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H-Square Corporation

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uuid000e9i7

Namestring
H-Square Corporation
Legal namestring
H-Square Corporation
Websiteurl
h-square.com
Company typeenum
Private
Founded yearint
1974
Short descriptiontext

H-Square Corporation designs, manufactures, and sells manual and automated wafer handling tools and equipment for semiconductor fabs globally, including sorters, transfer tools, aligners, Breeze non-contact wands, and cassettes.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
11–50
akta.pro rankint
HeadquartersSanta Clara, United States
HQ citystring
Santa Clara
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices2 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
semiconductor wafer handling, wafer transfer equipment, FOUP SMIF pod openers, wafer alignment systems, wafer shipping cassettes
Industry1 code
1Wafer Cleaning & Surface Preparation Equipment
CodeHDAHAEAGPrimaryYes
NAICS code1 code
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Semiconductors & Related Devices3674
Product category
Semiconductor Wafer Handling Equipment
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model2 records
1Hardware Equipment Sales
TypeOne Time License
Description

One-time sale of semiconductor wafer handling equipment including automated systems (WS300, WS200, AVT, AHWT), manual tools, vacuum wands, aligners, cassettes, and accessories. Products are sold directly through the website shop and through distributor network.

h-square.com
2Aftermarket Parts and Accessories
TypeHardware Sales
Description

Replacement parts, PEEK vacuum tips, wand holders, and consumables for existing equipment. Continuous revenue from customers needing replacement components for their H-Square tools.

h-square.com
Marketing channels4 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels4 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Operations, Supply Chain, Personnel, Technology or R&D, Marketing or Sales, Infrastructure
Pricing details8 tiers
1PEEK Vacuum Tips - Individual pricing
ModelUnit PricingBilling cadencePay-as-you-go
Notes

T693PKAS3: $97.00; T791PKAS: $129.00; T792PKAS: $129.00; T793PKAS3: $129.00; T794PKAS: $125.00; T691PKAS: $105.00; T692PKAS: $82.00; T695PKAS: $124.00; T696PK: $142.00; T3PKAS1 (300mm): $544.00

h-square.com
2Vacuum Wand Sets - Complete kits
ModelUnit PricingBilling cadencePay-as-you-go
Notes

VWSET-D (50-100mm): $371.00; VWSET-E (50-150mm): $371.00; VWSET-B (200mm): $363.00; VWSET-C (200mm thin wafer): $371.00; VWSET-A (300mm): $1,107.00; VWSET-F (small die): $388.00

h-square.com
3Breeze Non-Contact Wands
ModelUnit PricingBilling cadencePay-as-you-go
Notes

H2B-2 (vertical, 2 inch): $2,160.00; H2B-3: $2,160.00; H2B-4: $2,160.00; H2B-6: $2,376.00; H2B-8: $2,376.00; H2BST-3 (horizontal): $2,880.00; H2BST-4: $2,880.00; H2BST-6: $2,880.00; H2BST-8: $3,167.00; Holder H2BST: $771.00; H2BST-12 holder: $1,397.00

h-square.com
4Process Cassettes
ModelUnit PricingBilling cadencePay-as-you-go
Notes

Open End Wall Cassette (AMC): $675.00 - $860.00 depending on wafer size; FB Series 200mm thin wafer cassettes: Minimum order quantity 10 pieces

h-square.com
5Manual FOUP/FOSB Opener
ModelUnit PricingBilling cadencePay-as-you-go
Notes

FOMH Manual FOUP/FOSB Opener: $2,684.00 (currently out of stock)

h-square.com
6Mechanical Picks
ModelUnit PricingBilling cadencePay-as-you-go
Notes

MCP2-23 (50/75mm): $519.00; MCP2-23-S spatula: $608.00; MCP2-6 (150mm): $583.00; MCP2-8-S (200mm): $607.00; MCP2-12 (300mm): $1,333.00

h-square.com
7Escalator + Aligner System
ModelUnit PricingBilling cadencePay-as-you-go
Notes

AET Escalator + Aligner: $21,000.00

h-square.com
8Freedom Cordless Wands
ModelUnit PricingBilling cadencePay-as-you-go
Notes

