What RAM Innovations does

RAM Innovations Ltd is a privately-held UK specialist in Embedded Die Packaging (EDP), founded in 2011 and headquartered at a purpose-built 1,000 sq metre facility in Pentre, North Wales. The company's core technology embeds bare semiconductor dies — particularly wide bandgap GaN and SiC devices — directly into printed circuit board substrates, replacing wire bonds with copper interconnects to cut parasitic losses, improve thermal dissipation, and shrink power modules by up to 10x versus conventional silicon transistor designs. Building blocks include the 500V/100A Half-Bridge Building Block (30x20x5mm with ceramic substrate, integrated gate drives, isolated supplies and DC-link decoupling), Floating Tile Technology (Aluminium Nitride insert bonding) and an Integrated Cooling Module for liquid heat recovery.

RAM operates a dual business model combining custom R&D services and advanced low-to-high volume manufacturing under ISO 9001, with conventional assembly techniques (wire bonding, flip chip, sintering, SMT) offered alongside proprietary EDP. Go-to-market is enterprise field sales targeting aerospace and automotive OEMs and Tier 1 suppliers, supported by grant-funded collaborative R&D projects (Innovate UK, Welsh Government, CSconnected, DRIVE35) with consortium partners including Cambridge GaN Devices, PPM Power, TTPi, the Compound Semiconductor Application Catapult, Paragraf, INEX Microtechnology, University of Nottingham, Infineon and Nissan Technical Centre Europe. The company has 11-50 employees.

Since 2021, RAM has been a subsidiary of Russel Industries (also containing Prima Electronic Services and Denchi), operating within a UK Mittelstand-style holding model led by CEO Nick Russel. The business is publicly described as "transitioning from a niche R&D business to a manufacturing-oriented business" and is actively recruiting, with recent commercial milestones including embedded power module deliveries to an aerospace OEM (2022) and participation in the £10m Project SUITE consortium on smart EV charging and AI-enhanced GaN traction inverters. No revenue is publicly disclosed.

Name

RAM Innovations

Legal name

RAM Innovations Ltd

Website

https://ram-innovations.com

Company type

Private

Founded year

2011

Operating status

Operating

Headcount range

11–50 employees

Short description

RAM Innovations is a UK specialist in embedded die packaging (EDP) for GaN and SiC semiconductors, serving aerospace, automotive, industrial, rail and marine OEMs and Tier 1 suppliers with bespoke R&D and advanced low-to-high volume PCB-based power module manufacturing from a 1,000 sq metre North Wales facility.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Services

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Bare Printed Circuit Board Manufacturing (334412), Semiconductor and Related Device Manufacturing (334413)

SIC

Printed Circuit Boards (3672), Semiconductors & Related Devices (3674), Electronic Components, Nec (3679)

akta.pro primary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

akta.pro secondary industry

PCB Assembly (PCBA/EMS) (HDAHAOAI)

Keywords

• Embedded die packaging
• Semiconductor packaging services
• Power electronics manufacturing
• PCB embedding technology
• Wide bandgap semiconductors

Headquarters

HQ city

Buckley

HQ country

United Kingdom

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Technology or R&D, Operations, Infrastructure, Marketing or Sales, Supply Chain

Revenue model

1. R&D Services: Flexible and highly customised product and process development services supporting scenarios from one-off samples to long-term structured development programs. Includes proof-of-concept, test vehicles, marketing and engineering samples, technology training, and hosting facilities for collaborator meetings.
2. Advanced Manufacturing (EDP): Low-volume manufacturing of embedded die packaging products with an option to scale to high-volume production using large panel (450 x 600mm) format. Includes half-bridge building blocks, floating tile modules, and flip chip development.
3. Conventional Manufacturing Services: Conventional assembly techniques including wire bonding, flip chip, conductive adhesive, sintering, and surface-mount technology (SMT) for semiconductor and electronics producers.
4. Innovate UK and Grant-Funded R&D: Revenue from government grant-funded collaborative R&D projects including Innovate UK funding programmes such as the GRAPHIC-MAN project and P3EP project.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

RAM Innovations develops and manufactures embedded die packaging (EDP) products and services for the semiconductor and electronics industries. The company embeds bare GaN and SiC semiconductor dies directly into PCB structures to create compact, high-efficiency power modules, and provides bespoke R&D, advanced manufacturing, and conventional assembly services spanning proof-of-concept samples to high-volume production.

