What Engent does

Engent, Inc. is a US-based provider of next-generation microelectronics development, engineering, and manufacturing services headquartered in Norcross, Georgia. The company serves customers in defense/military, aeronautics/avionics, medical devices, GPS/tracking, telecommunications, industrial, civil services, POS, and audio/video sectors, supporting them across the full product lifecycle from concept and prototyping through volume manufacturing and end-of-life. Engent is privately held, founder-led by President Dr. Daniel F. Baldwin and Managing Director Matt Perry, and operates with 101-250 employees. Customers reportedly range from early-stage technology firms to Fortune 50 companies, with no public revenue or funding disclosures in the available data.

Engent's core technical capabilities include advanced Surface Mount Technology (SMT) assembly, flip chip and direct chip attach (C4), 3D wafer-level chip scale packaging (WLCSP), MEMS technology and packaging, wafer processing (saw/sort/inspect/thin/bump/known good die), chip-on-board assembly, integrated circuit packaging, hermetic and conformal packaging, box build, and comprehensive reliability testing (thermal shock, HAST, HALT, vibration, drop) and failure analysis (SEM, EDX, CSAM, IR microscopy). The company holds an unusually deep certification stack — ITAR registration, ISO 9001:2015, AS9100:2016, and more than 20 additional IPC, J-STD, AIAG, AS, and ISO standards — enabling participation in defense and aerospace programs. Proprietary capability was acquired via the late-2025 assumption of Siemens Dematic's Advanced Assembly Technology (AAT) Center contracts, equipment, and personnel, and a long-standing 2006 alliance with FlipChip International for 3D WLCSP co-development.

Engent's business model is project-based professional services and contract manufacturing, with revenue tied to engineering services, prototyping, NPI-to-volume manufacturing, and testing/failure analysis work. GTM is direct enterprise field sales plus inside sales, supplemented by US regional rep firms (Lupton Associates, Kevin Kendrick/K2) covering the Southeast, New York/New England, Mid-Atlantic, Midwest, and West. Pricing is quote-based and not publicly disclosed. Marketing is primarily technical: white papers, SMT Magazine Q&A, SMTA and IMAPS presentations, and LinkedIn/Twitter corporate communications. No app, API, SDK, or external integrations are offered.

Name

Engent

Legal name

Engent Inc.

Website

https://engentaat.com

Company type

Private

Founded year

2003

Operating status

Operating

Headcount range

101–250 employees

Short description

Engent is a US-based next-generation microelectronics development and manufacturing services provider serving defense, aerospace, medical, telecommunications, and industrial customers with advanced SMT, flip chip, 3D packaging, and reliability testing capabilities.

Ownership category

akta.pro rank

Product category

Electronic Manufacturing Services

NAICS

Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Semiconductor and Other Electronic Component Manufacturing (33441), Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing (334511), Other Communications Equipment Manufacturing (334290)

SIC

Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Electronic & Other Electrical Equipment (No Computer Equip) (3600), Electronic Components, Nec (3679), Industrial Instruments For Measurement, Display, And Control (3823), Search, Detection, Navagation, Guidance, Aeronautical Sys (3812)

akta.pro primary industry

Industrial Electronics Manufacturing Services (EMS) (IMAGAGAA)

akta.pro secondary industries

Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics) (IMAGAGAH), Sensors & Instrumentation Electronics Manufacturing Services (Transmitters, analyzers, industrial sensors) (IMAGAGAL), Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware) (IMAGAGAK), Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD), Ruggedized/Harsh-Environment Electronics Manufacturing (IP-rated, shock/vibration, wide-temp) (IMAGAGAF)

Keywords

• Electronic manufacturing services
• Microelectronics assembly
• Surface mount technology
• Printed circuit board assembly
• Flip chip packaging

Headquarters

HQ city

Norcross

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Infrastructure, Technology or R&D, Supply Chain, Marketing or Sales

Revenue model

1. Electronic Manufacturing Services (EMS): Engent provides comprehensive electronic manufacturing services including design support, engineering, manufacturing, and electronic component testing. Services are delivered through project-based contracts supporting customers from new product introduction (NPI) through end of life (EOL), with flexibility to scale manufacturing based on business needs.
2. Engineering and Consulting Services: Engineering consulting, process development, prototyping, environmental testing, and failure analysis services provided to assist clients with technology development and commercialization. Services supported by highly educated professionals contributing to ongoing research and development.
3. Technology Commercialization: Customer support from conception through manufacturing, including proof of concept development, prototyping, and testing to advance technology into commercial applications. Advanced process development and advanced technology component prototyping services.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels5 records

Core offering

Engent is a U.S.-based electronic manufacturing services (EMS) provider that delivers advanced microelectronics assembly, engineering, prototyping, testing, and failure analysis for next-generation small form factor electronics. The company supports customers from concept and proof-of-concept through new product introduction (NPI), volume manufacturing, and end-of-life (EOL), with specialized capabilities in advanced SMT assembly, flip chip (C4), 3D packaging, MEMS technology and packaging, and wafer processing. Services target defense, aerospace/avionics, medical devices, telecommunications, GPS/tracking, and industrial customers needing miniaturized, high-reliability electronics.

