Circuit Foil

What Circuit Foil does

Circuit Foil Luxembourg SA, headquartered in Wiltz, Luxembourg, is a specialty manufacturer of electrodeposited (ED) copper foil serving the global electronics industry. Founded in 1959 in New Jersey and incorporated in Luxembourg in 1960, the company has accumulated 60+ years of know-how focused exclusively on high value-added copper foil. Its core technology is electrodeposition onto rotating titanium drums with computerized process automation and chemical additive control, enabling a portfolio of 20+ foil types spanning ultra-thin carrier-supported Doublethin (using metallic chromium-based separation to avoid organic residues, functional thickness down to 1.5µm), HVLP ultra-low-roughness foil for AI accelerators, high-frequency and low-loss foils, flexible electronics, smart card, and aerospace variants.

The company sells primarily to enterprise electronics manufacturers across IC substrate, consumer electronics (smartphones, 5G), high-speed digital/AI accelerator, automotive, flexible electronics, smart card, and aerospace customers in 50+ countries. GTM is direct enterprise field sales through a regional structure covering Europe (Luxembourg HQ), North America (Granby Canada, Glenside USA), and Asia Pacific (Hong Kong office plus Zhangjiagang, China service center with slitting and sheeting capacity). Revenue is generated through hardware sales of specification-tailored copper foil, with quote-based pricing and customization for every customer request. A global MSAP patent license with Mitsui Mining & Smelting (since 2020) extends Circuit Foil's offerings into fine-line circuit fabrication.

Since 2014 the company has operated under Korean ownership, currently as a wholly-owned subsidiary of Solus Advanced Materials (the rebranded Doosan Solus Group, acquired by SkyLake Investment in 2020). Operational leadership is split between Luxembourg (manufacturing, R&D, ESG, quality, production, finance) and Korea (sales team). Recent milestones include UL 2809-2 100% recycled content validation across five product lines (2025) and HVLP foil approval by a major North American GPU manufacturer for next-generation AI accelerators (May/June 2025).

Name

Circuit Foil

Legal name

Circuit Foil Luxembourg

Website

https://circuitfoil.com

Company type

Private

Founded year

1959

Operating status

Operating

Headcount range

101–250 employees

Short description

Circuit Foil Luxembourg is a specialty manufacturer of electrodeposited copper foil for the global electronics industry, supplying IC substrates, smartphones, 5G devices, AI accelerators, automotive, smart cards, and aerospace customers in 50+ countries through a direct enterprise sales model backed by Korean parent Solus Advanced Materials.

Ownership category

akta.pro rank

Product category

Copper Foil Manufacturing

NAICS

Copper Rolling, Drawing, Extruding, and Alloying (33142), Electroplating, Plating, Polishing, Anodizing, and Coloring (332813)

SIC

Printed Circuit Boards (3672), Semiconductors & Related Devices (3674)

akta.pro primary industry

PCB Materials & Laminates (Copper Clad, Prepreg, Cores) (HDAHAOAJ)

akta.pro secondary industry

Electroplating & Metal Finishing (Anodizing/Galvanizing/Passivation) (IMAIAKAE)

Keywords

• Electrodeposited copper foil
• Copper foil manufacturing
• PCB substrate materials
• Ultra-thin copper foil
• High-frequency copper foil

Headquarters

HQ city

Wiltz

HQ country

Luxembourg

HQ region

Europe

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Infrastructure, Marketing or Sales

Revenue model

1. Copper foil product sales: Circuit Foil develops, produces and markets high-quality copper foil products to the electronics industry. Revenue is generated through the sale of electrodeposited copper foils across various product types (ultra-thin, high frequency, standard profiles) serving diverse end applications including smartphones, 5G devices, IC substrates, smart cards, autonomous vehicles, and AI accelerators. Customization and application-specific product development support premium pricing.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Core offering

Circuit Foil develops, produces, and markets high-quality electrodeposited (ED) copper foils for the electronics industry, with a portfolio of more than 20 foil types spanning ultra-thin, high-frequency, low-loss, high-density, standard, flexible, smart-card, and aerospace grades. The company serves high-end applications including IC substrates, SLP PCBs, 5G smartphones, AI accelerators, autonomous vehicles, and smart cards through its Luxembourg-based manufacturing facility and global service center network.

