Custom Interconnect
- Company typePrivate
- Founded1987
- HeadquartersAndover, United Kingdom
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Custom Interconnect does
Custom Interconnect Limited (CIL) is a UK-based electronics manufacturing services (EMS) and outsourced semiconductor assembly and test (OSAT) provider headquartered in Andover, Hampshire. Founded in 1989 and operating from two Andover sites totaling 100,000 sq ft, CIL delivers vertically integrated production from wafer bumping through to tested, boxed electronic assemblies, with particular depth in wide-bandgap (SiC and GaN) power packaging, flip chip/WLCSP, wire bonding, chip-on-board, and surface-mount PCBA. Its flagship BP2 facility is the UK's largest semiconductor packaging site, housing a 15,000 sq ft ISO7 cleanroom, the country's first PacTech SB2-Jet laser solder ball reflow system, and one of only three Boschman silver sinter presses in Europe.
CIL serves enterprise customers across medical, automotive BEV/PHEV, communications (including 5G RF), aerospace and space tech, defense, oil and gas, industrial, and transportation infrastructure. Disclosed customers include BMW and Jaguar Land Rover (via Advanced Propulsion Centre programs for SiC power modules), Halliburton (high-temperature downhole electronics for ~10 years), OxVent (COVID-era ventilator electronics), Novarix (medical imaging devices), and unnamed military reflex sight manufacturers. The company holds AS9100 Rev D, ISO 13485:2016, and ISO 9001:2015 certifications, and is part of nine InnovateUK/DER/APC consortium projects with combined program values of £65M and CIL's share of approximately £8M.
Revenue is generated through B2B contract manufacturing on a project-quoted basis, with engineering-led proposals for complex OSAT and PCBA work and no reseller or distribution channel. Planned turnover for FY2026 is £45M, reflecting 400% growth since 2021 driven by capacity expansion (34,000 to 100,000 sq ft), automated assembly throughput scaling, and entry into power electronics and RF packaging. The company is privately held with no disclosed external equity investment, funding growth through customer contracts, government innovation grants, and reinvested profits; senior management is long-tenured, led by Managing Director John Boston (with the company since 1989).
Custom Interconnect firmographics
Firmographics- Name
- Custom Interconnect
- Legal name
- Custom Interconnect Limited
- Website
- https://www.cil-uk.co.uk/
- Company type
- Private
- Founded year
- 1987
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Ownership category
- akta.pro rank
Custom Interconnect industry classification
Industry- Product category
- Contract Electronics Manufacturing Services
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441)
- SIC
- Electronic Components, Nec (3679), Printed Circuit Boards (3672)
- akta.pro primary industry
- Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)
- akta.pro secondary industries
- Power Modules (IGBT/MOSFET/SiC/GaN Modules) (HDAHAHAH), Leadframes & Package Interconnect Materials (HDAHADAF)
Keywords
Where Custom Interconnect is headquartered
LocationHeadquarters
- HQ city
- Andover
- HQ country
- United Kingdom
- HQ region
- Europe
Offices2 records
Markets served
Custom Interconnect business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D
Revenue model
- Semiconductor Packaging OSAT Services: Outsourced semiconductor assembly and test services including wafer dicing, die bonding, wire bonding, encapsulation, device test for Si, SiC, GaN, and compound semiconductor devices
- Electronics Manufacturing Services (EMS): SMT board assembly, conventional PCB assembly, inspection and testing services for prototype through volume production
- Power Electronics for BEV/PHEV: SiC and GaN power module design and manufacture for electric vehicle applications
- Box Build & Product Assembly: Complete product build services beyond PCB assemblies
- Design Services: Hardware and software design services using network of design partners
- Rapid Prototyping: Fast-turnaround prototype and pre-production services
Go-to-market motion1 record
Distribution channels1 record
Marketing channels5 records
Custom Interconnect product offering
Product offeringCore offering
Custom Interconnect Limited (CIL) is a UK-based vertically integrated electronics manufacturing services provider offering SMT board assembly, conventional PCB assembly, advanced semiconductor packaging (OSAT) including wafer dicing, die bonding, wire bonding, flip chip, WLCSP, and WBG power device packaging for SiC and GaN. The company operates the UK's largest OSAT facility at its 64,000 sq ft BP2 site with ISO7 cleanroom, and produces SiC power modules up to 1000A/1000V for BEV/PHEV vehicles, alongside rapid prototyping, box build, and design services.
