What Electro-Ceramic Industries does

Electro-Ceramic Industries (ECI) is a privately held US microelectronic components manufacturer founded in 1970 and headquartered in Hackensack, New Jersey, with a second manufacturing facility in Lawrence, Massachusetts acquired in 2023. The company specializes in hermetic packaging technologies including metalized ceramic substrates, ceramic-to-metal seals, glass-to-metal seals, and Direct Bond Copper (DBC) substrates on Alumina and Aluminum Nitride. Core technical capabilities span thick film metallization, high-temperature brazing (780°C–1000°C), proprietary glass formulations, and in-house plating services including rare Au/Sn alloy plating. ECI serves defense, aerospace, medical, telecommunications, and automotive OEMs with a vertically integrated model spanning custom design, prototyping, and full-scale production of Hi-Rel microelectronic packaging.

The company monetizes through hardware sales of custom-manufactured microelectronic components and professional services for custom design and plating, operating a quote-based B2B engagement model with no public pricing. Go-to-market is enterprise field sales driven by direct customer engagement via phone and email, supplemented by trade show participation at events such as the IEEE IMS Tradeshow. The customer base includes defense primes (L3Harris, Cobham, CPI, Ametek), semiconductor companies (MACOM, Microchip, Skyworks, Microsemi, SemiGen), test and measurement leaders (Keysight), sensor manufacturers (Sensata, Kulite), medical device makers (ConMed), automotive OEMs (Stellant), and lighting companies (Lumileds). ECI holds ITAR registration (2020) and ISO 9001:2015 certification (2019), qualifying it for defense and aerospace supply chains requiring strict compliance with MIL-STD-105 and related standards.

Recent strategic activity centers on inorganic expansion: ECI acquired Pekay Industries in 2019 and United Glass to Metal Sealing in 2023, and formed an alliance with sister company M2 Global Technology, Ltd. in 2023 to extend into RF and microwave components. The company is led by Jasmine Shah, who purchased ECI in 2017 and serves as President and CEO, with a senior management team combining 80+ years of manufacturing experience. ECI ships over 50 million parts annually and maintains a team of approximately 50 employees with design assistance staff collectively holding 100+ years of experience.

Name

Electro-Ceramic Industries

Legal name

Electro Ceramic Industries

Website

https://electroceramic.com

Company type

Private

Founded year

1970

Operating status

Operating

Headcount range

51–100 employees

Short description

Electro-Ceramic Industries is a privately held US manufacturer founded in 1970 that produces hermetic microelectronic packaging—including metalized ceramics, ceramic-to-metal seals, glass-to-metal seals, and Direct Bond Copper substrates—for defense, aerospace, medical, telecommunications, and automotive OEMs.

Ownership category

akta.pro rank

Product category

Microelectronic Hermetic Packaging and Components

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes) (IMAGAJAE)

akta.pro secondary industry

Electroplating & Metal Finishing (Anodizing/Galvanizing/Passivation) (IMAIAKAE)

Keywords

• Hermetic microelectronic packaging
• Ceramic-to-metal seals
• Glass-to-metal seals
• Thick film metallization
• Direct bond copper substrates

Headquarters

HQ city

Hackensack

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Microelectronic Component Manufacturing: Custom manufacturing of metalized ceramics, ceramic to metal seals, glass to metal seals, power electronic products, metal components, and specialty plating services for defense, aerospace, medical, telecommunications, and automotive industries.
2. Plating Services: In-house electroplating and specialty plating services including Gold, Nickel, Silver, Copper, Tin, and Gold/Tin alloy plating for microelectronic components.
3. Custom Component Design: Custom design and quick-turn prototyping services with engineering team collaboration for customized microelectronic solutions.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels4 records

Core offering

Electro-Ceramic Industries is a US-based custom manufacturer of microelectronic components, producing metalized ceramic substrates, ceramic-to-metal seals, glass-to-metal seals, power packages, Direct Bond Copper substrates, custom metal components, and specialty plated parts for high-reliability defense, aerospace, medical, telecommunications, and automotive applications. The company operates a vertically integrated manufacturing model with in-house thick film processing, brazing, plating, and precision machining, supporting both quick-turn prototyping and high-volume production runs.

