New Jersey and operating since 1960. Its product portfolio centers on convection reflow ovens — led by the MK7 generation launched in 2023 — and extends into vacuum/voidless reflow ovens (including the 2025-award-winning Short Cycle Vacuum model), fluxless formic acid reflow ovens, and a full family of curing ovens (horizontal, vertical, magazine, and pressure-cure autoclaves). Differentiated technical features include the original waterless/filterless flux separation system, low-temperature integrated catalyst, Uniform Gas Management (up to 40% nitrogen reduction), Industry 4.0 / Internet-of-Manufacturing connectivity, and integrated Cpk software. The company holds ISO 9001:2015 quality certifications for its China and Korea operations and complies with SEMI S2/S8 safety standards for its formic acid product line.

The company serves four primary use-case segments: Surface Mount Technology (SMT) reflow soldering for printed circuit board assembly, semiconductor advanced packaging (ball attach, bumping, die attach, underfill curing, TIM and lid attach), power device packaging for automotive / industrial / renewable-energy applications, and consumer electronics assembly (mobile, wearables, camera modules). Customers configure equipment through an online portal and request quotes, with consultative selling delivered via Webex presentations and on-site demonstrations at Heller's facilities across the USA, China, India, Japan, Korea, Thailand, and Vietnam, with additional European coverage. Heller previously held roughly 17% of the global SMT reflow soldering equipment market (2002 Frost & Sullivan data) and has won multiple Frost & Sullivan awards through 2020, alongside recent recognition from Foxconn, Productronica China, NEPCON Asia, and Semiconductor Review.

Revenue is generated predominantly through capital-equipment sales of new ovens with custom configurations, supplemented by a used-equipment channel and post-sale service. Pricing is quote-based and not publicly disclosed. The company is led by CEO David Heller, with no parent corporation, institutional investor, or public listing disclosed in the source material, indicating founder/family ownership of a mature, profitable industrial niche player. Recent strategic activity has emphasized generational product refresh (MK7, Short Cycle Vacuum), an ecosystem buildout into adjacent materials via the Diamond Quanta / ExtenD partnership (announced November 2025), and deeper penetration into Foxconn's intelligent-manufacturing ecosystem.

Short descriptiontext

Heller Industries designs and manufactures thermal processing equipment — convection, vacuum, formic-acid fluxless reflow ovens, and curing ovens — for global electronics manufacturers across SMT, semiconductor advanced packaging, power device, and consumer electronics assembly.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
101–250
akta.pro rankint
HeadquartersFlorham Park, United States
HQ citystring
Florham Park
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices6 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
SMT reflow ovens, semiconductor curing ovens, convection reflow soldering, vacuum reflow systems, thermal processing equipment
NAICS code1 code
  • Industrial Process Furnace and Oven Manufacturing333994
SIC code1 code
  • Industrial Process Furnaces & Ovens3567
Product category
Industrial Thermal Processing Equipment
Social media profiles2 records
GTM motion2 records

Each record includes

Type, Description, Source

Revenue model1 record
1Reflow Ovens and Thermal Processing Equipment
TypeHardware Sales
Description

Heller Industries manufactures and sells convection reflow ovens, vacuum reflow ovens, formic acid reflow ovens, and curing ovens. Revenue is generated through equipment sales with various configurations and options to meet customer requirements.

hellerindustries.com
Marketing channels6 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels2 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components5 values
Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

Heller Industries manufactures and sells thermal processing equipment for electronics manufacturers and assemblers worldwide. Its portfolio includes convection reflow ovens (MK7 and MK5 series), vacuum/voidless reflow ovens, fluxless formic acid reflow ovens, and a range of curing ovens (pressure, vertical, magazine, horizontal) used for SMT soldering and semiconductor advanced packaging applications.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 5 values shown
  • Reduce solder voids to less than 1%
+4 more records
Product overview1 text field

