What Nisene does

Nisene Technology Group, Inc. is a U.S.-based manufacturer of automated integrated circuit (IC) decapsulation systems used in semiconductor failure analysis and counterfeit detection. Founded in the 1970s, the company pioneered the original JetEtch system, which was the first automated IC decapsulation system commercialized for the semiconductor industry. Nisene serves semiconductor device manufacturers, aerospace and defense contractors, automotive electronics firms, electronics distributors performing counterfeit screening, and academic and research institutions. Confirmed enterprise users include Intel, cited as a "vendor of choice" for more than 20 years, alongside LSI, Raytheon, DfR Solutions, North Shore Components, and Abstract Electronics, with global deployment wherever failure analysis and counterfeit detection are performed.

The product portfolio addresses three primary decapsulation modalities: JetEtch (high-velocity acid jet chemical etching supporting Cu, Au, CuPd, and Al wires); PlasmaEtch, a microwave-induced-plasma dry decapsulation platform using CF4/O2 with independent mass flow controllers, targeted at sensitive silver-wire devices; and LaserEtch LE1064 (laser pre-cavitation with 18x optical-zoom monitoring). Proprietary modules extend the JetEtch line: CuProtect applies a patented bias voltage to preserve copper bonding wires during chemical decapsulation, while TotalProtect layers sub-ambient cooling onto that bias technique. The mechanical accessory line includes the CERDIP Opener and Can Opener for hermetically sealed packages. Software control, accessory kits, spare parts, and process recipes are unified across the platform. Nisene also markets VeinFinder, a near-infrared medical imaging device carrying ISO 13485, ISO 9001, FDA 21 CFR Part 820, and EU MDR certifications.

The business model is a hardware-led capital equipment sale plus aftermarket recurring revenue. Systems (JetEtch, PlasmaEtch, LaserEtch and their modules) are sold via direct enterprise field sales on quote-based, Net-30 terms, with optional paid installation and training. A members-only online storefront at shop.nisene.com sells spare parts, etch fixtures, gaskets, and consumables on upfront payment. Pricing is not publicly disclosed. Demand generation runs through YouTube, LinkedIn, Facebook, a company blog, ISTFA conference presence, and direct enterprise outreach. The company is a private California corporation operating as a subsidiary of Polymatech, with no publicly disclosed external funding rounds.

Name

Nisene

Legal name

Nisene Technology Group, Inc.

Website

https://nisene.com

Company type

Private

Founded year

1970

Operating status

Operating

Headcount range

11–50 employees

Short description

Nisene Technology Group manufactures automated IC decapsulation systems (JetEtch, PlasmaEtch, LaserEtch) for semiconductor failure analysis and counterfeit detection, serving semiconductor manufacturers, aerospace and defense firms, and academic labs worldwide.

Ownership category

akta.pro rank

Headquarters

HQ city

Watsonville

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Supply Chain, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. IC Decapsulation Systems: Sale of automated decapsulation equipment including JetEtch Pro, JetEtch CuProtect, JetEtch TotalProtect, PlasmaEtch, LaserEtch, CERDIP Opener, and Can Opener systems. Payment terms are Net-30 from date of invoice for system purchases.
2. Spare Parts and Accessories: Spare parts, accessory kits, etch fixtures, and consumables sold through online store at shop.nisene.com with upfront payment via major credit card or PayPal.
3. Professional Services: Installation and training services offered as optional add-ons for system purchases. Customer must complete facility preparation requirements before scheduling.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels6 records

Core offering

Nisene Technology Group manufactures and sells automated integrated circuit (IC) decapsulation equipment used by semiconductor labs to expose the internal structure of packaged chips for failure analysis and counterfeit detection. The product portfolio spans chemical (JetEtch), laser (LaserEtch LE1064) and dry plasma (PlasmaEtch MIP) decapsulation systems, supplemented by patented copper-wire protection modules (CuProtect and TotalProtect) and mechanical package-opening accessories (CERDIP Opener and Can Opener). The company also sells the VeinFinder near-infrared vein-detection device for medical use.

Product overview

Nisene Technology Group offers a comprehensive portfolio of IC decapsulation systems and related products for semiconductor failure analysis and counterfeit detection. The core product line includes three main decapsulation technologies: JetEtch (chemical-based acid decapsulation), PlasmaEtch (Microwave Induced Plasma dry decapsulation), and LaserEtch (laser pre-cavitation). These are supplemented by specialized modules CuProtect and TotalProtect, which provide patented bias technology for protecting sensitive copper bonding wires during decapsulation. Accessory products include the CERDIP Opener and Can Opener for mechanically opening hermetically-sealed packages. The company also offers VeinFinder, a medical device using near-infrared imaging for vein detection. The product ecosystem is unified by shared software control, accessory kits, and service support, enabling customers to select the appropriate decapsulation method based on their specific IC types, wire materials, and analysis requirements.

