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MFS Technology

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uuid000eafz

Namestring
MFS Technology
Legal namestring
MFS Technology (S) Pte Ltd
Websiteurl
mfstech.com.sg
Company typeenum
Private
Founded yearint
1988
Descriptiontext

MFS Technology (S) Pte Ltd is a Singapore-incorporated private company founded in 1988 that designs and manufactures printed circuit applications, specifically Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex circuits. Its manufacturing spans Malaysia (Melaka) and China (Changsha, Hunan; Yiyang, Hunan), with the Yiyang facility delivering 300,000 sqm/year of automated double-sided roll-to-roll production under a Class-1000 cleanroom. Technology capabilities include ultra-thin HDI FPC at 25 µm line/space with 50 µm micro vias, heavy copper PCBs up to 10 oz and 32 layers, embedded copper coin thermal management, and rigid-flex constructions of 1–12 layers, complemented by value-added CAD design, DFx, Polar Si8000 + XFE simulation, SMT assembly, and customized testing.

The company operates a B2B enterprise field-sales model with Early Supplier Involvement (ESI), in which sales and R&D teams collaborate with customers from the design stage. Pricing is quote-based against customer specifications with multi-year contracts; revenue is generated from hardware sales (FPC/PCB/Rigid Flex) and professional services (assembly, DFx, testing). MFS serves more than 200 global blue-chip multinational customers across Automotive (IATF 16949), Medical (ISO 13485), Industrial, Consumer Electronics, Telecommunication, Data Storage, and Aerospace, with regional sales/support offices in Shanghai, Chengdu, Stuttgart, and North America.

In February 2026 MFS acquired SunPower Malaysia Manufacturing Sdn. Bhd. from Maxeon Solar Technologies, adding solar manufacturing capacity with approximately USD 59.9 million in total assets. The company is privately held, with no public listing, and is led by Tan Ee (CEO), Akira Nakayamada (Chairman and CEO), and Janny Zhang (CFO); Novo Tellus Capital Partners appears on the cap table from a 2014 round. Revenue is not publicly disclosed.

Short descriptiontext

MFS Technology is a Singapore-based private manufacturer of flexible printed circuits, rigid PCBs, and rigid-flex circuits founded in 1988, serving more than 200 global blue-chip customers across automotive, medical, industrial, consumer, and aerospace end markets via Asian manufacturing and global sales offices.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
51–100
akta.pro rankint
HeadquartersSingapore, Singapore
HQ citystring
Singapore
HQ countrystring
Singapore
HQ regionstring
Asia
Markets served

Serves global market

Offices8 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
flexible printed circuits, rigid PCB manufacturing, rigid flex circuits, heavy copper PCB, turnkey assembly services
Industry3 codes
1PCB Fabrication (Flex & Rigid-Flex PCBs)
CodeHDAHAOAHPrimaryYes
2Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components)
CodeHDAHAOAKPrimaryNo
3Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film)
CodeIMAGAJAMPrimaryNo
NAICS code1 code
  • Bare Printed Circuit Board Manufacturing334412
SIC code1 code
  • Printed Circuit Boards3672
Product category
Printed Circuit Board Manufacturing
Social media profiles1 record
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model2 records
1Printed Circuit Manufacturing and Sales
TypeHardware Sales
Description

MFS generates revenue through manufacturing and distribution of Flexible Printed Circuits (FPCs), Rigid PCBs, and Rigid Flex circuits. The company serves diverse market segments including Automotive, Industrial, Medical, Consumer, Telecommunication, Mobile, and Aerospace with both standard and customized products.

mfstech.com.sg:443
2Assembly and Manufacturing Services
TypeProfessional Services
Description

Turnkey component assembly services and module level integration including CAD design, circuit routing, DFM/DFx services, SMT assembly, and customized testing services. Revenue generated through value-added services complementing circuit manufacturing.

mfstech.com.sg:443
Marketing channels3 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D, Marketing or Sales
Pricing details1 tier
1Custom quotation-based pricing for enterprise customers
ModelOtherBilling cadenceMulti-year contract
Notes