Heller Industries is a thermal process equipment manufacturer specializing in reflow ovens and curing ovens for electronics manufacturing. The product portfolio centers on the MK7 and MK5 Convection Reflow Oven lines (models spanning 8-17 heating zones), complemented by Vacuum/Voidless Reflow Ovens for void-free applications, Formic/Fluxless Reflow Ovens for oxide removal, and a full range of curing solutions including Pressure Curing Ovens, Vertical Curing Ovens, and Magazine Curing Ovens. The company serves key markets including Surface Mount Technology (SMT), Semiconductor Advanced Packaging (ball attach, die attach, underfill curing, TIM/lid attach), Power Electronics, and Consumer Electronics Assembly. The latest MK7 generation offers Industry 4.0 compatibility and integrated Cpk software, while the Short Cycle Vacuum Oven addresses throughput bottlenecks in vacuum reflow.

Product and service11 records
1MK7 Reflow Oven
CategoryReflow Soldering Equipment
Description

Latest generation SMT convection reflow oven with revolutionary low height top shell, double insulation for energy efficiency, advanced heater modules for lowest Delta T's on boards, Industry 4.0 compatibility, and integrated Cpk software. Available in multiple models (1809, 1826, 1913, 1936, 2043, 2049, 2156) with 8-17 heating zones for electronics manufacturers.

2MK5 Convection Reflow Oven
CategoryReflow Soldering Equipment
Description

Previous generation convection reflow oven with proven reliability for SMT reflow soldering applications. The 2043 Mark 5 model won the 2015 SMT China Vision Award. Used by electronics manufacturers for surface mount technology reflow soldering.

3Vacuum/Voidless Reflow Ovens
CategoryReflow Soldering Equipment
Description

Reflow ovens with vacuum-assisted processing for achieving void-free solder connections, reducing solder voids to less than 1%. Features closed-loop vacuum pump control, IR heated chambers, and optional staging conveyor systems. Used in semiconductor packaging and power electronics applications.

4Short-Cycle Vacuum Reflow Oven
CategoryReflow Soldering Equipment
Description

Vacuum reflow oven designed to tackle throughput bottlenecks in vacuum reflow applications for semiconductor and power electronics packaging. Won 2025 PRODUCTRONICA China Most Popular New Product Award.

5Formic/Fluxless Reflow Ovens (1936MK5-F, 2043MK5-F)
CategoryReflow Soldering Equipment
Description

Production-ready horizontal flux-free formic reflow ovens using formic acid vapor for oxide removal without applied flux. Meets SEMI S2/S8 safety standards with optional vacuum process, real-time formic monitoring, and up to Class 100 cleanroom compatibility. Designed for semiconductor advanced packaging and assembly applications.

6Pressure Curing Ovens
CategoryCuring Equipment
Description

Curing ovens with pressure chambers (autoclaves) for void-free underfill curing and TIM/lid attach applications. Cleanroom and full automation options available for high volume semiconductor and electronics manufacturing.

7Vertical Curing Ovens (VCOs)
CategoryCuring Equipment
Description

In-line curing ovens with vertical architecture requiring minimal floor space, ideal for cleanroom environments. Suitable for device-level and board-level underfill curing in consumer electronics and semiconductor applications.

8Magazine Curing Ovens
CategoryCuring Equipment
Description

Curing ovens suitable for applications involving magazine loading, designed for efficient batch processing workflows in electronics and semiconductor manufacturing.

9Horizontal Curing Ovens
CategoryCuring Equipment
Description

In-line horizontal curing ovens offering high pallet size flexibility at high units per hour (UPH) for various curing applications in electronics manufacturing.

10Custom Reflow and Curing Ovens
CategoryCustom Thermal Processing Equipment
Description

Custom-engineered solutions for special and challenging heating requirements, configured to specific application needs for electronics and semiconductor manufacturers.

11Used Reflow Ovens
CategoryReflow Soldering Equipment
Description

Pre-owned reflow oven equipment available for purchase for electronics manufacturers seeking cost-effective thermal processing solutions.

