What Jiujiang Defu Technology does

Jiujiang Defu Technology Co., Ltd. (九江德福科技股份有限公司), traded on the Shenzhen Stock Exchange ChiNext board under stock code 301511 since its August 2023 IPO, is a Chinese manufacturer of high-performance electrolytic copper foil with origins as a 1985 state-owned electronic materials factory. The company produces two main product families: lithium battery copper foil (4-10μm grades including GT, MT-40, HT-50, UHT-60, HM-50, LM-50, HE series, plus next-generation PCF/ACF/SCF foils for solid-state batteries and supercapacitors) and electronic circuit copper foil (12-210μm grades including HTE, HVLP, RTF, SLP, V-SLP, R-SLP, H-HCD, and R-FPC). Its manufacturing rests on an electrochemistry and materials science R&D platform comprising two named laboratories (Zhuofeng and Kuafu) and four specialized laboratory platforms totaling ~10,000 sqm and 300M+ RMB invested, supplemented by 200+ R&D personnel and partnerships with Peking University, the Chinese Academy of Sciences, South China University of Technology, and Xiamen University.

Commercially, Defu operates a B2B direct enterprise sales model targeting lithium-ion battery manufacturers and PCB/CCL makers, with named tier-1 customers including CATL (宁德时代), LG Chemistry, BYD, Guoxuan High-Tech, and Shengyi Technology. The company maintains 1 R&D center, 3 production bases (Jiujiang and Lanzhou), and 2 sales centers, distributing across dozens of countries and regions. Following the abandonment of its $200M Luxembourg acquisition, total electrolytic copper foil capacity stands at 191,000 tons/year, ranking #1 globally; a January 2026 acquisition of Anhui Huiru Technology and an October 2025 new copper foil project indicate continued capacity buildout. Revenue is generated primarily through hardware sales of foil by specification, with pricing not publicly disclosed and structured around quote-based B2B contracts determined by thickness, grade, and order volume.

Name

Jiujiang Defu Technology

Legal name

九江德福科技股份有限公司

Website

https://jjdefu.com

Company type

Public

Founded year

1985

Operating status

Operating

Headcount range

1–10 employees

Short description

Jiujiang Defu Technology is a China-based, Shenzhen-listed manufacturer of high-performance electrolytic copper foil serving lithium-ion battery OEMs (CATL, BYD, LG Chemistry) and PCB/CCL makers, operating 191,000 tons/year of global #1 capacity across three production bases in Jiujiang and Lanzhou.

Ownership category

akta.pro rank

Product category

Electrolytic Copper Foil Manufacturing

NAICS

Communication and Energy Wire and Cable Manufacturing (33592)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Current Collectors & Foils (Copper, Aluminum) Manufacturing (EUAFABAF)

Keywords

• Electrolytic copper foil
• Lithium battery foil
• Electronic circuit foil
• PCB copper foil
• Copper foil manufacturing

Headquarters

HQ city

Jiujiang

HQ country

China

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Infrastructure, Technology or R&D, Operations, Marketing or Sales

Revenue model

1. Electrolytic Copper Foil Manufacturing and Sales: Revenue generated from R&D, production, and sale of high-performance electrolytic copper foil including lithium battery copper foil and electronic circuit copper foil. Primary B2B direct sales model to battery manufacturers and PCB makers.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

Jiujiang Defu Technology is a manufacturer of high-performance electrolytic copper foil. The company R&Ds, produces, and sells two main product lines: lithium battery copper foil (4–10 μm grades for energy storage, EV power batteries, and 3C digital batteries) and electronic circuit copper foil (12–210 μm grades for PCBs, CCLs, IC packaging substrates, high-frequency/high-speed circuits, automotive electronics, and 5G infrastructure). Customers are enterprise cell makers and PCB producers served through direct B2B sales.

Product overview

Jiujiang Defu Technology (德福科技) is a leading manufacturer of high-performance electrolytic copper foils serving two primary product lines: lithium battery copper foils (锂电铜箔) and electronic circuit copper foils (电子电路铜箔). The lithium battery copper foil portfolio includes GT, MT-40, HT-50, UHT-60, HM-50, LM-50, HE, PCF, ACF, and SCF series, each designed for specific applications in energy storage, automotive power, and 3C digital batteries. The electronic circuit copper foil line encompasses V-SLP, R-SLP, C-IC1, high-frequency signal foils (RHF1/VHF1/VHF2), HVLP and RTF high-speed foils (VHS/RHS series), H-SLP, automotive circuit foils (H-HCD/R-HCD), flexible board foils (R-FPC), E-TFR special foils, and H-HSP/HTE-R for lamination applications. These products serve diverse markets including EV batteries, consumer electronics, 5G infrastructure, IC packaging, and automotive electronics.

