Developer docs
API playgroundTry for free, no card

Search company profiles

Toshiba America Electronic Components

Full company profile

uuid000epih

Namestring
Toshiba America Electronic Components
Legal namestring
Toshiba America Electronic Components, Inc.
Websiteurl
toshiba.com
Company typeenum
Private
Founded yearint
1965
Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
5,001–10,000
akta.pro rankint
HeadquartersIrvine, United States
HQ citystring
Irvine
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices4 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
power semiconductors, hard disk drives, energy storage systems, industrial motors drives, electronic components
Industry5 codes
1High-Voltage, Power Discretes & Modules (IGBT/MOSFET/SiC/GaN)
CodeHDAHAAAKPrimaryYes
2Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes)
CodeIMAGAJAEPrimaryNo
3Wide-Bandgap Power Devices (SiC/GaN Discretes)
CodeHDAHAHAGPrimaryNo
4Internal Storage Devices (HDD & SSD)
CodeHDACACAAPrimaryNo
5EV/Industrial Charging Power Electronics (Chargers, rectifiers, power stages)
CodeIMAGADAFPrimaryNo
NAICS code5 codes
  • Semiconductor and Related Device Manufacturing334413
  • Semiconductor and Other Electronic Component Manufacturing33441
  • Computer Storage Device Manufacturing334112
  • Motor and Generator Manufacturing335312
  • Electrical Equipment Manufacturing33531
SIC code4 codes
  • Semiconductors & Related Devices3674
  • Electronic Components & Accessories3670
  • Computer Storage Devices3572
  • Motors & Generators3621
Product category
Electronic Components & Power Semiconductors
GTM motion3 records

Each record includes

Type, Description, Source

Revenue model7 records
1Power Semiconductors
TypeHardware Sales
Description

Revenue from Si, SiC, and GaN power semiconductors for automotive, industrial, data center, and infrastructure applications

toshiba.com
2Hard Disk Drives
TypeHardware Sales
Description

Enterprise, consumer, and specialty HDDs for data center, personal computing, and industrial storage applications

toshiba.com
3Energy Storage Systems
TypeHardware Sales
Description

SCiB rechargeable batteries and UPS lithium energy storage systems for critical power and mobility applications

toshiba.com
4Steam Turbine Generators
TypeHardware Sales
Description

Large-scale steam turbine and generator systems from 200MW to 1200MW+ for thermal, nuclear, and hydro power plants

toshiba.com
5Turbine Generator Services
TypeProfessional Services
Description

Maintenance, repair, outage services, and parts manufacturing for thermal, nuclear, and hydro turbines and generators

toshiba.com
6Industrial Motors and Drives
TypeHardware Sales
Description

Low and medium voltage motors, adjustable speed drives, and motor control solutions for industrial applications

toshiba.com
7Uninterruptible Power Systems
TypeHardware Sales
Description

Single-phase (1-22 kVA) and three-phase (15-2000 kVA) UPS systems for data centers, telecom, healthcare, and industrial applications

toshiba.com
Marketing channels6 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels5 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Personnel, Supply Chain, Operations, Technology or R&D, Infrastructure, Marketing or Sales
Pricing details3 tiers
1Single-phase UPS systems (1-22 kVA)
ModelOtherBilling cadenceMulti-year contract
Notes

Single-phase UPS models range from 1 to 22 kVA for applications including edge facilities, retail, and small data centers. Pricing not publicly disclosed - quote-based.

toshiba.com
2Three-phase UPS systems (15-2,000 kVA)
ModelOtherBilling cadenceMulti-year contract
Notes

Three-phase UPS systems range from 15 to 2,000 kVA, supporting operations from mid-size facilities to hyperscale environments. Pricing not publicly disclosed - quote-based.

toshiba.com
3IoT Solution Pack
ModelOtherBilling cadenceAnnual
Notes

Cloud-based IoT solution with remote monitoring, visualization and data collection capabilities. Pricing not publicly disclosed - quote-based for enterprise deployments.

toshiba.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 7 records shown
1SCiB
Description

Proprietary lithium titanium oxide (LTO) battery technology offering fast charging, long cycle life, and consistent performance for demanding environments

toshiba.com
+6 more records
Core offering1 text field

Toshiba America Electronic Components manufactures and sells power semiconductors (Si, SiC, and GaN MOSFETs/IGBTs), enterprise and consumer hard disk drives, and energy storage solutions including SCiB lithium titanium oxide batteries. Its portfolio also includes industrial motors and drives, UPS systems, and high-capacity HDD technology targeting automotive, data center, industrial, and infrastructure markets.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 5 values shown
  • 40TB-class HDDs planned for 2027 using 12-disk stacking + MAMR technology
+4 more records
Product overview1 text field