Quote-based / Not publicly disclosed - pricing determined based on customer specifications, volume requirements, and technical complexity.

mfstech.com.sg:443
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

MFS Technology designs and manufactures Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex circuits serving automotive, industrial, medical, consumer electronics, telecommunication, mobile, and aerospace OEMs. The company complements its circuit portfolio with value-added turnkey assembly services, CAD design and routing, DFM/DFx engineering, Polar Si8000 + XFE circuit simulation, and customized testing. Manufacturing spans 51-100 employees across strategically located facilities in Singapore, Malaysia (Melaka), and China (Changsha, Yiyang) with regional sales offices in Europe and North America.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 3 values shown
  • Fast prototype turnaround-time performance
+2 more records
Product overview1 text field

MFS Technology is an innovation leader and pioneer in printed circuit applications with over 30 years of experience. The company offers a comprehensive portfolio of Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex Circuits, complemented by value-added services including turnkey assembly, CAD design/routing, circuit simulation (Polar Si8000 + XFE), and customized testing. The product range spans from ultra-thin HDI FPCs with fine pitch circuitry (50μm) to heavy copper PCBs up to 10oz and 32 layers, serving diverse market segments including Automotive, Industrial, Medical, Consumer, Telecommunication, Mobile, and Aerospace applications.

Product and service9 records
1Flexible Printed Circuit (FPC)
CategoryFlexible Printed Circuits
Description

Flexible Printed Circuit consisting of conducting copper foil layers and insulating dielectric layers (PI/PET/PEN/LCP) that can be bent for specific applications. Available in single-sided, double-sided, multi-layered, single-side-double-contact, and bare-backed variants for automotive, industrial, medical, consumer electronics, telecommunication, mobile, and aerospace OEMs.

2Rigid Flex Circuit
CategoryRigid Flex Circuits
Description

Hybrid construction combining flexible and rigid substrates laminated together into a single structure with plated through-hole interconnections. Supports 1-12 layers, board thickness from 0.20mm to 2.4mm, with blind/buried via plating, impedance control, and static/multiple bending capabilities. Designed for applications requiring mechanical flexibility in confined spaces.

3Heavy Copper PCB
CategoryRigid Printed Circuit Boards
Description

Rigid PCB with heavy copper construction featuring copper thickness up to 10oz and up to 32 layers, with controlled-depth drilling/routing and ±10% impedance control. Designed for power management, planar transformers, and energy conversion applications.

4Rigid PCB
CategoryRigid Printed Circuit Boards
Description

Rigid printed circuit board with heavy copper construction featuring 10oz copper thickness and up to 24 layers. Includes buried and blind via capabilities, fine-pitch BGA support, low DK/DF materials, copper/silver paste via filling, and resin plug + copper plating processes. Used in automotive, power, industrial, energy, and planar transformer applications.

5Embedded Copper Coin PCB
CategoryRigid Printed Circuit Boards
Description

PCB with embedded copper coin technology for enhanced heat dissipation, thermal simulation, and reliability. Features embedded I-coin with ENIG finishing and coin inner flatness control under 30µm. Incorporates 2.5D cavity technology to enhance PCB thermal management and reduce overall assembly thickness for high-power applications.

6Assembly Services
CategoryValue-Added Assembly Services
Description

Turnkey component assembly service including SMT (Surface Mount Technology), through hole, hand assemblies, box build, and a full range of testing services. Also covers component qualification, sourcing of heatsinks, plastics, heater flex, and customized testing with dedicated assembly lines for special product and manufacturing requirements. Includes ACP/ACF bonding capabilities (CMOS, FOG, FOF, FOB) and various component types such as switches, microphones, camera bases, LEDs, filters, resistors, capacitors, and sensors.

7CAD Design and Routing Services
CategoryDesign and Engineering Services
Description

Comprehensive Computer-Aided Design (CAD) and circuit routing services including DFM (Design for Manufacturability) file preparation and iteration with customers for design optimization. Provided as a flexible design and engineering service to support customer product development.

8Polar Si8000 + XFE Circuit Simulation
CategoryDesign and Engineering Services
Description

Flexible circuit simulation using Polar Si8000 + XFE software for product stackup analysis and verification of electrical requirements. Provided as a specialized service to validate impedance and signal integrity characteristics before manufacturing.

