Ziguang Tongxi Micro Eletronics

What Ziguang Tongxi Micro Eletronics does

Ziguang Tongxi Micro Electronics (紫光同芯微电子有限公司) is a Beijing-headquartered, privately held fabless semiconductor company founded in 2001 as a spin-off of the Tsinghua University Microelectronics Institute's national second-generation resident ID card chip R&D team. It operates as the core enterprise of the New Unigroup (新紫光集团) conglomerate in the automotive electronics and smart chip sector, specializing in security chip design with capabilities spanning contact and contactless IC card chips, dual-interface financial IC card chips, automotive MCUs (THA6 series), automotive security chips (T9 series), eSIM solutions (TMC-E9, THC9E), secure element chips, RF interface chips, and power devices (IGBT, MOSFET). Core architecture is built around 32-bit CPU cores, embedded non-volatile memory, hardware cryptography accelerators, and Global Platform-compliant secure operating systems. Since founding, the company has shipped over 27 billion cumulative chips across 20+ countries in Asia, Europe, the Americas, and Africa.

The company serves enterprise customers through direct sales teams organized along two business lines (security chip business and automotive electronics business), targeting state-owned banks, telecom operators, automotive OEMs and Tier1 suppliers, government agencies, and global consumer electronics brands. Notable customers include all six Chinese state-owned commercial banks (ICBC, ABC, BOC, CCB, BOCOM, PSBC) for financial IC cards, China Unicom and China Mobile for telecom/eSIM, the Ministry of Public Security for second-generation ID cards (25% market share), and dozens of head automotive OEMs plus Tier1s for MCU and security chips. Revenue is generated through hardware sales of chips (the dominant model) complemented by customized solution and professional services including digital key total solutions, eSIM solutions, vehicle connectivity security, and anti-counterfeiting traceability solutions with bundled firmware, SDK, and technical support. Pricing is not publicly disclosed and is conducted via direct enterprise sales ([email protected]; [email protected]).

Ziguang Tongxi holds unique certification positioning as the only Chinese chip designer combining CC EAL6+ (SOGIS, first Chinese chip globally), CC EAL5+, GSMA SAS-UP (first in China), ISO 26262 ASIL D, AEC-Q100 Grade 1, and EMVCo certifications. Its THD89 series became the world's first China-developed chip to receive SOGIS CC EAL6+ certification in 2020, and in 2024 it launched E450R, the world's first open-architecture security chip (RISC-V based) with open hardware and software. The company's strategic focus in 2024-2026 has shifted toward automotive electronics (THA6, THA6412 flagship MCU), AI+eSIM converged solutions for AI terminals (THC9E with satellite communication, in partnership with China Unicom and GSMA), and post-quantum cryptography electronic credentials, supported by an ecosystem of tooling partners including ETAS (comprehensive strategic partnership from 2025), HighTec, TASKING, NeuSAR, IAR, and UAES.

Name

Ziguang Tongxi Micro Eletronics

Legal name

紫光同芯微电子有限公司

Website

https://tsinghuaic.com

Company type

Private

Founded year

2001

Operating status

Operating

Headcount range

11–50 employees

Short description

Beijing-headquartered fabless semiconductor company spun out of Tsinghua University in 2001, specializing in security chips (financial IC, eSIM, SE) and automotive MCUs/security chips. Serves all six Chinese state-owned banks, major telecom operators, automotive OEMs, and global consumer brands with over 27 billion cumulative chips shipped.

Ownership category

akta.pro rank

Product category

Semiconductor Chip Design (Security Chips and Automotive Electronics)

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Secure ICs, Smart Cards & Trusted Hardware (HDAHAAAJ)

akta.pro secondary industries

General-Purpose Logic & Microcontrollers (MCU/MPU) (HDAHAAAA), High-Voltage, Power Discretes & Modules (IGBT/MOSFET/SiC/GaN) (HDAHAAAK), Security & Trusted Hardware ICs (Secure Element/TPM/Crypto) (HDAHABAF), Secure Elements & Trusted Execution Processors (TPM/TEE/Crypto MCUs) (HDAHAJAK)

Keywords

• Security chip design
• Automotive MCUs
• Financial IC card chips
• ESIM chips
• RFID interface chips

