What FCT Solder does

FCT Solder, founded in 1991 and headquartered in Windsor, Colorado, is a privately held manufacturer of soldering materials for the electronics assembly industry. The company produces a broad consumables portfolio spanning no-clean and water-soluble solder pastes (including the proprietary AMP One series with industry-low 1.3% voiding), liquid and tacky fluxes, wire solders, and bar solders (notably the patented SN100C nickel-stabilized Sn/Cu alloy licensed from Nihon Superior). It complements these with three specialty alloys — SN100CV (silver-free SAC305 replacement), LF-C2 (high-reliability Sn/Ag/Bi/Cu), and TempSave B37 (low-temperature Sn/Bi/In) — engineered for specific defect-mitigation and reliability requirements such as automotive underhood thermal cycling, LED thermal management, and miniaturization for 01005/008004 components.

Its technology centers on proprietary chemistry and formulation know-how, supported by certifications including IATF 16949:2016 (automotive), ISO 9001:2015, ITAR, REACH, and RoHS. The portfolio spans 12 solder paste products, 9 liquid fluxes, 4 tacky fluxes, 2 wire solders, 3 bar solders, plus alloys and recycling services — sufficient breadth to address paste printing, wave soldering, selective soldering, and rework across five vertical markets: automotive electronics, LED assembly, IT/telecom, military/aerospace, and solar/photovoltaic.

FCT operates a direct sales-led go-to-market model with Field Application Engineers providing consultative technical support to contract manufacturers and OEMs, augmented by an extensive technical papers library, a "Tech Tuesday" webinar series, and presence at IPC APEX and productronica. Products are quote-based B2B consumables shipped fresh within four working days; no public pricing is disclosed. The company is part of a broader FCT Companies ecosystem including FCT Recovery (e-waste/dross recycling, established 2008), FCT Water, and partner affiliates (BlueRing Stencils, A-Laser, Nanoslic, Florida Cirtech), with regional distribution via FCTA Mexico and global technical reach across 23 countries for the SN100C patent footprint.

Name

FCT Solder

Legal name

FCT Solder

Website

https://fctsolder.com

Company type

Private

Founded year

2008

Operating status

Operating

Headcount range

11–50 employees

Short description

FCT Solder, founded 1991 in Windsor, Colorado, manufactures lead-free and leaded solder pastes, fluxes, wire solder, and bar solders (including the licensed SN100C alloy) for contract manufacturers and OEMs across automotive, LED, IT/telecom, military, and solar electronics assembly, selling via direct technical-sales engagement.

Ownership category

akta.pro rank

Product category

Electronics Assembly Soldering Materials

akta.pro primary industry

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

Keywords

• Lead-free solder paste
• Soldering flux manufacturing
• Electronics assembly materials
• SMT soldering consumables
• Bar solder alloys

Headquarters

HQ city

Greeley

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Operations, Marketing or Sales, Technology or R&D, Infrastructure

Revenue model

1. Solder Products Sales: FCT Solder manufactures and sells solder paste, bar solder, wire solder, and liquid/tacky fluxes to contract manufacturers and OEMs in the electronics industry. Products are sold as consumables with repeat purchase patterns based on manufacturing volumes.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

FCT Solder manufactures and sells lead-free and leaded soldering consumables — including solder paste, liquid soldering flux, tacky/gel flux, wire solder, bar solder, and specialty alloys — to contract manufacturers and OEMs in the electronics assembly industry. The company formulates proprietary alloys (SN100CV, LF-C2, TempSave B37) and ultra-low voiding solder pastes (AMP One series) designed to solve specific SMT assembly defects such as voiding, tombstoning, head-in-pillow, and poor wetting.

Product overview

FCT Solder provides a comprehensive portfolio of soldering products for electronics manufacturing, organized into five core product lines: Solder Paste (12 products including AMP One series, NL, NC, WS, and RMA formulations), Liquid Soldering Flux (9 products including NC, WIL, 159HF, WW series), Tacky/Gel Flux (4 products), Wire Solder (2 products with flux cores), and Bar Solder (3 products). The company also offers three specialty alloys (SN100CV for SAC305 replacement, TempSave B37 low temperature alloy, and LF-C2 high reliability alloy) designed for specific application requirements. FCT's solder paste and flux lines include no-clean, water-soluble, RMA, halogen-free, and ultra-low voiding formulations. All products are formulated to work with various solder alloys including Sn63/Pb37, SAC305, SN100C, SN100CV, LF-C2, and other Pb-free options. The company additionally provides recovery/recycling services and engineering technical support.