9Customized Testing Services
CategoryValue-Added Assembly Services
Description

Customized testing services and dedicated assembly lines for special product and manufacturing requirements. Full range of testing services complementing SMT and through-hole assembly, including special product qualification and dedicated assembly line provisioning.

Scale indicator6 records

Each record includes

Type, Value, Description, Source

Partnership1 partner
Strategic tierMinorTypeStrategic or Co-development PartnerAnnounced on2026-02-13
Description

MFS Technology acquired 100% equity interest in SunPower Malaysia Manufacturing Sdn. Bhd. from Maxeon Solar Technologies. The transaction closed on February 13, 2026 pursuant to a Share Sale and Purchase Agreement entered into on January 23, 2026. The Malaysian manufacturing facility (approximately USD 59.9 million in total assets) becomes part of MFS's manufacturing footprint as part of Maxeon's portfolio restructuring and strategic realignment.

Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight5 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

Taiwan-listed PCB and IC substrate leader with HDI, rigid-flex, and substrate capabilities serving global electronics OEMs. A broader incumbent competing in many of MFS's end markets at significantly greater scale.

TypeDirect peer
Description

Taiwan-listed FPC specialist serving consumer electronics, smartphone, and wearable OEMs. Highly comparable in FPC process technology and customer engagement model (design-in to mass production).

TypeDirect peer
Description

Taiwan-based PCB manufacturer with strong HDI, rigid, and rigid-flex capabilities serving networking, automotive, and consumer electronics. Comparable layer-count and HDI specifications to MFS.

TypeDirect peer
Description

Taiwan-listed PCB producer focused on multilayer, HDI, and rigid-flex boards for automotive, networking, and consumer segments. Comparable automotive IATF-certified manufacturing and heavy-copper/HDI overlap with MFS.

TypeDirect peer
Description

Korea-based PCB manufacturer specializing in multilayer, HDI, and flexible PCBs for automotive, telecom, and consumer OEMs. Comparable automotive IATF-certified capabilities and HDI/FPC overlap.

TypeDirect peer
Description

Taiwan-based global leader in FPC and PCB manufacturing serving smartphone, automotive, and consumer electronics OEMs. Closely comparable product portfolio (FPC, rigid-flex, HDI) and ESI-style customer engagement with major multinationals.

TypeDirect peer
Description

China-headquartered PCB manufacturer specializing in HDI, rigid-flex, and high-layer-count boards for communication, automotive, and industrial customers. Direct competitor in Hunan/greater China region with overlapping automotive and telecom customer base.

TypeBroad incumbent
Description

Austria-headquartered global PCB and IC substrate manufacturer serving automotive, industrial, and medical customers. Overlaps with MFS in high-end automotive and medical PCB applications at a much larger scale.

TypeOthers
Description

Korea-based large-scale electronic components manufacturer including advanced PCB and FPC for mobile, automotive, and IT applications. A broad incumbent with overlapping automotive and consumer FPC capabilities.

TypeDirect peer
Description

Taiwan-listed FPC and PCB manufacturer serving mobile, consumer electronics, and automotive customers with HDI and rigid-flex capability. Comparable FPC product portfolio and Asian manufacturing footprint.

Market position
Strengths4 records

Each record includes

Headline, Details, Source

Weaknesses4 records

Each record includes

Headline, Details, Source

Competitive moat5 records

Each record includes

Type, Details

Key risks5 records

Each record includes

Headline, Details, Source

Key highlights6 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers6 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment7 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile6 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature6 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles3 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries7 records

Each record includes

Name, Acquired on, Relationship type, Type, Business focus

Compliance11 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds1 record

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors1 record

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

MFS Technology

Printed Circuit Board Manufacturingmfstech.com.sg

MFS Technology is a Singapore-based private manufacturer of flexible printed circuits, rigid PCBs, and rigid-flex circuits founded in 1988, serving more than 200 global blue-chip customers across automotive, medical, industrial, consumer, and aerospace end markets via Asian manufacturing and global sales offices.