Headquarters

HQ city

Beijing

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales

Revenue model

1. 安全芯片及解决方案销售: 销售各类安全芯片产品（金融IC卡芯片、SIM卡芯片、电子证件芯片、支付终端芯片、SE芯片、射频接口芯片）以及汽车电子芯片（域控MCU、安全芯片、功率器件），以芯片硬件销售为主，配套提供固件、SDK和技术支持服务
2. 定制化解决方案与服务: 提供从芯片到解决方案的全栈式服务，包括数字钥匙整体解决方案、eSIM解决方案、车联网安全解决方案、防伪溯源解决方案等，配套提供操作系统、软件集成、安全生产交付

Go-to-market motion1 record

Distribution channels3 records

Marketing channels5 records

Core offering

Ziguang Tongxi Micro Electronics designs and manufactures security chips and automotive electronics, including financial IC card chips, SIM card chips, dual-interface IC card chips, eSIM/eUICC chips, SE security chips, automotive MCUs (THA6 series), automotive security chips (T9 series), power devices (IGBT/MOSFET), and anti-counterfeiting authentication chips. The company sells its own designed chips and provides tailored solutions including firmware, operating systems, SDKs, and technical support services to enterprise customers in telecommunications, banking, government, automotive, and industrial sectors.

Product overview

Ziguang Tongxi Micro Electronics (紫光同芯) is a leading chip and solution provider specializing in automotive electronics and security chips. The company's product portfolio is organized into three core pillars: (1) Automotive Electronics covering THA6 series MCUs (THA6412, THA6206) for domain/zonal control, T9 series security chips for digital keys/T-BOX/OBD/eUICC, and power devices (IGBT/SJ MOSFET/SGT MOSFET); (2) Security Chips including THD89/THD88 financial IC card chips, THM36 series payment terminal security MCUs, T91/T97 anti-counterfeiting authentication chips, THK88 USB-Key chips, and SE/RFID chips; and (3) Connectivity Solutions featuring eSIM products (TMC-E9, THC9E) and RF interface chips. The company also provides turnkey solutions for digital keys, T-Box/OBD, wireless charging authentication, and IoT applications. Founded in 2001 and headquartered in Beijing, it has shipped over 27 billion chips globally, serving telecommunications, financial payments, government ID, IoT, automotive, and industrial control sectors.

Differentiator

Problem solved

Functional benefit

Brands

• T9系列: 汽车安全芯片系列，应用于数字钥匙、T-BOX、eSIM等车联网安全场景
• THA6系列
• THD89系列
• THM36系列
• T91系列
• 超级汽车芯
• 超级金融芯
• 紫光芯能