Scale indicator4 records

Each record includes

Type, Value, Description, Source

Partnership2 partners
Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-11-20
Description

Diamond Quanta developed Adamantine Optics, an engineered diamond-integrated antireflective coating for consumer electronics and precision optics. Heller Industries served as a system integration partner using hot-filament CVD technology for drop-in integration with existing manufacturing lines.

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-11-20
Description

ExtenD Co. Ltd. of Japan collaborated with Diamond Quanta and Heller Industries on the Adamantine Optics project, contributing to the development of the diamond-integrated antireflective coating technology using hot-filament CVD for drop-in integration with existing manufacturing lines.

Recent move5 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight6 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Vitronics Soltec, part of ITW's Electronics Assembly Equipment group, produces reflow ovens and wave soldering equipment. It is a direct competitor to Heller in SMT reflow soldering ovens across mid- and high-end segments.

TypeDirect peer
Description

Kurtz Ersa is a German manufacturer of soldering equipment including reflow ovens, wave soldering, and selective soldering systems. It is one of Heller's most direct global competitors in convection and vacuum reflow soldering for SMT and semiconductor packaging.

TypeDirect peer
Description

SEHO is a German manufacturer of reflow ovens, selective soldering systems, and wave soldering equipment. Its product portfolio and target customer base (SMT contract manufacturers and OEMs) closely overlap with Heller's.

TypeEmerging player
Description

PacTech is a German specialist in semiconductor packaging equipment and services, with notable strength in laser soldering and fluxless soldering technologies. It overlaps with Heller in advanced packaging and fluxless reflow, particularly for emerging die-attach and 3D packaging applications.

TypeDirect peer
Description

Rehm is a German manufacturer of reflow soldering ovens and thermal systems for electronics manufacturing. Its product range and customer base in automotive, SMT, and LED closely mirror Heller's convection and vacuum reflow offerings.

TypeDirect peer
Description

IBL-Löttechnik is a German manufacturer of reflow ovens and selective soldering systems for electronics manufacturing. Its convection reflow and vacuum/reflow soldering equipment compete directly with Heller's MK-series and vacuum reflow oven lines.

TypeBroad incumbent
Description

Kulicke & Soffa is a global leader in semiconductor packaging assembly equipment (wire bonders, advanced packaging tools). Its advanced packaging equipment portfolio competes with Heller in ball attach, die attach, and thermal processing steps for semiconductor assembly.

TypeBroad incumbent
Description

ASM Pacific Technology is a large Singapore-headquartered semiconductor and SMT assembly equipment manufacturer. While broader in scope (die bonding, wire bonding, packaging), its thermal processing and SMT assembly offerings overlap with Heller's advanced packaging and SMT reflow lines.

TypeDirect peer
Description

BTU International, part of Amtech Group, is a US-based manufacturer of reflow ovens and thermal processing equipment for SMT and semiconductor advanced packaging, competing head-to-head with Heller in convection and vacuum reflow soldering.

TypeDirect peer
Description

SMT Wertheim is a German manufacturer of reflow soldering ovens serving SMT and power electronics manufacturers. Its oven product family directly competes with Heller's convection reflow and vacuum reflow systems in industrial and automotive applications.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat6 records

Each record includes

Type, Details

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers1 record

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment4 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile4 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
No
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature10 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance2 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Heller Industries

Industrial Thermal Processing Equipmenthellerindustries.com

Heller Industries designs and manufactures thermal processing equipment — convection, vacuum, formic-acid fluxless reflow ovens, and curing ovens — for global electronics manufacturers across SMT, semiconductor advanced packaging, power device, and consumer electronics assembly.