FWCR2 (50-200mm cordless): $1,363.00; FWTTA1 (portable): requires tips; FWCR3 (300mm): $1,725.00; FWCR-4 (small device): $1,607.00

h-square.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

H-Square Corporation designs, manufactures, and sells semiconductor wafer handling equipment and tooling for wafer sizes ranging from 50 mm (2") to 300 mm (12"). Its portfolio spans manual tools such as vacuum wands, wafer aligners, and cassettes, as well as automated systems for loading and unloading process wafers in SMIF, FOUP, and standard cassette environments. The products are ESD-safe and ISO Class 3-5 cleanroom compatible, and are sold to wafer fabs, equipment makers, and research institutions worldwide.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 4 values shown
  • 96% repeat orders rate indicating customer retention
+3 more records
Product overview1 text field

H-Square Corporation is the longest-serving company dedicated to fab wafer handling processes, providing a comprehensive portfolio of automated and manual semiconductor handling solutions. The product portfolio centers on wafer transfer equipment including automated sorters (WS300, WS200), bulk transfer tools (AVT, AHWT, LCT2, LCT1AS12), and manual transfer systems (HWT). Supporting these core transfer systems are pod openers (SMIFPO, SMIFMAN, AFO, FOMH series) for FOUP/FOSB and SMIF pod management. Manual handling tools include Breeze non-contact Bernoulli wands (H2B, H2BST series), vacuum wands (NOASPF2, NO3AS1, FWTT), PEEK vacuum tips, mechanical picks, and inspection tools (BLIS, ETAS1, wafer presenters). Alignment solutions span automatic and manual flat and notch aligners. Process cassettes include aluminum, stainless steel thermal, and Fuji Bakelite thin wafer cassettes. All products are designed for cleanroom environments from ISO Class 3 to Class 5, featuring antistatic construction and compatibility with SEMI compliant carriers.

Product and service2 records
1Wafer Transfer Systems (Vacuum Wands)
CategoryWafer Handling Tools
Description

Hand-held and automated vacuum wand tools used to pick up and move individual semiconductor wafers without contacting the active device surface, suitable for use in ISO Class 3-5 cleanrooms.

2Wafer Alignment Tools
Scale indicator8 records

Each record includes

Type, Value, Description, Source

Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight4 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

TEL is a top-tier global WFE vendor with coater/developer systems that incorporate wafer handling subsystems; broad incumbent offering overlapping with H-Square's fab handling focus.

TypeDirect peer
Description

Nidec Sankyo produces vacuum and atmospheric wafer handling robots for fabs and OEMs; comparable to H-Square's wafer transfer and aligner products at the system level.

TypeDirect peer
Description

Daihen supplies wafer handling robots and transfer systems to semiconductor fabs, overlapping with H-Square's automated wafer sorter and bulk transfer tool portfolio.

TypeBroad incumbent
Description

Lam Research is a leading WFE vendor for etch and deposition; while not a direct handling competitor, its systems embed wafer handling functions adjacent to H-Square's product scope.

TypeDirect peer
Description

Kensington Labs specializes in precision wafer handling robots and aligners for semiconductor fabs — directly comparable to H-Square's aligner and automated wafer transfer product lines.

TypeBroad incumbent
Description

Entegris supplies fluid handling, filtration, and wafer/carrier solutions to semiconductor fabs — a broader incumbent in materials handling that overlaps with H-Square's cassette and carrier product lines.

TypeDirect peer
Description

Brooks Automation is the most direct competitor in semiconductor wafer handling automation, offering robotic wafer handlers, sorters, and SMIF/FOUP solutions to the same fab customer base as H-Square.

8Ichinen Services Co., Ltd.
TypeRegional player
Description

A Japanese specialist offering wafer handling-related services and equipment to Asian fabs — a regional peer to H-Square in the same product category but concentrated in Japan.

TypeDirect peer
Description

RORZE is a Japanese supplier of wafer handling robots, FOUP/reticle stockers, and automated transport systems used in 300mm fabs, directly competing with H-Square's automated sorter/transfer offerings.

TypeDirect peer
Description

Hirata builds automated wafer handling, stocker, and transport systems for semiconductor fabs — closely comparable in product scope and customer segment to H-Square's automated handling line.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat4 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers1 record

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment1 record

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile2 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature5 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

H-Square Corporation

Semiconductor Wafer Handling Equipmenth-square.com

H-Square Corporation designs, manufactures, and sells manual and automated wafer handling tools and equipment for semiconductor fabs globally, including sorters, transfer tools, aligners, Breeze non-contact wands, and cassettes.

