Name

Semight Instruments

Legal name

苏州联讯仪器股份有限公司

Website

https://cn.semight.com

Company type

Public

Founded year

2017

Operating status

Ipo

Headcount range

101–250 employees

Ownership category

akta.pro rank

Product category

Semiconductor Test and Measurement Equipment

NAICS

Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Semiconductor Machinery Manufacturing (333242), Other Measuring and Controlling Device Manufacturing (334519)

SIC

Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Industrial Instruments For Measurement, Display, And Control (3823), Measuring & Controlling Devices, Nec (3829)

akta.pro primary industry

Test & Measurement Equipment (Oscilloscopes, DAQ, signal analyzers, calibration benches) (IMAGAFAC)

akta.pro secondary industry

Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)

Keywords

• Semiconductor test instruments
• Optical module testing
• Wafer-level burn-in systems
• Precision source measure units
• Power semiconductor test equipment

Headquarters

HQ city

Hangzhou

HQ country

China

HQ region

Asia

Offices8 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. High-Speed Communication Testing Instruments: Sales of high-precision instruments including sampling oscilloscopes, clock recovery units, high-speed BERTs, precision wavelength meters, and general optical test instruments for optical module and optical device testing. Products range from benchtop units to integrated ATE systems. Revenue is generated through one-time capital equipment sales, typically to semiconductor fabs and optical module manufacturers.
2. Electrical Performance Testing Instruments: Sales of precision source measure units (SMU), PXIe modular SMU instruments, low-leakage switch matrices, high-voltage source meters, and pulse sources. These instruments serve semiconductor front-end and back-end testing applications. Revenue is generated through direct equipment sales to semiconductor manufacturers and research institutions.
3. Optical Chip Testing Equipment: Sales of laser diode burn-in systems, bare die testing systems, silicon photonics wafer testing systems, and CoC reliability testing equipment. These systems provide comprehensive solutions from bare die to CoC, spanning high to cryogenic temperatures (-40°C).
4. Power Chip Testing Equipment: Sales of wafer-level burn-in systems, SiC power chip KGD testing and sorting systems, and wafer acceptance test (WAT) systems for power semiconductors. Solutions cover the complete power chip lifecycle from wafer-level burn-in to die-level testing.

Pricing tiers

Go-to-market motion2 records

Distribution channels5 records

Marketing channels10 records

Core offering

Semight Instruments manufactures high-end test and measurement instruments and automated test equipment for the optical communication module and chip test industry. The company offers an "instruments + equipment + solutions" ecosystem spanning four domains: high-speed communication testing (sampling oscilloscopes, BERTs, clock recovery units), electrical performance testing (precision SMUs, PXIe modular instruments, switch matrices, pulse sources), optical chip testing (laser diode testers, CoC aging systems), and power semiconductor testing (wafer-level burn-in systems, SiC KGD handlers, WAT systems, silicon photonics wafer testers).

Product overview

Semight Instruments (苏州联讯仪器股份有限公司) is a comprehensive supplier of high-end test and measurement instruments and equipment for high-speed communications, optical chip, electrical performance, and power semiconductor wafer chip testing. The company operates a "仪器+设备+解决方案" (instruments + equipment + solutions) ecosystem, organized into four core product domains: (1) High-speed communication testing — including the DCA1065 65GHz sampling oscilloscope, CR3302 120GBaud clock recovery unit, PBT3058 1.6T BERT, rBT3250 50G burst-mode BERT, and high-speed optical module ATE systems (MTP series); (2) Electrical performance testing — including the SA8000 semiconductor parameter analyzer, S2000/S3000 series desktop and PXIe SMUs, high-voltage S3030F 3500V SMU, low-leakage switch matrices (RM series), and pulse current sources (S3026P/S3029H/S3029P); (3) Optical chip testing — including CT8201/CT8203 die testers, CT6201 CoC test system, and BI6201/BI6202/BI6203 CoC aging systems; (4) Power semiconductor testing — including WLBI3810/370A/370B/3800 wafer-level burn-in systems, PB6800/PB6600/PB6400 KGD test handlers, WAT6600/WAT6200S WAT test systems, sCT9002/sCT9001 silicon photonics wafer test systems, AL6200 die inspection/sorting, and PLR0010 package-level reliability test system.

