Hermes-Epitek

What Hermes-Epitek does

Hermes-Epitek (漢民科技) is a privately held Taiwanese semiconductor and optoelectronics manufacturing equipment company founded in 1977 and headquartered in Hsinchu Science Park. It supplies a full equipment portfolio spanning front-end processes (ion implanters, MOCVD systems, photolithography coater/developers, ICP etchers, e-beam evaporators, and SiC substrates) targeting advanced nodes down to 2nm and below, as well as back-end advanced packaging equipment (fluxless solder bumping process, fluxless thermal compression gang bonders for 3D IC) and semiconductor testing solutions. The company is positioning into wide-bandgap (SiC) power semiconductors for electric vehicles and 5G, and maintains R&D in quantum sensing and quantum communication technologies.

The firm operates a B2B enterprise field-sales model, selling capital equipment directly to semiconductor manufacturers (IDMs and fabless companies), flat panel display manufacturers (TFT-LCD, OLED), and advanced packaging companies, with regional offices in Taiwan, China, Singapore, and the United States. Revenue is generated through three streams: one-time equipment sales (one_time_license), technical process development services (professional_services), and replacement parts (transaction_fee). It also acts as an integrator of multiple upstream equipment suppliers' tools into optimized customer process flows. Pricing is quote-based for enterprise customers and is not publicly disclosed.

Marketing reach is conducted via industry trade shows (Touch Taiwan), corporate website, and educational scientific articles. The leadership comprises Chairman Huang Minqi (黃民奇) and Vice Chairman Xu Jinrong (許金榮), both long-tenured. The firm maintains a strategic collaborative relationship with Episil Technologies Inc. (漢磊科技) for SiC wafer technology. No public listing, institutional funding rounds, or ownership percentages are disclosed; the company operates as an independent private firm with 1,001-5,000 employees.

Name

Hermes-Epitek

Legal name

漢民科技股份有限公司

Website

https://hermes.com.tw

Company type

Private

Founded year

1977

Operating status

Operating

Headcount range

11–50 employees

Short description

Hermes-Epitek is a privately held Taiwanese semiconductor and optoelectronics equipment company, founded in 1977 and headquartered in Hsinchu, supplying front-end and back-end process tools, SiC substrates, advanced packaging equipment, and technical services to semiconductor, flat panel display, and advanced packaging manufacturers across Asia and the USA.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Industrial Process Furnaces & Ovens (3567), Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Ion Implantation & Doping Equipment (HDAHAEAD)

akta.pro secondary industries

Epitaxy Materials & Services (Epi Wafers/MBE/MOCVD) (HDAHAGAC), Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)

Keywords

• Semiconductor manufacturing equipment
• Photolithography systems
• Ion implantation equipment
• Advanced packaging solutions
• Silicon carbide substrates

Headquarters

HQ city

Hsinchu

HQ country

Taiwan

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales

Revenue model

1. Semiconductor Manufacturing Equipment Sales: Sale of front-end and back-end semiconductor process equipment including SiC substrates, ion implanters, MOCVD systems, photolithography equipment, etchers, and e-beam evaporators to semiconductor manufacturers
2. Technical Services: Process technology development and technical support services for semiconductor manufacturing
3. Parts Sales: Sales of replacement parts and components for semiconductor manufacturing equipment

Go-to-market motion1 record

Distribution channels2 records

Marketing channels3 records

Core offering

Hermes-Epitek designs, manufactures, and integrates semiconductor and optoelectronic manufacturing process equipment for front-end and back-end semiconductor production, including SiC substrates, ion implanters, MOCVD systems, photolithography coater developers, ICP etchers, e-beam evaporators, fluxless solder bumping equipment, thermal compression gang bonders, and testing solutions. The company complements this equipment portfolio with technical services for process optimization and parts sales to support installed equipment bases.

Product overview

Hermes-Epitek (漢民科技) provides a comprehensive portfolio of semiconductor manufacturing equipment and process solutions spanning front-end and back-end manufacturing. The company's front-end offerings include advanced processes supporting 2nm and below technology nodes, while back-end capabilities focus on high-throughput packaging equipment. The product lineup includes SiC (silicon carbide) substrates, MOCVD equipment, ion implanters, photolithography coater developers, ICP etchers, e-beam evaporators, fluxless solder bumping systems, thermal compression gang bonders, and semiconductor testing solutions. The company also invests in quantum sensing and communication technologies alongside wide bandgap power semiconductors (SiC and GaN).

Differentiator

Problem solved

Functional benefit

Products and services

• SiC (Silicon Carbide) Substrates (導電型4H碳化矽及半絕緣基板) Conductive 4H silicon carbide and semi-insulating SiC substrates for third-generation wide bandgap power semiconductor applications, targeting power electronics, 5G, and electric vehicle use cases for semiconductor manufacturers.
• MOCVD Equipment (有機金屬化學氣相沉積設備) Metal-Organic Chemical Vapor Deposition (MOCVD) equipment used by compound semiconductor manufacturers for epitaxial growth of compound semiconductors, including wide bandgap materials.
• Ion Implanter (高電流離子佈植機) High-current ion implanter for semiconductor doping processes, providing high-throughput ion implantation into silicon and compound semiconductor wafers for IDMs and foundries.
• Photolithography Coater Developer (塗佈及顯影機) Coating and development equipment for semiconductor photolithography processes, supporting advanced nodes (2nm and below) for semiconductor manufacturers and display manufacturers.
• ICP Etcher (感應耦合式電漿蝕刻機) Inductively Coupled Plasma (ICP) etcher for precise semiconductor patterning processes, used by semiconductor and flat panel display manufacturers requiring high-accuracy etching.
• E-beam Evaporator (電子束蒸鍍設備) Electron beam evaporation system for thin film deposition in semiconductor fabrication, used for precision metallization layers in advanced device manufacturing.
• Fluxless Solder Bumping Process (無助焊劑植球迴焊檢測補球機) Fluxless solder bumping process with reflow inspection and rework capabilities for advanced semiconductor packaging, enabling bump formation without flux for high-reliability advanced packaging and 3D IC applications.
• Fluxless Thermal Compression Gang Bonder (無助焊劑多晶片熱壓鍵合機) Fluxless multi-chip thermal compression gang bonder for advanced semiconductor packaging, supporting 3D multi-chip integration and heterogeneous integration in advanced packaging facilities.
• Semiconductor Testing Solutions (半導體測試解決方案) Comprehensive semiconductor testing solutions for device quality assurance and reliability verification, used by semiconductor manufacturers and packaging/test companies across the back-end test flow.

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature10 records

Partnerships

One partnership is on record.

• Episil Technologies Inc.moderateStrategic or Co-development PartnerEpisil Technologies Inc. (漢磊科) is referenced as a SiC (silicon carbide) technology partner. Hermes-Epitek mentions Episil's SiC wafer technology capabilities on their third-generation semiconductor materials page, indicating a collaborative relationship in SiC development and manufacturing for power semiconductor applications.

Scale indicators2 records

Recent moves6 records

Expansion highlights6 records

Market position

Strengths2 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/hermes-epitek

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments4 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hermes-Epitek