Differentiator

Problem solved

Functional benefit

Brands

• AmpOne Solder: Premium solder paste brand including Amp One, Amp OnePT, Amp One (ultra-low voiding solder pastes)
• SN100C
• LF-C2
• TempSave B37
• NC Series
• WS Series
• FCT Recovery

Products and services

• AMP OnePT Ultra-low voiding no-clean, lead-free solder paste with pin-testable flux residues designed for high-reliability applications in harsh environments. Achieves 1.3% void area with excellent printability, activity, wetting, and low solder balling/graping.
• AMP Micro Ultra-fine feature no-clean lead-free solder paste for miniaturization in PCB assemblies. Formulated for Type 6 and 7 solder powders supporting 01005 and 008004 Imperial component sizes, with excellent coalescence in convection air reflow, 6+ hour stencil life, and halide/halogen-free clear residue.
• AMP Wash Lead-free water-soluble solder paste in the AMP One series providing ultra-low voiding in SMT applications, with flux residues easily removed using de-ionized water. Compatible with SN100CV or LF-C2 alloys for harsh environment reliability.
• AMP One No-clean lead-free solder paste redefining voiding standards for PCB assembly with industry-low voiding performance, excellent activity, and decreased potential for solder balling and graping for higher yields and wider process windows.
• NL932HF Zero halide, zero halogen, lead-free no-clean solder paste designed for repeatability and consistency with exceptional cosmetics and minimized graping issues in reflow.
• NL930PT Zero halide, zero halogen, lead-free no-clean pin-probable solder paste delivering area ratio (AR) paste transfer efficiencies below 0.50.
• WS890 All-around water-soluble lead-free solder paste with superior reflow characteristics including excellent wetting, very low solder balling, very low graping, long stencil life, and excellent print characteristics.
• NC722 No-clean low melting lead-free solder paste designed for tin-bismuth alloys. Halide-free with excellent stencil life, usable across a wide range of environmental conditions, with clear pin-testable residues. Classified ROL0.
• NC676 No-clean leaded solder paste with creamy smooth texture. Both halogen and halide free with rosin-based chemistry, classified ROL0, with clear residues, virtually indefinite pin probability life, extensive tack time, and long shelf life.
• WS161 High activity water-soluble tin-lead solder paste with excellent stencil life, ideal response to printing pauses, excellent wetting, very low solder balling and graping, and very low voiding potential. Flux residues easy to clean using D.I. water.
• RMA250 High activity no-clean solder paste classified ROL1 with rosin-based chemistry providing improved cosmetics and excellent wetting on all surface finishes. Low viscosity with low slump for fast printing, with clear pin-probable residues.
• WS159 Water-soluble leaded solder paste classified ORH0, formulated for reliable solder joints with humidity tolerance and excellent wetting. Stable across temperatures 65-85F and relative humidities 25-65%RH, with low voiding and easily visible removable residue.
• 360HF Next generation water-soluble liquid flux for selective soldering, wave soldering, and rework. Eliminates icicling and bridging, extends soldering iron tip life, and provides excellent hole fill performance. Halide and halogen free with isopropanol base, compatible with spray, foaming, and drop-jet flux systems.
• NC164 Low activity, low-solids no-clean liquid flux for selective and wave solder applications. Contains no rosin, halides, or halogens with solids content of approximately 3.6%. Compatible with spray and foaming flux systems, works with leaded and Pb-free alloys.
• NC165 No-clean activated material for wave soldering through-hole, mixed, and surface mount assemblies. Completely halide and halogen free with lower solids content. Works with SN100C Bar Solder and standard Sn/Pb alloys. Classified ROL0, eliminates solder balls while providing excellent solderability.
• NC120 No-clean flux for wave soldering through-hole, mixed, and surface mount assemblies. Halide free, non-rosin with 2% organic solid content. Low residue formulation eliminates bridges and icicles while providing good wetting. Classified ORL0.