Product overview
Custom Interconnect Limited (CIL) is a UK-based electronics manufacturing services provider offering a vertically integrated portfolio spanning prototype through volume production. The core offerings include Electronics Manufacturing Services (EMS) with SMT and conventional PCB assembly, Advanced Semiconductor Packaging (OSAT) with wafer-level processing through advanced packaging, Power Electronics for BEV/PHEV vehicles, Rapid Prototypes, Box Build, and Design Services. The company's flagship asset is its BP2 facility—the UK's largest OSAT facility—housing semiconductor packaging capabilities (wafer dicing, die bonding, wire bonding, encapsulation) alongside high-volume SMT PCBA production. The product portfolio connects these capabilities into a continuous manufacturing chain from wafer through to tested PCBA.
Differentiator
Problem solved
Functional benefit
Products and services
- Electronics Manufacturing Services (EMS) Full-service electronics manufacturing including SMT board assembly, conventional PCB assembly, inspection, testing, and production engineering services for customers from prototype through volume production across multiple sectors.
- Advanced Semiconductor Packaging (OSAT) Outsourced semiconductor assembly and test services including wafer dicing, flip chip, WLCSP, CSP, die bonding, wire bonding, chip on board (COB), plastic packaging, RF MMIC packaging, WBG power device (SiC and GaN) packaging, MCM and custom BGAs, system in package (SiP), LED and thermal management, and chip/die repackaging.
- Power Electronics for BEV & PHEV Vehicles Specialized power electronics manufacturing for battery electric and plug-in hybrid electric vehicles, including SiC power modules up to 1000A/1000V and GaN devices, with silver sinter die attach and high-pressure AMB to baseplate.
- Rapid Prototypes Rapid prototyping and pre-production service for early models and development projects with quick turnaround times, using a dedicated rapid prototype SMT PCBA line.
- Box Build Specialized product build facility extending beyond PCB assembly to complete box-level product manufacturing, providing fully integrated product assembly services.
- Design Services
Quantifiable outcome
- 400% revenue growth from 2021 to 2026 with £45M planned turnover
- +4 more outcomes
Companies that use Custom Interconnect
Customer profileNamed customers6 records
Segments8 records
Ideal customer profiles6 records
Custom Interconnect technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
Custom Interconnect partnerships and signals
Strategic signalPartnerships
Ten partnerships are on record, tiered secondary and core.
- University of Bristol / Nagoya UniversitysecondaryREWIRE-IKC collaboration with universities for power semiconductor technology development. Visit to CIL facilities to build international partnerships and identify collaboration opportunities.
- OSYRYS Consortium (24 partners including Safran, Airbus, ATR, Collins Aerospace, Liebherr, Thales)coreEU Clean Aviation project to develop hybrid-electric regional aircraft. CIL contributes power electronics and electrification expertise as part of 24-member consortium led by Safran Electrical & Power. €140M funding from Clean Aviation plus €200M in-kind contributions.
- UK Department for Science, Innovation and Technology (DSIT)coreFuture RAN Competition (FRANC) - £36M government-funded program supporting 14 projects for 5G Open RAN solutions. CIL participated in OranGaN project for RF GaN device packaging.
- Ultrawise Innovation, Tribus-D, University of Warwick, DZP Technologies, HPM, BioniqscoreDER PE2M project partners for restructuring UK supply chain for power electronics modules for aerospace using thermoplastic encapsulation technology
- INEX Microtechnology / Viper RFsecondaryOranGaN project (DSIT) developing 5G RF GaN MMIC components and QFN style packaging for 5G base station power amplifiers
- Compound Semiconductor Applications Catapult (CSA Catapult)coreProject GaNSiC partnership to develop novel silver sinter paste deposition for WBG semiconductors. CSA Catapult provides circuit design and testing expertise.
- BMW (Advanced Propulsion Centre)coreCIL joined BMW's APC15@FutureBEV consortium to develop next generation SiC power modules for BEV systems. This flagship project led to CIL's expansion into power electronics and creation of the BP2 facility.
- Jaguar Land Rover (APC20 EleVAIT)coreAPC20 EleVAIT project for electrified vehicle power electronics development
- Universities of Warwick, Cardiff, Swansea, Nottingham, Newcastle, Imperial College LondonsecondaryAcademic partnerships for InnovateUK projects and research collaboration on WBG semiconductor packaging
- 3 CatapultscoreWorking with multiple Catapult organizations including CSA Catapult to advance compound semiconductor applications
Scale indicators10 records
Recent moves10 records
Expansion highlights6 records
Custom Interconnect competitors and assessment
Company assessmentDirect peers
- Scanfil Oyj: Finnish EMS group operating production in Europe, Asia and the Americas with focus on industrial, automotive, energy and medical customers. Comparable to CIL as a vertically integrated European EMS offering both volume PCBA and box-build across similar end-markets.
- Note AB: Nordic (Sweden-headquartered) EMS provider serving industrial, automotive, defense and medical customers with NPI through volume production. Comparable to CIL as a mid-sized, multi-sector European EMS with proprietary technical capabilities and a similar revenue band.