Product overview

Circuit Foil is a manufacturer of high-quality electrodeposited copper foils for the electronics industry. The company produces a comprehensive portfolio of copper foil products organized by application segment: IC Substrates/SLP (featuring ultra-thin DOUBLETHIN carrier-supported foils in ANP, ANPS, N-TZA, NF-HT, NF, NN, and CL variants), High Density Interconnect PCBs (BF-TZA and DOUBLETHIN products), High Speed Digital & Low Loss applications (BF-NN, BF-ANP, BF-HFI-LP2 series), High Frequency applications (BFL-NF, BFL-NN, HFA, TWLS families), Flexible electronics (BF-TZA-FX, TZA-B-FX, TZA-FX), Smart Cards (LPT-TZA, LPT-NP), and Aerospace (TZA-TZA double-sided treated). The company also offers standard foil lines (TZA, TZA-B2, TZA-B3) for regular MLB applications. All products use electrodeposition manufacturing technology and are sold globally through service centers in Luxembourg, Hong Kong, Zhangjiagang, and North America.

Differentiator

Problem solved

Functional benefit

Brands

• Doublethin: Ultra-thin carrier-supported copper foil product line for IC substrates and high-density PCB applications
• BF-TZA
• BF-NN
• HVLP
• BFL-NF

Products and services

• DOUBLETHIN Ultra-thin Carrier-Supported Copper Foil Ultra-thin electrodeposited copper foil supported on a carrier foil with metallic chromium-based separation (no organic residues), designed for IC substrates and SLP (Substrate-Like PCB) applications requiring fine-line circuitry fabrication. Available in multiple variants (ANP, ANPS, N-TZA, NF-HT, NF, NN, CL) with varying thickness and roughness specifications and maximum lamination temperature of 220-225°C. Functional thickness down to 1.5μm.
• BF-TZA Ultra-Flat Profile Copper Foil Ultra-flat profile matte-side treated copper foil for high-density PCB and high-speed digital applications, available in thicknesses from 9μm to 70μm.
• BF-NN / BF-NN-HT Super-Flat Profile Copper Foil Super-flat profile matte-side treated copper foil designed for high-speed digital and low loss applications, with very low roughness specifications.
• BF-ANP Almost No Profile Copper Foil Almost no profile matte-side treated copper foil for high speed digital applications, offering minimal signal loss characteristics.
• BF-HFI-LP2 Ultra-Flat Profile Copper Foil Ultra-flat profile copper foil designed for high-frequency applications with optimized loss performance.
• BFL-NF-HT / BFL-NF-Z Nodular-Free Copper Foil Nodular-free matte-side treated copper foil for high-frequency applications, offering excellent signal integrity at high frequencies.
• BFL-NN / BFL-NN-HT / BFL-NN-Z Super-Flat High Frequency Copper Foil Super-flat profile matte-side treated copper foil for high-frequency applications, available in standard, high-temperature, and zinc-treated variants.
• TZA-B Very Low Profile Copper Foil Very low profile reverse-treated copper foil for high-speed digital applications, providing excellent peel strength.
• HFA / HFA-LP / HFA-B High Frequency Copper Foil High-frequency application copper foils available in standard/low profile and very low profile reverse-treated variants for aerospace and advanced electronics.
• TWLS / TWL-HP / TWLS-B High Frequency Copper Foil Standard and low profile matte-side treated copper foil for high-frequency applications, with TWLS-B reverse-treated variant.
• BF-TZA-FX / TZA-B-FX / TZA-FX Flexible Copper Foil Ultra-flat and very low profile copper foils designed specifically for flexible electronics applications.
• LPT-TZA / LPT-NP Smart Card Copper Foil Standard and low profile matte-side treated copper foils designed for smart card applications.
• TZA-TZA Double-Sided Aerospace Copper Foil Double-sided treated copper foil for aeronautical engineering applications, combining standard and very low profile treatments.
• TZA / TZA-B2 / TZA-B3 Standard Copper Foil Standard and low profile matte-side treated copper foils for regular MLB (Multilayer Board) applications, with B2 and B3 reverse-treated variants for enhanced adhesion.
• HVLP Copper Foil for High-Performance Computing and AI Ultra-low-roughness (High Value Low Profile) copper foil specifically designed for high-performance computing and AI accelerator applications. Approved by major GPU manufacturers for next-generation AI accelerator mass production. Validated under UL 2809-2 as 100% recycled copper foil.

