What NAMICS does

NAMICS Corporation is a privately held Japanese specialty materials company founded in 1947 (originally as Hokuriku Toryo Co., Ltd., renamed in 1996) and headquartered in Niigata City, Japan. It designs, manufactures, and sells electro-chemical materials — conductive pastes, insulating materials, encapsulation compounds, and adhesive films — used in semiconductor packaging, electronic components, power modules, and solar cells. Core product families include CHIPCOAT (high-purity insulating paste, produced in cleanrooms since 1984), UNIMEC (thermoset conductive paste, commercialized 1981), HIMEC (silver sintering conductive paste, developed 1971), and the newly commercialized Liquid Compression Mold Underfill (LCMUF) for advanced packaging. The company is led by President Toshinobu Odajima, with a 773-person workforce as of March 2025 and FY2024 sales of JPY 102.1 billion, of which over 80% is derived from overseas markets.

The business model is direct enterprise sales of custom-formulated, specification-driven materials to major semiconductor manufacturers and OSATs, supported by wholly-owned sales subsidiaries across the U.S., Europe, Singapore, Korea, China, Taiwan, and Hong Kong, plus manufacturing facilities in China (Yantai) and Taiwan (Miaoli). Customers include Intel, TSMC, and ASE Holdings — each of which has recognized NAMICS with major supplier awards in 2020, 2024, 2025, and 2026. The company pursues a "Small but Global" strategy targeting niche electro-chemical applications under its SEEDS development concept (Semiconductor, Environment, Energy, Device, System), with 5% of sales reinvested in R&D. Certifications include ISO 9001, ISO 14001, IATF 16949, and SBT 1.5°C, and 2024–2025 milestones include the JIEP Technology Award for LCMUF and a carbon-neutrality commitment by 2050.

Name

NAMICS

Legal name

NAMICS CORPORATION

Website

https://namics.co.jp

Company type

Private

Founded year

1947

Operating status

Operating

Headcount range

501–1,000 employees

Short description

NAMICS Corporation is a privately held Japanese specialty materials company that designs and manufactures electro-chemical materials — conductive pastes, insulating pastes, and encapsulation compounds — for semiconductor packaging, electronics, and energy applications, selling direct to chipmakers and OSATs globally with over 80% of FY2024 sales (JPY 102.1 billion) from overseas.

Ownership category

akta.pro rank

Product category

Electronic Materials for Semiconductor Packaging

NAICS

Adhesive Manufacturing (32552), Paint and Coating Manufacturing (325510), Paint and Coating Manufacturing (32551)

SIC

Electronic Components, Nec (3679), Miscellaneous Chemical Products (2890), Adhesives & Sealants (2891), Industrial Organic Chemicals (2860)

akta.pro primary industry

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

akta.pro secondary industries

Dielectrics & Insulating Materials Chemicals (Low-k/High-k precursors) (IMAEAKAJ), PCB & Electronics Manufacturing Chemicals (Desmear, micro-etch, plating, fluxes) (IMAEAKAL), Conductive/ESD & EMI-Shielding Compounds (IMANABAH), Electroplating & Metallization Chemicals (Cu/Ni/Au plating, additives) (IMAEAKAK), Deposition Precursors (CVD/ALD Precursors, Metalorganics) (IMAEAKAG)

Keywords

• Semiconductor packaging materials
• Conductive pastes
• Insulating materials
• Encapsulation materials
• Electronic component materials

Headquarters

HQ city

Niigata

HQ country

Japan

HQ region

Asia

Offices16 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Electro-chemical materials sales: Research, development, manufacture and sales of electro-chemical materials for electronic components including conductive pastes, insulating materials, encapsulation materials, and adhesives. Revenue is generated through direct sales to semiconductor and electronics manufacturers globally. Approximately 80% of sales derived from overseas markets.

Go-to-market motion2 records

Distribution channels4 records

Marketing channels1 record

Core offering

NAMICS researches, develops, manufactures, and sells electro-chemical materials for the electronics and semiconductor industries. The product portfolio centers on conductive pastes (thermoset and sintering types), insulating materials (high-purity pastes for semiconductors and resistors), encapsulation compounds (liquid compression mold underfill, capillary underfill), protective coatings, and functional adhesive films used in chip packaging, assembly, and interconnect applications.