H-Square Corporation firmographics

Firmographics
Name
H-Square Corporation
Legal name
H-Square Corporation
Website
https://h-square.com
Company type
Private
Founded year
1974
Operating status
Operating
Headcount range
11–50 employees
Short description
H-Square Corporation designs, manufactures, and sells manual and automated wafer handling tools and equipment for semiconductor fabs globally, including sorters, transfer tools, aligners, Breeze non-contact wands, and cassettes.
Ownership category
akta.pro rank

H-Square Corporation industry classification

Industry
Product category
Semiconductor Wafer Handling Equipment
NAICS
Semiconductor Machinery Manufacturing (333242)
SIC
Semiconductors & Related Devices (3674)
akta.pro primary industry
Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)

Keywords

  • Semiconductor wafer handling
  • Wafer transfer equipment
  • FOUP SMIF pod openers
  • Wafer alignment systems
  • Wafer shipping cassettes

Where H-Square Corporation is headquartered

Location

Headquarters

HQ city
Santa Clara
HQ country
United States
HQ region
North America

Offices2 records

Markets served

H-Square Corporation business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Operations, Supply Chain, Personnel, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

  1. Hardware Equipment Sales: One-time sale of semiconductor wafer handling equipment including automated systems (WS300, WS200, AVT, AHWT), manual tools, vacuum wands, aligners, cassettes, and accessories. Products are sold directly through the website shop and through distributor network.
  2. Aftermarket Parts and Accessories: Replacement parts, PEEK vacuum tips, wand holders, and consumables for existing equipment. Continuous revenue from customers needing replacement components for their H-Square tools.

Pricing tiers

ModelBillingPrice
Unit PricingPay-as-you-goPEEK Vacuum Tips - Individual pricing
Unit PricingPay-as-you-goVacuum Wand Sets - Complete kits
Unit PricingPay-as-you-goBreeze Non-Contact Wands
Unit PricingPay-as-you-goProcess Cassettes
Unit PricingPay-as-you-goManual FOUP/FOSB Opener
Unit PricingPay-as-you-goMechanical Picks
Unit PricingPay-as-you-goEscalator + Aligner System
Unit PricingPay-as-you-goFreedom Cordless Wands

Go-to-market motion1 record

Distribution channels4 records

Marketing channels4 records

H-Square Corporation product offering

Product offering

Core offering

H-Square Corporation designs, manufactures, and sells semiconductor wafer handling equipment and tooling for wafer sizes ranging from 50 mm (2") to 300 mm (12"). Its portfolio spans manual tools such as vacuum wands, wafer aligners, and cassettes, as well as automated systems for loading and unloading process wafers in SMIF, FOUP, and standard cassette environments. The products are ESD-safe and ISO Class 3-5 cleanroom compatible, and are sold to wafer fabs, equipment makers, and research institutions worldwide.

Product overview

H-Square Corporation is the longest-serving company dedicated to fab wafer handling processes, providing a comprehensive portfolio of automated and manual semiconductor handling solutions. The product portfolio centers on wafer transfer equipment including automated sorters (WS300, WS200), bulk transfer tools (AVT, AHWT, LCT2, LCT1AS12), and manual transfer systems (HWT). Supporting these core transfer systems are pod openers (SMIFPO, SMIFMAN, AFO, FOMH series) for FOUP/FOSB and SMIF pod management. Manual handling tools include Breeze non-contact Bernoulli wands (H2B, H2BST series), vacuum wands (NOASPF2, NO3AS1, FWTT), PEEK vacuum tips, mechanical picks, and inspection tools (BLIS, ETAS1, wafer presenters). Alignment solutions span automatic and manual flat and notch aligners. Process cassettes include aluminum, stainless steel thermal, and Fuji Bakelite thin wafer cassettes. All products are designed for cleanroom environments from ISO Class 3 to Class 5, featuring antistatic construction and compatibility with SEMI compliant carriers.