Quantifiable outcome

• Resistivity below IPC-4562 limits (e.g., <0.162 Ωg/m² for nominal 35µm thickness)
• +1 more outcomes

Named customers1 record

Segments7 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Two partnerships are on record, tiered core and minor.

• MITSUI MINING & SMELTING CO., LTDcoreTechnology or Integration · 1 January 2020Circuit Foil Luxembourg and Mitsui Mining & Smelting Co., Ltd reached a global patent license agreement regarding Mitsui's technology for the fabrication of fine lines using a process called MSAP (Modified Semi Additive Process). This enables Circuit Foil to offer advanced fine-line circuit fabrication solutions.
• EIPC (European Institute for the PCB Community)minorOthersCircuit Foil is a proud member of the European Institute for the PCB Community (EIPC), participating in industry conferences and staying connected with the European PCB community.

Scale indicators6 records

Recent moves14 records

Expansion highlights5 records

Direct peers

• Mitsui Mining & Smelting: Japan-based global leader in electrodeposited copper foil for PCBs and IC substrates, with the largest portfolio of high-end foil grades. Direct competitor to Circuit Foil across IC substrate, HVLP and high-frequency applications, and also its MSAP technology licensor.
• LS Mtron: Korea-based manufacturer of ED copper foil serving PCB and electronics customers, with comparable focus on ultra-thin and high-end foil grades. Direct competitor in Asia with strong relationships with Korean PCB and substrate manufacturers.
• Furukawa Electric: Japan-based diversified materials manufacturer with a significant ED copper foil business serving PCB and IC substrate customers. Direct competitor in high-end foil grades and a similarly broad product portfolio across high-frequency and high-speed digital applications.
• SK Nexilis: Korea-based leading ED copper foil manufacturer (formed from SKC KOLON PI's acquisition of Iljin Materials). Direct competitor across PCB and battery copper foil, with comparable high-end product positioning targeting AI accelerator and IC substrate customers.
• Co-Tech Development: Taiwan-based copper foil manufacturer serving PCB and electronics customers across Asia. Direct competitor in commodity and mid-grade foil products, with overlap to Circuit Foil in IC substrate and high-density PCB segments.
• JX Nippon Mining & Metals: Japan-based nonferrous metals producer with an established electrodeposited copper foil business serving PCB manufacturers globally. Direct competitor in standard, RTF and HVLP foil grades used in IC substrates and high-end PCBs.
• Nippon Denkai: Japan-based specialist ED copper foil manufacturer focused on high-end applications including IC substrates and high-frequency PCBs. Direct competitor to Circuit Foil in premium foil grades serving similar end-customers.

Broad incumbents

• Doosan: Korea-based diversified industrial conglomerate and former parent of Circuit Foil (acquired it in 2014, divested via Solus in 2019–2020). Operates broadly in advanced materials and electronic materials, overlapping with Circuit Foil's positioning but across a much wider portfolio.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• Facebookfacebook.com/Circuit.Foil
• LinkedInlinkedin.com/company/circuit-foil-luxembourg-sa

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles25 records

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Circuit Foil