Products and services

• THD89/THD88 Financial IC Card Chip (金融IC卡芯片) Dual-interface financial IC card chips manufactured with globally advanced processes. THD89 is the world's first chip to receive CC EAL6+ certification and supports EMV overseas batch issuance. THD88 is the dual-interface series for banking applications. Both support international and Guomi algorithms, used for bank card and payment card issuance in financial institutions globally.
• Dual-Interface IC Card Chip (双界面IC卡芯片) Contactless and contact dual-interface smart card chips for banking, transportation, social security, and government ID applications. Supports PBOC, EMV, and national secret algorithms. Used by banks, transit authorities, and government agencies.
• THA6 Series Automotive MCU (汽车控制芯片) 32-bit automotive-grade domain controller MCUs available in Gen1 and Gen2 generations. Gen2 features 400MHz multi-core CPU, GTM 4.1, hardware RDC, ISO 26262 ASIL D and EVITA-Full security, covering power, chassis, body, battery management, and domain/zonal controller applications. Used by automotive OEMs and Tier1 suppliers.
• T9 Series Automotive Security Chip (汽车安全芯片) Automotive-grade secure elements providing key storage, data encryption, identity authentication, and secure communication for connected vehicles. Applications include digital keys, T-BOX, OBD, eUICC, OBU-ESAM, and V2X. Available in multiple variants including T97-415E, T97-315E, T95, T92 series.
• eSIM Products (TMC-E9/THC9E Series) Embedded SIM chips supporting GSMA standards with 6-8 profiles, international and Guomi algorithms, CC EAL5+, AEC-Q100, and GSMA SAS-UP certifications. Adapted to 400+ global operators. TMC-E9 series is in mass commercial use globally; THC9E is the next-gen AI eSIM with satellite communication support. Used by telecom operators, device manufacturers, and automotive OEMs.
• Power Devices (功率器件) IGBT, SJ MOSFET, and SGT MOSFET product families spanning 30V-1200V voltage range. Available in automotive and industrial grades, covering TO-247, TO-252, TO-263, DFN, and module packages for automotive power electronics, PV inverters, energy storage, and industrial power applications.
• THM36 Series Security MCU (支付终端芯片) Security MCUs for financial payment terminals including POS, mPOS, fingerprint sensors, barcode scanners, and password keyboards. THM36 2.0 features larger RAM, configurable Flash, USB Device, camera SPI, LCD SPI, and passed UPTS 3.0, PCI 7.x certifications. Used by payment terminal manufacturers and POS solution providers.
• E450R Open Architecture Security Chip World's first open architecture security chip combining open hardware (RISC-V based) and open software architecture. Features new PKE cryptography engine, new NVM management, and reduced application code size. First to receive China's financial IT product self-controllable capability Level 1 certification from Beijing National Financial Technology Certification Center.
• Digital Key Total Solution (数字钥匙整体解决方案) Complete digital key solution comprising vehicle-side SE (T97), KeyFob SE (T95), NFC key card (T92), and NFC Reader (THN31A). Supports Bluetooth, UWB, and NFC front-end protocols for car access, meeting CCC, ICCE, ICCOA, and private protocol requirements. Deployed in dozens of OEMs and Tier1s.
• WPC Qi Wireless Charging Authentication IC (WPC Qi鉴权IC) WPC Qi1.3/Qi2.0 authentication chip providing trusted wireless charging device security certification. CC EAL6+ and AEC-Q100 certified, with anti-side-channel, fault injection, and physical attack countermeasures. Used by wireless charging device manufacturers and consumer electronics brands.
• eUICC (车规级eSIM) Automotive-grade eUICC chip supporting GSMA SGP22 and operator RSP specifications. CC EAL5+, AEC-Q100, OSCCA L2 certified. Enables operator profile download, activation, and deletion via SM-DP+ for seamless global vehicle connectivity. Used by automotive OEMs and Tier1 suppliers.
• T-Box/OBD Security Solution In-vehicle security solution working with MCU to encrypt and authenticate transmitted data, decrypt and verify received data. Enables secure vehicle boot, in-vehicle communication, and data storage. Supports international and Guomi algorithms with CC EAL6+ and AEC-Q100 certifications. Used by automotive OEMs and Tier1 suppliers.
• RF Interface Chip (射频接口芯片) RF reader chips compliant with ISO/IEC14443 Type A/B and ISO/IEC15693 standards, meeting EMV Contactless Level 1 and PBOC3.0 requirements for access control, smart meters, and financial terminals. Used by smart terminal manufacturers and RFID system integrators.
• THK88 USB-Key Chip 32-bit USB-Key controller with PKI-based security, supporting DES/RSA/SM algorithms. First to receive national commercial cryptography Level 2 certificate in the Ukey field. ISCCC EAL4+ and Guomi Level 1 certified. Used by financial institutions and enterprise security application providers.
• THD89 Series Secure Element (SE芯片) High-security chips with up to 512KB NVM, supporting AES/DES/RSA/ECC/SM1/SM2/SM3/SM4 algorithms. CC EAL6+, AEC-Q100, EMVCo certified. Used in IoT, digital identity, financial payments, and automotive applications.
• Contact IC Card Chip (接触式IC卡芯片) Contact-type IC card chips for SIM, social security, and identity verification applications, available in multiple memory configurations. Used by telecom operators, government agencies, and identity verification solution providers.
• OBU-ESAM Module Single Guomi and multi-logic channel OBE-SAM modules for ETC applications, supporting SM4 algorithm and anti-removal state setting. CC EAL6+, AEC-Q100 Grade2 certified, compliant with transportation ministry technical standards. Used by ETC solution providers and transportation authorities.

Quantifiable outcome

• 累计出货超过270亿颗，为亚洲、欧洲、美洲、非洲20多个国家和地区提供产品和服务
• +5 more outcomes

Named customers16 records

Segments5 records

Ideal customer profiles6 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration21 records

AI capability7 records

Feature10 records

Partnerships

18 partnerships are on record, tiered 重要 and 核心战略.

