What Pureon does

Pureon is a privately held specialty manufacturer of precision surface finishing consumables, headquartered in Willich, Germany, with manufacturing operations in Lengwil, Switzerland, and a global direct sales footprint across EMEA, the Americas, and Asia-Pacific. The company produces a vertically integrated portfolio spanning diamond micron powders (polycrystalline detonation-synthesized, HPHT monocrystalline, natural, and nanocluster), diamond grinding pads, polyurethane and composite polishing pads (including SiC-specific platforms like IRINO-PROSiC and IKONIC 4250L), diamond suspensions and slurries, solid diamond compounds, synthetic coolants and lubricants, ID slicing blades, and cleaning chemistries.

The company's products serve seven primary verticals: Advanced Optics, Semiconductor & Electronics (with a strategic emphasis on silicon carbide wafer processing), Precision Industry, Luxury Goods (horlogerie and synthetic gemstones), MedTech, Tools & Coatings, and Metallography. Pureon monetizes primarily through direct, quote-based B2B sales of consumables — a model that creates recurring revenue once products are qualified into customer production lines — supplemented by application engineering and process development services delivered through its Surface Lab facilities. The go-to-market relies on regional sales directors and product managers by category, supported by an active trade fair and technical content marketing program, rather than channel partners or e-commerce.

Name

Pureon

Legal name

Pureon

Website

https://pureon.com

Company type

Private

Founded year

2021

Operating status

Operating

Headcount range

51–100 employees

Short description

Pureon is a privately held German-Swiss manufacturer of precision surface finishing consumables — diamond powders, grinding pads, polishing pads, slurries, and coolants — serving advanced optics, semiconductor (notably SiC), MedTech, and luxury goods manufacturers worldwide through direct enterprise sales.

Ownership category

akta.pro rank

Product category

Precision Surface Finishing Consumables

NAICS

Paint and Coating Manufacturing (32551), Nonmetallic Mineral Product Manufacturing (327)

SIC

Abrasive, Asbestos & Misc Nonmetallic Mineral Prods (3290), Paints, Varnishes, Lacquers, Enamels & Allied Prods (2851)

akta.pro primary industry

CMP Slurries & Pads Chemicals (CMP Consumables Chemicals) (IMAEAKAE)

akta.pro secondary industry

Primers, Bonding Agents & Surface Preparation Products (IMADAOAK)

Keywords

• Precision surface finishing
• Diamond micron powders
• CMP polishing pads
• Silicon carbide processing
• Industrial grinding consumables

Headquarters

HQ city

Langwies

HQ country

Switzerland

HQ region

Europe

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Marketing or Sales

Revenue model

1. Surface Finishing Consumables: Sale of precision surface finishing consumables including diamond micron powders, polishing pads, grinding pads, slurries, compounds, coolants, and cleaning solutions. Products are sold directly to industrial manufacturers requiring precision surface finishing for their manufacturing processes.
2. Process Development Services: Technical consulting and process development services through Surface Lab facilities, supporting customers in optimizing their surface finishing processes using Pureon's products and equipment.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels6 records

Core offering

Pureon manufactures and sells precision surface finishing consumables including diamond micron powders (polycrystalline, monocrystalline, natural, nanocluster), diamond grinding pads, polishing pads (including CMP and SiC-specific composite pads), lapping and polishing slurries, slicing blades, coolants, compounds, and cleaning agents. The company serves industrial manufacturers in semiconductors, advanced optics, MedTech, luxury goods, precision industry, metallography, and tools and coatings, and supplements its product portfolio with Surface Lab process development and application testing services.

Product overview

Pureon is a vertically integrated surface solutions provider offering a comprehensive portfolio of consumables and process solutions for precision surface finishing across grinding, lapping, polishing, and chemical mechanical polishing (CMP). The product portfolio centers on micron diamond powders (including Microdiamant DP polycrystalline, MSY monocrystalline, NAT natural, XP nanocluster, and GAF liquid diamond), lapping and polishing slurries (SPLENDIS, SPW, OPW, PURE-DS series, ULTRA-SOL suspensions), diamond grinding pads (PLATO II, SQUADRO-M/H, SQUADRO-O/OWH, APOLLO-S, SQUADRO-G2), polishing pads (IC1000, IKONIC 4250L, SUBA series, STEP-PRO/PLUS, QUICK-STEP, MAMBO, IRINO-PRO-C, IRINO-PROSiC, IC OPTIC, POLITEX, OPTIVISION, GS), compounds (LUCIO, SPARKLING), coolants and lubricants (VECTOR HTI, HTG, HTN, HTS, CHALLENGE series), wafering and slicing consumables (WSG, WSO, ID Slicing Blades), cleaning and rinsing products (CHALLENGE 700HT, VECTOR HTR), and fixtures/templates (NTA E310, DF 200). Solutions span multiple industries including semiconductors, advanced optics, precision industry, luxury goods, MedTech, metallography, and tools & coatings.