Differentiator

Problem solved

Functional benefit

Products and services

• GT — General-Purpose Double-Sided Smooth Lithium Battery Copper Foil (普强双面光锂电铜箔) General-purpose double-sided smooth lithium battery copper foil with high ductility, uniform thickness, good conductivity, and wettability, widely used in energy storage batteries, automotive power batteries, and 3C digital batteries.
• MT-40 — Medium-Strength Double-Sided Smooth Lithium Battery Copper Foil (中强双面光锂电铜箔) Medium-strength double-sided smooth lithium battery copper foil with high tensile strength, high elongation rate, and stable product performance, reducing foil wrinkles and breakage during battery manufacturing.
• HT-50 — High-Strength Double-Sided Smooth Lithium Battery Copper Foil (高强双面光锂电铜箔) High-strength double-sided smooth lithium battery copper foil with high tensile strength, uniform thickness, and low roughness, suitable for high-capacity rechargeable batteries in large-scale energy storage, new energy vehicles, and consumer electronics.
• UHT-60 — Ultra-High Strength 60 Double-Sided Smooth Lithium Battery Copper Foil (超高强60双面光锂电铜箔) Ultra-high strength 60 double-sided smooth lithium battery copper foil achieving >60 kgf/mm² tensile strength while maintaining >4% elongation at 6 μm thickness, designed for silicon-oxygen or silicon-carbon anodes with high expansion coefficients.
• HM-50 — High Elastic Modulus Double-Sided Smooth Lithium Battery Copper Foil (高弹性模量双面光锂电铜箔) High elastic modulus double-sided smooth lithium battery copper foil with high modulus, strong flexibility, bend resistance, and high electrical conductivity, improving battery structural stability and safety.
• LM-50 — Low Elastic Modulus Double-Sided Smooth Lithium Battery Copper Foil (低弹性模量双面光锂电铜箔) Low elastic modulus double-sided smooth lithium battery copper foil with low roughness, low modulus, high tensile strength, and easy elongation, preventing electrode breakage during winding and pressing processes.
• HE — High-Elongation Double-Sided Smooth Lithium Battery Copper Foil (高延伸双面光锂电铜箔) High-elongation double-sided smooth lithium battery copper foil with low roughness, extremely high ductility, and stable performance, suitable for long-cycle and high-rate lithium-ion batteries.
• PCF — Porous Copper Foil for Lithium-Ion Capacitors and Solid-State Batteries (PCF多孔铜箔) Porous copper foil for lithium-ion capacitors and solid-state lithium-ion batteries, anchoring lithium metal, increasing adhesion, reducing interface impedance, and improving energy density.
• ACF — Atomized Copper Foil (ACF雾化铜箔) Atomized copper foil as high-performance current collector for supercapacitors and lithium batteries, featuring a 3D structure that increases electrode active material attachment area and reduces internal resistance.
• SCF — Sandwich-Structure Copper Foil (SCF芯箔) Sandwich-structure copper foil providing antioxidant barrier for copper substrate, inhibiting electrolyte corrosion, suitable for high-voltage cathode systems, solid-state batteries, and high-temperature sintering processes.
• V-SLP — Copper Foil for IC Packaging and SLP Substrates Copper foil for IC packaging and substrate-like printed boards (SLP), featuring ultra-high tensile strength for BT/ABT substrates.
• R-SLP — Reverse-Treated Copper Foil for IC Packaging and SLP Reverse-treated copper foil for IC packaging and SLP applications.
• C-IC1 / C-IC1-C — Ultra-Thin Copper Foil for IC Packaging Substrates and HDI Boards Ultra-thin copper foil for IC packaging substrates and high-density interconnect boards, separable after lamination; C-IC1-C features carrier layer roughening treatment for coreless technology.
• RHF1 / VHF1 / VHF2 — High-Frequency Signal Copper Foil (高频信号铜箔) High-frequency signal copper foil for PTFE, hydrocarbon resin (PCH), and high-frequency circuit boards with stable peel strength.
• VHS1–VHS4 — HVLP High-Speed Copper Foil (HVLP高速铜箔) HVLP series high-speed copper foil for low-loss and mid-loss applications with good signal integrity (SI) for high-speed digital circuits (HSD).
• RHS1–RHS4 — RTF Reverse-Treated High-Speed Copper Foil (RTF高速铜箔) RTF reverse-treated high-speed copper foil for FR-4 and high-density interconnect boards (HDI) with good signal integrity.
• H-SLP — Copper Foil for HDI / SLP / Packaging Substrates High-density interconnect and substrate-like printed board (SLP)/packaging substrate copper foil with low roughness.
• H-HCD / R-HCD — Automotive BMS Circuit Board Copper Foil (汽车线路板铜箔) Copper foil for automotive BMS circuit boards, medium-high TG epoxy, and heat dissipation boards.
• R-FPC — Flexible Substrate Copper Foil (软板用铜箔) Copper foil for flexible substrates (2L-FCCL) with PI/TPI materials featuring high bend resistance.
• E-TFR — Special Copper Foil (特种铜箔) Special copper foil with low resistivity temperature coefficient and excellent thermal stability for consumer electronics, aerospace, and medical applications.
• H-HSP / HTE-R — Outer Layer Lamination Copper Foil (外层压合用铜箔) Copper foil for PPO, modified epoxy, and outer layer lamination with high roughening and high peel strength; HTE-R for 3C consumer electronics, multilayer boards, power devices, and automotive boards.

