What Nisene Technology Group does

Nisene Technology Group, Inc. is a US-based manufacturer of automated semiconductor decapsulation equipment, headquartered in Watsonville, California (incorporated 1999, with operating lineage to B&G International from 1950). The company builds specialty capital tools — primarily the JetEtch Pro (chemical, acid-based decapsulation) and the PlasmaEtch Pro (chemical-free microwave-induced plasma etching under US Patent 9,548,227) — that remove mold compound from integrated circuits to expose dies for failure analysis and counterfeit-component detection. Supporting product lines include the CERDIP Opener and Can Opener mechanical accessories, CuProtect/TotalProtect copper-wire-bond configurations, and a portfolio of monolithic gaskets and recipe kits. In 2024 the company also surfaced a manufacturing-services line spanning silicon and sapphire ingots, wafers, custom bare dies, and testing equipment.

The business model centers on direct enterprise sales of high-ASP capital equipment with quote-based pricing (not publicly disclosed), supplemented by installation, training, applications-support, and warranty service. The customer base is dominated by semiconductor failure-analysis labs (Intel, Broadcom, Skyworks), defense and government contractors (Raytheon, Lockheed Martin), and IC distributors/authenticity-testing firms (SMT Corporation, North Shore Components), with sales-led engagement and long-tenure equipment placements (Intel exceeding 20 years). Certifications include CE marking and SEMI S2-93/2000 compliance for the JetEtch Pro.

In August 2024, Nisene was acquired by India's Polymatech Electronics for $100 million through its Singapore WOS AEIM Pte. Ltd.; Nisene now operates as an AEIM Group subsidiary, retaining the NISENE trade name and continuing to design, manufacture, and sell decapsulation systems globally from the US while gaining Asia-based channel and manufacturing-services reach via its parent.

Name

Nisene Technology Group

Legal name

Nisene Technology Group, Inc.

Website

https://nisene.co

Company type

Private

Founded year

1950

Operating status

Operating

Headcount range

11–50 employees

Short description

Nisene Technology Group manufactures automated semiconductor decapsulation equipment — chemical JetEtch Pro and microwave plasma PlasmaEtch Pro systems — sold to failure analysis labs, IC distributors, and defense contractors worldwide, and now operates as a subsidiary of Polymatech Electronics.

Ownership category

akta.pro rank

Product category

Semiconductor Decapsulation Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery, Nec (3559), Semiconductors & Related Devices (3674)

akta.pro primary industry

Etch & Strip Equipment (Dry/Wet/Ashing) (HDAHAEAC)

akta.pro secondary industry

Wet Process Chemicals (Etchants/Cleaners/Strippers/SC-1/SC-2/BOE) (HDAHAGAF)

Keywords

• Semiconductor decapsulation equipment
• Integrated circuit failure analysis
• Automated jet etching systems
• Counterfeit component detection
• Plasma etching semiconductor

Headquarters

HQ city

Watsonville

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Decapsulation Equipment Sales: Sale of automated decapsulation systems including JetEtch Pro, PlasmaEtch Pro, CERDIP Opener, and Can Opener. One-time capital equipment purchase with comprehensive warranty coverage.
2. Accessories and Monolithic Gaskets: Sale of accessory kits for various package types (DIP/SIP, PLCC, SOIC, QFP, BGA, QFN/MLP) and custom-designed monolithic gaskets.
3. Service and Support: Installation services, training programs, applications support, and extended warranty options for decapsulation systems.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels4 records

Core offering

Nisene Technology Group designs, manufactures, and sells automated semiconductor decapsulation systems that remove mold compound from integrated circuits to expose dies for failure analysis and counterfeit protection. Its core product line consists of the JetEtch Pro wet-chemical decapsulation system and the PlasmaEtch Pro microwave-induced plasma etching system, supported by the CERDIP Opener and Can Opener mechanical package-opening tools. The company also provides semiconductor manufacturing services for silicon and sapphire ingots, wafers, and custom bare dies.

Product overview

Nisene Technology Group is the world leader in automated semiconductor decapsulation, offering a portfolio of specialized equipment and services for the semiconductor industry. The core product line centers on the JetEtch Pro chemical decapsulation system and PlasmaEtch Pro microwave plasma etching system, supported by accessory tools including the CERDIP Opener and Can Opener for different package types. The company also offers add-on configurations like CuProtect and TotalProtect for copper wire protection. Beyond equipment, Nisene provides semiconductor manufacturing services including ingot manufacturing (silicon and sapphire), wafer production, custom bare die fabrication, and testing equipment. The company operates as an AEIM Group subsidiary and positions itself as 'The Semiconductor People' serving both failure analysis and counterfeit protection markets.