What MFS Technology does

MFS Technology (S) Pte Ltd is a Singapore-incorporated private company founded in 1988 that designs and manufactures printed circuit applications, specifically Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex circuits. Its manufacturing spans Malaysia (Melaka) and China (Changsha, Hunan; Yiyang, Hunan), with the Yiyang facility delivering 300,000 sqm/year of automated double-sided roll-to-roll production under a Class-1000 cleanroom. Technology capabilities include ultra-thin HDI FPC at 25 µm line/space with 50 µm micro vias, heavy copper PCBs up to 10 oz and 32 layers, embedded copper coin thermal management, and rigid-flex constructions of 1–12 layers, complemented by value-added CAD design, DFx, Polar Si8000 + XFE simulation, SMT assembly, and customized testing.

The company operates a B2B enterprise field-sales model with Early Supplier Involvement (ESI), in which sales and R&D teams collaborate with customers from the design stage. Pricing is quote-based against customer specifications with multi-year contracts; revenue is generated from hardware sales (FPC/PCB/Rigid Flex) and professional services (assembly, DFx, testing). MFS serves more than 200 global blue-chip multinational customers across Automotive (IATF 16949), Medical (ISO 13485), Industrial, Consumer Electronics, Telecommunication, Data Storage, and Aerospace, with regional sales/support offices in Shanghai, Chengdu, Stuttgart, and North America.

In February 2026 MFS acquired SunPower Malaysia Manufacturing Sdn. Bhd. from Maxeon Solar Technologies, adding solar manufacturing capacity with approximately USD 59.9 million in total assets. The company is privately held, with no public listing, and is led by Tan Ee (CEO), Akira Nakayamada (Chairman and CEO), and Janny Zhang (CFO); Novo Tellus Capital Partners appears on the cap table from a 2014 round. Revenue is not publicly disclosed.

MFS Technology firmographics

Firmographics
Name
MFS Technology
Legal name
MFS Technology (S) Pte Ltd
Website
https://mfstech.com.sg
Company type
Private
Founded year
1988
Operating status
Operating
Headcount range
51–100 employees
Short description
MFS Technology is a Singapore-based private manufacturer of flexible printed circuits, rigid PCBs, and rigid-flex circuits founded in 1988, serving more than 200 global blue-chip customers across automotive, medical, industrial, consumer, and aerospace end markets via Asian manufacturing and global sales offices.
Ownership category
akta.pro rank

MFS Technology industry classification

Industry
Product category
Printed Circuit Board Manufacturing
NAICS
Bare Printed Circuit Board Manufacturing (334412)
SIC
Printed Circuit Boards (3672)
akta.pro primary industry
PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH)
akta.pro secondary industries
Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK), Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film) (IMAGAJAM)

Keywords

  • Flexible printed circuits
  • Rigid PCB manufacturing
  • Rigid flex circuits
  • Heavy copper PCB
  • Turnkey assembly services

Where MFS Technology is headquartered

Location

Headquarters

HQ city
Singapore
HQ country
Singapore
HQ region
Asia

Offices8 records

Markets served

MFS Technology business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D, Marketing or Sales

Revenue model

  1. Printed Circuit Manufacturing and Sales: MFS generates revenue through manufacturing and distribution of Flexible Printed Circuits (FPCs), Rigid PCBs, and Rigid Flex circuits. The company serves diverse market segments including Automotive, Industrial, Medical, Consumer, Telecommunication, Mobile, and Aerospace with both standard and customized products.
  2. Assembly and Manufacturing Services: Turnkey component assembly services and module level integration including CAD design, circuit routing, DFM/DFx services, SMT assembly, and customized testing services. Revenue generated through value-added services complementing circuit manufacturing.

Pricing tiers

ModelBillingPrice
OtherMulti-year contractCustom quotation-based pricing for enterprise customers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

MFS Technology product offering

Product offering

Core offering

MFS Technology designs and manufactures Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex circuits serving automotive, industrial, medical, consumer electronics, telecommunication, mobile, and aerospace OEMs. The company complements its circuit portfolio with value-added turnkey assembly services, CAD design and routing, DFM/DFx engineering, Polar Si8000 + XFE circuit simulation, and customized testing. Manufacturing spans 51-100 employees across strategically located facilities in Singapore, Malaysia (Melaka), and China (Changsha, Yiyang) with regional sales offices in Europe and North America.

