Name

Precision Surfacing Solutions

Legal name

Lapmaster Wolters GmbH

Website

https://precision-surface.com

Company type

Private

Founded year

2019

Operating status

Operating

Headcount range

501–1,000 employees

Ownership category

akta.pro rank

Product category

Industrial Precision Grinding and Lapping Machinery

NAICS

Machine Tool Manufacturing (333517)

SIC

Machine Tools, Metal Cutting Types (3541), Special Industry Machinery, Nec (3559)

akta.pro primary industry

Grinding, Honing & Superfinishing Equipment (IMAHADAE)

Keywords

• Precision grinding machines
• Lapping polishing equipment
• Surface finishing machinery
• Creep feed grinding
• Wafering slicing equipment

Headquarters

HQ city

Rendsburg

HQ country

Germany

HQ region

Europe

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Supply Chain, Operations, Marketing or Sales, Technology or R&D, Infrastructure

Revenue model

1. Industrial Machinery Equipment Sales: Sale of precision grinding, lapping, polishing, and deburring machines. Machines are sold with payment terms of 30% down payment upon order confirmation, 60% upon readiness for shipment, and 10% 30 days after invoice date.
2. Consumables and Spare Parts: Sale of consumables including lapping plates, polishing plates, diamond slurries, abrasive products, polishing pads, work holders, and replacement parts to maintain machines in operation
3. Service and Technical Support: Global service and technical support for all current and future customers including remote maintenance solutions and on-site service

Pricing tiers

Go-to-market motion2 records

Distribution channels2 records

Marketing channels5 records

Core offering

Precision Surfacing Solutions manufactures and sells industrial precision surfacing machinery and related consumables for grinding, lapping, polishing, deburring, and wafering applications. The company operates a portfolio of brands including Lapmaster Wolters, ELB-Schliff, aba, REFORM, KEHREN, MICRON, Peter Wolters, ISOG, and Barnes Technology, offering machines, consumables, and service to industrial manufacturers across aerospace, medical device, semiconductor, photovoltaic, optics, and automotive sectors.

Product overview

Precision Surfacing Solutions is an industrial machinery company that offers a portfolio of precision surfacing equipment organized under multiple well-established brands: Lapmaster Wolters (lapping, polishing, grinding, honing), ELB-Schliff and aba Grinding (surface and profile grinding), REFORM, KEHREN, and ISOG (Surface and Profile Grinding Division/SPG), MICRON (creep feed and profile grinding), Peter Wolters (lapping, polishing, fine grinding), and Barnes Technology. The company manufactures machines and systems along with comprehensive consumables including abrasive powders, slurries, lapping vehicles, diamond products, polishing pads, lapping plates, and precision accessories. The portfolio also includes wafering equipment acquired from Meyer Burger in 2019 for photovoltaic and semiconductor substrate processing. PSS serves 9,000+ active global customers across 13 manufacturing facilities on three continents, providing both standardized equipment and customized turnkey solutions for industries including automotive, medical technology, aerospace, and precision optics.

Differentiator

Problem solved

Functional benefit

Brands

• Lapmaster Wolters: Lapping and polishing machines, founded in Chicago in 1948, serving precision optics and advanced materials for more than 20 industries.
• ELB-Schliff
• aba Grinding
• REFORM
• KEHREN
• MICRON
• Peter Wolters
• Barnes Technology
• ISOG