Toshiba America Electronic Components (TAEC) operates as a platform-plus-modules product architecture within the broader Toshiba Americas Group. The core semiconductor and data storage portfolio includes power semiconductors (MOSFETs, IGBTs, SiC, and GaN devices), enterprise and consumer HDDs, and specialized imaging sensors. TAEC's power semiconductor lineup integrates with the broader TIC power electronics ecosystem (UPS systems, SCiB batteries) to deliver comprehensive energy solutions for AI data centers, automotive, industrial, and infrastructure applications. The vertically integrated manufacturing model provides supply stability for demanding applications including electric vehicles and hyperscale data centers.

Product and service13 records
1UMOS 11 MOSFETs
CategoryPower Semiconductors
Description

Latest generation MOSFET power semiconductors with improved switching characteristics for power management in automotive, data center, industrial, and infrastructure markets.

2Silicon Carbide (SiC) Power Modules
CategoryPower Semiconductors
Description

Wide-bandgap silicon carbide power semiconductor modules for grid-level and industrial systems, providing higher efficiency and power density than traditional silicon devices.

3Gallium Nitride (GaN) Devices
CategoryPower Semiconductors
Description

Wide-bandgap GaN semiconductor devices for high-efficiency applications in automotive, data center, industrial, and infrastructure markets.

440TB-class Hard Disk Drives with MAMR
CategoryData Storage
Description

High-capacity hard disk drives using first-in-industry 12-disk stacking technology combined with MAMR for hyperscale and enterprise storage workloads.

5TCD2400DG High-Speed CCD Linear Image Sensor
CategoryImaging Semiconductors
Description

High-speed color CCD linear image sensor for Automated Optical Inspection (AOI) equipment in industrial manufacturing, featuring 100MHz maximum data rate and 22.7kHz line rate.

6Data Center/Enterprise HDDs
CategoryData Storage
Description

Enterprise hard disk drives engineered for 24/7 operation, combining high capacity, speed, and durability for hyperscale, enterprise, and cloud environments.

7Internal/Specialty HDDs
CategoryData Storage
Description

Internal and specialty hard disk drives for industrial and embedded applications.

8SCiB Rechargeable Battery Systems
CategoryEnergy Storage
Description

Proprietary lithium titanium oxide (LTO) battery cells and modules offering fast charging, long cycle life, and consistent performance for demanding environments. Offered to OEMs and battery integrators developing custom energy storage or backup applications.

9Uninterruptible Power Systems (UPS)
CategoryPower Electronics
Description

Single-phase (1-22 kVA) and three-phase (15-2,000 kVA) UPS systems for data centers, telecom, healthcare, and industrial applications, featuring advanced diagnostics and intelligent load management.

10Steam Turbine Generators
CategoryPower Generation Equipment
Description

Large-scale steam turbine and generator systems from 200MW to 1,200MW+ for thermal, nuclear, and hydro power plants.

11Turbine Generator Services
CategoryEnergy Services
Description

Maintenance, repair, outage services, and parts manufacturing for thermal, nuclear, and hydro turbines and generators.

12Industrial Motors and Drives
CategoryIndustrial Equipment
Description

Low and medium voltage motors, adjustable speed drives, and motor control solutions for industrial applications including the EQP Global product line with severe duty and explosion proof configurations.

13IoT Solution Pack
CategoryIndustrial IoT
Description

Cloud-based IoT solution combining edge computing, remote monitoring, visualization, and data collection capabilities for smart connected facilities.

Scale indicator15 records

Each record includes

Type, Value, Description, Source

Partnership4 partners
1National Institute of Radiological Sciences (NIRS/QST)
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-01-01
Description

Long-term collaboration with NIRS/QST for development of heavy ion therapy technologies. Toshiba developed the world's smallest rotating gantry for heavy ion therapy using superconducting technologies through this partnership, advancing cancer treatment capabilities.

toshiba.com
2Mikawa Power Plant (18 partner organizations)
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2024-01-01
Description

Toshiba, in conjunction with 18 partner organizations, constructed one of the world's largest Carbon Capture plants at the Mikawa Power Plant in Omuta, Fukuoka prefecture. The plant captures more than 600 tons-CO2/day, over 50 percent of the power plant's daily emissions. Nearly 13,000 operating hours of testing have been gathered.

toshiba.com
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2024-01-01
Description

Partnership with Meidensha to develop gas insulated switchgear (GIS) using a natural origin gas that does not contain SF6 (sulphur hexafluoride). This addresses the need to replace SF6, a greenhouse gas with 23,500 times the global warming potential of CO2.

