What Laird Performance Materials does

Laird Performance Materials is a product brand under Qnity Electronics, Inc. that designs, manufactures, and sells electronic protection and performance materials, organized into three business units: Thermal & Power (thermal interface materials including gap fillers, phase change materials, thermal greases, and liquid gap fillers, plus inductive components such as ferrite cores, power inductors, and wireless charging coils), Electromagnetic (EMI shielding products including microwave absorbers, fabric-over-foam gaskets, electrically conductive elastomers, form-in-place elastomers, board-level shields, and precision metal fingerstock gaskets), and Integrated Solutions (co-engineered multi-functional shields combining thermal and EMI capabilities). The company's underlying technology rests on proprietary materials science spanning magnetic ceramic powders, thermal compound resins, conductive elastomers, and Beryllium Copper metal stamping, supported by in-house simulation, modeling, prototyping, and automated inspection capabilities.

The company sells to enterprise customers across at least eight verticals — 5G wireless infrastructure, aerospace and defense, automotive, consumer electronics, datacenter, industrial, medical, and artificial intelligence — with a hybrid go-to-market combining direct enterprise field sales (quote-based, multi-year contracts, co-engineering engagement), a global distributor and converter network, manufacturer representative firms, and an Octopart-powered quick-purchase channel. Pricing is opaque and quote-based rather than publicly listed, consistent with custom-engineered, design-in hardware sales rather than commodity distribution. Select customers include major defense contractors for survivability and EMI applications and Tier 1 automotive suppliers such as BorgWarner for e-mobility thermal management, as recognized by the 2025 BorgWarner Innovation Award and the 2025 ASE Best Supplier in Advanced Packaging Materials award.

Laird traces its origins to a 2000 founding as Laird Technologies, was acquired by DuPont in 2018, and was subsequently acquired by Qnity Electronics in 2025–2026, under which it now operates as a brand within a semiconductor and electronics-focused materials platform. Headcount is reported at 5,001–10,000 employees with a self-described global manufacturing footprint; revenue is not publicly disclosed.

Name

Laird Performance Materials

Legal name

Qnity Electronics, Inc.

Website

https://laird.com

Company type

Private

Founded year

2000

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Laird Performance Materials, a product brand under Qnity Electronics, designs and manufactures thermal interface materials, EMI shielding products, and inductive components, selling through direct enterprise sales and global distribution to customers in 5G, aerospace and defense, automotive, datacenter, and consumer electronics.

Ownership category

akta.pro rank

Product category

Electronic Materials (Thermal Management & EMI Shielding)

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing (334416)

SIC

Electronic Components, Nec (3679), Electronic Coils, Transformers & Other Inductors (3677)

akta.pro primary industry

Thermal Management Components (Heat sinks, TIMs, fans/blowers, thermal pads) (IMAGAJAL)

akta.pro secondary industries

Thermal & EMI/EMC Interconnect Materials (Shielding, Gaskets, Grounding) (HDAHAOAL), Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

Keywords

• Thermal interface materials
• EMI shielding solutions
• Inductive components
• Wireless charging coils
• Precision metal stamping

Headquarters

HQ city

Xinzhuang

HQ country

China

HQ region

Asia

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. Thermal Interface Materials: Sale of thermal gap fillers, thermal pads, phase change materials, thermal greases, and thermally conductive insulators. Products sold as standard catalog items and custom-engineered solutions. One-time product sales with potential for repeat orders as products are incorporated into customer device designs.
2. EMI Shielding Products: Sale of microwave absorbers, fabric-over-foam gaskets, electrically conductive elastomers, form-in-place elastomers, fingerstock metal gaskets, and board level shields. Products sold as standard and custom configurations.
3. Inductive Components: Sale of wireless charging coils, power inductors, signal inductors, ferrite cores, EMC components, and common mode chokes. Products designed for power delivery and signal integrity preservation.
4. Custom Engineering and Co-engineering Services: Integrated Solutions business partners with companies globally to co-engineer modified board-level shielding and precision metal parts. Includes simulation, modeling, rapid prototyping, and lab testing during early design stages.

Pricing tiers

Go-to-market motion2 records

Distribution channels5 records

Marketing channels7 records

Core offering

Laird Performance Materials manufactures and sells thermal interface materials (gap fillers, thermal pads, phase change materials, thermal greases, liquid gap fillers), EMI shielding products (absorbers, fabric-over-foam gaskets, conductive elastomers, fingerstock gaskets, board level shields, vent panels), inductive components (EMC components, ferrite cores, power and signal inductors, wireless charging coils), custom precision metal stamping, semiconductor assembly materials, and LED silicone materials. The company also offers integrated multi-functional solutions that co-engineer thermal and EMI capabilities within a single design, supported by simulation, modeling, prototyping, and lab testing services.