Product overview

MFS Technology is an innovation leader and pioneer in printed circuit applications with over 30 years of experience. The company offers a comprehensive portfolio of Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex Circuits, complemented by value-added services including turnkey assembly, CAD design/routing, circuit simulation (Polar Si8000 + XFE), and customized testing. The product range spans from ultra-thin HDI FPCs with fine pitch circuitry (50μm) to heavy copper PCBs up to 10oz and 32 layers, serving diverse market segments including Automotive, Industrial, Medical, Consumer, Telecommunication, Mobile, and Aerospace applications.

Differentiator

Problem solved

Functional benefit

Products and services

  • Flexible Printed Circuit (FPC) Flexible Printed Circuit consisting of conducting copper foil layers and insulating dielectric layers (PI/PET/PEN/LCP) that can be bent for specific applications. Available in single-sided, double-sided, multi-layered, single-side-double-contact, and bare-backed variants for automotive, industrial, medical, consumer electronics, telecommunication, mobile, and aerospace OEMs.
  • Rigid Flex Circuit Hybrid construction combining flexible and rigid substrates laminated together into a single structure with plated through-hole interconnections. Supports 1-12 layers, board thickness from 0.20mm to 2.4mm, with blind/buried via plating, impedance control, and static/multiple bending capabilities. Designed for applications requiring mechanical flexibility in confined spaces.
  • Heavy Copper PCB Rigid PCB with heavy copper construction featuring copper thickness up to 10oz and up to 32 layers, with controlled-depth drilling/routing and ±10% impedance control. Designed for power management, planar transformers, and energy conversion applications.
  • Rigid PCB Rigid printed circuit board with heavy copper construction featuring 10oz copper thickness and up to 24 layers. Includes buried and blind via capabilities, fine-pitch BGA support, low DK/DF materials, copper/silver paste via filling, and resin plug + copper plating processes. Used in automotive, power, industrial, energy, and planar transformer applications.
  • Embedded Copper Coin PCB PCB with embedded copper coin technology for enhanced heat dissipation, thermal simulation, and reliability. Features embedded I-coin with ENIG finishing and coin inner flatness control under 30µm. Incorporates 2.5D cavity technology to enhance PCB thermal management and reduce overall assembly thickness for high-power applications.
  • Assembly Services Turnkey component assembly service including SMT (Surface Mount Technology), through hole, hand assemblies, box build, and a full range of testing services. Also covers component qualification, sourcing of heatsinks, plastics, heater flex, and customized testing with dedicated assembly lines for special product and manufacturing requirements. Includes ACP/ACF bonding capabilities (CMOS, FOG, FOF, FOB) and various component types such as switches, microphones, camera bases, LEDs, filters, resistors, capacitors, and sensors.
  • CAD Design and Routing Services Comprehensive Computer-Aided Design (CAD) and circuit routing services including DFM (Design for Manufacturability) file preparation and iteration with customers for design optimization. Provided as a flexible design and engineering service to support customer product development.
  • Polar Si8000 + XFE Circuit Simulation Flexible circuit simulation using Polar Si8000 + XFE software for product stackup analysis and verification of electrical requirements. Provided as a specialized service to validate impedance and signal integrity characteristics before manufacturing.
  • Customized Testing Services Customized testing services and dedicated assembly lines for special product and manufacturing requirements. Full range of testing services complementing SMT and through-hole assembly, including special product qualification and dedicated assembly line provisioning.

Quantifiable outcome

  • Fast prototype turnaround-time performance
  • +2 more outcomes

Companies that use MFS Technology

Customer profile

Named customers6 records

Segments7 records

Ideal customer profiles6 records

MFS Technology technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature6 records

MFS Technology partnerships and signals

Strategic signal

Partnerships

One partnership is on record.

