Multek

What Multek does

Multek is a global manufacturer of printed circuit boards (PCBs) and interconnect solutions, founded in 1978 in Santa Ana, California, and currently headquartered in Irvine, California. The company was acquired by China's Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ, SZSE: 002384) in July 2018 and operates as a wholly-owned subsidiary. As part of DSBJ, Multek is positioned among the world's top ten PCB suppliers, with the combined parent group ranking as the world's third-largest PCB supplier. The company operates five global manufacturing sites, anchored by a 1.6–2.0 million square foot production campus in Zhuhai, China, with a new facility under construction in Chonburi, Thailand, targeted for Phase I completion in Q1 2025.

Multek's product portfolio spans multilayer rigid PCBs, high-density interconnect (HDI) boards featuring proprietary Every Layer Interconnect (ELIC) technology with up to 18+ layers of vertically-stacked copper-filled microvias, flexible circuits, rigid-flex circuits, inlay PCB technology, and thermal management solutions including embedded copper coin (COIN) structures. The company offers vertically integrated services from design-for-manufacturability (DFM) engineering, rapid prototyping with lead times of three days to three weeks, and advanced materials qualification through to volume production and SMT assembly. Multek holds certifications across automotive (IATF 16949, TISAX AL3), medical (ISO 13485), aerospace (AS9100D), information security (ISO/IEC 27001:2022), and environmental/quality (ISO 9001, ISO 14001, QC080000) standards.

Multek generates revenue primarily through hardware sales of PCBs and value-added assembly services via direct enterprise sales channels, with regional sales directors covering the Americas (Stephen Sims, Silicon Valley), EMEA (Kenth Svärd), and Asia (Stanley Chow, Hong Kong), plus a Japan channel partner (NTW). The company serves more than 300 active enterprise customers across nine verticals: telecommunications, computing and data communications, mobile devices, automotive, medical, wearables, consumer electronics, industrial/commercial/instrumentation, and energy. End-applications include 4G/5G network infrastructure, cloud servers, EV and autonomous driving electronics, medical diagnostics and implantable devices, smartphones, and AR/VR wearables. Pricing is quote-based and negotiated through account managers, with a Cadence DesignTrue DFM ecosystem partnership enabling real-time in-design manufacturability checking for customers.

Name

Multek

Legal name

Multek Corporation

Website

https://multek.com

Company type

Private

Founded year

1978

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Multek is a global PCB and interconnect solutions manufacturer, wholly-owned by China's DSBJ, producing rigid, HDI, flex, and rigid-flex circuits for automotive, telecom, computing, medical, mobile, and wearables customers across five global manufacturing sites.

Ownership category

akta.pro rank

Product category

Printed Circuit Board (PCB) Manufacturing

NAICS

Bare Printed Circuit Board Manufacturing (334412), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

PCB Fabrication (Rigid PCBs) (HDAHAOAG)

Keywords

• Printed circuit boards
• PCB manufacturing
• Flexible circuits
• Rigid-flex PCBs
• HDI interconnect

Headquarters

HQ city

Northfield

HQ country

United States

HQ region

North America

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. PCB Manufacturing and Sales: Multek generates revenue through manufacturing and selling printed circuit boards including rigid PCBs, flexible circuits, and rigid-flex circuits. The company offers full product lifecycle services from rapid prototyping and NPI through volume mass production, with typical lead times for prototypes ranging from three days to three weeks.
2. Assembly Services: Value-added Surface Mount Technology (SMT) and component assembly services offered in Zhuhai, China factories, including paste printing, high speed placement, atmosphere-controlled reflow, specialized joining processes, and continuous custody through final assembly, electrical test and inspection.

Pricing tiers

Go-to-market motion2 records

Distribution channels3 records

Marketing channels5 records

Core offering

Multek manufactures and sells printed circuit boards (PCBs) including multilayer rigid PCBs, high-density interconnect (HDI) boards, flexible circuits, and rigid-flex circuits, alongside thermal management solutions and value-added assembly services. The company serves electronics OEMs across automotive, telecommunications, computing, mobile, medical, wearables, and consumer electronics industries. Multek offers a full product lifecycle from design-for-manufacturability engineering and rapid prototyping (3 days to 3 weeks) through to volume mass production across global manufacturing sites.

Product overview

Multek is a global leader in printed circuit board (PCB) technology and value-added manufacturing, offering a comprehensive portfolio of interconnect solutions. The core product portfolio centers on Multilayer Rigid PCBs, High-Density Interconnect (HDI), Flexible Circuits, and Rigid-Flex Circuits—each available as distinct product lines with varying complexity tiers (e.g., Standard, HDI, ELIC-enabled). These are complemented by thermal management solutions (COIN, Thru-Hole Via Farm), Assembly Services, and Inlay PCB technology. Supporting services include Advanced Materials qualification, Reliability Testing, Design for Manufacturability (DFM) engineering services, and Rapid Prototyping/QTA offerings. The company serves diverse markets including Automotive, Telecommunications, Computing, Mobile, Wearables, Consumer Electronics, Industrial/Commercial/Instrumentation, Energy, and Medical sectors, enabling customers to move products from early engineering through prototype to volume production.

