Hermes-Epitek
Hermes-Epitek is a privately held Taiwanese semiconductor and optoelectronics equipment company, founded in 1977 and headquartered in Hsinchu, supplying front-end and back-end process tools, SiC substrates, advanced packaging equipment, and technical services to semiconductor, flat panel display, and advanced packaging manufacturers across Asia and the USA.
- Company typePrivate
- Founded1977
- HeadquartersHsinchu, Taiwan
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What Hermes-Epitek does
Hermes-Epitek (漢民科技) is a privately held Taiwanese semiconductor and optoelectronics manufacturing equipment company founded in 1977 and headquartered in Hsinchu Science Park. It supplies a full equipment portfolio spanning front-end processes (ion implanters, MOCVD systems, photolithography coater/developers, ICP etchers, e-beam evaporators, and SiC substrates) targeting advanced nodes down to 2nm and below, as well as back-end advanced packaging equipment (fluxless solder bumping process, fluxless thermal compression gang bonders for 3D IC) and semiconductor testing solutions. The company is positioning into wide-bandgap (SiC) power semiconductors for electric vehicles and 5G, and maintains R&D in quantum sensing and quantum communication technologies.
The firm operates a B2B enterprise field-sales model, selling capital equipment directly to semiconductor manufacturers (IDMs and fabless companies), flat panel display manufacturers (TFT-LCD, OLED), and advanced packaging companies, with regional offices in Taiwan, China, Singapore, and the United States. Revenue is generated through three streams: one-time equipment sales (one_time_license), technical process development services (professional_services), and replacement parts (transaction_fee). It also acts as an integrator of multiple upstream equipment suppliers' tools into optimized customer process flows. Pricing is quote-based for enterprise customers and is not publicly disclosed.
Marketing reach is conducted via industry trade shows (Touch Taiwan), corporate website, and educational scientific articles. The leadership comprises Chairman Huang Minqi (黃民奇) and Vice Chairman Xu Jinrong (許金榮), both long-tenured. The firm maintains a strategic collaborative relationship with Episil Technologies Inc. (漢磊科技) for SiC wafer technology. No public listing, institutional funding rounds, or ownership percentages are disclosed; the company operates as an independent private firm with 1,001-5,000 employees.
Hermes-Epitek firmographics
Firmographics- Name
- Hermes-Epitek
- Legal name
- 漢民科技股份有限公司
- Website
- https://hermes.com.tw
- Company type
- Private
- Founded year
- 1977
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- Hermes-Epitek is a privately held Taiwanese semiconductor and optoelectronics equipment company, founded in 1977 and headquartered in Hsinchu, supplying front-end and back-end process tools, SiC substrates, advanced packaging equipment, and technical services to semiconductor, flat panel display, and advanced packaging manufacturers across Asia and the USA.
- Ownership category
- akta.pro rank
Hermes-Epitek industry classification
Industry- Product category
- Semiconductor Manufacturing Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Industrial Process Furnaces & Ovens (3567), Industrial Instruments For Measurement, Display, And Control (3823)
- akta.pro primary industry
- Ion Implantation & Doping Equipment (HDAHAEAD)
- akta.pro secondary industries
- Epitaxy Materials & Services (Epi Wafers/MBE/MOCVD) (HDAHAGAC), Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)
Keywords
Where Hermes-Epitek is headquartered
LocationHeadquarters
- HQ city
- Hsinchu
- HQ country
- Taiwan
- HQ region
- Asia
Offices2 records
Markets served
Hermes-Epitek business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales
Revenue model
- Semiconductor Manufacturing Equipment Sales: Sale of front-end and back-end semiconductor process equipment including SiC substrates, ion implanters, MOCVD systems, photolithography equipment, etchers, and e-beam evaporators to semiconductor manufacturers
- Technical Services: Process technology development and technical support services for semiconductor manufacturing
- Parts Sales: Sales of replacement parts and components for semiconductor manufacturing equipment
Go-to-market motion1 record
Distribution channels2 records
Marketing channels3 records
Hermes-Epitek product offering
Product offeringCore offering
Hermes-Epitek designs, manufactures, and integrates semiconductor and optoelectronic manufacturing process equipment for front-end and back-end semiconductor production, including SiC substrates, ion implanters, MOCVD systems, photolithography coater developers, ICP etchers, e-beam evaporators, fluxless solder bumping equipment, thermal compression gang bonders, and testing solutions. The company complements this equipment portfolio with technical services for process optimization and parts sales to support installed equipment bases.
Product overview
Hermes-Epitek (漢民科技) provides a comprehensive portfolio of semiconductor manufacturing equipment and process solutions spanning front-end and back-end manufacturing. The company's front-end offerings include advanced processes supporting 2nm and below technology nodes, while back-end capabilities focus on high-throughput packaging equipment. The product lineup includes SiC (silicon carbide) substrates, MOCVD equipment, ion implanters, photolithography coater developers, ICP etchers, e-beam evaporators, fluxless solder bumping systems, thermal compression gang bonders, and semiconductor testing solutions. The company also invests in quantum sensing and communication technologies alongside wide bandgap power semiconductors (SiC and GaN).