  • Maxeon Solar TechnologiesminorStrategic or Co-development Partner · 13 February 2026MFS Technology acquired 100% equity interest in SunPower Malaysia Manufacturing Sdn. Bhd. from Maxeon Solar Technologies. The transaction closed on February 13, 2026 pursuant to a Share Sale and Purchase Agreement entered into on January 23, 2026. The Malaysian manufacturing facility (approximately USD 59.9 million in total assets) becomes part of MFS's manufacturing footprint as part of Maxeon's portfolio restructuring and strategic realignment.

Scale indicators6 records

Recent moves6 records

Expansion highlights5 records

MFS Technology competitors and assessment

Company assessment

Broad incumbents

  • Unimicron Technology: Taiwan-listed PCB and IC substrate leader with HDI, rigid-flex, and substrate capabilities serving global electronics OEMs. A broader incumbent competing in many of MFS's end markets at significantly greater scale.
  • AT&S (Austria Technologie & Systemtechnik): Austria-headquartered global PCB and IC substrate manufacturer serving automotive, industrial, and medical customers. Overlaps with MFS in high-end automotive and medical PCB applications at a much larger scale.

Direct peers

  • Flexium Interconnect: Taiwan-listed FPC specialist serving consumer electronics, smartphone, and wearable OEMs. Highly comparable in FPC process technology and customer engagement model (design-in to mass production).
  • Compeq Manufacturing: Taiwan-based PCB manufacturer with strong HDI, rigid, and rigid-flex capabilities serving networking, automotive, and consumer electronics. Comparable layer-count and HDI specifications to MFS.
  • Tripod Technology: Taiwan-listed PCB producer focused on multilayer, HDI, and rigid-flex boards for automotive, networking, and consumer segments. Comparable automotive IATF-certified manufacturing and heavy-copper/HDI overlap with MFS.
  • Daeduck Electronics: Korea-based PCB manufacturer specializing in multilayer, HDI, and flexible PCBs for automotive, telecom, and consumer OEMs. Comparable automotive IATF-certified capabilities and HDI/FPC overlap.
  • Zhen Ding Technology Holding: Taiwan-based global leader in FPC and PCB manufacturing serving smartphone, automotive, and consumer electronics OEMs. Closely comparable product portfolio (FPC, rigid-flex, HDI) and ESI-style customer engagement with major multinationals.
  • Shennan Circuits: China-headquartered PCB manufacturer specializing in HDI, rigid-flex, and high-layer-count boards for communication, automotive, and industrial customers. Direct competitor in Hunan/greater China region with overlapping automotive and telecom customer base.
  • Ichia Technologies: Taiwan-listed FPC and PCB manufacturer serving mobile, consumer electronics, and automotive customers with HDI and rigid-flex capability. Comparable FPC product portfolio and Asian manufacturing footprint.

Others

  • Samsung Electro-Mechanics: Korea-based large-scale electronic components manufacturer including advanced PCB and FPC for mobile, automotive, and IT applications. A broad incumbent with overlapping automotive and consumer FPC capabilities.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

MFS Technology social profiles

Digital presence

MFS Technology compliance and trust

Trust signal

Compliance11 records

MFS Technology financial estimates

Financial estimate

Revenue estimate

Valuation estimate

MFS Technology leadership team

Management profile

Number of profiles

Profiles3 records

MFS Technology subsidiaries and ownership

Company hierarchy

Subsidiaries7 records

MFS Technology funding detail

Funding detail

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

MFS Technology M&A and investment

M&A and investment

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about MFS Technology

What does MFS Technology do?

MFS Technology designs and manufactures Flexible Printed Circuits (FPC), Rigid PCBs, and Rigid Flex circuits serving automotive, industrial, medical, consumer electronics, telecommunication, mobile, and aerospace OEMs. The company complements its circuit portfolio with value-added turnkey assembly services, CAD design and routing, DFM/DFx engineering, Polar Si8000 + XFE circuit simulation, and customized testing. Manufacturing spans 51-100 employees across strategically located facilities in Singapore, Malaysia (Melaka), and China (Changsha, Yiyang) with regional sales offices in Europe and North America.