Differentiator

Problem solved

Functional benefit

Brands

• CuProtect: Patented bias voltage process for etching samples with copper wires
• TotalProtect

Products and services

• JetEtch Pro Automated chemical decapsulation system that removes mold compound from integrated circuits using user-specified chemical solutions, exposing dies for failure analysis and counterfeit verification. Compatible with copper, aluminum, and gold wire bonds and equipped with patented pump, robust heat exchanger, advanced software, and safety waste diversion features.
• PlasmaEtch Pro Patented gas-based semiconductor etching system that uses microwave-induced plasma (MIP) to perform chemical-free isotropic decapsulation of integrated circuits. Capable of processing most sample sizes, encapsulant types, and wire bond types including gold, copper, and silver wires, with a touchscreen interface and PC/Windows-based GUI.
• CERDIP Opener Mechanical device that opens hermetically-sealed ceramic dual inline packages (CERDIPs) for failure analysis and counterfeit protection inspection, with an adjustable Z-axis for prying point adjustment to accommodate various CERDIP part thicknesses.
• Can Opener Mechanical accessory device for opening metal can-style integrated circuit packages that cannot be etched by chemical means, using a process similar to a kitchen can opener to access dies encapsulated in metal.
• Semiconductor Manufacturing Services Full-service semiconductor manufacturing including silicon and sapphire ingot manufacturing, silicon and sapphire wafer production, custom bare die manufacturing to customer specifications, and testing equipment services.

Quantifiable outcome

• 5-year pump warranty demonstrates confidence in durability
• +4 more outcomes

Named customers9 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature11 records

Partnerships

One partnership is on record.

• AEIM Group Pte. Ltd.coreStrategic or Co-development PartnerAEIM Group Pte. Ltd. Singapore is the parent company of Nisene Technology Group. Nisene operates as an AEIM Group company and is branded as 'An AEIM Group' entity. The company has been part of the AEIM family since 2024 acquisition by Polymatech.

Scale indicators5 records

Recent moves8 records

Expansion highlights6 records

Broad incumbents

• Tokyo Electron: Major semiconductor etch and process equipment vendor with global service reach into the same fab customers that purchase Nisene's decapsulation systems.
• KLA Corporation: Dominant semiconductor process control and inspection vendor whose portfolio (including SPTS) overlaps with Nisene's failure-analysis customer base and could expand into decapsulation-adjacent workflows.
• Lam Research: One of the largest etch equipment vendors globally; while focused on high-volume fab etch, its tools and customer relationships set the benchmark for semiconductor etch technology Nisene competes with in specialty niches.
• Bruker: Large analytical instruments vendor whose X-ray, micro-CT, and inspection tools are deployed in the same failure-analysis labs that buy Nisene decapsulation equipment, making it a broad-incumbent peer in the same buyer workflow.
• Applied Materials: Broad semiconductor equipment incumbent with extensive etch and inspection offerings; serves many of the same fab and failure-analysis customers and could bundle decapsulation-adjacent capabilities.

Direct peers

• Oxford Instruments: Provides plasma etch and deposition tools for semiconductor R&D and failure analysis labs, competing with Nisene's PlasmaEtch Pro in chemical-free decapsulation applications.
• DISCO Corporation: Global leader in semiconductor dicing, grinding, and related sample-preparation equipment used heavily in failure analysis and package opening workflows that overlap with Nisene's decapsulation tools.
• Plasma-Therm: Supplies plasma etch and deposition equipment for semiconductor R&D and specialty fabs, including ICP/RIE systems used for package decapsulation and failure analysis, directly competing with Nisene's PlasmaEtch Pro.
• SPTS Technologies (KLA): KLA's plasma etch division offers DRIE and plasma etch tools used in advanced packaging and failure-analysis sample preparation, addressing the same labs as Nisene's JetEtch and PlasmaEtch systems.

Emerging players

• Buehler (ITW): Supplies metallographic sample-preparation equipment (cutting, grinding, polishing) used alongside decapsulation in failure-analysis labs, making it an adjacent peer in the cross-section workflow rather than a direct decapsulation competitor.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/nisene-technology-group-inc

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Nisene Technology Group