What Heller Industries does

Heller Industries, Inc. is a privately held American manufacturer of thermal processing equipment for the global electronics manufacturing industry, headquartered in Florham Park, New Jersey and operating since 1960. Its product portfolio centers on convection reflow ovens — led by the MK7 generation launched in 2023 — and extends into vacuum/voidless reflow ovens (including the 2025-award-winning Short Cycle Vacuum model), fluxless formic acid reflow ovens, and a full family of curing ovens (horizontal, vertical, magazine, and pressure-cure autoclaves). Differentiated technical features include the original waterless/filterless flux separation system, low-temperature integrated catalyst, Uniform Gas Management (up to 40% nitrogen reduction), Industry 4.0 / Internet-of-Manufacturing connectivity, and integrated Cpk software. The company holds ISO 9001:2015 quality certifications for its China and Korea operations and complies with SEMI S2/S8 safety standards for its formic acid product line.

The company serves four primary use-case segments: Surface Mount Technology (SMT) reflow soldering for printed circuit board assembly, semiconductor advanced packaging (ball attach, bumping, die attach, underfill curing, TIM and lid attach), power device packaging for automotive / industrial / renewable-energy applications, and consumer electronics assembly (mobile, wearables, camera modules). Customers configure equipment through an online portal and request quotes, with consultative selling delivered via Webex presentations and on-site demonstrations at Heller's facilities across the USA, China, India, Japan, Korea, Thailand, and Vietnam, with additional European coverage. Heller previously held roughly 17% of the global SMT reflow soldering equipment market (2002 Frost & Sullivan data) and has won multiple Frost & Sullivan awards through 2020, alongside recent recognition from Foxconn, Productronica China, NEPCON Asia, and Semiconductor Review.

Revenue is generated predominantly through capital-equipment sales of new ovens with custom configurations, supplemented by a used-equipment channel and post-sale service. Pricing is quote-based and not publicly disclosed. The company is led by CEO David Heller, with no parent corporation, institutional investor, or public listing disclosed in the source material, indicating founder/family ownership of a mature, profitable industrial niche player. Recent strategic activity has emphasized generational product refresh (MK7, Short Cycle Vacuum), an ecosystem buildout into adjacent materials via the Diamond Quanta / ExtenD partnership (announced November 2025), and deeper penetration into Foxconn's intelligent-manufacturing ecosystem.

Heller Industries firmographics

Firmographics
Name
Heller Industries
Legal name
Heller Industries, Inc.
Website
https://hellerindustries.com
Company type
Private
Founded year
1960
Operating status
Operating
Headcount range
101–250 employees
Short description
Heller Industries designs and manufactures thermal processing equipment — convection, vacuum, formic-acid fluxless reflow ovens, and curing ovens — for global electronics manufacturers across SMT, semiconductor advanced packaging, power device, and consumer electronics assembly.
Ownership category
akta.pro rank

Where Heller Industries is headquartered

Location

Headquarters

HQ city
Florham Park
HQ country
United States
HQ region
North America

Offices6 records

Markets served

Heller Industries business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales

Revenue model

  1. Reflow Ovens and Thermal Processing Equipment: Heller Industries manufactures and sells convection reflow ovens, vacuum reflow ovens, formic acid reflow ovens, and curing ovens. Revenue is generated through equipment sales with various configurations and options to meet customer requirements.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels6 records

Heller Industries product offering

Product offering

Core offering

Heller Industries manufactures and sells thermal processing equipment for electronics manufacturers and assemblers worldwide. Its portfolio includes convection reflow ovens (MK7 and MK5 series), vacuum/voidless reflow ovens, fluxless formic acid reflow ovens, and a range of curing ovens (pressure, vertical, magazine, horizontal) used for SMT soldering and semiconductor advanced packaging applications.

Product overview

Heller Industries is a thermal process equipment manufacturer specializing in reflow ovens and curing ovens for electronics manufacturing. The product portfolio centers on the MK7 and MK5 Convection Reflow Oven lines (models spanning 8-17 heating zones), complemented by Vacuum/Voidless Reflow Ovens for void-free applications, Formic/Fluxless Reflow Ovens for oxide removal, and a full range of curing solutions including Pressure Curing Ovens, Vertical Curing Ovens, and Magazine Curing Ovens. The company serves key markets including Surface Mount Technology (SMT), Semiconductor Advanced Packaging (ball attach, die attach, underfill curing, TIM/lid attach), Power Electronics, and Consumer Electronics Assembly. The latest MK7 generation offers Industry 4.0 compatibility and integrated Cpk software, while the Short Cycle Vacuum Oven addresses throughput bottlenecks in vacuum reflow.