Differentiator

Problem solved

Functional benefit

Brands

• SA8000: 半导体参数分析仪 - 18槽模块化设计的集成化测试平台，支持从基础IV、CV表征到快速精准的脉冲IV测试等全方位测量

Products and services

• DCA1065 65GHz Sampling Oscilloscope 65GHz equivalent-time sampling oscilloscope supporting 53/56 GBaud and 106/112 GBaud PAM4 signal testing for 1.6T optical modules, with multi-channel (1/2/4) and integrated TDECQ measurement capability.
• CR3302 120 GBaud Clock Recovery Unit Desktop clock recovery unit supporting 25–120 GBaud NRZ/PAM4 signal extraction for 1.6T optical module and interface testing, featuring low intrinsic jitter ≤200 fs and built-in clock division outputs.
• PBT3058 Desktop 8×224G Bit Error Rate Tester High-performance BERT covering 1.6T BASE/CEI-224G standards with 8 channels supporting independent NRZ/PAM4 configuration, hardware PCS layer FEC encoding/decoding and analysis, and 21-tap TX pre-emphasis.
• rBT3250 50G Burst-Mode Bit Error Rate Tester Burst-mode BERT specifically for next-generation 25G/50G PON OLT testing, supporting GPON/EPON burst rates and PAM4 burst testing with built-in clock recovery for long-fiber environments.
• SA8000 Semiconductor Parameter Analyzer 18-slot modular semiconductor parameter analyzer supporting IV, CV, and fast pulse IV testing, with configurable modules including High Power SMU, High Resolution SMU, Multi-Frequency Capacitance Measurement, and Semiconductor Pulse Generator.
• S2035H/S2036H Single/Dual-Channel Precision SMU High-precision source measure units with ±200V, ±1A DC / ±3A pulse output, minimum measurement resolution of 1fA/100nV, and maximum 1MS/s sampling rate for electrical characterization.
• S3030F 3500V High-Voltage SMU High-voltage desktop SMU delivering up to ±3500V/±120mA DC and 180W power output with 10GΩ resistance measurement range, designed for SiC/GaN characterization and high-voltage leakage current testing.
• PXIe SMU Series (S2011C, S2012C, S2014C, S2016C, S2017C, S2019C, S0342C) Modular PXIe source measure units in 1–12 channel configurations, supporting voltage ranges from ±10V to ±200V and current ranges from ±50mA to ±3A, with resolution down to 0.1fA for automated semiconductor test system integration.
• WAT6600 Parallel WAT Test System Universal parallel wafer acceptance test system supporting up to 48 channels of Perpin SMU/PGU/FMU with ±200V/±1A output, 1pA minimum current accuracy, and full Kelvin connection for semiconductor wafer-level parametric testing.
• WAT6200S Serial WAT Test System Universal serial WAT test system with up to 8 SMU channels and 4 HV-SPGU channels, supporting up to 48-channel low-leakage switch matrix expansion for wafer acceptance testing and WLR reliability testing of Si/GaN/SiC devices.
• WLBI3810 Wafer-Level Burn-in System High-end SiC/GaN wafer-level burn-in system supporting simultaneous testing of 9 wafers in HTGB and HTRB modes, with independent per-die over-current protection, 0.1nA leakage current resolution, and automated probe card switching.
• WLBI370A/370B Wafer-Level Burn-in Systems Automated wafer-level burn-in systems for SiC/GaN: WLBI370A supports 20 wafers simultaneously in HTGB mode; WLBI370B supports 15 wafers in combined HTGB/HTRB mode with probe card quick-change and 3-load-port design.
• WLBI3800 Wafer-Level Burn-in System SiC wafer-level burn-in system supporting simultaneous 3-wafer HTGB/HTRB testing with up to 2112 dies per wafer, automated loading/unloading with dual magazine design, and independent per-die over-current protection.
• PB6800 SiC KGD Test Handler High-end KGD test handler for bare-die SiC power chip static and dynamic parameter testing, featuring modular design, 6 parallel test stations, up to 2000V/600A static and 1200V/2000A dynamic testing, and nitrogen-sealed socket with anti-arc protection.
• PB6600 KGD Test Handler Rotary-type KGD test handler for SiC bare-die dynamic and static testing with Hard Docking connection, supporting up to 2000V/600A static and 1200V/2000A dynamic tests, with >1400 UPH throughput and automatic bin sorting.
• PB6400 KGD Test Handler Linear KGD test handler for SiC static and dynamic parameter testing, supporting multiple chip packaging formats (Frame Ring, Tape&Reel, Tray), temperature range up to 185°C, and up to 4 test stations with dual-track throughput exceeding 900 UPH.
• CT8201 RT-HT Die Tester Room temperature and high-temperature laser diode chip tester for DFB/EML semiconductor lasers, performing LIV, EA, and spectral scans at two temperature zones (25–95°C) with OCR chip identification and <6s cycle time.
• CT8203 LT Die Tester Low-temperature chip tester for semiconductor laser diodes supporting three temperature zones (-40 to 95°C) with TEC+water cooling and dew point monitoring, performing LIV and spectral scans on DFB/EML/EML+SOA chips.
• CT6201 CoC Test System Fully automatic CoC (Chip on Carrier) test system for high-volume semiconductor laser chip testing, featuring dual-fixture parallel testing, independent temperature-controlled platforms, and <7.5s test cycle time.
• BI6201/BI6202/BI6203 CoC Aging Systems High-density CoC aging systems for semiconductor laser chip reliability testing, supporting up to 8448 channels (BI6202), heat sink temperature uniformity ≤±1.0°C (40–100°C), and online power monitoring with Ith analysis capability.
• sCT9002 Silicon Photonics Wafer Test System Automated silicon photonics wafer test system supporting 12-inch and 8-inch wafers with vertical and edge coupling, spiral and gradient scanning achieving <1.5s coupling time, and integrated DC and RF probe capabilities for photonic integrated circuit testing.
• sCT9001 Silicon Photonics Wafer Test System 8-inch/6-inch silicon photonics wafer test system with 6-axis hexapod plus piezo stage for optical coupling, supporting grating, FA, and edge coupling with spiral/gradient scanning at <1.5s coupling time.
• AL6200 Die-Level Chip Inspection and Sorting System Die-level chip inspection and sorting system for power chip bare-die visual inspection and binning, supporting 6-sided defect detection with ≥10μm accuracy, ≥2k UPH throughput, and Frame Ring input with Tape&Reel or Tray output.
• PLR0010 Package-Level Reliability Test System Package-level reliability test system based on JEDEC standards for TDDB/HCI/BTI/GOI testing, supporting 960 DUT parallel testing, 4 independent ovens up to 250°C, and ~220μs stress-to-monitor switching for accelerated reliability assessment.
• RM1010-LLC/ RM1010-PRO / RM1014-MV Low Leakage Switch Matrices Low-leakage switch matrix series based on high-insulation reed relays for semiconductor wafer parametric measurement: RM1010-LLC supports <100fA leakage, RM1010-PRO supports <100fA with 20 inputs/48 outputs, and RM1014-MV supports up to 2000V with <1pA leakage.
• S3029H / S3029P / S3026P Pulse Current Sources High-speed pulse current source/measurement units supporting ±1.5A–±2A output, minimum pulse width down to 1–3μs, rise time <200–400ns, and synchronous voltage measurement for semiconductor device, laser driver, and EMC testing applications.
• MTP8104 / ATE8104/ATE8108 High-Speed Optical Module Test Systems Integrated optical module ATE platforms combining BERT, temperature control, and MCB test boards for 400G/800G OSFP and QSFP-DD optical module BERT and eye diagram testing.