Product overview

Engent is a provider of next generation microelectronics development, testing and manufacturing services. The company operates as a platform-plus-services model offering comprehensive Electronic Manufacturing Services (EMS) as its core platform, supported by specialized service modules including Printed Circuit Board Assembly (PCBA), Microelectronics Assembly, Flip Chip Technology, Surface Mount Assembly, Wafer Processing, Chip on Board Assembly, Integrated Circuit Packaging, Electronic Packaging, Box Build Services, Technology Commercialization, Electronic Product Testing, Reliability Testing, and Electronic Failure Analysis. Engent also provides engineering consulting, process development, and prototyping services that support customers from concept through volume manufacturing. The company serves defense/military, aeronautics/avionics, medical devices, GPS/tracking, telecommunications, industrial, civil services, POS terminals, and audio/video sectors.

Differentiator

Problem solved

Functional benefit

Products and services

• Electronic Manufacturing Services (EMS) Comprehensive Electronic Manufacturing Services (EMS) platform enabling high volume manufacturing while shortening time to market, including design support, engineering, manufacturing, and OEM assembly. Services are delivered through project-based contracts supporting customers from new product introduction (NPI) through end of life (EOL), with flexibility to scale manufacturing.
• Printed Circuit Board Assembly (PCBA) Full-service PCBA capabilities including through-hole and surface-mount soldering, high volume machine production, and small volume precision hand assembly for OEM customers across defense, aerospace, medical, and industrial markets.
• Microelectronics Assembly Advanced microelectronics assembly services leveraging cutting-edge technologies and unique wiring solutions for small form factor applications across medical, defense, and industrial sectors.
• Flip Chip Technology System-in-package assembly service (C4 - controlled collapse chip connection) providing high performance, smaller footprint, and greater reliability than traditional wire bonding, with thermal dissipation optimization and integration with anisotropic and isotropic adhesive attach technologies.
• MEMS Technology and Packaging Advanced MEMS (micro electro mechanical systems) technology and packaging services protecting devices from moisture, current, and chemicals for medical, automotive, and consumer applications, including chip carrier, pin array, and dual inline packaging (DIP).
• Surface Mount Assembly and Processing Advanced SMT assembly services for electronic circuit applications including flip chip, direct chip attach, BGA processing, CSP assembly, and fine pitch stencil printing for OEM customers.
• Wafer Processing Complete wafer processing services including wafer saw/sort/inspect, wafer thinning, wafer bumping, die banking, and known good die testing at speed for semiconductor customers.
• Chip on Board Assembly and Packaging Semiconductor assembly technology that eliminates conventional device packaging by directly mounting microchips to circuit boards with die-attach adhesive and wirebonding.
• Integrated Circuit Packaging Secure IC packaging services providing protective casings for custom microelectronics to protect circuits and electrical contacts from corrosion and physical damage.
• Electronic Packaging Service Comprehensive electronic packaging services including PCB assemblies, liquid filling, hermetic packages, conformal coating, potting, and 3D packaging solutions for system-in-package applications.
• Electronic Components Manufacturing Next generation manufacturing services including module/SIP/hybrid package production, advanced SMT production, direct chip attach, multi-chip module assembly, and miniaturized passive components.
• Electronic Printed Circuit Board Prototyping Critical PCB prototyping services that enable thorough engineering review, design validation, and cost savings through effective prototyping that addresses technical challenges.
• Technology Commercialization Customer support from conception through manufacturing, including proof of concept development, prototyping, testing, and technology advancement into commercial applications.
• Engineering Consulting and Process Development Professional engineering consulting and advanced process development services supporting customers from concept through manufacturing, including proof of concept development, prototyping, testing, and technology advancement into commercial applications.
• Electronic Product Testing State-of-the-art electronic product testing services including shock, vibration, temperature, acceleration, cycling testing and qualification testing using liquid thermal shock, air thermal shock, HAST, HALT, AGREE chamber, and Surface Insulation Resistance (SIR) testing equipment.
• Reliability Testing Electronic product testing for shock, vibration, temperature, acceleration using AGREE Chamber and other state-of-the-art equipment for qualification and cycling testing across harsh-environment use cases.
• Electronic Failure Analysis Expert failure analysis services using advanced technologies and equipment including low pressure SEM, SEM backscatter, energy disperse X-Ray analysis, polarizing light/dark field microscopy, metallagraph, differential contrast microscopy, X-Ray fluorescence, CSAM (acoustic microscopy), IR microscopy, 3D surface inspection, and thermal analysis to identify root causes.
• SPEA 4060M Flying Probe Testing Fixtureless in-circuit and continuity testing service using the SPEA 4060M Flying Probe, added to Engent's comprehensive testing services to support OEM customers requiring fast, flexible test coverage without custom fixtures.
• Box Build Services Complete turnkey box build services including enclosure fabrication, subassembly installation, cabling, wire harnesses, cabinet assembly, control panels, and rack/enclosure builds for OEM customers.