• 全球智慧物联网联盟(GIIC)重要Strategic or Co-development Partner · 26 June 2026紫光同芯作为牵头和核心参编企业，重点编写了《eSIM机卡安全技术白皮书》中的整体架构与状态模型、配对与互认证的核心流程、安全机制等关键章节。
• 中国联通核心战略GTM or Marketing Partner · 3 March 2026MWC26期间，中国联通与GSMA联合发布AI+eSIM云智终端合作联通方案，紫光同芯以核心行业伙伴身份受邀出席并见证这一重要时刻，eSIM产品已适配全球400多家运营商。
• GSMA重要Strategic or Co-development Partner · 1 January 2026紫光同芯与中国联通、GSMA共同推进AI+eSIM云智终端的标准化与规模化发展，紫光同芯eSIM产品符合GSMA及国内通信标准，已通过全球400+运营商测试。
• 头部Tier1和主机厂核心战略Strategic or Co-development Partner · 1 January 2026依托与头部Tier1和主机厂的长期合作，紫光同芯打通了产业上下游资源，构建起高效、稳定的生态服务体系，全方位赋能车企提升市场竞争力。
• ETAS核心战略Strategic or Co-development Partner · 24 April 2025紫光同芯与全球领先的软件定义汽车解决方案提供商ETAS达成全面战略合作伙伴关系，将合作关系从战略合作伙伴升级为全面战略合作伙伴。相较于此前MCU芯片研发完成后再开展嵌入式软件适配的传统模式，全新合作机制将在芯片定义阶段即启动操作系统协同开发工作，携手构建贯穿架构设计、功能验证、量产落地全流程的技术保障体系。
• 中国头部手机厂商核心战略Strategic or Co-development Partner · 2 March 2025紫光同芯携手中国头部手机厂商在海外市场推出eSIM终端，实现手机eSIM中国芯在全球范围内的首次商用。
• HighTec重要Technology or Integration · 1 January 2025HighTec编译器完成对紫光同芯THA6 Gen2系列产品的全面适配，实现从指令集优化到功能安全的全栈支持。HighTec汽车级编译器以其高效的代码优化能力和对多核架构的支持而闻名，广泛应用于汽车电子核心控制器开发。
• 东软睿驰重要Technology or Integration · 1 January 2025紫光同芯旗舰域控芯片THA6412与东软睿驰NeuSAR cCore基础软件产品完成全栈技术验证，双方为下一代智能汽车电子电气架构提供安全可靠的国产化软硬件一体解决方案。
• 上海银基重要Strategic or Co-development Partner · 1 January 2025紫光同芯联手上海银基打造云-车-人的整套蓝牙数字钥匙解决方案，已成功导入。
• 经纬恒润核心战略Strategic or Co-development Partner · 12 December 2024紫光同芯与经纬恒润正式签署战略合作协议，双方在智能网联、智能座舱、新能源和动力系统、车身及底盘域等多个关键领域展开全面深入合作。基于汽车安全芯片T9系列的项目持续量产交付，基于汽车域控芯片THA6系列的智能底盘域控制器项目取得重要突破。
• TASKING重要Technology or Integration · 1 January 2024TASKING调试工具winIDEA已全面支持紫光同芯第二代汽车域控芯片THA6系列，提供完整的软件调试和Trace功能，支持多核同步调试，丰富汽车芯片的生态体系。
• SGS重要Others · 1 January 2024SGS是国际公认的测试、检验和认证机构，紫光同芯第二代THA6系列MCU通过SGS关于功能安全开发流程体系以及功能安全产品设计的评估，获得符合ISO 26262标准的ASIL D等级功能安全流程体系认证、功能安全ASIL D Ready产品认证两项资质。
• TUV NORD重要Others · 1 January 2024紫光同芯成功通过德国TUV NORD认证机构的审核，获得ISO/SAE 21434汽车网络安全管理体系认证证书。
• 飞天诚信重要Strategic or Co-development Partner · 1 January 2024紫光同芯与信息安全专家飞天诚信协力推出新型支付应用——指纹金融IC卡，紫光THD89高性能安全芯片成为该卡的核心安全组件。
• 联合汽车电子重要Strategic or Co-development Partner · 1 January 2024紫光同芯与联合汽车电子成立国产汽车芯片创新联合实验室，基于中高端主控MCU THA6206开发的联合汽车电子首个国产动力域控制器已于近期成功点火，实现精准启动与稳定运行。
• 中国汽车芯片标准检测认证联盟/中汽研科技有限公司重要Strategic or Co-development Partner · 1 January 2023紫光同芯参编国内首个《汽车安全芯片应用领域白皮书》，撰写数字钥匙、动力电池防伪、eSIM安全、充电认证和北斗导航智能系统五大核心应用场景内容，为白皮书的技术框架搭建、安全芯片落地实践提供决定性和务实性支撑。
• 中国移动通信集团重要Strategic or Co-development Partner · 1 January 20222022年双方携手攻关，成功研发支持5G Profile下载、SA和NSA双模联网的联通5G eSIM产品，以及支持5G SA和MEP的eSIM产品。
• 联通华盛/中国联通核心战略Strategic or Co-development Partner · 1 January 20192019年双方正式建立战略合作关系；2021年联合成立中国联通&紫光同芯5G安全创新联合实验室；2024年MWC上海期间升级联合实验室合作模式；2025年紫光同芯以核心芯片供应商身份深度参与联通华盛母公司中国联通发起的AI+5G+eSIM产业合作行动，携手构建开放共赢的AI终端生态。