Product overview

Laird Performance Materials is a product brand under Qnity Electronics, offering a comprehensive portfolio of electronic protection and performance solutions organized into three primary business units: Thermal & Power (thermal interface materials, inductive components, wireless charging), Electromagnetic (EMI shielding, absorbers, enclosure solutions), and Integrated Solutions (co-engineered shields, multi-functional solutions). The product portfolio includes thermal interface materials (gap fillers, greases, phase change materials, liquid gap fillers), absorbers (microwave, mmWave, foam, elastomer types), inductive components (EMC components, ferrite cores, power inductors, wireless charging coils), EMI shielding solutions (board level shields, fabric-over-foam, conductive elastomers, fingerstock gaskets, vent panels), semiconductor assembly materials, LED silicone materials, and multi-function solutions combining thermal and EMI capabilities. The products serve markets including 5G wireless, aerospace/defense, automotive, consumer electronics, datacenter, industrial, and medical sectors.

Differentiator

Problem solved

Functional benefit

Brands

• Tflex: Thermal interface materials product line including gap fillers, pads, and thermal solutions
• Eccosorb
• Eccostock
• CoolZorb
• Steward
• Tputty
• Tgrease
• Tgel
• NoiseSorb
• MaxAir
• EcoTemp
• EcoGreen
• ElectroSeal
• Laird ISE

Products and services

• Thermal Interface Materials Complete line of thermal interface sheets/pads, phase change materials, thermal greases, thermally conductive insulator materials, and liquid gap fillers for effective heat transfer in electronics cooling across telecom, datacom, servers, automotive, and consumer applications.
• Absorbers Microwave and mmWave absorber products including foam absorbers, elastomer absorbers, low loss dielectrics, and specialty absorbers for reducing electromagnetic interference and radiated energy from free space to cavity resonance applications.
• Enclosure Level EMI Shielding EMI shielding solutions including fabric-over-foam gaskets, conductive fabrics, conductive foam gaskets, vent panels (MaxAir), and EMI tapes for computer, telecommunications, and other enclosure applications.
• PCB Component EMI Shielding & Grounding Contacts Board level shields (BLS) and SMD metal contacts for EMI shielding and grounding at the component level on printed circuit boards, including one-piece and two-piece designs for six-sided protection.
• Custom Precision Metal Stamping – EMI & Non-EMI Precision stamped metal shields and fingerstock metal gaskets for custom EMI shielding and grounding solutions, including SMD metal contacts and various mounting configurations.
• Inductive Components - EMC Components and Ferrite Cores EMC components including common mode chokes, ferrite beads, ferrite cable cores, ferrite chip beads, ferrite plates and disks, ferrite rods, ferrite sheets, ferrite toroids, and nanocrystalline sheets for signal integrity and EMI suppression.
• Inductive Components - Inductors for Power and Signal Lines Power inductors including molded surface mount inductors, multilayer power inductors, and wire-wound SMT inductors for power and signal line applications with high current handling and signal integrity preservation.
• Wireless Charging Coils and Ferrite Plates/Sheets Wireless charging coil assemblies (Steward brand) and ferrite plates/sheets for wireless power transfer applications including transmitter and receiver coil modules meeting WP Qi standard, with automotive-grade assemblies available.
• Multi-function Solutions (MFS) Integrated thermal and EMI solutions combining multiple material functions including CoolShield thermal/EMI shields, HeatsinX enhanced heatsinks, ShieldZorb RF absorbers, CoolZorb combined thermal/absorber materials, and engineered thermoplastics.
• Semiconductor Assembly Materials Materials for semiconductor assembly including die attach adhesives, lid seal adhesives, and thermal interface materials for chip-level packaging applications.
• LED Silicone Materials Silicone materials for LED applications including die attach adhesives, optical encapsulants, and optical white reflector materials for LED lighting systems.
• Laird ISE (Integrated Solutions Engineered) Co-engineering Services Co-engineering services combining EMI shielding with heat transfer capabilities, providing simulation, modeling, rapid prototyping, lab testing, and single-source design support from concept to manufacturing.
• Tflex SF16 Gap Filler 16 W/mK non-silicone gap filler combining industry-leading thermal conductivity with low hardness to protect components in demanding electronics thermal management applications.
• Steward MAF06 Power Inductors High current, low DCR molded SMT power inductors for high efficiency power delivery applications.
• Tflex HR 6.5 Thermal Pad 6.5 W/mK thermal pad with superior spring back and vibration resistance for vibration-prone thermal management applications.
• SNN1055HSLV Form-in-Place EMI Shielding Paste Low-volatile heat curable form-in-place silicone paste for automated EMI shielding gasket dispensing on plastic enclosures and electronic assemblies.
• Tputty 607MF Liquid Gap Filler Single-part dispensable silicone-based gap filler with 6.2 W/mK thermal conductivity and higher fluidity for liquid gap filler applications.
• TYS Series Power Inductors Extreme low profile power inductors with magnetic resin shield construction for high current and low DCR power circuit applications.
• Tflex CR550 Liquid Gap Filler Two-part dispensable silicone-based gap filler with 5.4 W/mK thermal conductivity for liquid gap filler applications.
• Tflex SF4 and SF7 Gap Fillers Non-silicone based gap fillers with high compliance for thermal management in electronics.
• Tflex CR350S Dispensable Gap Filler Ultra-soft two-part dispensable gap filler with 3.6 W/mK thermal conductivity and lower hardness for sensitive components.
• Tgel 600 All-in-One Dispensable Thermal Solution All-in-one dispensable thermal solution combining grease and gap filler properties for thin bondline and large gap applications.
• BMI-S-608 Board Level Shield Integrated cost-saving board level EMI shielding solution for PCB component protection.
• Tgard TNC-6 Series Thermally Conductive Adhesive Film Thermally conductive and electrically insulative adhesive film for thermal interface applications.