• NC165-S Low-solids liquid flux for selective and wave solder applications passing Telcordia GR-78 electrochemical migration for high reliability applications. Low solids content (4% wt) leaves clear colorless residue and reduces potential for drop-jet flux system clogging.
• WIL-1 VOC-free low activity and solids no-clean wave soldering flux designed for efficient transition from tin-lead to lead-free wave soldering. Provides high electrical reliability with excellent solderability, ultra-low residue, and no white residues. Halogen free.
• 159HF Halide and halogen-free neutral pH water-soluble liquid flux providing excellent wetting and high temperature tolerance with good ionic cleanliness after water cleaning. Minimizes foaming in wash process. Suitable for wave, selective soldering, and surface mount rework operations.
• NC160 Highly activated no-clean flux for wave soldering formulated for SN100C Bar Solder. Halide free and rosin-based. Eliminates solder balls while providing excellent solderability with minimal flux residue. Classified ROL0.
• WW525 Activated non-corrosive type RA rosin flux with excellent activity and superior mobility for wave soldering. Results in faster throughput, reduced solder build-up, fewer defects, and less residue than conventional high solids fluxes. Works with SN100C Bar Solder. Classified ROL1.
• NC 26 No-clean tacky solder flux (gel flux) for applications requiring 100% flux content with high activity for difficult-to-solder surfaces.
• NC 27 No-clean tacky solder flux for rework and touch-up soldering operations requiring high activity.
• NC 32 No-clean tacky solder flux providing high activity for improved soldering performance.
• WS 89 Water-soluble tacky solder flux for applications requiring high activity with washable residue.
• NC601 Rosin Activated (RA) no-clean flux core wire solder for repairing through-hole, mixed, and surface mount assemblies. Provides faster melting and higher activity than typical RA flux cores with clear, colorless residues. Available in SN100C and SAC305 alloys with 3% flux.
• WS101 High activity water washable solder wire for repairing through-hole, mixed, and surface mount assemblies. Provides faster and better flux activity than RA flux cores. Residue easily washable without cleaning additives. Classified ORH1 with 2% flux.
• SN100C Bar Solder Lead-free nickel-stabilized tin/copper wave solder alloy (Sn-0.7Cu-0.05Ni+Ge) developed by Nihon Superior. Silver-free, eutectic solder that melts and freezes at 227°C. Significantly less costly than SAC305 with reduced drossing due to germanium anti-oxidant, compatible with steel alloys used in wave and selective soldering machines.
• AO-1000 Anti-oxidant bar solder used to maintain germanium levels in SN100C solder baths, ensuring optimal solder composition and performance over time.
• Solder Bath Composition Solder bath composition products for wave and selective soldering maintenance, ensuring proper alloy levels for consistent soldering quality.
• SN100CV Silver-free SAC305 replacement alloy (Sn/Bi/Cu/Ni) providing higher reliability than SAC305 through stable strengthening mechanism with Bi dissolved in Sn matrix. Delivers lasting reliability in drop shock and thermal cycling tests using identical reflow parameters as SAC305 for drop-in replacement. Approximately 30% less expensive than SAC alloys.
• TempSave B37 Low temperature solder alloy protecting thermally sensitive assemblies with melting point below 180°C. Incorporates tin, bismuth, and/or indium with additives that enhance alloy structure and reduce brittleness compared to Bi58 eutectic. Lower reflow temperatures reduce energy costs and mitigate warpage defects.
• LF-C2 High reliability Sn/Ag/Bi/Cu solder alloy developed to resist thermal fatigue. Microstructure allows reliable performance in high temperature, high vibration environments including under-hood automotive and aerospace. Features low voiding potential, significant creep resistance, and better failure mode compared to other high reliability alloys.
• Recovery Services Environmental sustainability services for safe disposal and recycling of electronic waste (e-waste) and solder dross, including solder dross recycling and e-waste recycling with free pickup. Precious metals and valuable resources are reclaimed and reused.
• Engineering Support Technical engineering assistance for solder-related issues and manufacturing process optimization. Field Application Engineers help solve solder problems, identify defects, and increase yields.