- Hanza AB: Swedish contract manufacturer providing EMS and mechanical manufacturing services from sites in Northern and Central Europe. Comparable to CIL as a mid-sized European EMS with a similar regional/multi-vertical customer mix and value-added manufacturing model.
- Plexus Corp: US-headquartered EMS provider with global footprint, strong in complex regulated end-markets (medical, aerospace/defense, industrial). Comparable to CIL as a mid-market EMS emphasizing complex, regulated, low-volume-to-mid-volume PCBA work similar to CIL's Stage 1 / Stage 2 product mix.
- Inission AB: Nordic industrial EMS and mechanics provider with manufacturing in Sweden, Finland and Estonia serving industrial and medical customers. Comparable to CIL as a mid-market European EMS with full-box-build capability and similar scale.
- TT Electronics plc: UK-headquartered electronics manufacturer offering EMS, power conversion and sensor solutions to aerospace, defense, medical and industrial markets. Comparable to CIL as a UK domestic specialist in high-reliability electronics manufacturing for similar regulated sectors.
Broad incumbents
- Sanmina Corporation: Global EMS and ODM provider with both PCBA and integrated PCB/backplane substrate manufacturing, serving industrial, medical, automotive and communications customers. Comparable to CIL as a broad incumbent offering both PCBA and advanced packaging services to overlapping end-markets, but at substantially larger scale.
- Amkor Technology: Largest US-headquartered OSAT provider offering advanced packaging (flip chip, WLCSP, SiP) and test services to semiconductor and OEM customers globally. Comparable to CIL's OSAT offering (wafer dicing, die/wire bonding, flip chip, WLCSP) but at global scale with footprint across multiple geographies.
- ASE Technology Holding Co. World's largest OSAT provider with full spectrum of packaging and test services, including advanced packaging for SiC/GaN power devices and 5G RF components. Comparable to CIL on the advanced semiconductor packaging side but at multi-billion-dollar scale across Asia, Americas and Europe.
Others
- Hon.Twin Interconnect (Foxconn Interconnect Technology): Foxconn-affiliated interconnect and cable assembly business producing connectors, cables and module assemblies for 5G, automotive and industrial customers. Comparable to CIL only on the SiC power module and packaging-related assembly periphery; does not directly compete in OSAT or PCBA services.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Custom Interconnect social profiles
Digital presenceCustom Interconnect compliance and trust
Trust signalCompliance4 records
Custom Interconnect financial estimates
Financial estimateRevenue estimate
Valuation estimate
Custom Interconnect leadership team
Management profileNumber of profiles
Profiles12 records
Custom Interconnect funding detail
Funding detailFunding overview
Funding rounds1 record
Investors1 record
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Custom Interconnect M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Custom Interconnect
What does Custom Interconnect do?
Custom Interconnect Limited (CIL) is a UK-based vertically integrated electronics manufacturing services provider offering SMT board assembly, conventional PCB assembly, advanced semiconductor packaging (OSAT) including wafer dicing, die bonding, wire bonding, flip chip, WLCSP, and WBG power device packaging for SiC and GaN. The company operates the UK's largest OSAT facility at its 64,000 sq ft BP2 site with ISO7 cleanroom, and produces SiC power modules up to 1000A/1000V for BEV/PHEV vehicles, alongside rapid prototyping, box build, and design services.
Is Custom Interconnect a public or private company?
Custom Interconnect is a private company. It is classified as management employee owned and is currently operating.
When was Custom Interconnect founded?
Custom Interconnect was founded in 1987. It employs 101 to 250 people.
Where is Custom Interconnect based?
Custom Interconnect is headquartered in Andover, United Kingdom, in the Europe region.
How does Custom Interconnect make money?
Six revenue lines are on record. Semiconductor Packaging OSAT Services are the primary driver. The others are electronics Manufacturing Services (EMS), power Electronics for BEV/PHEV, box Build & Product Assembly, design Services and rapid Prototyping.
Who are Custom Interconnect's main competitors?
Direct peers on record are Scanfil Oyj, Note AB, Hanza AB, Plexus Corp, Inission AB and TT Electronics plc. Broad incumbents are Sanmina Corporation, Amkor Technology and ASE Technology Holding Co.. Hon.Twin Interconnect (Foxconn Interconnect Technology) is listed as an others.
Does Custom Interconnect have an API?
No public API is recorded for Custom Interconnect.
What industry is Custom Interconnect in?
Custom Interconnect's product category is Contract Electronics Manufacturing Services. Its primary akta.pro industry code is HDAHADAA, Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA), with a secondary code of HDAHAHAH, Power Modules (IGBT/MOSFET/SiC/GaN Modules). Its NAICS code is 33441 and its SIC code is 3679.