Differentiator

Problem solved

Functional benefit

Products and services

  • MK7 Reflow Oven Latest generation SMT convection reflow oven with revolutionary low height top shell, double insulation for energy efficiency, advanced heater modules for lowest Delta T's on boards, Industry 4.0 compatibility, and integrated Cpk software. Available in multiple models (1809, 1826, 1913, 1936, 2043, 2049, 2156) with 8-17 heating zones for electronics manufacturers.
  • MK5 Convection Reflow Oven Previous generation convection reflow oven with proven reliability for SMT reflow soldering applications. The 2043 Mark 5 model won the 2015 SMT China Vision Award. Used by electronics manufacturers for surface mount technology reflow soldering.
  • Vacuum/Voidless Reflow Ovens Reflow ovens with vacuum-assisted processing for achieving void-free solder connections, reducing solder voids to less than 1%. Features closed-loop vacuum pump control, IR heated chambers, and optional staging conveyor systems. Used in semiconductor packaging and power electronics applications.
  • Short-Cycle Vacuum Reflow Oven Vacuum reflow oven designed to tackle throughput bottlenecks in vacuum reflow applications for semiconductor and power electronics packaging. Won 2025 PRODUCTRONICA China Most Popular New Product Award.
  • Formic/Fluxless Reflow Ovens (1936MK5-F, 2043MK5-F) Production-ready horizontal flux-free formic reflow ovens using formic acid vapor for oxide removal without applied flux. Meets SEMI S2/S8 safety standards with optional vacuum process, real-time formic monitoring, and up to Class 100 cleanroom compatibility. Designed for semiconductor advanced packaging and assembly applications.
  • Pressure Curing Ovens Curing ovens with pressure chambers (autoclaves) for void-free underfill curing and TIM/lid attach applications. Cleanroom and full automation options available for high volume semiconductor and electronics manufacturing.
  • Vertical Curing Ovens (VCOs) In-line curing ovens with vertical architecture requiring minimal floor space, ideal for cleanroom environments. Suitable for device-level and board-level underfill curing in consumer electronics and semiconductor applications.
  • Magazine Curing Ovens Curing ovens suitable for applications involving magazine loading, designed for efficient batch processing workflows in electronics and semiconductor manufacturing.
  • Horizontal Curing Ovens In-line horizontal curing ovens offering high pallet size flexibility at high units per hour (UPH) for various curing applications in electronics manufacturing.
  • Custom Reflow and Curing Ovens Custom-engineered solutions for special and challenging heating requirements, configured to specific application needs for electronics and semiconductor manufacturers.
  • Used Reflow Ovens Pre-owned reflow oven equipment available for purchase for electronics manufacturers seeking cost-effective thermal processing solutions.

Quantifiable outcome

  • Reduce solder voids to less than 1%
  • +4 more outcomes

Companies that use Heller Industries

Customer profile

Named customers1 record

Segments4 records

Ideal customer profiles4 records

Heller Industries technology and API

Technology

Technology focussed No

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature10 records

Heller Industries partnerships and signals

Strategic signal

Partnerships

Two partnerships are on record, tiered core.

  • Diamond QuantacoreTechnology or Integration · 20 November 2025Diamond Quanta developed Adamantine Optics, an engineered diamond-integrated antireflective coating for consumer electronics and precision optics. Heller Industries served as a system integration partner using hot-filament CVD technology for drop-in integration with existing manufacturing lines.
  • ExtenD Co. Ltd.coreTechnology or Integration · 20 November 2025ExtenD Co. Ltd. of Japan collaborated with Diamond Quanta and Heller Industries on the Adamantine Optics project, contributing to the development of the diamond-integrated antireflective coating technology using hot-filament CVD for drop-in integration with existing manufacturing lines.