Quantifiable outcome

• 28-fold stock price appreciation from IPO price reflecting strong investor and market validation
• +4 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration9 records

Feature7 records

Partnerships

One partnership is on record.

• Major Global and Domestic Semiconductor Equipment and Material SuppliersminorOthersSemight Instruments collaborates with upstream semiconductor equipment and material suppliers for probe cards, sockets, and fixture components used in its testing systems. The company maintains supply chain relationships for precision mechanical components, optical components, and specialized materials needed for its testing instruments and equipment.

Scale indicators8 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• Cohu: US-based supplier of semiconductor test handlers and contactors with a strong presence in power device and SiC test. Directly competes with Semight's PB-series KGD test handlers and power semiconductor test equipment.
• Anritsu: Japanese specialist in optical/electrical T&M, BERTs, and high-speed network testing. Directly competes with Semight in BERTs and burst-mode BERTs (rBT3250 vs Anritsu's MP1900A series) for optical module and PON test applications.
• Siglent Technologies (鼎阳科技): Chinese oscilloscope, spectrum analyzer, and general-purpose T&M manufacturer listed on the STAR Market. Competes with Semight in benchtop oscilloscopes, SMUs, and entry-to-mid-range T&M at domestic enterprise and academic customers.
• RIGOL Technologies (普源精电): Leading Chinese oscilloscope and T&M manufacturer listed on the Shanghai STAR Market. Competes with Semight in domestic oscilloscope and electrical performance test markets and represents a domestic alternative for Chinese research and academic customers.

Broad incumbents

• Advantest: Global leader in semiconductor ATE (V93000, T5503 series) and memory test. Competes indirectly with Semight's wafer-level burn-in, KGD test, and WAT systems as a broad incumbent in semiconductor test equipment.
• Rohde & Schwarz: German-based global T&M incumbent offering oscilloscopes, signal analyzers, and optical test equipment. Competes with Semight's high-end sampling oscilloscopes (DCA1065) and electrical performance test portfolio at global fab and module maker customers.
• Teradyne: Major semiconductor ATE provider (UltraFlex, J750) serving logic, analog, and power device test markets. Competes with Semight's WAT and KGD systems and serves many of the same fab customers globally.
• Keysight Technologies: Global leader in electronic test and measurement with a broad portfolio including sampling oscilloscopes, BERTs, and optical test instruments. Directly competes with Semight in high-speed optical communication test equipment and is the established incumbent Semight aims to displace in China.
• Yokogawa Electric: Japanese industrial T&M and control specialist with a strong oscilloscope, SMU, and power device test portfolio. Overlaps with Semight's S-series precision SMUs, optical wavelength meters, and power semiconductor test systems.
• FormFactor: US-based supplier of wafer probe cards, probe stations, and integrated test solutions. Overlaps with Semight's wafer-level test and burn-in systems through complementary probe technology and competes for the same fab capex budgets.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries7 records

Funding overview

Funding rounds1 record

Investors7 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Semight Instruments