Product overview

RAM Innovations is a bespoke R&D and manufacturing services provider offering a portfolio of embedded die packaging (EDP) solutions for the semiconductor and electronics industries. Their core offering centers on Embedded Die Packaging technology, which enables semiconductor devices to be embedded within PCB structures for improved efficiency and power density. The product line includes the Integrated Cooling Solution and Half-Bridge Building Block Solution as primary product offerings, supplemented by Floating Tile Technology as a sub-product. Services span Research and Development, Advanced Manufacturing (including high-volume large panel production), Conventional Manufacturing, Flip Chip Development, and Customer Product Development. The company supports the full product lifecycle from proof-of-concept through prototyping to volume production, with particular focus on GaN and SiC power electronics for aerospace, automotive, industrial, rail, and marine applications.

Differentiator

Problem solved

Functional benefit

Products and services

• Integrated Cooling Solution A flexible integrated modular technology for heat harvesting and system cooling of power electronic modules. The cooling module bonds directly to the back side of IMS or Thick Film Substrate to form a thermally efficient contact area for heat transfer to a liquid heat recovery system. Intended for power module manufacturers in aerospace, automotive, industrial, rail, and marine applications.
• Half-Bridge Building Block Solution An integrated power building block for GaN and SiC solutions rated at +500V and 100A in a 30 x 20 x 5 mm form factor. Includes ceramic substrate, integrated gate drives, isolated power supplies, integrated DC-link decoupling, and an optional integrated liquid cooling feature. Designed for high-density power conversion applications.
• Floating Tile Technology Insert bonding technology in which Aluminum Nitride tiles are bonded within the PCB structure, allowing access to both sides of the tile simultaneously. Enables high-current, fast-switching power converter applications with enhanced thermal and electrical performance.
• Embedded Die Packaging (EDP) A manufacturing technology in which semiconductor devices are embedded within a core PCB structure to create highly efficient three-dimensional components or integrated modules. Enables greater design freedom, improved thermal transfer, reduced parasitics, and the elimination of bond wires. Offered to semiconductor and electronics manufacturers as a core capability and productised service.
• Research and Development Services Research and development of advanced manufacturing methods to produce PCBs, electronics, and electronics packaging. Includes flexible product and process development supporting one-off samples through to long-term structured development programmes for semiconductor and electronics producers.
• Advanced Manufacturing Services Electronics manufacturing using advanced methods such as embedded die packaging, including low-volume production of products such as half-bridge building blocks and floating tile modules, with an option to scale to high-volume production using a large panel (450 x 600mm) format configuration.
• Conventional Manufacturing Services Conventional assembly techniques including wire bonding, flip chip, conductive adhesive, sintering, and surface-mount technology (SMT) for semiconductor and electronics assembly. Supports customers needing traditional packaging alongside RAM's advanced EDP offerings.
• Flip Chip Development Research and development services for flip chip assembly processes used in semiconductor packaging applications, supporting customers developing advanced die-to-substrate interconnect solutions.
• Customer Product Development Flexible and highly customised product and process development services supporting proof-of-concept, 3D modelling evaluation, thermal analysis, prototyping, product testing, micro-sectioning analysis, and low-volume manufacturing for semiconductor and electronics customers.

Named customers4 records

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Ten partnerships are on record, tiered core, flagship and minor.