4SCiB Battery OEM and Integrator Partners
Strategic tierMinorTypeChannel Partner/ Reseller/ Distributor
Description

Toshiba offers SCiB cells and modules to OEMs and battery integrators developing custom energy storage or backup applications. Partners can build modular backup to large-scale storage systems using Toshiba's battery technology.

toshiba.com
Recent move5 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight5 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

Japanese conglomerate with overlapping portfolios in industrial motors/drives, power semiconductors (Hitachi Power Solutions), T&D, and energy systems directly comparable to Toshiba Americas' TIC and TAES subsidiaries.

TypeBroad incumbent
Description

Direct Japanese peer operating across power semiconductors (Si/SiC), factory automation, motors, drives, and energy systems with similar breadth and integrated manufacturing comparable to the Toshiba Americas portfolio.

TypeDirect peer
Description

Leading global supplier of IGBTs, MOSFETs, SiC, and GaN power discretes and modules targeted at automotive traction, industrial drives, and renewable energy, directly competing with Toshiba's UMOS and SiC product lines.

TypeDirect peer
Description

Major automotive and industrial power semiconductor vendor with SiC MOSFETs and modules for EV and renewable applications, a head-to-head competitor to Toshiba in power discrete and module design wins.

TypeDirect peer
Description

One of the two remaining HDD manufacturers competing with Toshiba in nearline and enterprise capacity drives where Toshiba's planned 40TB MAMR drives are positioned.

TypeDirect peer
Description

Primary mass-capacity HDD rival pursuing HAMR technology; Toshiba and Seagate together with Western Digital form the global HDD oligopoly competing on $/TB and capacity ceiling.

TypeDirect peer
Description

Strong UPS, power management, and industrial electrical equipment manufacturer serving data centers and industrial customers, directly comparable to Toshiba's TIC UPS and power electronics lines.

TypeDirect peer
Description

Power semiconductor specialist with SiC and IGBT modules spanning EV, industrial, and renewable markets, a focused competitor to Toshiba's power discrete and module business.

TypeEmerging player
Description

Pure-play SiC power semiconductor company with vertically integrated wafer-to-module capability, competing with Toshiba in SiC discretes and modules for EV and industrial power conversion.

TypeBroad incumbent
Description

Global industrial electrical equipment leader with overlapping UPS, motor control, drives, and power management portfolios serving data center and industrial customers comparable to Toshiba Americas' TIC offerings.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat6 records

Each record includes

Type, Details

Key risks5 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers6 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment6 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile4 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI capability3 records

Each record includes

Type, Description, Source

AI maturity
App detail

Has app

Feature7 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries3 records

Each record includes

Name, Acquired on, Relationship type, Type, Business focus

No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment5 records

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Toshiba America Electronic Components

Electronic Components & Power Semiconductorstoshiba.com

Toshiba America Electronic Components firmographics

Firmographics
Name
Toshiba America Electronic Components
Legal name
Toshiba America Electronic Components, Inc.
Website
https://toshiba.com
Company type
Private
Founded year
1965
Operating status
Operating
Headcount range
5,001–10,000 employees
Ownership category
akta.pro rank

Toshiba America Electronic Components industry classification

Industry
Product category
Electronic Components & Power Semiconductors
NAICS
Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Computer Storage Device Manufacturing (334112), Motor and Generator Manufacturing (335312), Electrical Equipment Manufacturing (33531)
SIC
Semiconductors & Related Devices (3674), Electronic Components & Accessories (3670), Computer Storage Devices (3572), Motors & Generators (3621)
akta.pro primary industry
High-Voltage, Power Discretes & Modules (IGBT/MOSFET/SiC/GaN) (HDAHAAAK)
akta.pro secondary industries
Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes) (IMAGAJAE), Wide-Bandgap Power Devices (SiC/GaN Discretes) (HDAHAHAG), Internal Storage Devices (HDD & SSD) (HDACACAA), EV/Industrial Charging Power Electronics (Chargers, rectifiers, power stages) (IMAGADAF)