Differentiator
Problem solved
Functional benefit
Products and services
- SiC (Silicon Carbide) Substrates (導電型4H碳化矽及半絕緣基板) Conductive 4H silicon carbide and semi-insulating SiC substrates for third-generation wide bandgap power semiconductor applications, targeting power electronics, 5G, and electric vehicle use cases for semiconductor manufacturers.
- MOCVD Equipment (有機金屬化學氣相沉積設備) Metal-Organic Chemical Vapor Deposition (MOCVD) equipment used by compound semiconductor manufacturers for epitaxial growth of compound semiconductors, including wide bandgap materials.
- Ion Implanter (高電流離子佈植機) High-current ion implanter for semiconductor doping processes, providing high-throughput ion implantation into silicon and compound semiconductor wafers for IDMs and foundries.
- Photolithography Coater Developer (塗佈及顯影機) Coating and development equipment for semiconductor photolithography processes, supporting advanced nodes (2nm and below) for semiconductor manufacturers and display manufacturers.
- ICP Etcher (感應耦合式電漿蝕刻機) Inductively Coupled Plasma (ICP) etcher for precise semiconductor patterning processes, used by semiconductor and flat panel display manufacturers requiring high-accuracy etching.
- E-beam Evaporator (電子束蒸鍍設備) Electron beam evaporation system for thin film deposition in semiconductor fabrication, used for precision metallization layers in advanced device manufacturing.
- Fluxless Solder Bumping Process (無助焊劑植球迴焊檢測補球機) Fluxless solder bumping process with reflow inspection and rework capabilities for advanced semiconductor packaging, enabling bump formation without flux for high-reliability advanced packaging and 3D IC applications.
- Fluxless Thermal Compression Gang Bonder (無助焊劑多晶片熱壓鍵合機) Fluxless multi-chip thermal compression gang bonder for advanced semiconductor packaging, supporting 3D multi-chip integration and heterogeneous integration in advanced packaging facilities.
- Semiconductor Testing Solutions (半導體測試解決方案) Comprehensive semiconductor testing solutions for device quality assurance and reliability verification, used by semiconductor manufacturers and packaging/test companies across the back-end test flow.
Companies that use Hermes-Epitek
Customer profileSegments3 records
Ideal customer profiles3 records
Hermes-Epitek technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature10 records
Hermes-Epitek partnerships and signals
Strategic signalPartnerships
One partnership is on record.
- Episil Technologies Inc.moderateEpisil Technologies Inc. (漢磊科) is referenced as a SiC (silicon carbide) technology partner. Hermes-Epitek mentions Episil's SiC wafer technology capabilities on their third-generation semiconductor materials page, indicating a collaborative relationship in SiC development and manufacturing for power semiconductor applications.
Scale indicators2 records
Recent moves6 records
Expansion highlights6 records
Hermes-Epitek competitors and assessment
Company assessmentMarket position
Strengths2 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Hermes-Epitek social profiles
Digital presenceHermes-Epitek compliance and trust
Trust signalCompliance1 record
Hermes-Epitek financial estimates
Financial estimateRevenue estimate
Valuation estimate
Hermes-Epitek leadership team
Management profileNumber of profiles
Profiles2 records
Hermes-Epitek funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Hermes-Epitek M&A and investment
M&A and investmentM&A
Investments4 records
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Hermes-Epitek
What does Hermes-Epitek do?
Hermes-Epitek designs, manufactures, and integrates semiconductor and optoelectronic manufacturing process equipment for front-end and back-end semiconductor production, including SiC substrates, ion implanters, MOCVD systems, photolithography coater developers, ICP etchers, e-beam evaporators, fluxless solder bumping equipment, thermal compression gang bonders, and testing solutions. The company complements this equipment portfolio with technical services for process optimization and parts sales to support installed equipment bases.
Is Hermes-Epitek a public or private company?
Hermes-Epitek is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was Hermes-Epitek founded?
Hermes-Epitek was founded in 1977. It employs 11 to 50 people.
Where is Hermes-Epitek based?
Hermes-Epitek is headquartered in Hsinchu, Taiwan, in the Asia region.
How does Hermes-Epitek make money?
Three revenue lines are on record. Semiconductor Manufacturing Equipment Sales are the primary driver. The others are technical Services and parts Sales.
Does Hermes-Epitek have an API?
No public API is recorded for Hermes-Epitek.
What industry is Hermes-Epitek in?
Hermes-Epitek's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is HDAHAEAD, Ion Implantation & Doping Equipment, with a secondary code of HDAHAGAC, Epitaxy Materials & Services (Epi Wafers/MBE/MOCVD). Its NAICS code is 333242 and its SIC code is 3567.