Differentiator

Problem solved

Functional benefit

Products and services

• JetEtch Automated chemical decapsulation system for integrated circuits using high-velocity acid jet etching. Supports Cu, Au, CuPd and Al wire types and diverse IC packages, and is sold to semiconductor failure analysis labs and manufacturers.
• PlasmaEtch (MIP) Next-generation dry decapsulation system using Microwave Induced Plasma (MIP) technology. Eco-friendly and wet-chemical-free IC decapsulation ideal for silver and sensitive wire devices, with independent mass flow controllers for CF4 and O2 process gas control.
• LaserEtch (LE1064) Precision laser-based pre-cavitation system used prior to chemical or plasma IC decapsulation. Features high-resolution video monitoring with up to 18x optical zoom for real-time visualization and pinpoint accuracy.
• JetEtch CuProtect Patented Bias Technology integrated into the JetEtch Pro platform to protect copper bonding wire during chemical decapsulation, ensuring copper wires remain intact and the IC remains fully functional.
• JetEtch TotalProtect Sub-ambient IC decapsulation technology combined with Patented Bias Technology to fully protect copper bonding wire, with safer acid delivery and reduced device damage risk.
• CERDIP Opener Mechanical device with adjustable prying blades that opens hermetically-sealed ceramic dual inline packages (CERDIPs) for failure analysis and counterfeit protection inspection.
• Can Opener Mechanical can-style device opener for accessing metal-encapsulated dies that cannot be etched by chemical means, using a can-opening process for failure analysis inspection.
• VeinFinder Portable vein detection device using near-infrared light technology for healthcare professionals to locate veins in home infusion therapy, emergency care and blood donation centers; holds ISO 13485, ISO 9001, FDA 21 CFR Part 820 and EU MDR compliance.
• Installation, Training and Repair Services Professional installation, operator training, technical support, troubleshooting and repair services for Nisene decapsulation systems, including an extended warranty program for qualified equipment.

Quantifiable outcome

• Copper bond wires preserved intact during decapsulation
• +3 more outcomes

Named customers6 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Two partnerships are on record, tiered core.

• PolymatechcoreOthersNisene Technology Group is a Polymatech Company. Polymatech is the parent company of Nisene Technology Group.
• SAE InternationalcoreStrategic or Co-development PartnerMain contributor to SAE AS6081 and SAE AS6171 counterfeit detection standards. These are industry standards for counterfeit detection in electronic components.

Scale indicators3 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Thermo Fisher Scientific: Thermo Fisher provides electron microscopes and analytical instruments used downstream of IC decapsulation in failure-analysis workflows. Broad incumbent with significant overlap in semiconductor FA lab purchasing budgets.
• Oxford Instruments: Oxford Instruments manufactures analytical and plasma-based equipment for semiconductor research and failure analysis. Overlaps with Nisene's PlasmaEtch microwave-induced plasma technology and serves similar semiconductor R&D customers.
• Carl Zeiss: Carl Zeiss supplies high-end optical and electron microscopes for semiconductor failure analysis and quality control. Same end-customers and use cases as Nisene's decap tools, but positioned at the inspection stage post-decap.
• Sonoscan: Sonoscan is the dominant supplier of acoustic microscopy tools (C-SAM) used in semiconductor package-level failure analysis. Same customer base and FA lab workflow as Nisene, though addressing different failure-mode detection (delamination vs. decap for die inspection).
• Evident (Olympus Industrial): Evident, the former Olympus Scientific Solutions, supplies industrial microscopes and digital imaging systems widely used in semiconductor failure analysis and counterfeit-component inspection labs. Same end-customers as Nisene though different equipment category.
• Nordson DAGE: Nordson DAGE supplies bond testing and destructive physical analysis equipment for semiconductor failure analysis. Complementary — not directly competing in decap — but addressing the same FA lab budgets and customer set (semiconductor manufacturers, OSATs, A&D).

Emerging players

• Keyence: Keyence produces laser-based precision systems and optical measurement/microscopy equipment increasingly used in semiconductor failure analysis and counterfeit detection workflows. Partial overlap with Nisene's LaserEtch pre-cavitation positioning.

Direct peers

• Ultra Tec Manufacturing: Ultra Tec produces IC decapsulation equipment and sample-preparation tools used by semiconductor failure-analysis and counterfeit-detection labs. Closest direct competitor in Nisene's core automated decap niche.
• RKD Engineering: RKD Engineering offers automated IC decapsulators targeted at failure-analysis labs, directly competing for the same semiconductor customer accounts as Nisene's JetEtch line.
• B&G International: B&G International manufactures IC decapsulation equipment (model 250 and dcap d2i referenced by LSI as a competing legacy platform). Direct peer competing head-to-head in chemical and plasma decapsulation for semiconductor failure analysis.

Market position

Strengths5 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/channel/UCgjzIQjJUX4X_f1sgXmddHA
• Facebookfacebook.com/nisene.technology.group.inc
• LinkedInlinkedin.com/company/nisene-technology-group-inc

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Nisene