Quantifiable outcome

• Global #1 ranking in electrolytic copper foil production capacity with 191,000 tons/year total capacity
• +3 more outcomes

Named customers5 records

Segments2 records

Ideal customer profiles2 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Nine partnerships are on record, tiered core, major and minor.

• 白银有色集团 (Baiyin Nonferrous Group)coreStrategic or Co-development Partner · 1 January 2018Strategic supply partnership ensuring cathode copper supply for copper foil production. Baiyin Nonferrous Group holds 38% stake in subsidiary 甘肃德福新材料有限公司. This partnership has provided strong support for the construction and release of copper foil production capacity.
• 北京大学化学与分子工程学院 (Peking University School of Chemistry and Molecular Engineering)majorStrategic or Co-development PartnerSchool-enterprise R&D cooperation. Defu Technology collaborates with Peking University on产学研 projects, advancing the industrialization of scientific research achievements in copper foil technology.
• 华南理工大学 (South China University of Technology)majorStrategic or Co-development PartnerSchool-enterprise R&D cooperation on copper foil materials and manufacturing technology, part of the '产、学、研、用' mechanism.
• 中国科学院 (Chinese Academy of Sciences)majorStrategic or Co-development PartnerAcademic research partnership with CAS for advanced R&D in copper foil materials and electrochemical processes.
• 厦门大学 (Xiamen University)majorStrategic or Co-development PartnerSchool-enterprise cooperation partner for R&D collaboration in copper foil technology and new materials development.
• 兰州大学 (Lanzhou University)minorStrategic or Co-development PartnerSchool-enterprise cooperation partner, likely leveraging proximity to Gansu Defu production base.
• 中国人民大学化学系 (Renmin University of China Department of Chemistry)minorStrategic or Co-development PartnerSchool-enterprise R&D cooperation partner in chemistry and materials science.
• 苏州科技大学 (Suzhou University of Science and Technology)minorStrategic or Co-development PartnerSchool-enterprise cooperation partner for R&D in copper foil technology.
• 晨光中学 (Chenguang Middle School)minorOthersDefu Technology partnered with Chenguang Middle School to launch the 'Doctor Lecture' program (博士讲堂), where company PhDs teach students about lithium-ion batteries and copper materials, promoting science education and company-community engagement.

Scale indicators10 records

Recent moves8 records

Expansion highlights6 records

Direct peers

• Nuode Investment (诺德股份): One of the largest Chinese electrolytic copper foil manufacturers, listed on Shanghai Stock Exchange (600110). Direct competitor in lithium battery copper foil, serving similar battery customers including CATL and BYD. Most comparable peer given overlapping product portfolio, technology base, and Chinese customer base.
• Lingbao Wason (灵宝华鑫/华鑫铜箔): Major Chinese electrolytic copper foil producer serving lithium battery and electronic circuit markets. Direct competitor to Defu with significant domestic capacity and overlapping customers in the battery and PCB supply chains.
• SK Nexilis (SK ie technology): Korean subsidiary of SKC specializing in copper foil for EV batteries, with global manufacturing footprint. Direct competitor serving major Korean battery makers (LG Energy Solution, Samsung SDI) and competing for the same end markets as Defu.
• Furukawa Electric (古河电气工业): Japanese global leader in electrolytic copper foil manufacturing, serving both battery and PCB markets. Comparable high-end copper foil product portfolio and serves similar downstream electronics customers with global reach.
• Mitsui Mining & Smelting (三井金属): Japanese copper foil manufacturer with global operations in electrolytic copper foil for lithium batteries and high-frequency PCBs. Direct competitor particularly in high-end electronic circuit foils for AI/HPC and 5G applications.
• JX Nippon Mining & Metals: Japanese nonferrous metals and electronic materials manufacturer with copper foil operations. Competes in both lithium battery copper foil and electronic circuit foil markets with comparable technology depth.
• Iljin Materials (일진머티리얼즈): Korean copper foil manufacturer acquired by SKC, serving global battery customers. Direct competitor in lithium battery copper foil with overlapping product portfolio for EV and energy storage applications.
• Shenghua New Materials (圣达电气): Chinese electrolytic copper foil manufacturer focused on lithium battery applications. Direct domestic competitor to Defu in the same Chinese battery supply chain serving similar EV and energy storage customers.

Emerging players

• Doosan Corporation (Electro-Materials): Korean electronic materials company with growing presence in copper foil for PCBs and battery applications. Competes in segments of Defu's product portfolio, particularly electronic circuit foils.
• Chang Chun Group (长春化工): Taiwanese chemical and electronic materials supplier with PCB-related product offerings including copper-clad laminates. Adjacent competitor in the electronic circuit materials value chain serving similar downstream PCB customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance10 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries6 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Jiujiang Defu Technology