Differentiator

Problem solved

Functional benefit

Products and services

  • Wafer Transfer Systems (Vacuum Wands) Hand-held and automated vacuum wand tools used to pick up and move individual semiconductor wafers without contacting the active device surface, suitable for use in ISO Class 3-5 cleanrooms.
  • Wafer Alignment Tools

Quantifiable outcome

  • 96% repeat orders rate indicating customer retention
  • +3 more outcomes

Companies that use H-Square Corporation

Customer profile

Named customers1 record

Segments1 record

Ideal customer profiles2 records

H-Square Corporation technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature5 records

H-Square Corporation partnerships and signals

Strategic signal

Scale indicators8 records

Recent moves6 records

Expansion highlights4 records

H-Square Corporation competitors and assessment

Company assessment

Broad incumbents

  • Tokyo Electron (TEL): TEL is a top-tier global WFE vendor with coater/developer systems that incorporate wafer handling subsystems; broad incumbent offering overlapping with H-Square's fab handling focus.
  • Lam Research: Lam Research is a leading WFE vendor for etch and deposition; while not a direct handling competitor, its systems embed wafer handling functions adjacent to H-Square's product scope.
  • Entegris: Entegris supplies fluid handling, filtration, and wafer/carrier solutions to semiconductor fabs — a broader incumbent in materials handling that overlaps with H-Square's cassette and carrier product lines.

Direct peers

  • Nidec Sankyo (Nidec Corporation): Nidec Sankyo produces vacuum and atmospheric wafer handling robots for fabs and OEMs; comparable to H-Square's wafer transfer and aligner products at the system level.
  • Daihen Corporation: Daihen supplies wafer handling robots and transfer systems to semiconductor fabs, overlapping with H-Square's automated wafer sorter and bulk transfer tool portfolio.
  • Kensington Laboratories: Kensington Labs specializes in precision wafer handling robots and aligners for semiconductor fabs — directly comparable to H-Square's aligner and automated wafer transfer product lines.
  • Brooks Automation (now part of Thermo Fisher Scientific): Brooks Automation is the most direct competitor in semiconductor wafer handling automation, offering robotic wafer handlers, sorters, and SMIF/FOUP solutions to the same fab customer base as H-Square.
  • RORZE Corporation: RORZE is a Japanese supplier of wafer handling robots, FOUP/reticle stockers, and automated transport systems used in 300mm fabs, directly competing with H-Square's automated sorter/transfer offerings.
  • Hirata Corporation: Hirata builds automated wafer handling, stocker, and transport systems for semiconductor fabs — closely comparable in product scope and customer segment to H-Square's automated handling line.

Regional players

  • Ichinen Services Co., Ltd. A Japanese specialist offering wafer handling-related services and equipment to Asian fabs — a regional peer to H-Square in the same product category but concentrated in Japan.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

H-Square Corporation social profiles

Digital presence

H-Square Corporation financial estimates

Financial estimate

Revenue estimate

Valuation estimate

H-Square Corporation leadership team

Management profile

Number of profiles

Profiles1 record

H-Square Corporation funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

H-Square Corporation M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about H-Square Corporation

What does H-Square Corporation do?

H-Square Corporation designs, manufactures, and sells semiconductor wafer handling equipment and tooling for wafer sizes ranging from 50 mm (2") to 300 mm (12"). Its portfolio spans manual tools such as vacuum wands, wafer aligners, and cassettes, as well as automated systems for loading and unloading process wafers in SMIF, FOUP, and standard cassette environments. The products are ESD-safe and ISO Class 3-5 cleanroom compatible, and are sold to wafer fabs, equipment makers, and research institutions worldwide.

Is H-Square Corporation a public or private company?

H-Square Corporation is a private company. It is classified as founder individual operated bootstrapped and is currently operating.

When was H-Square Corporation founded?

H-Square Corporation was founded in 1974. It employs 11 to 50 people.

Where is H-Square Corporation based?

H-Square Corporation is headquartered in Santa Clara, United States, in the North America region.

How does H-Square Corporation make money?

Two revenue lines are on record. Hardware Equipment Sales are the primary driver. The others are aftermarket Parts and Accessories.

Who are H-Square Corporation's main competitors?

Broad incumbents on record are Tokyo Electron (TEL), Lam Research and Entegris. Direct peers are Nidec Sankyo (Nidec Corporation), Daihen Corporation, Kensington Laboratories, Brooks Automation (now part of Thermo Fisher Scientific), RORZE Corporation and Hirata Corporation. Ichinen Services Co., Ltd. is listed as a regional player.

Does H-Square Corporation have an API?

No public API is recorded for H-Square Corporation.

What industry is H-Square Corporation in?

H-Square Corporation's product category is Semiconductor Wafer Handling Equipment. Its primary akta.pro industry code is HDAHAEAG, Wafer Cleaning & Surface Preparation Equipment. Its NAICS code is 333242 and its SIC code is 3674.

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