Product overview

Electro Ceramic Industries offers a portfolio of microelectronic component products centered on ceramic and glass-to-metal sealing technologies. The core offerings include Metalized Ceramic substrates, Ceramic to Metal Seals, and Glass to Metal Seals, which form the foundation of their hermetic packaging solutions. These are complemented by Power Solutions and Direct Bond Copper products for thermal management applications, Metal Components in various configurations, and in-house Plating Services spanning over five decades of proprietary processes. The company also provides Aerospace Precision Machining and RF Components through their alliance with M2 Global. Custom Components and quick-turn programs round out the service offerings, enabling solutions from prototype to full-scale production for defense, aerospace, telecommunications, medical, and automotive industries.

Differentiator

Problem solved

Functional benefit

Brands

• M2 Global: Sister company alliance for RF products and contract manufacturing. M2 Global Technology, Ltd. is described as a premier designer and supplier of microwave products and precision manufacturing services serving defense, aerospace, and telecommunications industries.

Products and services

• Metalized Ceramic Thick film metalized substrates manufactured to meet diverse design requirements for Optoelectronic, Power, and Microwave/RF packaging applications, with customizable thick film metallized thru-hole and wraparound castellations for leadless surface mountable configurations. For defense, aerospace, medical, automotive, telecom, and semiconductor customers.
• Ceramic to Metal Seals Components integrating thick film metalized ceramics with various metals, brazed at high temperatures (780°C–1000°C) to metal leads, tabs, and bases, for high-reliability applications in military, medical, aerospace, automotive, and commercial industries.
• Glass to Metal Seals Matched and Compression Glass to Metal Seal packages engineered for extreme conditions including extreme temperatures, moisture, pressure, and chemical exposure. Includes legacy packages (TO-5, TO-8), power transistor packages (TO-254, TO-257), glass flatpacks, and feedthroughs. Product line was expanded in 2023 through acquisition of United Glass to Metal Sealing, Inc. to include coaxial feedthrough configurations, 50-Ohm products, and ordnance and defense applications.
• Power Solutions Ceramic to metal sealed power packages and substrates designed for low thermal resistance and critical thermal dissipation. Available in surface mount, drop-in, and bolt-down versions with advanced thermal material flanges for high power density applications, including Hi-Rel power transistor package outlines (TO-254, TO-257, TO-258, TO-259) for military, aeronautics and space use cases.
• Direct Bond Copper (DBC) Custom cost-effective Direct Bond Copper products on Alumina and Aluminum Nitride for demanding thermal management applications, with high thermal conductivity, high current capacity, and heat dissipation of high-purity copper on ceramic substrate. Includes proprietary brazing process for attaching metal leads and configurations.
• Metal Components Custom configured metal parts including Cu, Cu/Mo, Cu/W, Kovar, and Mo, available stamped or machined with or without plating. Components include pins, tubes, tabs, heat sinks, studs, and chip carriers for thermal management applications.
• Plating Services Complete in-house plating operation with rack and barrel plating capabilities and proprietary processes, specializing in plating small geometry components. Plating options include Gold, Nickel, Electroless Nickel, Silver, Copper, RoHS Compliant Tin, and 80/20 Gold/Tin Alloy.
• Aerospace Precision Machining Comprehensive aerospace machining services including milling, turning, and secondary operations for metals and plastics, utilizing precision CNC machining centers and engineering support for efficient production.
• RF Components RF products manufactured by M2 Global including Coaxial Circulators, Drop-In Circulators, Surface Mount Circulators, Waveguide Circulators and Isolators, Coaxial Isolators, RF Switches, Couplers and Dividers, Filters and Diplexers, and Waveguide Products.
• Custom Components Custom manufacturing and mechanical package design solutions leveraging 50+ years of experience with integrated manufacturing operations, including quick-turn programs to expedite the development process from prototype to full-scale production.

Quantifiable outcome

• Ships over 50 million parts per year with high product uniformity and yield consistency
• +2 more outcomes

Named customers15 records

Segments6 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Two partnerships are on record, tiered core.