Products and services

• Lapping Machines Precision lapping machines for processing components with high flatness requirements, including single-side and dual-side lapping equipment, sold to industrial manufacturers requiring micron-level accuracy.
• Polishing Machines Polishing equipment for producing high-quality scratch-free reflective surface finishes using diamond abrasive or chemical polishing agents, used by manufacturers of precision optics, advanced materials, and mechanical seals.
• Surface and Profile Grinding Machines Precision grinding machines for surface and profile machining applications including creep feed grinding, cylindrical grinding, and reciprocating grinding, sold to manufacturers in aerospace, automotive, and industrial production.
• HSG Surface Grinding Machines HSG surface grinding machines designed for fine grinding and deburring of turbine blades for engine rotors and gas turbines, featuring calibration block and on-board master, sold to aerospace and power generation manufacturers.
• REFORM Trirex Grinding Spindle Precision grinding spindle for ID/OD and surface grinding with 50 kW power, 400-4000 min-1 speed, and up to 600 mm grinding wheel diameter, sold to industrial manufacturers requiring high-power precision grinding.
• KEHREN RS Series Precision Grinding Machines Surface grinding machines with rotary table and vertical grinding spindle providing a hybrid solution for high stock removal rates while achieving high accuracies, sold to precision manufacturers.
• Meyer Burger Wafering Equipment and Service Business Photovoltaic and specialized substrate material wafering equipment and service business for semiconductor and sapphire industries, serving wafer manufacturers globally.
• Diamond Slurry, Lubricants, and Powders Diamond slurry with synthetic or polycrystalline diamond, available in water, petroleum, and emulsion bases with various concentrations, plus monocrystalline and polycrystalline synthetic diamond powders for lapping and polishing.
• Abrasive Powders Complete line of lapping abrasive products including aluminum oxide, silicon carbide, boron carbide, diamond powder, cerium oxide, and calcined aluminum oxide for various materials and applications.
• Abrasive Slurries Abrasive slurries with aluminum oxide, silicon carbide, and boron carbide suspended in oil or water-based gel, ranging from coarse for high stock removal to extremely fine for high precision applications.
• Lapping Vehicles Oil and water-base lapping vehicles for carrying abrasive to the lap plate, including lapping oils, honing oils, cutting oils, grinding oils, and concentrates like Aqualap, Aquasol, and Hysol.
• Lapping and Polishing Pads Felt, sponge rubber, tension pad sheets, and polishing pads including Pellon, Lapmaster Supreme, Kemet ASF, Suba 500, polyurethane, silk, nylon, cotton, and various specialized pads for different materials.
• Lapping Plates and Polishing Plates Cast iron, hardened steel, ceramic, glass, aluminum/stainless steel, and natural metal plates, including Kemet composites for diamond slurry processing with various groove patterns.
• AccuPol Wafer Thinning Fixtures Precision vacuum gauge fixtures for processing thin and fragile components, capable of thinning wafers to under 75 microns while maintaining taper to less than 1 micron, serving semiconductor manufacturers.
• Global Service and Technical Support Global service and technical support for all current and future customers, including remote maintenance solutions and on-site service, for precision surfacing machines and systems.

Quantifiable outcome

• Can process wafers down to under 75 microns thickness while maintaining taper to less than 1 micron
• +1 more outcomes

Named customers9 records

Segments6 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Partnerships

One partnership is on record.

• Meyer Burger Technology Ltd.coreStrategic or Co-development Partner · 7 February 2019PSS acquired Meyer Burger's wafering equipment and service business for photovoltaic and specialized substrate material (semiconductor and sapphire industries). The acquisition included taking over around 70 employees at Thun location and 26 globally, with PSS maintaining global service support for all current and future wafering customers. Non-PV wafering manufacturing continues in Switzerland while PV wafering production remains in China.

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• United Grinding Group: United Grinding (Studer, Walter, Schaudt, Mikrosa) is one of the largest grinding machinery groups globally and a direct competitor in surface, profile, and creep-feed grinding. Comparable across KEHREN, ELB, REFORM, and MICRON product lines.
• DMG Mori: DMG Mori is a global broad-line machine tool incumbent. While not a direct precision-grinding peer, it competes with PSS at large manufacturers for capex share and represents the broader competitive landscape for industrial precision OEMs.
• Haas Automation: Haas Automation is one of the largest CNC machine tool manufacturers in North America. Indirect competitor through competing for manufacturing customer capex budgets and serves as a benchmark for industrial machinery OEM scale.

Direct peers

• DISCO Corporation: DISCO is the global leader in precision wafer dicing and grinding equipment for semiconductors, directly competing with the Meyer Burger wafering business PSS acquired. Both serve advanced semiconductor packaging with thin-wafer processing technologies.
• Okamoto Corporation: Okamoto is a Japanese manufacturer of surface grinding machines and lapping/polishing equipment. Directly competes with PSS's surface grinding (ELB/aba) and lapping (Lapmaster) product lines across automotive, aerospace, and general industrial customers.
• Stahli Group: Swiss-based Stahli is a leading specialist in flat lapping and polishing machines for precision optics, advanced ceramics, and semiconductor substrates. Closely comparable to PSS's Peter Wolters and Lapmaster Wolters lapping/polishing portfolio.
• SpeedFam (Kobelco): SpeedFam (now part of Kobelco) specializes in precision lapping, polishing, and double-side grinding equipment for silicon wafers and advanced materials. Comparable to PSS's lapping machines and consumables for substrate manufacturers.
• Tokyo Seimitsu (Accretech): Tokyo Seimitsu manufactures wafer probing, dicing, and CMP equipment for semiconductors. Comparable to PSS's Meyer Burger-acquired wafer thinning business, both targeting advanced packaging and substrate processing customers.
• LAM Plan: French-based LAM Plan specializes in precision lapping and polishing machines plus consumables (diamond pastes, slurries). A direct niche competitor to PSS's Lapmaster and Peter Wolters brands in lapping equipment and consumables.

Emerging players

• Hamai Co., Ltd. Hamai is a Japanese manufacturer of double-disc grinding and lapping machines. Direct niche competitor to PSS's double-disc grinding and lapping portfolio, particularly relevant for automotive and bearing industry customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks2 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A2 records

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Precision Surfacing Solutions