• Nissan Technical Centre Europe / Project SUITEcoreStrategic or Co-development Partner · 18 June 2026RAM Innovations is involved in Project SUITE, a £10 million UK Government-backed research project led by Nissan Technical Centre Europe, focused on developing smart EV charging technologies including vehicle-integrated solar panels, intelligent charging management systems, bidirectional Vehicle-to-Grid charging, and AI-enhanced Gallium Nitride traction inverters.
• CSconnected / Cardiff Capital RegioncoreStrategic or Co-development Partner · 13 April 2026RAM Innovations is listed as a project recipient under CSconnected's £1m supply chain development programme, delivered in partnership with Cardiff Capital Region. The programme offers grants of up to £100,000 covering up to 50% of project costs to support the UK's compound semiconductor supply chain.
• InfineoncoreStrategic or Co-development Partner · 1 January 2014In 2014, Infineon engaged RAM as a rapid response R&D capability for embedded PCB technology, establishing an early strategic relationship in advanced semiconductor packaging.
• Russel IndustriesflagshipStrategic or Co-development PartnerRAM Innovations was acquired by Russel Industries in 2021 as part of a strategy to build a UK Mittelstand focused on electrification. Russel Industries comprises Prima Electronic Services (contract electronics manufacturer), RAM Innovations (semiconductor die packaging specialist), and Denchi (high-reliability battery solutions provider). Nick Russel is CEO of Russel Industries.
• PPM Power, Cambridge GaN Devices, CamutronicscoreStrategic or Co-development PartnerRAM is part of the P3EP (Pre-packaged Power Devices for PCB Embedded Power Electronics) consortium funded by the Driving the Electric Revolution challenge at UK Research and Innovation. Consortium partners include PPM Power, Cambridge GaN Devices, Camutronics, Compound Semiconductor Application Catapult, and TTPi. The project develops compact and lightweight power conversion modules using GaN technology.
• Paragraf, INEX Microtechnology LtdcoreStrategic or Co-development PartnerRAM Innovations participated in a two-year Innovate UK funded project led by Paragraf (Cambridge-based graphene semiconductor specialist) together with INEX Microtechnology Ltd (semiconductor developer and manufacturer). The project developed ways of handling, processing, and packaging Paragraf's novel graphene Hall effect sensors.
• Compound Semiconductor Application CatapultcoreStrategic or Co-development PartnerThe Compound Semiconductor Application Catapult is a consortium partner in the P3EP project alongside RAM Innovations. RAM continues to invest in R&D through grant-funded collaborations with the Catapult and other partners.
• Institute for Manufacturing (IfM), University of CambridgeminorStrategic or Co-development PartnerRAM Innovations engaged a team of students from the Institute for Manufacturing at University of Cambridge to explore new requirements for in-line production, characterisation and reliability testing equipment and services.
• University of NottinghamcoreStrategic or Co-development PartnerIn 2017, RAM and University of Nottingham developed an embedded PCB cooling structure in an APC 'Preparing for the Grand Challenge' programme. In 2018, RAM, University of Nottingham and The Thinking Pod Innovations (TTPi) were awarded Innovate UK funding for a development programme to demonstrate the viability of PCB embedded die packaging process for high current, fast switching power converters.
• TTPi (The Thinking Pod Innovations)coreStrategic or Co-development PartnerTTPi is a consortium partner in the P3EP project. Previously in 2018, RAM, University of Nottingham and TTPi were jointly awarded Innovate UK funding to demonstrate the viability of PCB embedded die packaging process for high current, fast switching power converters.

Scale indicators5 records

Recent moves7 records

Expansion highlights6 records

Broad incumbents

• AT&S (Austria Technologie & Systemtechnik): Leading European substrate and advanced PCB manufacturer with IC substrate and embedding capabilities serving automotive and industrial power electronics. Comparable as a scaled advanced-packaging supplier targeting similar GaN/SiC applications but with a much broader product portfolio.
• ASE Technology Holding: Global OSAT leader with SiP, fan-out, and embedded packaging capabilities serving consumer, automotive, and industrial customers. Comparable only at the broad packaging level; competes for similar OEM wallet share on advanced packaging programs.
• Amkor Technology: One of the world's largest OSATs offering advanced packaging services including embedded die and fan-out wafer-level packaging. Overlaps with RAM's downstream customers in automotive and aerospace power, though at vastly different scale.
• TTM Technologies: US-based large-scale PCB manufacturer with growing advanced packaging and substrate capabilities including aerospace and defense customers. Operates in the same end markets as RAM but at dramatically higher volume and a broader technology mix.
• Unimicron Technology: Taiwanese PCB and IC substrate manufacturer increasingly active in advanced packaging, including embedded component solutions. Highly comparable end-market exposure but orders of magnitude larger scale than RAM.

Direct peers

• Schweizer Electronic: German-headquartered pioneer of embedded die PCB technology (Smart pQFN, IC Embedded) for power and automotive applications. Directly comparable to RAM as one of the few firms offering production-grade PCB-based die embedding for GaN/SiC power modules.
• Dyconex (Micro Systems Technologies): Switzerland-based specialist in flexible and rigid-flex PCBs with embedded chip and component technology for medical, aerospace, and high-reliability markets. Directly comparable as a niche European embedded die packaging service provider.

Regional players

• TT Electronics: UK-headquartered electronics manufacturer with PCB assembly, power electronics, and sensor capabilities serving aerospace, defense, and industrial customers. Directly comparable as a UK-based advanced electronics manufacturing peer targeting overlapping aerospace and industrial customers.

Emerging players

• Paragraf: Cambridge-based graphene Hall-effect sensor developer that partnered with RAM under the Innovate UK GRAPHIC-MAN project. Comparable as a CSconnected cluster company driving specialized packaging demand for novel semiconductor devices.
• Cambridge GaN Devices: UK-based GaN power semiconductor designer and consortium partner with RAM in the P3EP project. Not a packaging competitor but a GaN device partner whose roadmap directly drives demand for RAM's EDP services.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/ram-innovations-ltd

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about RAM Innovations