Product overview

NAMICS develops and manufactures electro-chemical materials for the electronics and semiconductor industries. The product portfolio centers on two core technologies: insulating and conductive materials, supported by formulation and dispersion process capabilities. The main product lines include: conductive pastes (UNIMEC thermoset, HIMEC sintering type, Low-temperature Sinterable Ag Nano Paste) for electrode and die attach applications; insulating materials (CHIPCOAT for semiconductors, OHMCOAT for resistors) and encapsulants including Liquid Compression Mold Underfill and Capillary Underfill; protective coatings (Overcoat, Glass Preform); and functional films (ADFLEMA insulating adhesive film, Low Modulus Thermal Conductive Film). Products serve semiconductor, electronics packaging, automotive, energy (solar PV), and device applications through the company's SEEDS development concept covering Semiconductor, Environment, Energy, Device, and System growth fields.

Differentiator

Problem solved

Functional benefit

Brands

• Chipcoat: High purity insulating paste used in semiconductors
• UNIMEC
• HIMEC
• Ohmcoat
• ADFLEMA
• CuTAP
• NAMICS Techno Core
• えびがせ保育園アミック (Ebigase Nursery School Amic)

Products and services

• CHIPCOAT (チップコート) High purity insulating paste used in semiconductors, produced in a cleanroom facility for protecting and insulating semiconductor components.
• UNIMEC (ユニメック) Thermoset conductive paste commercialized in 1981 for electronic component applications requiring heat-based curing.
• HIMEC (ハイメック) Sintering type electro-conductive paste developed in 1971 using silver paste technology that sinters to form conductive pathways for terminal electrodes.
• Overcoat Protective coating product for electronic components providing insulation and environmental protection.
• KINOMEC (キノメック) Stretchable paste designed for applications requiring flexible conductive pathways.
• Glass Preform Glass preform products for electronic packaging and semiconductor applications.
• Liquid Compression Mold Underfill (LCMUF) Encapsulation material for advanced semiconductor packages that simultaneously encapsulates the gap between interposer and chips plus peripheral parts in a single compression molding step, with optimized resin and filler design for warpage reduction and high flowability.
• ADFLEMA Insulating Adhesive Film Insulating adhesive film for high-frequency applications and low modulus thermal conductive film for metal base substrates, used in advanced electronic packaging.
• CuTAP (Cu Treatment Adhesion Promoter) Copper treatment adhesion promoter enhancing bonding between copper surfaces and encapsulant materials.
• EMI Shielding Pastes Conductive pastes providing electromagnetic interference shielding for electronic components.
• Capillary Underfill Material Underfill material for flip-chip applications using capillary flow technology, designed for harsh environment conditions.
• Low-temperature Sinterable Ag Nano Paste Silver nano-particle paste that sinters at low temperatures for terminal electrodes and advanced packaging applications.

Quantifiable outcome

• Received 2026 Intel EPIC Supplier Award recognizing excellence in quality, technological capability, collaboration, and continuous improvement among thousands of Intel suppliers worldwide
• +4 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Eight partnerships are on record, tiered core and secondary.