Keywords

  • Power semiconductors
  • Hard disk drives
  • Energy storage systems
  • Industrial motors drives
  • Electronic components

Where Toshiba America Electronic Components is headquartered

Location

Headquarters

HQ city
Irvine
HQ country
United States
HQ region
North America

Offices4 records

Markets served

Toshiba America Electronic Components business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Personnel, Supply Chain, Operations, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

  1. Power Semiconductors: Revenue from Si, SiC, and GaN power semiconductors for automotive, industrial, data center, and infrastructure applications
  2. Hard Disk Drives: Enterprise, consumer, and specialty HDDs for data center, personal computing, and industrial storage applications
  3. Energy Storage Systems: SCiB rechargeable batteries and UPS lithium energy storage systems for critical power and mobility applications
  4. Steam Turbine Generators: Large-scale steam turbine and generator systems from 200MW to 1200MW+ for thermal, nuclear, and hydro power plants
  5. Turbine Generator Services: Maintenance, repair, outage services, and parts manufacturing for thermal, nuclear, and hydro turbines and generators
  6. Industrial Motors and Drives: Low and medium voltage motors, adjustable speed drives, and motor control solutions for industrial applications
  7. Uninterruptible Power Systems: Single-phase (1-22 kVA) and three-phase (15-2000 kVA) UPS systems for data centers, telecom, healthcare, and industrial applications

Pricing tiers

ModelBillingPrice
OtherMulti-year contractSingle-phase UPS systems (1-22 kVA)
OtherMulti-year contractThree-phase UPS systems (15-2,000 kVA)
OtherAnnualIoT Solution Pack

Go-to-market motion3 records

Distribution channels5 records

Marketing channels6 records

Toshiba America Electronic Components product offering

Product offering

Core offering

Toshiba America Electronic Components manufactures and sells power semiconductors (Si, SiC, and GaN MOSFETs/IGBTs), enterprise and consumer hard disk drives, and energy storage solutions including SCiB lithium titanium oxide batteries. Its portfolio also includes industrial motors and drives, UPS systems, and high-capacity HDD technology targeting automotive, data center, industrial, and infrastructure markets.

Product overview

Toshiba America Electronic Components (TAEC) operates as a platform-plus-modules product architecture within the broader Toshiba Americas Group. The core semiconductor and data storage portfolio includes power semiconductors (MOSFETs, IGBTs, SiC, and GaN devices), enterprise and consumer HDDs, and specialized imaging sensors. TAEC's power semiconductor lineup integrates with the broader TIC power electronics ecosystem (UPS systems, SCiB batteries) to deliver comprehensive energy solutions for AI data centers, automotive, industrial, and infrastructure applications. The vertically integrated manufacturing model provides supply stability for demanding applications including electric vehicles and hyperscale data centers.

Differentiator

Problem solved

Functional benefit

Brands

  • SCiB: Proprietary lithium titanium oxide (LTO) battery technology offering fast charging, long cycle life, and consistent performance for demanding environments
  • UMOS
  • EtaPRO
  • TOSHcare
  • RemotEye
  • EQP Global
  • IoT Solution Pack

Products and services

  • UMOS 11 MOSFETs Latest generation MOSFET power semiconductors with improved switching characteristics for power management in automotive, data center, industrial, and infrastructure markets.
  • Silicon Carbide (SiC) Power Modules Wide-bandgap silicon carbide power semiconductor modules for grid-level and industrial systems, providing higher efficiency and power density than traditional silicon devices.
  • Gallium Nitride (GaN) Devices Wide-bandgap GaN semiconductor devices for high-efficiency applications in automotive, data center, industrial, and infrastructure markets.
  • 40TB-class Hard Disk Drives with MAMR High-capacity hard disk drives using first-in-industry 12-disk stacking technology combined with MAMR for hyperscale and enterprise storage workloads.
  • TCD2400DG High-Speed CCD Linear Image Sensor High-speed color CCD linear image sensor for Automated Optical Inspection (AOI) equipment in industrial manufacturing, featuring 100MHz maximum data rate and 22.7kHz line rate.
  • Data Center/Enterprise HDDs Enterprise hard disk drives engineered for 24/7 operation, combining high capacity, speed, and durability for hyperscale, enterprise, and cloud environments.
  • Internal/Specialty HDDs Internal and specialty hard disk drives for industrial and embedded applications.
  • SCiB Rechargeable Battery Systems Proprietary lithium titanium oxide (LTO) battery cells and modules offering fast charging, long cycle life, and consistent performance for demanding environments. Offered to OEMs and battery integrators developing custom energy storage or backup applications.
  • Uninterruptible Power Systems (UPS) Single-phase (1-22 kVA) and three-phase (15-2,000 kVA) UPS systems for data centers, telecom, healthcare, and industrial applications, featuring advanced diagnostics and intelligent load management.
  • Steam Turbine Generators Large-scale steam turbine and generator systems from 200MW to 1,200MW+ for thermal, nuclear, and hydro power plants.
  • Turbine Generator Services Maintenance, repair, outage services, and parts manufacturing for thermal, nuclear, and hydro turbines and generators.
  • Industrial Motors and Drives Low and medium voltage motors, adjustable speed drives, and motor control solutions for industrial applications including the EQP Global product line with severe duty and explosion proof configurations.
  • IoT Solution Pack Cloud-based IoT solution combining edge computing, remote monitoring, visualization, and data collection capabilities for smart connected facilities.