Scale indicators4 records

Recent moves5 records

Expansion highlights6 records

Heller Industries competitors and assessment

Company assessment

Direct peers

  • Vitronics Soltec (ITW EAE): Vitronics Soltec, part of ITW's Electronics Assembly Equipment group, produces reflow ovens and wave soldering equipment. It is a direct competitor to Heller in SMT reflow soldering ovens across mid- and high-end segments.
  • ERSA (Kurtz Ersa): Kurtz Ersa is a German manufacturer of soldering equipment including reflow ovens, wave soldering, and selective soldering systems. It is one of Heller's most direct global competitors in convection and vacuum reflow soldering for SMT and semiconductor packaging.
  • SEHO Systems GmbH: SEHO is a German manufacturer of reflow ovens, selective soldering systems, and wave soldering equipment. Its product portfolio and target customer base (SMT contract manufacturers and OEMs) closely overlap with Heller's.
  • Rehm Thermal Systems: Rehm is a German manufacturer of reflow soldering ovens and thermal systems for electronics manufacturing. Its product range and customer base in automotive, SMT, and LED closely mirror Heller's convection and vacuum reflow offerings.
  • IBL-Löttechnik: IBL-Löttechnik is a German manufacturer of reflow ovens and selective soldering systems for electronics manufacturing. Its convection reflow and vacuum/reflow soldering equipment compete directly with Heller's MK-series and vacuum reflow oven lines.
  • BTU International (Amtech): BTU International, part of Amtech Group, is a US-based manufacturer of reflow ovens and thermal processing equipment for SMT and semiconductor advanced packaging, competing head-to-head with Heller in convection and vacuum reflow soldering.
  • SMT Wertheim: SMT Wertheim is a German manufacturer of reflow soldering ovens serving SMT and power electronics manufacturers. Its oven product family directly competes with Heller's convection reflow and vacuum reflow systems in industrial and automotive applications.

Emerging players

  • PacTech Packaging Technologies: PacTech is a German specialist in semiconductor packaging equipment and services, with notable strength in laser soldering and fluxless soldering technologies. It overlaps with Heller in advanced packaging and fluxless reflow, particularly for emerging die-attach and 3D packaging applications.

Broad incumbents

  • Kulicke & Soffa (K&S): Kulicke & Soffa is a global leader in semiconductor packaging assembly equipment (wire bonders, advanced packaging tools). Its advanced packaging equipment portfolio competes with Heller in ball attach, die attach, and thermal processing steps for semiconductor assembly.
  • ASM Pacific Technology: ASM Pacific Technology is a large Singapore-headquartered semiconductor and SMT assembly equipment manufacturer. While broader in scope (die bonding, wire bonding, packaging), its thermal processing and SMT assembly offerings overlap with Heller's advanced packaging and SMT reflow lines.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key highlights7 records

Customer concentration

Heller Industries social profiles

Digital presence

Heller Industries compliance and trust

Trust signal

Compliance2 records

Heller Industries financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Heller Industries leadership team

Management profile

Number of profiles

Profiles1 record

Heller Industries funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Heller Industries M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Heller Industries

What does Heller Industries do?

Heller Industries manufactures and sells thermal processing equipment for electronics manufacturers and assemblers worldwide. Its portfolio includes convection reflow ovens (MK7 and MK5 series), vacuum/voidless reflow ovens, fluxless formic acid reflow ovens, and a range of curing ovens (pressure, vertical, magazine, horizontal) used for SMT soldering and semiconductor advanced packaging applications.

Is Heller Industries a public or private company?

Heller Industries is a private company. It is classified as family owned and is currently operating.

When was Heller Industries founded?

Heller Industries was founded in 1960. It employs 101 to 250 people.

Where is Heller Industries based?