Differentiator

Problem solved

Functional benefit

Products and services

• Microdiamant DP Polycrystalline synthetic diamond powder produced through detonation synthesis, featuring high compressive strength, toughness, and micro-rough surface. Enables very high surface qualities and significantly higher material removal rates across abrasive lapping of superhard materials to high-gloss polishing of high-precision components. Available in precision size range from 0-0.03 µm to 20-30 µm.
• Microdiamant MSY Monocrystalline diamond powder produced through HPHT synthesis with oriented crystal structure and parallel cleavage planes similar to natural diamond. Self-sharpening fracturing mechanism increases tool life. Used for precision grinding, lapping, and polishing of various materials.
• Microdiamant NAT Natural diamond powder with the same monocrystalline structure as synthetic diamond but without traces of metal catalysts. Exhibits pronounced cleavage planes resulting in blocky and irregular shape. Preferred for manufacturing electroplated diamond tools.
• Microdiamant XP Nanocluster diamond produced through detonation synthesis. Crystallites of 4-8 nanometers form clusters with aggregate sizes up to one micrometer. Very high surface area and micro-rough particle surface. Preferred for surface coatings and super-fine polishing applications and used as diamond nanomaterial in research applications. Submicron size range.
• Microdiamant GAF Liquid diamond concentrate using GAF (Gallium Arsenide Free) technology that delivers polishing solutions free of unwanted agglomerates. Proprietary process guarantees all diamond is dispersed in a single particle distribution completely free of agglomerates, eliminating scratched surfaces and increasing finished product yield.
• PLATO II Metal-bonded diamond grinding pad for non-metallic samples such as ceramics, glass, and rock samples. Ensures high and steady material removal even in very hard materials with self-sharpening due to high diamond concentration and quality. Available in diameters 125 µm and 250 mm with grits from 10-125 micron.
• SQUADRO-M / SQUADRO-H Innovative diamond grinding pads extending fine grinding to single-micron grit sizes (3 µm, 6 µm, 15 µm, 30 µm, 125 µm). Replaces conventional lapping processes with superior material removal rate, surface quality, workpiece geometry, and tool life. SQUADRO-M uses medium-hard resin; SQUADRO-H uses hard resin.
• SQUADRO-O / SQUADRO-OWH Diamond grinding pads optimized for fine grinding of optical components. Manufactured using high-precision diamond micron sizes in self-sharpening bond. Achieve excellent surface quality, exact geometry, and very high removal rates on flat or spherical optical components. Compatible with CaF2, ZnSe, Si, Ge, GaAs.
• APOLLO-S Self-sharpening, flexible diamond grinding pad for flat and fine grinding applications, replacing traditional SiC paper. Precision graded diamond and optimized grit concentration (125 µm, 75 µm, 54 µm, 18 µm) deliver short process times, flat surfaces, and superior edge sharpness. Prevents corrosion.
• SQUADRO-G2 Second-generation diamond grinding pad with 50% more grinding thickness (0.8 mm optional abrasive layer) for significantly increased lifetime. High and uniform stock removal, impressive surface qualities, and edge sharpening. Compatible with BK7, BOROFLOAT, Tempax glass, quartz, and polycarbonate. Diamond sizes: 15 µm, 30 µm, 45 µm, 60 µm.
• IC1000 Industry-standard polishing pad for chemical mechanical polishing (CMP). Made of rigid, micro-porous polyurethane material. Enables localized planarization, excellent removal rates, low global non-uniformity, and low defectivity for tungsten, copper, ILD, STI, and polysilicon processes.
• IKONIC 4250L Next-generation pad for SiC single-wafer polish process. Polymer formulation delivers high removal rate and meets surface roughness requirements for 200 mm SiC wafers. Controlled porosity and tight pore size distribution extend pad lifetime, with lower cut rates during conditioning further extending pad life. Available with or without subpad, and with slurry-reduction grooving options.
• SUBA IV Polyurethane impregnated polyester felt for stock and intermediate polishing. Open pore structure and less aggressive urethane composition. Ideal primary polishing pad for low to medium pressure applications with fragile crystals or delicate surfaces. Available in grooved, embossed, plain, and perforated surface textures.
• SUBA 800 Polyurethane impregnated polyester felt for stock and intermediate polishing. Denser, harder pad with smaller pore structure than SUBA IV. Used for polishing glass, quartz, or ceramics with consistent, reproducible results. Available in grooved and plain surface textures.
• STEP-PRO Woven pad made of cellulose triacetate strands. Low moisture absorbency (5%) ensures high stock removal. Quality of sharp corners with very uniform roughness. Indispensable for quality pre-polishing. Hard, even pad surface with crisscross weave of cellulose acetate yarns.
• STEP-PLUS Pad made from woven cellulose acetate filaments resembling silk. Low absorbency holds different types of suspension and diamond on surface. Universal use in 99% of polishing applications from hard ceramics to yellow gold. Reserved for small grain sizes from 6 µm to 0.1 µm and maintains sharp edges.
• QUICK-STEP