Quantifiable outcome

• Placement rate of 50,000 components per hour using Siemens Dematic machinery
• +2 more outcomes

Segments9 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Five partnerships are on record, tiered core and minor.

• FlipChip InternationalcoreStrategic or Co-development Partner · 1 May 2006Strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP) Technologies for highly integrated stacked die packaging applications. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world's leading wafer level bumping company. This technology enables packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives.
• Siemens Dematic Electronics Assembly SystemscoreStrategic or Co-development PartnerEngent acquired rights to the Advanced Assembly Technology (AAT) Center contracts, equipment and personnel located in Norcross, Georgia from Siemens Dematic. Additionally, Engent became a member of the newly formed Siemens Dematic Technology Network, with the two companies working closely together to provide advanced technology solutions to the electronics industry.
• Siemens Dematic Technology NetworkcoreTechnology or IntegrationEngent became a member of the newly formed Siemens Dematic Technology Network following the acquisition of Advanced Assembly Technology Center rights, enabling collaboration on advanced technology solutions for the electronics industry.
• IPC Solder Products Value CouncilminorStrategic or Co-development PartnerEngent participates in IPC's comprehensive study of lead free alloys (Tin-Silver-Copper) analyzing properties of leading candidates for lead free assembly, along with Solectron, Flextronics and U.S. NAVSEA.
• HDP User GroupminorStrategic or Co-development PartnerEngent became a member of the High Density Packaging User Group, an international user group of electronics companies working together to advance packaging technology.

Scale indicators6 records

Recent moves7 records

Expansion highlights5 records

Broad incumbents

• Celestica: Large publicly-traded EMS provider serving aerospace/defense, industrial, and healthcare end markets with a global footprint. Comparable to Engent as an EMS competitor for defense and aerospace microelectronics, though significantly larger and broader in scope.
• Benchmark Electronics: Public EMS company with strong focus on complex, low-to-medium volume, high-reliability assemblies for aerospace, defense, medical, and industrial customers. Directly comparable to Engent's specialty EMS positioning in regulated, high-mix microelectronics.
• Jabil: One of the world's largest EMS providers with diversified offerings across consumer, automotive, aerospace/defense, and healthcare. Competes with Engent for aerospace/defense and medical microelectronics work but at vastly larger scale.
• Sanmina Corporation: Global EMS provider with strong aerospace/defense, medical, and industrial verticals. Comparable to Engent as a broad incumbent in microelectronics manufacturing and integrated solutions.

Direct peers

• Creation Technologies: Private specialty EMS provider serving aerospace/defense, medical, and industrial markets with a focus on complex, regulated electronics. Comparable to Engent as a mid-sized private competitor in the same regulated, high-reliability niche.
• Plexus Corporation: Mid-tier EMS company specializing in complex, lower-volume, high-mix products for aerospace/defense, medical, and industrial. Directly comparable to Engent in service model and customer verticals, with similarly strong engineering-to-manufacturing integration.
• Key Tronic Corporation: Mid-sized EMS provider offering PCBA, box build, and engineering services to medical, aerospace, and industrial customers. Directly comparable to Engent in scope of EMS services and end-market exposure.
• Kimball Electronics: Specialty EMS provider focused on complex, high-reliability electronics for medical, automotive, and industrial markets. Closely aligned with Engent's model of high-mix, low-to-medium volume microelectronics manufacturing with strong quality system certifications.
• SMTC Corporation: Mid-tier EMS provider with capabilities in complex PCBA and box-build assembly serving aerospace/defense, medical, and industrial markets. Comparable to Engent as a similarly-sized specialty EMS competitor.

Emerging players

• FlipChip International: Specialty wafer-level bumping and 3D WLCSP technology company that is Engent's strategic alliance partner. Highly relevant as a technology peer in advanced microelectronics packaging, and is also a potential complementary ecosystem partner.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

• Xx.com/engentaat
• LinkedInlinkedin.com/company/engent-inc-

Compliance28 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles6 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Engent