Heller Industries is headquartered in Florham Park, United States, in the North America region.

How does Heller Industries make money?

One revenue line is on record: reflow Ovens and Thermal Processing Equipment.

Who are Heller Industries's main competitors?

Direct peers on record are Vitronics Soltec (ITW EAE), ERSA (Kurtz Ersa), SEHO Systems GmbH, Rehm Thermal Systems, IBL-Löttechnik, BTU International (Amtech) and SMT Wertheim. PacTech Packaging Technologies is listed as an emerging player. Broad incumbents are Kulicke & Soffa (K&S) and ASM Pacific Technology.

Does Heller Industries have an API?

No public API is recorded for Heller Industries.

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Live signals
MorningstarDiamond Quanta to Debut Adamantine Optics™ at CES 2026 Eureka ParkDiamond Quanta announced it will debut Adamantine Optics, its engineered diamond-integrated antireflective coating for consumer electronics and precision optics, at CES 2026 Eureka Park in Las Vegas (January 6–9, 2026), with live demonstrations showcasing scratch resistance and durability using a confocal laser microscope. The coating addresses a significant market problem—78 million smartphones were damaged in the U.S. last year, with cracked screens costing consumers an estimated $8.3 billion in repairs—and was developed with system integration partners Heller Industries and ExtenD Co. Ltd. of Japan using hot-filament CVD technology for drop-in integration with existing manufacturing lines. The company is positioning this as its first commercially targeted application of a broader engineered-diamond platform spanning optics, electronics, and quantum devices.LinkedInJapan Pressure Curing Oven (Autoclave) Market by application — investment hotspots and M&A trendsA market report forecasts the Japan Pressure Curing Oven (Autoclave) market to grow from USD 450 million in 2024 to USD 700 million by 2033, driven by demand for advanced composite materials in aerospace and automotive sectors. The growth is further supported by Industry 4.0 integration, regulatory standards for high-strength materials, and technological advancements in energy-efficient designs. Key industry leaders shaping this landscape include Heller Industries, Ableprint, Ilshin Autoclave, and Tuttnauer.PR NewswireHeller Industries Wins Frost & Sullivan Acclaim for Dominating the Convection Reflow Soldering Market with High-efficiency MK7 Oven SeriesFrost & Sullivan awarded Heller Industries the 2020 Global Company of the Year Award based on its analysis of the global SMT soldering equipment market, recognizing Heller's innovations in convection reflow soldering technology. Heller Industries maintained production throughout the COVID-19 pandemic while delivering its MK7 oven series, which offers up to 50% reductions in nitrogen consumption and 40% energy savings compared to conventional systems. The company has further strengthened its market position through strategic partnerships, including collaborations with Ours Technology and integration of Panasonic's PanaCIM system to support smart factory and Industry 4.0 capabilities.PR NewswireFrost & Sullivan Honors Heller Industries for Standing out in the SMT Soldering Equipment Market with Its Novel Reflow Soldering Tool That Supports Industry 4.0Frost & Sullivan awarded Heller Industries the 2017 Global Frost & Sullivan Company of the Year Award for its SMT reflow soldering equipment supporting Industry 4.0 requirements. The company holds 20-23% market share and achieved 10% year-on-year sales growth in 2017 driven by increased investments in electronic devices. Heller Industries was specifically recognized for its communication software protocols, including SEC/GEM and IPC Industry 4.0 CFX standards, as well as its predictive analytics capabilities for remote equipment monitoring.PR NewswireFrost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0Frost & Sullivan awarded Heller Industries the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership based on the company's performance in the SMT reflow soldering equipment market over the past decade. Heller Industries has positioned itself for Industry 4.0 by developing advanced SMT equipment with improved connectivity and automation capabilities, while maintaining competitive pricing and low total cost of ownership through a partnership with IBM Microelectronics. The company operates R&D divisions in the United States, South Korea, and China, and is pursuing expansion in Europe and Asia to sustain long-term growth.