Differentiator

Problem solved

Functional benefit

Products and services

• Multilayer Rigid PCB Multilayer PCB processing for high layer count constructions, blind and buried via technologies, high-speed and ultra low-loss materials, and thermal solutions with attached or embedded copper coins, sold to electronics OEMs across automotive, telecom, computing, and other verticals.
• High-Density Interconnect (HDI) Advanced HDI PCB technology featuring microvia capabilities, laser drilling control, and fine line copper trace formation using semi-additive or subtractive copper plating, with continuous feature size reduction for miniaturized, high-density electronic assemblies.
• Flexible Circuits Single, double-sided, and multilayer flexible printed circuits using adhesive and adhesiveless polyimide film substrates with annual production exceeding millions of square feet, offered for mobile, wearable, automotive, medical, and consumer electronics applications.
• Rigid-Flex Circuits Integration of rigid board technologies with flexible circuit capabilities, including Standard Rigid-Flex, HDI Rigid-Flex with ELIC stacked copper-filled µVias, and Semi-Flex solutions for cost-effective 3D product assembly.
• Thermal Management Solutions Heat dissipation solutions including solid-plated µVia arrays, embedded metal structures (Coins), surface-attached heat transfer media, Thru-Hole Via Farm for dense via formations, and proprietary COIN technology for enhanced thermal dissipation in power amplifier boards and high layer count PCBs.
• Every Layer Interconnect (ELIC) Also known as Any Layer Technology, ELIC enables up to 18+ layers of vertically-stacked and copper-filled µVias with 0.3mm fine-pitch package support, edge plating, and active cavity structures for thin, high-density assemblies.
• Inlay PCB Technology Selective semi-finished inlay circuitry using high-frequency laminate embedded in FR4 laminate panels with 3D structuring, reducing the amount of high-frequency laminate required and enabling integration of thermal solutions into PCB designs.
• Assembly Services Value-added Surface Mount Technology (SMT) and component assembly services including specialized handling for flexible and rigid-flex circuits, paste printing, high-speed placement, atmosphere-controlled reflow, specialized joining processes, and continuous custody through final assembly, electrical test, and inspection.
• Rapid Prototyping & QTA Services Complete prototyping capabilities with typical lead times ranging from three days to three weeks; Quick Turn-around (QTA) and Super QTA services designed to fast-track products to market through a global network of R&D labs and quick-turn factory lines.

Quantifiable outcome

• Prototype lead times as fast as 3 days to 3 weeks depending on design complexity
• +2 more outcomes

Named customers6 records

Segments8 records

Ideal customer profiles7 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Two partnerships are on record, tiered core and minor.

• Cadence Design SystemscoreTechnology or IntegrationMultek joined the Cadence DesignTrue DFM (Design for Manufacturability) technology ecosystem as a founding member. Multek shares its PCB manufacturing rules with Cadence customers through the DesignTrue platform, enabling real-time in-design DFM checking. Customers using Cadence DesignTrue DFM technology report 50 to 67 percent fewer technical queries from manufacturers.
• NTW (Japan Partner)minorChannel Partner/ Reseller/ DistributorNTW serves as Multek's Japan partner, representing Multek at NEPCON Japan trade shows. NTW showcased Multek's latest technologies in rigid, flexible & rigid-flex PCBs at NEPCON Japan 2020.

Scale indicators8 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• TTM Technologies: US-headquartered, publicly traded PCB manufacturer serving aerospace/defense, automotive, computing and telecom customers with rigid, flex, HDI and substrate-like PCBs — the closest publicly visible analog to Multek across product mix and end markets.
• Zhen Ding Technology Holding: World-leading flexible PCB maker based in Taiwan/China serving smartphone, tablet, and wearable OEMs — directly comparable to Multek's flex circuits and rigid-flex lines that anchor its mobile and wearables customer base.
• Unimicron Technology: Major Taiwanese PCB and IC substrate manufacturer with multilayer, HDI and rigid-flex capability across computing, networking, automotive and mobile customers — competing head-to-head with Multek in HDI and multilayer rigid PCBs.
• Tripod Technology: Taiwanese PCB manufacturer specializing in multilayer, HDI and rigid-flex boards for networking, server, automotive and consumer electronics OEMs — overlapping with Multek's CEC (Communications, Enterprise, Compute) and automotive segments.
• AT&S (Austria Technologie & Systemtechnik): European-headquartered high-end PCB and substrate maker serving mobile, automotive, industrial and computing customers with HDI, rigid and substrate-like PCB technology — directly comparable to Multek's advanced HDI/ELIC roadmap.
• Nippon Mektron: Japan-based global leader in flexible printed circuits serving automotive, consumer electronics and mobile device OEMs — a direct competitor in flex PCB capacity and technology that Multek's flexible circuits business line is benchmarked against.
• Ibiden: Japanese manufacturer of high-density multilayer PCBs and IC substrates used in computing, mobile and AI applications — a comparable advanced-PCB player with similar HDI and substrate technology overlap to Multek's ELIC and multilayer rigid lines.
• Compeq Technology: Taiwanese PCB manufacturer focused on HDI, multilayer rigid and rigid-flex boards for networking, server and mobile customers — competes directly with Multek in CEC and mobile device PCBs.

Broad incumbents

• Flex (Flextronics): Global EMS giant and Multek's prior owner (divested in 2018 for ~$273M of China operations) — operates a much broader assembly/services portfolio but overlaps with Multek's SMT assembly and PCB-adjacent offerings to similar OEM customers.
• Foxconn (Hon Hai Precision Industry): World's largest EMS/contract manufacturer with vertically integrated PCB substrates (through its Sharp/InterElectronics and Sakai subsidiaries) competing with Multek for consumer electronics, mobile and computing OEM volumes.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance10 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles11 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Multek