Quantifiable outcome

• IRINO-PROSiC achieves surface finishes down to 3 nm Ra for SiC wafer processing
• +2 more outcomes

Segments7 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Three partnerships are on record, tiered core and minor.

• Silicon Carbide Innovation Alliance (SCIA)coreStrategic or Co-development PartnerPureon is a founding member of SCIA, actively contributing to SiC research and innovation. The company participates in collaborative research initiatives including work with Penn State University on SiC processing advancement.
• APOMA (Arbeitsgemeinschaft zur Förderung der Photonik und Optik e.V.)minorOthersIndustry association membership supporting photonics and optics industry in German-speaking regions.
• SwissmemminorOthersSwiss industry association membership representing the Swiss mechanical and electrical engineering industries.

Scale indicators1 record

Recent moves6 records

Expansion highlights5 records

Direct peers

• Fujimi Corporation: Fujimi is a Japanese specialty manufacturer of precision polishing slurries and abrasive materials for semiconductors, optics, and hard disk substrates. Closely comparable to Pureon's diamond slurries, polishing compounds, and pad portfolio for high-precision surface finishing.
• Buehler (ITW): Buehler is a leading supplier of metallographic sample preparation equipment and consumables, including diamond grinding pads, polishing pads, and diamond suspensions. Highly comparable to Pureon's metallography-focused products (PLATO II, SQUADRO, APOLLO-S, diamond suspensions).
• Element Six (De Beers Group): Element Six is a leading producer of synthetic diamond and superhard materials, including polycrystalline and monocrystalline diamond powders and slurries used in precision grinding, lapping, and polishing. Highly comparable to Pureon's Microdiamant DP, MSY, and XP product families across the same end-markets.
• Engis Corporation: Engis supplies precision lapping and polishing equipment and consumables, including diamond slurries, abrasive compounds, and polishing pads. Direct peer in the precision optics and hard material lapping/polishing consumables market served by Pureon.
• CMC Materials (Cabot Microelectronics): Cabot Microelectronics is a leading CMP slurry specialist serving semiconductor wafer polishing applications. Direct overlap with Pureon's CMP slurry/suspension offerings targeting tungsten, copper, ILD, STI, polysilicon, and emerging SiC processes.
• Lapmaster Wolters: Lapmaster Wolters is a precision surfacing equipment and consumables supplier offering lapping, polishing, and fine grinding products for optics, semiconductors, and industrial components. Comparable to Pureon's SQUADRO pad family and lapping-focused consumables portfolio.

Broad incumbents

• Versum Materials (Merck KGaA): Merck's semiconductor materials business (formerly Versum) is a major supplier of CMP slurries and polishing pads to semiconductor fabs. Comparable to Pureon's CMP slurry and pad portfolio (IC1000, IKONIC, PURE-DS, IRINO-PROSiC), but operating as a large-scale incumbent with broader semiconductor chemistry offerings.
• Diamond Innovations (Hyperion Materials & Technologies): Hyperion Materials & Technologies (formerly Diamond Innovations) manufactures synthetic diamond, cubic boron nitride, and cemented carbide materials. Comparable to Pureon's Microdiamant product lines and used in similar grinding and lapping applications across tooling and precision industries.
• Saint-Gobain Surface Solutions: Saint-Gobain supplies abrasive grains, bonded and coated abrasives, and precision surface finishing consumables globally. Comparable to Pureon's diamond grinding pad and lapping consumables portfolio, particularly in optics and precision components, but as a much larger diversified industrial materials supplier.

Emerging players

• Kem International: Kem International manufactures precision lapping and polishing machines and related consumables for optics, semiconductors, and ceramics. Partial overlap with Pureon's lapping-focused portfolio, particularly in single-side and double-side lapping applications.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/@pureon391?si=tiqwAkjkimvjmvUO
• LinkedInlinkedin.com/company/pureongroup
• Instagraminstagram.com/we.are.pureon

Revenue estimate

Valuation estimate

Number of profiles

Profiles9 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Pureon