Scale indicators20 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• NXP Semiconductors: Global leader in secure elements, automotive MCUs, NFC/RF, and connectivity ICs. Direct competitor to Ziguang Tongxi across financial IC, SIM/eSIM, automotive MCU (S32K), automotive security (Secure Element), and digital key solutions. Closest large-cap peer given overlapping product portfolio and target markets.
• Infineon Technologies: World leader in security controllers (CIPURSE, SECORA), automotive MCUs (AURIX/TriCore), and power semiconductors (IGBT, MOSFET). Direct overlap with Ziguang Tongxi across all three of the anchor's core pillars: security chips, automotive MCUs, and power discretes.
• STMicroelectronics: Major competitor in automotive MCUs (Stellar, SPC5), secure elements (STSAFE), NFC/RF readers, and power MOSFET/IGBT. Directly comparable to Ziguang Tongxi across automotive electronics, payment/secure ICs, and power devices.
• Renesas Electronics: Global automotive MCU leader (RH850, R-Car) and significant player in secure elements and connectivity. Directly comparable to Ziguang Tongxi's THA6 domain controller MCU line in automotive safety-critical applications.
• onsemi (ON Semiconductor): Leading supplier of automotive power discretes (IGBT, MOSFET, SiC) and analog/mixed-signal ICs. Closest direct peer to Ziguang Tongxi's power device product line (IGBT, SJ MOSFET, SGT MOSFET) targeting automotive and industrial applications.
• Fudan Microelectronics: Leading Chinese competitor in security ICs (financial/social security cards, SE chips, SIM) and MCUs. Most direct domestic peer to Ziguang Tongxi in the Chinese financial/identity security chip and general-purpose MCU markets.
• Nations Technologies: Chinese security MCU and trusted computing IC supplier with overlapping portfolio in financial payment, identity, and IoT security chips. Direct competitor in the Chinese secure MCU and financial IC market.
• GigaDevice: Leading Chinese MCU (GD32) and NOR flash supplier with growing presence in automotive-grade MCUs and security. Competes with Ziguang Tongxi's general-purpose and automotive MCU roadmap in the Chinese market.
• CEC Huada Electronic Design House: Chinese state-affiliated designer of secure smart card ICs, financial ICs, and SE chips for Chinese government ID, banking, and telecom. Domestic peer competing for the same Chinese SOE and government security chip sockets as Ziguang Tongxi.

Broad incumbents

• Samsung Semiconductor (System LSI / S.LSI): Major secure element and embedded SIM IC supplier across mobile, payment, and identity use cases. Competes with Ziguang Tongxi in eSIM and SE for handsets and IoT, though as part of a much broader semiconductor portfolio rather than a focused niche play.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/beijing-tongfang-microelectronics-company

Compliance27 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles15 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Ziguang Tongxi Micro Eletronics