Quantifiable outcome

  • 40TB-class HDDs planned for 2027 using 12-disk stacking + MAMR technology
  • +4 more outcomes

Companies that use Toshiba America Electronic Components

Customer profile

Named customers6 records

Segments6 records

Ideal customer profiles4 records

Toshiba America Electronic Components technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

AI capability3 records

Feature7 records

Toshiba America Electronic Components partnerships and signals

Strategic signal

Partnerships

Four partnerships are on record, tiered core and minor.

  • National Institute of Radiological Sciences (NIRS/QST)coreStrategic or Co-development Partner · 1 January 2025Long-term collaboration with NIRS/QST for development of heavy ion therapy technologies. Toshiba developed the world's smallest rotating gantry for heavy ion therapy using superconducting technologies through this partnership, advancing cancer treatment capabilities.
  • Mikawa Power Plant (18 partner organizations)coreStrategic or Co-development Partner · 1 January 2024Toshiba, in conjunction with 18 partner organizations, constructed one of the world's largest Carbon Capture plants at the Mikawa Power Plant in Omuta, Fukuoka prefecture. The plant captures more than 600 tons-CO2/day, over 50 percent of the power plant's daily emissions. Nearly 13,000 operating hours of testing have been gathered.
  • MeidenshacoreStrategic or Co-development Partner · 1 January 2024Partnership with Meidensha to develop gas insulated switchgear (GIS) using a natural origin gas that does not contain SF6 (sulphur hexafluoride). This addresses the need to replace SF6, a greenhouse gas with 23,500 times the global warming potential of CO2.
  • SCiB Battery OEM and Integrator PartnersminorChannel Partner/ Reseller/ DistributorToshiba offers SCiB cells and modules to OEMs and battery integrators developing custom energy storage or backup applications. Partners can build modular backup to large-scale storage systems using Toshiba's battery technology.

Scale indicators15 records

Recent moves5 records

Expansion highlights5 records

Toshiba America Electronic Components competitors and assessment

Company assessment

Broad incumbents

  • Hitachi: Japanese conglomerate with overlapping portfolios in industrial motors/drives, power semiconductors (Hitachi Power Solutions), T&D, and energy systems directly comparable to Toshiba Americas' TIC and TAES subsidiaries.
  • Mitsubishi Electric: Direct Japanese peer operating across power semiconductors (Si/SiC), factory automation, motors, drives, and energy systems with similar breadth and integrated manufacturing comparable to the Toshiba Americas portfolio.
  • Schneider Electric: Global industrial electrical equipment leader with overlapping UPS, motor control, drives, and power management portfolios serving data center and industrial customers comparable to Toshiba Americas' TIC offerings.

Direct peers

  • Infineon Technologies: Leading global supplier of IGBTs, MOSFETs, SiC, and GaN power discretes and modules targeted at automotive traction, industrial drives, and renewable energy, directly competing with Toshiba's UMOS and SiC product lines.
  • STMicroelectronics: Major automotive and industrial power semiconductor vendor with SiC MOSFETs and modules for EV and renewable applications, a head-to-head competitor to Toshiba in power discrete and module design wins.
  • Western Digital: One of the two remaining HDD manufacturers competing with Toshiba in nearline and enterprise capacity drives where Toshiba's planned 40TB MAMR drives are positioned.
  • Seagate Technology: Primary mass-capacity HDD rival pursuing HAMR technology; Toshiba and Seagate together with Western Digital form the global HDD oligopoly competing on $/TB and capacity ceiling.
  • Eaton: Strong UPS, power management, and industrial electrical equipment manufacturer serving data centers and industrial customers, directly comparable to Toshiba's TIC UPS and power electronics lines.
  • ON Semiconductor (onsemi): Power semiconductor specialist with SiC and IGBT modules spanning EV, industrial, and renewable markets, a focused competitor to Toshiba's power discrete and module business.