• ASE HoldingscoreStrategic or Co-development Partner · 24 April 2026NAMICS received the 2025 Best Supplier Award at ASE Holdings Annual Supplier Day 2026. ASE Holdings (including subsidiaries ASE, SPIL, and USI) is a major semiconductor assembly and test company. NAMICS was honored for providing advanced materials solutions and ensuring stable supply in the semiconductor field.
• Intel CorporationcoreStrategic or Co-development Partner · 24 March 2026NAMICS is a supplier to Intel Corporation, providing electronic component materials for semiconductor packaging. NAMICS has received multiple supplier awards from Intel including the 2026 Intel EPIC Supplier Award and the 2020 Preferred Quality Supplier (PQS) Award. Intel's CEO recognized NAMICS as representing the strength of Intel's global supply chain and the trust built through long-standing partnerships.
• TSMCcoreStrategic or Co-development Partner · 2 December 2024NAMICS received the 2024 TSMC Excellent Performance Award for outstanding technology collaboration and production support in advanced packaging at TSMC's 2024 Supply Chain Management Forum. This recognizes NAMICS' technological expertise and production capabilities that have strengthened TSMC's technology leadership.
• Topco Scientific Co., Ltd.secondaryChannel Partner/ Reseller/ DistributorOverseas agency handling NAMICS products distribution in Taiwan. Office relocated to No. 176, Zhouzi St., Neihu Dist., Taipei City 114064, Taiwan in October 2025.
• Telegent Technology CorporationsecondaryChannel Partner/ Reseller/ DistributorOverseas agency handling NAMICS products distribution in Taiwan.
• Topco Scientific (Shanghai) Co., Ltd.secondaryChannel Partner/ Reseller/ DistributorOverseas agency handling NAMICS products distribution in China (Shanghai region).
• CDS Electronique s.a.secondaryChannel Partner/ Reseller/ DistributorOverseas agency handling NAMICS products distribution in France.
• Hilpert electronics AGsecondaryChannel Partner/ Reseller/ DistributorOverseas agency handling NAMICS products distribution in Switzerland.

Scale indicators6 records

Recent moves21 records

Expansion highlights5 records

Direct peers

• Indium Corporation: Indium Corporation is a US-based specialty materials producer of solder pastes, fluxes, underfills, and conductive materials for semiconductor assembly, with overlapping product categories to NAMICS' conductive pastes and underfill materials.
• Sumitomo Bakelite Co., Ltd. Sumitomo Bakelite manufactures epoxy molding compounds and encapsulants for semiconductor packaging, directly overlapping NAMICS' encapsulation material offerings. Both serve Japanese and global semiconductor packaging customers.
• Ajinomoto Fine-Techno Co. Ajinomoto Fine-Techno manufactures ABF (Ajinomoto Build-up Film) for IC package substrates, a key electronic material in advanced semiconductor packaging. It competes with NAMICS' LCMUF and underfill products in advanced packaging applications.
• Tanaka Precious Metals: Tanaka produces precious metal conductive pastes and metallization materials, including silver pastes comparable to NAMICS' HIMEC and UNIMEC lines. Both serve semiconductor and electronics packaging customers in Japan and globally.
• Resonac Corporation (formerly Showa Denko Materials): Resonac is a Japanese specialty materials company that co-developed NAMICS' LCMUF technology and competes directly in semiconductor packaging materials including encapsulants, underfills, and die attach materials. Same customer base (TSMC, Intel) and overlapping product portfolio make it the closest direct competitor.

Broad incumbents

• Kyocera Corporation: Kyocera produces semiconductor packaging materials and electronic components, including some specialty chemical formulations. While primarily a components manufacturer, it has overlapping semiconductor materials capabilities and similar Japanese heritage.
• Henkel AG & Co. KGaA: Henkel's Adhesive Technologies division is a global leader in electronic materials, including underfills, conductive pastes, and encapsulants for semiconductor packaging. Comparable to NAMICS in serving Tier-1 semiconductor customers, but with significantly broader portfolio and scale.
• Shin-Etsu Chemical Co., Ltd. Shin-Etsu Chemical is a major Japanese specialty materials manufacturer producing encapsulants, silicones, and photoresists for semiconductor manufacturing. While broader than NAMICS in scope, it competes in adjacent materials categories for the same customer base.
• Dow Inc. Dow's electronics materials division produces encapsulants, underfills, and specialty chemicals for semiconductor packaging. As a global chemical conglomerate, Dow competes with NAMICS in advanced packaging materials at scale.
• Hitachi Chemical (Resonac HD): Now part of Resonac, Hitachi Chemical's electronic materials division produces packaging materials including underfills, encapsulants, and conductive materials for semiconductor manufacturing, with similar Tier-1 customer relationships.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• Xx.com/Pj1Nami

Compliance6 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries12 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments2 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about NAMICS