Quantifiable outcome

• 1.3% void area with AMP OnePT (industry-low)
• +4 more outcomes

Segments5 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Eight partnerships are on record, tiered core and minor.

• Nihon SuperiorcoreTechnology or IntegrationFCT Assembly partnered with Nihon Superior to offer their patented SN100C lead-free nickel stabilized tin/copper wave solder alloy worldwide. SN100C was developed as a technically superior and more economical option to tin-silver-copper alloys.
• BlueRing StencilsminorStrategic or Co-development PartnerPartner providing stencil design services for solder paste printing optimization. BlueRing Stencils offers specific stencil designs to minimize voiding including crosshatch patterns for bottom terminated components.
• A-LaserminorStrategic or Co-development PartnerPartner providing laser cutting precision services for electronics assembly. A-Laser offers state-of-the-art laser cutting services for precision manufacturing needs.
• Florida CirtechminorOthersTechnical services partner referenced in FCT Solder's partner ecosystem for electronics manufacturing support.
• FCT RecoveryminorOthersFCT Recovery division (started 2008) offers safe and responsible dross and e-waste recycling services to the electronics industry, supporting sustainability and environmental responsibility.
• FCT WaterminorOthersFCT Water provides water treatment services supporting FCT Companies' manufacturing and environmental sustainability operations.
• FCTA MexicominorChannel Partner/ Reseller/ DistributorRegional distribution partner for FCT products in Mexico, extending geographic coverage for the Latin American market.
• StannolminorGTM or Marketing PartnerCo-exhibiting partner at productronica trade show. FCT Solder and Stannol partnered to co-exhibit at the international electronics manufacturing trade show.

Scale indicators3 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Senju Metal Industry Co., Ltd. Japanese manufacturer of lead-free solder materials, bar solder, and flux for electronics assembly. Competes directly with FCT's SN100C bar solder and lead-free paste lines globally.
• Indium Corporation: Privately held global supplier of solder materials (paste, wire, bar, flux) and Indium-based alloys for electronics assembly. Closest direct competitor to FCT Solder across automotive, LED, and high-reliability end markets.
• Kester (Illinois Tool Works): Long-established manufacturer of solder paste, flux, and wire solder for SMT and through-hole assembly, owned by Illinois Tool Works. Direct competitor in the B2B solder consumables category served by FCT.
• Alpha Assembly Solutions: Global supplier of solder paste, bar solder, preforms, and fluxes for electronics assembly, part of the Element Solutions/MacDermid Alpha family. Direct competitor in lead-free and high-reliability solders.
• AIM Solder: Manufacturer of solder paste, bar, wire, and flux for electronics manufacturing, with strong lead-free and high-reliability offerings. Direct competitor to FCT in the contract manufacturer and OEM channel.
• Nihon Superior Co., Ltd. Japanese developer of the patented SN100C nickel-stabilized tin-copper alloy that FCT licenses and sells. Both a licensor/partner and a direct competitor in solder alloy sales globally.
• Stannol GmbH: German manufacturer of solder wire, bar, paste, and flux for electronics assembly. Co-exhibits with FCT at productronica and is a direct regional competitor in the European lead-free solder market.
• MG Chemicals: Canadian manufacturer of solder products, fluxes, and chemicals for electronics manufacturing and prototyping. Competes with FCT in the leaded and lead-free solder consumables category, particularly with smaller and mid-sized CMs.

Broad incumbents

• Henkel AG & Co. KGaA (Loctite): Diversified German specialty chemicals giant whose Loctite/electronics portfolio includes solder materials, conformal coatings, and underfills. Competes with FCT in solder materials as part of a much broader electronics materials portfolio.

Regional players

• Balver Zinn Josef Jost GmbH & Co. KG: European-based manufacturer of lead-free solders (SN100C, bar, wire, and paste) and fluxes. Regional competitor to FCT in Europe, with similar specialty positioning in lead-free and high-reliability alloys.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/fct_solder

Compliance6 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about FCT Solder