Is MFS Technology a public or private company?

MFS Technology is a private company. It is classified as venture growth investor backed and is currently operating.

When was MFS Technology founded?

MFS Technology was founded in 1988. It employs 51 to 100 people.

Where is MFS Technology based?

MFS Technology is headquartered in Singapore, Singapore, in the Asia region.

How does MFS Technology make money?

Two revenue lines are on record. Printed Circuit Manufacturing and Sales are the primary driver. The others are assembly and Manufacturing Services.

Who are MFS Technology's main competitors?

Broad incumbents on record are Unimicron Technology and AT&S (Austria Technologie & Systemtechnik). Direct peers are Flexium Interconnect, Compeq Manufacturing, Tripod Technology, Daeduck Electronics, Zhen Ding Technology Holding, Shennan Circuits and Ichia Technologies. Samsung Electro-Mechanics is listed as an others.

Does MFS Technology have an API?

No public API is recorded for MFS Technology.

What industry is MFS Technology in?

MFS Technology's product category is Printed Circuit Board Manufacturing. Its primary akta.pro industry code is HDAHAOAH, PCB Fabrication (Flex & Rigid-Flex PCBs), with a secondary code of HDAHAOAK, Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components). Its NAICS code is 334412 and its SIC code is 3672.

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Live signals
Stock TitanMaxeon (NASDAQ: MAXN) completes sale of Malaysian solar plantMaxeon Solar Technologies completed the sale of 100% equity interest in SunPower Malaysia Manufacturing Sdn. Bhd., its Malaysian solar manufacturing subsidiary, to MFS Technology (S) PTE Ltd on February 13, 2026, pursuant to a Share Sale and Purchase Agreement entered into on January 23, 2026. The transaction was finalized after two supplementary agreements that added completion deliverables and corrected a clerical discrepancy in share capital calculations, with the company reporting total assets of approximately USD59.9 million at closing. The sale is part of Maxeon's broader portfolio restructuring and strategic realignment plans.TipranksMaxeon Solar Completes Sale of Malaysian Manufacturing Subsidiary to MFS TechnologyMaxeon Solar Technologies has completed the sale of its entire equity interest in SunPower Malaysia Manufacturing Sdn. Bhd. to Singapore-based MFS Technology (S) PTE Ltd., with the transaction closing on Feb. 13, 2026 under a share sale and purchase agreement first signed on Jan. 23, 2026. The parties executed supplementary agreements on Feb. 6 and Feb. 13, 2026 to refine completion deliverables, correct a capital figure, and formalize a clean break in intercompany balances tied to the Malaysian unit. The divestment is part of Maxeon's broader reshaping of its global manufacturing footprint, leaving it with a more focused set of manufacturing assets as it pursues ongoing portfolio restructuring.BDA PartnersBDA advises on the sale of MFS Technology to Victory Giant TechnologyBDA Partners announced that its client Tree House Limited (THL) has entered into an agreement with Victory Giant Technology to sell MFS Technology for an enterprise value of up to US$460 million. MFS is a leader in flexible printed circuit design and manufacturing, headquartered in Singapore with facilities in Malaysia and China, serving automotive, industrial, and medical markets that now represent approximately 75% of its revenues. THL acquired MFS in 2017, and this transaction represents the second successful deal BDA has facilitated for MFS.MarketScreenerChina's Victory Giant to buy Singapore's MFS Technology for up to $460 mlnChinese electronics manufacturer Victory Giant Technology has agreed to acquire Singapore-based MFS Technology for up to $460 million in cash. The acquisition aims to diversify Victory Giant's product portfolio by adding flexible printed circuit capabilities to its existing rigid board business. The deal is currently pending regulatory approvals from Chinese authorities.Printed Circuit Design & Fab Online MagazineChina’s Victory Giant to buy Singapore’s MFS TechnologyChinese electronics manufacturer Victory Giant Technology has agreed to acquire Singaporean PCB maker MFS Technology for up to $460 million through the purchase of its parent company, Pole Star Limited. The transaction aims to diversify Victory Giant's product portfolio by adding flexible printed circuits to its existing rigid board capabilities.