Emerging players

  • Wolfspeed: Pure-play SiC power semiconductor company with vertically integrated wafer-to-module capability, competing with Toshiba in SiC discretes and modules for EV and industrial power conversion.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks5 records

Key highlights7 records

Customer concentration

Toshiba America Electronic Components social profiles

Digital presence

Toshiba America Electronic Components financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Toshiba America Electronic Components leadership team

Management profile

Number of profiles

Profiles1 record

Toshiba America Electronic Components subsidiaries and ownership

Company hierarchy

Subsidiaries3 records

Toshiba America Electronic Components funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Toshiba America Electronic Components M&A and investment

M&A and investment

M&A

Investments5 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Toshiba America Electronic Components

What does Toshiba America Electronic Components do?

Toshiba America Electronic Components manufactures and sells power semiconductors (Si, SiC, and GaN MOSFETs/IGBTs), enterprise and consumer hard disk drives, and energy storage solutions including SCiB lithium titanium oxide batteries. Its portfolio also includes industrial motors and drives, UPS systems, and high-capacity HDD technology targeting automotive, data center, industrial, and infrastructure markets.

Is Toshiba America Electronic Components a public or private company?

Toshiba America Electronic Components is a private company. It is classified as corporate owned and is currently operating.

When was Toshiba America Electronic Components founded?

Toshiba America Electronic Components was founded in 1965. It employs 5,001 to 10,000 people.

Where is Toshiba America Electronic Components based?

Toshiba America Electronic Components is headquartered in Irvine, United States, in the North America region.

How does Toshiba America Electronic Components make money?

Seven revenue lines are on record. Power Semiconductors are the primary driver. The others are hard Disk Drives, energy Storage Systems, steam Turbine Generators, turbine Generator Services, industrial Motors and Drives and uninterruptible Power Systems.

Who are Toshiba America Electronic Components's main competitors?

Broad incumbents on record are Hitachi, Mitsubishi Electric and Schneider Electric. Direct peers are Infineon Technologies, STMicroelectronics, Western Digital, Seagate Technology, Eaton and ON Semiconductor (onsemi). Wolfspeed is listed as an emerging player.

Does Toshiba America Electronic Components have an API?

No public API is recorded for Toshiba America Electronic Components.

What industry is Toshiba America Electronic Components in?

Toshiba America Electronic Components's product category is Electronic Components & Power Semiconductors. Its primary akta.pro industry code is HDAHAAAK, High-Voltage, Power Discretes & Modules (IGBT/MOSFET/SiC/GaN), with a secondary code of IMAGAJAE, Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes). Its NAICS code is 334413 and its SIC code is 3674.

Unlock the full company data

50 free credits on sign-up, no credit card required.