Quantifiable outcome

• 16 W/mK thermal conductivity achieved with non-silicone based Tflex SF16 gap filler
• +2 more outcomes

Named customers1 record

Segments8 records

Ideal customer profiles6 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

One partnership is on record.

• Qnity ElectronicscoreOthersLaird is now a product brand under Qnity, a global leader in materials and solutions for the semiconductor and electronics industries. Qnity Electronics acquired and integrated Laird Performance Materials into its portfolio.

Scale indicators5 records

Recent moves4 records

Expansion highlights5 records

Direct peers

• Momentive Performance Materials: Momentive competes with Laird in silicone-based thermal interface materials, thermal greases, and encapsulants, particularly for LED, automotive, and consumer electronics applications.
• Indium Corporation: Indium Corporation offers thermal interface materials, solder, and semiconductor assembly materials that overlap with Laird's TIM and semiconductor assembly product lines for chip-level packaging.
• Rogers Corporation: Rogers Corporation competes directly with Laird in high-frequency circuit materials, thermal management substrates, and EMI/thermal solutions for 5G base stations, aerospace/defense, and automotive radar applications.
• Boyd Corporation: Boyd supplies thermal management and EMI shielding solutions including gap fillers, gaskets, and integrated cooling assemblies to similar datacenter, EV battery, and industrial electronics customers as Laird.
• Parker Hannifin (Chomerics): Parker's Chomerics division directly competes with Laird's EMI shielding portfolio, offering conductive elastomers, form-in-place gaskets, board level shields, and thermal management materials to aerospace, defense, telecom, and automotive OEMs.
• Henkel (Bergquist): Henkel's Bergquist brand is one of the closest direct competitors to Laird in thermal interface materials (gap fillers, phase change materials) and silicone-based thermal solutions for electronics, serving the same automotive, telecom, and consumer electronics customers.

Broad incumbents

• 3M: 3M's Electronics Materials division competes across thermal interface materials, EMI shielding, and adhesive solutions as part of a much broader industrial portfolio, leveraging scale and global distribution that Laird must match in design-ins.
• DuPont: Former owner of Laird Performance Materials and still a major competitor through DuPont Electronics & Industrial, offering Kapton polyimide films, thermal management materials, and semiconductor packaging adjacencies to overlapping customers.
• Shin-Etsu Chemical: Shin-Etsu supplies silicone-based thermal interface materials and EMI-related electronic materials at scale, competing with Laird's silicone gap fillers and elastomer shielding products especially in Asian markets.

Emerging players

• Würth Elektronik eiSos: Würth Elektronik offers inductive components (power inductors, chokes, ferrites) and EMI shielding products that overlap with Laird's Steward wireless charging coils, ferrite cores, and EMC component lines, particularly serving mid-market European customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/channel/UCOh5gksFEghELTDOWjG_kRQ
• LinkedInlinkedin.com/company/qnityelectronics

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Laird Performance Materials