• United Glass to Metal Sealing, Inc.coreStrategic or Co-development Partner · 10 October 2023Acquired in October 2023, United Glass to Metal Sealing, Inc. based in Lawrence, MA. This acquisition expanded ECI's glass-to-metal seal product offering, providing expanded capacity, technical resources, and broadened product portfolio including custom products, coaxial feedthrough configurations, 50-Ohm products, and ordnance and defense applications. United Glass's technical competence and sophisticated production techniques enable expanded header designs including feedthroughs.
• M2 GlobalcoreStrategic or Co-development Partner · 1 January 2023Alliance formed in 2023 with sister company M2 Global Technology, Ltd. M2 Global is a premier designer and supplier of microwave products and precision manufacturing services serving defense, aerospace, and telecommunications industries with over 30 years of experience. ECI and M2 Global offer complementary RF and microwave component capabilities including Coaxial Circulators, Drop-In Circulators, Surface Mount Circulators, Waveguide Circulators and Isolators, RF Switches, Couplers, Dividers, Filters and Diplexers.

Scale indicators6 records

Recent moves8 records

Expansion highlights6 records

Direct peers

• Materion Corporation: Materion is a US-based advanced materials manufacturer producing ceramic substrates, electronic packaging materials, beryllia, and ceramic-to-metal seal assemblies serving aerospace, defense, and semiconductor capital equipment customers - the closest functional peer to ECI's ceramic-to-metal and metallized ceramic business.
• Schunk Xycarb Technology (Schunk Group): Schunk Xycarb, part of Germany's Schunk Group, produces ceramic substrates and ceramic-to-metal assemblies for semiconductor and power electronics packaging, directly comparable to ECI's ceramic-to-metal seal and metallized ceramic substrate product lines.
• Hermetic Solutions Group: Hermetic Solutions Group is a US specialty manufacturer of hermetic microelectronic packages and glass-to-metal seals serving defense, aerospace, and medical customers - a direct head-to-head competitor in the same Hi-Rel packaging niche.
• Specialty Coating Systems: Specialty Coating Systems (a Curtiss-Wright company) provides precision Parylene and conformal coating/plating services for microelectronic components - a directly comparable specialty plating service provider overlapping ECI's in-house plating capabilities.
• Vincotech (Mitsubishi Electric): Vincotech, now part of Mitsubishi Electric, manufactures power electronic modules and substrates with DBC technology for industrial, automotive, and renewable energy customers - directly comparable to ECI's DBC substrates and power packaging business.
• HTMS (Hermetic Technology Manufacturing Solutions): HTMS is a smaller US specialty manufacturer of hermetic microelectronic packages and glass-to-metal seals serving defense, aerospace, and medical markets - a small-scale direct peer operating in the same Hi-Rel packaging niche as ECI.

Broad incumbents

• CoorsTek: CoorsTek is a large US technical ceramics manufacturer producing ceramic substrates, ceramic-metal assemblies, and components for semiconductor, aerospace, and defense applications - a much larger broad incumbent competing in ECI's ceramic packaging adjacency.
• Kyocera Corporation: Kyocera is a major Japanese ceramics and electronic components manufacturer producing ceramic packages, semiconductor substrates, and packaging components for industrial and automotive customers - a broad incumbent whose packaging portfolio overlaps ECI's specialty offerings.
• Amphenol Aerospace: Amphenol Aerospace is a division of Amphenol producing hermetic connectors, feedthroughs, and microelectronic packaging for defense and aerospace primes - a broad incumbent whose hermetic packaging portfolio competes with ECI's glass-to-metal seals and CTMS products in overlapping defense programs.

Emerging players

• Rogers Corporation (DuPont Electronics): Rogers Corporation, recently acquired by DuPont Electronics, supplies high-frequency circuit materials and ceramic-filled substrates for RF, microwave, and power electronic packaging - an emerging player with partial overlap to ECI's DBC and metalized ceramic substrate offerings.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/eci-electro-ceramic-industries

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Electro-Ceramic Industries