Bangxin Semiconductor

Name

Bangxin Semiconductor

Legal name

上海邦芯半导体科技有限公司 (Shanghai Bangxin Semiconductor Technology Co., Ltd.)

Website

https://bxsemi.com

Company type

Private

Founded year

2020

Operating status

Operating

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Etch & Strip Equipment (Dry/Wet/Ashing) (HDAHAEAC)

Keywords

• Semiconductor equipment
• Compound semiconductor
• Wafer fabrication
• Plasma etching
• Photoresist ashing

Headquarters

HQ city

Shanghai

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Equipment Sales: Sale of proprietary semiconductor manufacturing equipment including photoresist ashing systems (Yujia Spinel series), ICP/CCP etching systems (Honghu series), and WCVD thin film deposition equipment. Equipment sold to compound semiconductor and integrated circuit manufacturers.
2. Technical Services and Support: Technical consulting and Lab to Fab solutions services including process research and development, process transfer, and 7x12H or 7x24H comprehensive customer service

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

Bangxin Semiconductor designs and manufactures proprietary semiconductor manufacturing equipment for compound semiconductor and silicon-based integrated circuit production. Its product lines cover photoresist ashing (Yujia Spinel, QiJi Spinel series), plasma etching (Honghu Ivory ICP series, Honghu Coral CCP series), deep silicon etching (Honghu Topaz), tungsten CVD thin-film deposition (Honghu TSG), and chemical dry etching (QiJi Garnet), targeting 6/8-inch compound semiconductor and 12-inch IC fabs. The company also provides Lab to Fab technical consulting, process R&D, process transfer, and tiered after-sales support.

Product overview

Bangxin Semiconductor is a semiconductor equipment manufacturer offering a portfolio of 10 distinct equipment product lines across photoresist ashing (Yujia Spinel, QiJi Spinel series), tungsten CVD (Honghu TSG), plasma etching (Honghu ICP, Honghu CCP), deep silicon etching (Honghu Topaz), and chemical dry etching (QiJi Garnet). The products serve 6/8-inch compound semiconductor and 12-inch IC manufacturing processes, supporting wafer sizes from 6-inch to 12-inch and technology nodes from 0.35um down to 14nm. The company also provides Lab to Fab technical consulting services and a three-tier customer service system. The product families share common technology platforms (Yujia, Honghu, QiJi transmission platforms) and are used in compound semiconductor, integrated circuit, packaging and testing, and panel industry applications.