Contact sales
Live signals
36krIs Intense Involution Truly Necessary for the Home Appliance MCU Industry?Multiple home appliance MCU vendors launched new products in August, including Megawin, Geehy, Lingou, Nuvoton, NXP, Toshiba, and others. The launches target motor control, touch, and variable frequency applications, with features like high-current drive and low power consumption. The industry faces intense competition as new products appear frequently.MorningstarToshiba Showcases Advanced Power Semiconductor Solutions at APEC 2026Toshiba America Electronic Components is showcasing its latest power semiconductor technologies at the Applied Power Electronics Conference (APEC) 2026 in San Antonio from March 23-25. Key products on display include the new UMOS 11 MOSFETs with improved switching characteristics, silicon carbide power modules for grid-level and industrial systems, and GaN devices, targeting applications across automotive, data center, industrial, and infrastructure markets. The company highlighted its vertically integrated manufacturing model as providing reliable, scalable supply stability for demanding applications including electric vehicles and hyperscale data centers.ReutersMicron, Toshiba chips in new iPhones -iFixitiFixit's teardown of Apple's iPhone XS and XS Max found chips from Micron and Toshiba, with no mention of Samsung or Qualcomm. Qualcomm, a long-time Apple supplier, has been in a legal dispute over patent licensing. The teardown also listed components from Skyworks, Murata, NXP, Cypress, Texas Instruments, and STMicroelectronics.PR NewswireToshiba Announces New CMOS LDO Voltage RegulatorsToshiba America Electronic Components announced a new family of CMOS low dropout voltage regulators, the TCR4DG series, consisting of single-output devices with fixed output voltages between 1.0V and 4.5V capable of driving up to 420mA. The regulators are offered in an ultra-small WCSP4E package (0.645mm x 0.645mm) and feature over-current protection, over-temperature protection, inrush current protection, and auto-discharge functionality. The new series targets mobile applications requiring high-density board assembly such as cell phones, with the devices available now through Toshiba sales offices.PR NewswireToshiba Highlights New Advances in Memory, SSD and Architecture Technologies at Flash Memory SummitToshiba America Electronic Components (TAEC) showcased its latest memory and storage technologies at the Flash Memory Summit 2017 in Santa Clara, California, including 96-layer 3D flash memory, QLC BiCS FLASH 3D flash memory, and 3D flash memory with TSV technology, all claimed as industry firsts. The company presented 16 sessions and panels, delivered a keynote on future flash memory applications in self-driving cars, cloud computing, and virtual/augmented reality, and demonstrated new SSD products including the PM5 Series SAS SSD and CM5 Series enterprise NVMe SSD. TAEC emphasized its leadership position, noting it invented NAND flash 30 years ago and continues advancing the technology for emerging applications.PR NewswireToshiba Leads Sessions and Demos on New Advances in Memory, SSD and Architecture Technologies at Flash Memory SummitToshiba America Electronic Components announced its participation at the Flash Memory Summit 2017 in Santa Clara, California, where it will lead multiple technical sessions on SSDs, NVMe technologies, and 3D flash memory while demonstrating its product lineup including the CM5 enterprise SSD and 96-layer BiCS FLASH technology. The company is showcasing a broad range of flash storage solutions across consumer and enterprise segments at the three-day event (August 8-10), including demonstrations with partners such as Lenovo and Mellanox for NVMe over Fabrics technology.PR NewswireToshiba Expands Lineup of Photorelays in DIP8 PackagesToshiba America Electronic Components has expanded its large current photorelay lineup with two new products: the 100V TLP3823 (3A drive current) and the 200V TLP3825 (1.5A drive current), both housed in 8-pin DIP packages. The new photorelays utilize Toshiba's 8th generation UMOS trench MOSFET process technology and are designed to replace mechanical relays in applications including industrial equipment, HVAC, building automation, and semiconductor testers. Mass production of the new photorelays has commenced and samples are available through local Toshiba sales offices.PR NewswireToshiba Introduces New 20V MOSFETs with Low On-Resistance SpecificationsToshiba America Electronic Components introduced four new 20V MOSFETs featuring low on-resistance specifications housed in compact SOT-23F packages, designed for power supply controls in mobile devices, consumer products, and industrial equipment. The new products leverage Toshiba's UMOSVII-H MOSFET process to achieve reduced gate switch charge and on-state resistance, resulting in improved power efficiency. The SSM3K344R, SSM3K345R, SSM3J355R, and SSM3J358R models are available immediately through Toshiba sales offices.PR NewswireToshiba Bluetooth Low Energy Product Lineup Supports New Bluetooth Mesh StandardToshiba America Electronic Components, Inc. announced that its Bluetooth Low Energy product lineup now supports the newly ratified Bluetooth Mesh standard. This update enables devices to increase communication range, reliability, and obstacle penetration while extending battery life through secure mesh networking. The technology is targeted at expanding applications in rapidly growing segments such as factory automation and building management.PR NewswireToshiba Introduces ESD Protection Diodes for High-Speed Interfaces in Mobile DevicesToshiba America Electronic Components announced the launch of a new lineup of ten multi-bit, low-capacitance electrostatic discharge protection diodes for high-speed interfaces in mobile devices, supporting USB 3.0/3.1 and HDMI standards. The new products, developed using Toshiba's proprietary EAP-IV snapback process, deliver approximately 50 percent improvement in dynamic resistance and 75 percent improvement in ESD voltage compared to existing products. The diodes are available now in three package sizes to address mounting space requirements across applications including USB Type-C, tablets, and wearables.