Differentiator

Problem solved

Functional benefit

Brands

• Yujia: Yujia transmission platform for semiconductor equipment
• Honghu
• QiJi

Products and services

• Yujia Spinel 150A/200A (光刻胶灰化设备) Photoresist ashing equipment for 6/8-inch compound semiconductor and silicon-based integrated circuit processing. Built on the BangXin Yujia transmission platform with high-speed film transmission and serial/parallel process management; uses a self-developed high-density plasma generator for high ashing rate and a unique gas flow field and thermal field design for ashing uniformity; controlled by a database-based operating system for stable industrial control and high-speed data sampling. For compound semiconductor and silicon IC fabs.
• Honghu TSG 150W/200W (WCVD 钨沉积设备) Tungsten CVD (WCVD) thin film deposition equipment for 6/8-inch GaN power semiconductor processes. Built on the Honghu multi-chamber cluster vacuum transmission platform with serial or parallel process management; uniform flow field design ensures tungsten film-forming rate and uniformity, and an independent heating plate design enables adjustable film-forming rate and uniformity. For GaN power semiconductor manufacturers.
• Honghu Ivory 150W/200W (ICP 刻蚀设备) ICP (Inductively Coupled Plasma) etch equipment for 6/8-inch compound semiconductor processing. Built on the Honghu multi-chamber cluster vacuum transmission platform; uses an optimized ICP coil design for higher etching rate and better uniformity and an advanced surface coating to improve component service life, stabilize particle performance, and reduce production cost. Applications include GaN/SiC etching and tungsten re-etch processes.
• QiJi Spinel 300A (12英寸集成电路光刻胶灰化设备) 12-inch integrated circuit process photoresist ashing equipment. Built on the QiJi multi-chamber cluster vacuum transmission platform; uses a self-developed high-density plasma generator for high ashing rate and a unique gas flow field and thermal field design for ashing uniformity; supports 90nm-14nm integrated circuit photoresist ashing processes. For silicon IC manufacturers running 12-inch wafer lines.
• HongHu Coral 150D/200D (CCP 刻蚀设备) CCP (Capacitively Coupled Plasma) etch equipment for 6/8-inch compound semiconductor processing. Features a unique reaction chamber design for dielectric film etching rate and uniformity; an advanced surface coating improves component service life, stabilizes particle performance, and increases uptime and MTBC. Applications include compound semiconductor dielectric etching and 0.11-0.35µm process IC dielectric etching.
• Honghu Ivory 150E/200E (双ICP 线圈刻蚀设备) ICP etch equipment for 6/8-inch compound semiconductor processing featuring an optimized dual-ICP coil design for higher etching rate and improved uniformity. Applications include SiC etching, polysilicon etching, and deep silicon etching processes.
• Yujia Spinel 300D (12英寸室温光刻胶灰化设备) Room-temperature photoresist ashing equipment for 12-inch wafers. Uses a self-developed high-density plasma generator with a bottom bias feed system for high ashing rate at room temperature; fully digital control and database-based operating system; a unique wafer lifting mechanism accommodates thinned wafers, glass wafers and other substrates. Applications include room-temperature photoresist removal, residue removal, and surface treatment.
• QiJi Spinel 300E (12英寸低损伤光刻胶灰化设备) Photoresist ashing equipment for 12-inch wafers featuring ultra-high ion/electron filtering capability for ultra-low wafer damage. A unique wafer lifting mechanism provides a larger process window. Applications include front-end IC manufacturing photoresist removal.
• Honghu Topaz 150/200 (深硅刻蚀设备) Deep silicon etch equipment for 6/8-inch integrated circuit and packaging applications. Features a self-developed ICP dual-coil design for high etching rate and excellent uniformity, and a fast gas switching valve control system that enables an ultra-short Bosch process for high aspect ratio, high selectivity, and minimal sidewall roughness deep silicon etching. Applications include TSV etching and MEMS etching.
• QiJi Garnet 300I (12英寸化学干法刻蚀设备) Chemical dry etch equipment for 12-inch wafers featuring ultra-high ion/electron filtering for isotropic etching with minimal ion damage. Uses a self-developed high-density plasma generator for high isotropic etch rate and a unique gas flow field and thermal field design for etch rate uniformity; controlled by a database-based operating system. Applications include 12-inch IC manufacturing chemical dry etch processes.
• Lab to Fab Technical Services and Customer Support "Lab to Fab" full-process technical services including process research and development, process transfer, and tiered customer service (on-site support teams, TPS teams, R&D-level service tier) with 7x12H or 7x24H comprehensive customer service. Sold as a technical consulting and support offering to compound semiconductor and silicon IC manufacturers.

Quantifiable outcome

• 200+ units shipped cumulatively by end of 2025, demonstrating market adoption and operational scale
• +2 more outcomes

Named customers1 record

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Lam Research: Global leader in plasma etch and deposition equipment for advanced semiconductor manufacturing. Sets the performance benchmark Bangxin must match on etch rate, uniformity, and node-level qualification.
• Applied Materials: Largest global semiconductor equipment company with broad portfolio spanning etch, deposition, CMP, inspection, and more. Represents the incumbent alternative Bangxin aims to displace in Chinese fabs.
• Tokyo Electron (TEL): Japanese incumbent offering coater/developer, etch, deposition, and cleaning tools. Strong historical presence at memory and logic fabs that Bangxin's customers also operate.
• SPTS Technologies (KLA): KLA-owned etch and deposition equipment unit with strong position in compound semiconductor and power device markets. Direct head-to-head with Bangxin's GaN/SiC-focused Honghu and QiJi product lines.

Direct peers

• ACM Research (Shanghai ACM): NASDAQ-listed China-focused semiconductor cleaning equipment leader with adjacent process expertise. Targets the same domestic Chinese fab customers and benefits from the same domestic substitution policy tailwinds.
• NAURA Technology Group (北方华创): Largest China-based broad-line semiconductor equipment maker with overlapping etch, thin film deposition, and thermal processing products. Competes head-to-head with Bangxin for Chinese fab tool slots across multiple process steps.
• AMEC (Advanced Micro-Fabrication Equipment, 中微公司): Shanghai-headquartered, STAR Market-listed plasma etch equipment maker with deep overlap in ICP/CCP etch for both silicon IC and compound semiconductor customers. Closest direct competitor in China for etch market share.
• Piotech (拓荆科技): China-based thin film deposition equipment maker specializing in PECVD/ALD. Direct overlap with Bangxin's WCVD (Honghu TSG) tungsten deposition platform for advanced node and power semi applications.

Emerging players

• Hwatsing Technology (华海清科): STAR Market-listed Chinese CMP equipment specialist that scaled successfully through domestic substitution. Comparable trajectory archetype to Bangxin—Chinese equipment startup reaching scaled commercialization.
• SiCarrier (新凯来): Emerging Shenzhen-based Chinese semiconductor equipment maker with a broad portfolio across etch, deposition, and metrology. Represents a fast-moving domestic competitor targeting the same import substitution opportunity.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat3 records

Key risks6 records

Key highlights6 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries1 record

Funding overview

Funding rounds2 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Bangxin Semiconductor